US20080180906A1 - Heatsink thermal module with noise improvement - Google Patents

Heatsink thermal module with noise improvement Download PDF

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Publication number
US20080180906A1
US20080180906A1 US11959710 US95971007A US2008180906A1 US 20080180906 A1 US20080180906 A1 US 20080180906A1 US 11959710 US11959710 US 11959710 US 95971007 A US95971007 A US 95971007A US 2008180906 A1 US2008180906 A1 US 2008180906A1
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Prior art keywords
heatsink
module
heat
heatsink fins
thermal module
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Abandoned
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US11959710
Inventor
Frank Wang
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Frank Wang
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention provided a heatsink thermal module with noise improvement, which has a heatsink thermal module additionally consisting of a heat pipe, a heatsink fins set and a fan module; the fan module is combined with the heatsink fins set which consists of multiple heatsink fins with different lengths and is combined to the fan module with its end with a special geometric shape having the function of lowering the wind drag; by lowering the wind drag, not only the heat dissipation efficiency can be increased, but the noise caused by the heatsink thermal module can also be improved.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • This disclosed invention relates to a heatsink thermal module with noise improvement, and particularly a thermal module with noise improvement with a heatsink fins set consisting of multiple heatsink fins with different lengths to achieve the objective of lowering the wind drag.
  • 2. Description of the Related Art
  • Following the progress in information technology, the design of computers changes rapidly; the computers are designed to be lighter, slimmer, smaller and portable, and the requirement on their speed of data processing gets higher and higher; relatively, the design concerning the heat dissipation efficiency of heat generating components, such as central processing unit (CPU) and video graphics array (VGA) chips, become the key point and is especially challenging for light weight and easy carriage notebook computers.
  • The heatsink thermal modules used by the CPU or other heat generating components of notebook computers are usually made of high heat-conductive metal, which, by contacting the heat generating component of computers, transmits the heat to the heatsink fins set and, by means of the fan which provides strong cooling airflow toward the heatsink fins for heat exchange. The cumulated heat on the heatsink fins set can thus be brought away.
  • The heatsink fins set of conventional thermal modules is mounted on the airflow outlet to hinder the cooling airflow from increasing the wind drag; the higher the wind drag is, the lower the efficiency of cooling is and the more noise is produced. As shown in FIGS. 1A and 1B, which illustrate respectively the conventional heatsink module and the velocity profile diagram of the airflow outlet of the conventional heatsink module, the test is run by processing the data collected from the sensor which detects the airflow speed at a two-centimeter interval on the outer side of the fan module 100 from left to right (the direction is shown by the arrow D of FIG. 1A), and, as a result, the total airflow speed is 257.37 m/sec. As shown in FIGS. 2A and 2B, which illustrate respectively the conventional heatsink module and the velocity profile diagram of the airflow outlet of the conventional heatsink module; after the combination of the fan module 100 and the heatsink fins set 102, the total airflow speed drops from original 257.37 m/sec to 137.21 m/sec, which proves that the wind drag of conventional heatsink fins set 102 is rather elevated and the noise produced by the heatsink thermal module 101 is also higher. Users who work in a highly noisy environment over a long period of time would suffer from neurasthenia and absentmindedness which result in lower working efficiency.
  • For this, this invention provides a heatsink thermal module which can improve the unbalanced heat dissipation and the noise caused by the fan module and efficiently settles the above-mentioned defects.
  • SUMMARY OF THE INVENTION
  • In view of the problems of conventional techniques, the main purpose of this invention is to provide a heatsink thermal module with noise improvement which has the function of lowering the wind drag, raising consequently the heat dissipation efficiency and improving effectively the problem of the noise caused by the heatsink thermal module.
  • For attaining the above-mentioned purposes, this invention provides a heatsink module with noise improvement comprising a heatsink module which consists additionally of a heat pipe, a heatsink fins set composed by multiple heatsink fins with different lengths, and a fan module which is combined with the heatsink fins set.
  • The characteristic of this invention disclosed is relating to a heatsink thermal module with noise improvement is, by assembling multiple heatsink fins with different lengths, the construction of a heatsink thermal module with noise improvement with the function of lowering the wind drag and improving the noise.
  • For better understanding of characteristics, purposes and advantage of this invention, the detailed descriptions of the preferred embodiment with relating graphics are as follows:
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1A is the conventional fan module;
  • FIG. 1B is the velocity profile diagram of the conventional fan module;
  • FIG. 2A is the conventional heatsink module;
  • FIG. 2B is the velocity profile diagram of the conventional heatsink module;
  • FIG. 3 is the three-dimension view of the present invention;
  • FIG. 4 is the perspective three-dimension view of the present invention;
  • FIG. 5 is the three-dimension view of the heatsink fins set of the present invention; and
  • FIG. 6 is the velocity profile diagram of the present invention.
  • DETAILED DESCRIPTION OF THE INVENTION
  • As shown in FIG. 3 and FIG. 4, which are respectively the three-dimension view and the perspective three-dimension view of a desired embodiment of the heatsink thermal module with noise improvement, a heatsink thermal module 201 additionally consists of a heat pipe 103, a heatsink fins set 202 and a fan module 200 which is combined with the heatsink fins set 202.
  • Wherein the heat pipe 103 is made of highly heat-conductive material with its one end thermally connected to the heatsink fins set 202 and the other end thermally connected to the heat-conductive plate 104 to transmit the heat generated by the heat-generating component to the heatsink fins set 202, the heat pipe 103 homogeneously diffuses the heat to the heatsink fins set 202 during the heat-conducting process.
  • As shown in FIG. 5, which illustrates the three-dimension view of the heatsink fins set of this invention, the heatsink fins set 202 is composed of multiple parallel heatsink fins with different lengths where each heatsink fin is in form of slice. The heat pipe 103 thermally connects with each heatsink fin by penetrating its center for equivalent heat-conducting distance. By the spread of the heatsink area of the heatsink fins set 202, the heat transmitted by the heat pipe 103 can be effectively diffused and spread. The fan module 200 generates the cooling airflow which is parallel to the direction of the longitudinal axis of the heatsink fins for bringing away the heat cumulated on the heatsink fins set 202 by heat exchange between the cooling airflow and the heatsink fins set 202. The objectives of lowering the temperature and increasing the heat dissipation efficiency can thus be achieved.
  • Furthermore, the heatsink fins set 202 contains an airflow outlet 204 with the linear cut appearance and an airflow entrance 203 next to the fan module 200 with an adequate geometric shape such as the shape of a conjugate curve, an involute curve or any inward concave which makes the heatsink fins at its two sides longer than those at its center part, which can lower the wind drag by the special shape of the heatsink fins set 202 when the fan module 200 generates cooling airflow toward the heatsink fins set. Consequently, the objective of faster heat dissipation is achieved. Since the main purpose of the heatsink thermal module 201 is to conduct, transmit and dissipate heat, the material chosen for its fabrication shall be high-temperature resistant and high heat-conductive. The metal copper is utilized in this embodiment.
  • As shown in FIG. 6, which is the velocity profile diagram of this invention, the airflow of the cooling airflow generated by the fan module 200 blows toward the heatsink fins set passes each testing point on the airflow outlet 204 at a total airflow speed of 174.61 m/sec which shows a significant increase comparing to the FIG. 2 where the testing result (137.21 m/sec) of conventional heatsink fins set 102. It is thus clear that the design of this invention can lower the wind drag of the cooling airflow generated by the fan module 200 toward the heatsink fins set 202 and since the lower the wind drag is, the lesser the volume, the objective of noise improvement can therefore be achieved.
  • The characteristic of this invention disclosed is concerning a heatsink thermal module with noise improvement is that, by assembling metal fins with different lengths, a special designed heatsink fins set 202 is structured to improve the heat dissipation efficiency and to lower the noise. We see that this invention satisfies the noise-improvement requirement comparing to the conventional heatsink thermal modules.
  • While the present invention has been described with reference to a preferred embodiment, the description is illustrative of the invention and is not to be construed as limiting the invention. Various modifications to the present invention can be made to the preferred embodiment by those skilled in the art without departing from the true spirit and scope of the invention as defined by the appended claims.

Claims (2)

  1. 1-9. (canceled)
  2. 10. A heatsink fin module for reducing wind noise comprising:
    a heat pipe; and
    a heatsink fins set of a curved shape, the heatsink fins consisting of multiple heatsink fins with different lengths and extending from an upper surface of the heatsink fin module to a lower surface of the heatsink fin module,
    wherein the heat pipe is formed to penetrate the heatsink fins so as to thermally connect with each of the heatsink fins.
US11959710 2005-02-14 2007-12-19 Heatsink thermal module with noise improvement Abandoned US20080180906A1 (en)

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US11056164 US7333332B2 (en) 2005-02-14 2005-02-14 Heatsink thermal module with noise improvement
US11959710 US20080180906A1 (en) 2005-02-14 2007-12-19 Heatsink thermal module with noise improvement

Applications Claiming Priority (1)

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US11959710 US20080180906A1 (en) 2005-02-14 2007-12-19 Heatsink thermal module with noise improvement

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US11056164 Continuation US7333332B2 (en) 2005-02-14 2005-02-14 Heatsink thermal module with noise improvement

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Cited By (4)

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US20110042043A1 (en) * 2009-08-19 2011-02-24 Foxconn Technology Co., Ltd. Heat dissipation module
US20110180240A1 (en) * 2010-01-23 2011-07-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Centrifugal blower and heat dissipation device incorporating the same
US20110290450A1 (en) * 2010-05-31 2011-12-01 Asia Vital Components Co., Ltd. Heat Dissipation Module
US20120125570A1 (en) * 2010-11-19 2012-05-24 Inventec Corporation Heat dissipating device

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JP2007011786A (en) * 2005-06-30 2007-01-18 Toshiba Corp Cooling device and electronic device
CN100456913C (en) * 2005-08-12 2009-01-28 富准精密工业(深圳)有限公司;鸿准精密工业股份有限公司 Radiation device
US20070227707A1 (en) * 2006-03-31 2007-10-04 Machiroutu Sridhar V Method, apparatus and system for providing for optimized heat exchanger fin spacing
CN101166408A (en) * 2006-10-20 2008-04-23 富准精密工业(深圳)有限公司;鸿准精密工业股份有限公司 Heat radiation module
JP4846610B2 (en) * 2007-01-31 2011-12-28 株式会社東芝 Electronics
CN101370370B (en) * 2007-08-17 2011-11-09 富准精密工业(深圳)有限公司 Heat radiation module
US7609521B2 (en) * 2007-09-26 2009-10-27 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with a heat pipe
US20100101763A1 (en) * 2008-10-27 2010-04-29 Meng-Cheng Huang Thin heat dissipating apparatus
US7907411B2 (en) * 2008-12-03 2011-03-15 Goodrich Corporation Heat sink assembly having interdigitated cooling fins
CN101896054A (en) * 2009-05-21 2010-11-24 富准精密工业(深圳)有限公司;鸿准精密工业股份有限公司 Radiating device
WO2011041554A3 (en) * 2009-10-01 2012-04-05 Beckman Coulter, Inc. Sound abating heat sink and motor housing
JP4635101B1 (en) * 2009-12-25 2011-02-23 株式会社東芝 Cooling device, and electronic apparatus
US10107303B2 (en) * 2015-05-22 2018-10-23 Teza Technologies LLC Fluid cooled server and radiator
US10001140B2 (en) * 2015-07-17 2018-06-19 Hewlett-Packard Development Company, Lp. Fan cover with plurality of openings

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Publication number Priority date Publication date Assignee Title
US20110042043A1 (en) * 2009-08-19 2011-02-24 Foxconn Technology Co., Ltd. Heat dissipation module
US20110180240A1 (en) * 2010-01-23 2011-07-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Centrifugal blower and heat dissipation device incorporating the same
US20110290450A1 (en) * 2010-05-31 2011-12-01 Asia Vital Components Co., Ltd. Heat Dissipation Module
US20120125570A1 (en) * 2010-11-19 2012-05-24 Inventec Corporation Heat dissipating device

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US20060181849A1 (en) 2006-08-17 application
US7333332B2 (en) 2008-02-19 grant

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