CN1917194A - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- CN1917194A CN1917194A CNA2005100367346A CN200510036734A CN1917194A CN 1917194 A CN1917194 A CN 1917194A CN A2005100367346 A CNA2005100367346 A CN A2005100367346A CN 200510036734 A CN200510036734 A CN 200510036734A CN 1917194 A CN1917194 A CN 1917194A
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- Prior art keywords
- radiating fin
- mentioned
- heat abstractor
- heat
- wind scooper
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Abstract
The heat sink includes following parts and structures: a baseboard contacted to an electric component; thermolysis fins installed on the baseboard, and channels formed among fins; a wind scooper including mounting plate setup on top of thermolysis fins, and side plate setup on one side of fins; a fan installed on side plate of the wind scooper; the wind scooper also includes a shield wall setup and extended downward from the mounting plate. Thus, partial airflow generated by fan flows to channels of thermolysis fins. Passing through between fins and shield wall, the other part of airflow blows to other electric component adjacent to the above electric component directly. The invention can dissipate quantity of heat from first exothermic electric component as well as dissipate quantity of heat from second exothermic electric component adjacent to the first exothermic electric component.
Description
[technical field]
The present invention relates to a kind of heat abstractor, be meant a kind of heat abstractor that has wind scooper especially.
[background technology]
Along with developing rapidly of electronic industry, increase substantially as the arithmetic speed of electronic component in the computer, the heat of its generation also increases severely thereupon, and how the heat with electronic component distributes, and to guarantee its normal operation, is the essential problem that solves of dealer always.As everyone knows, the central processing unit that is installed on the motherboard is the core of computer system, and when computer moved, central processing unit produced heat.Too much heat can cause central processing unit normally to move.For effectively distributing the heat that central processing unit produces in running, on the central processing unit of circuit board, install a heat abstractor additional usually so that the heat of its generation is distributed.
Central processing unit periphery on the computer motherboard is provided with most transistors, and these transistors can be powered to central processing unit, when computer moves, these transistors also can produce a large amount of heat, transistor to motherboard, causes motherboard to heat up heat transferred, and then influences motherboard useful life.
One fan is installed on heat abstractor in the prior art usually, the airflow passes radiator that fan produces, thus improve radiating efficiency.For example the U.S. discloses 20030137807A1 patent and the U.S. and announces the 6832410B2 patent and disclosed a kind of heat abstractor respectively.The two difference is the relative position relation that the radiator in the heat abstractor follows the wind and fans.The U.S. discloses in the 20030137807A1 patent disclosed fan and places the radiator top, and the U.S. announces the side that the disclosed fan of 6832410B2 patent places radiator.
No matter yet in this two patent disclosed position of fan how because the air-flow that fan produces can not blow to the transistor of central processing unit periphery, so these heat abstractors all can not distribute the heat of these transistors generations.
Therefore, need a kind of new heat abstractor of design, this heat abstractor not only can distribute the heat that central processing unit produces, also can be to other electronic element radiatings of its periphery.
[summary of the invention]
By the following examples the present invention is illustrated.
Heat abstractor one embodiment of the present invention comprises a base plate, contacts with an electronic component; Majority places the radiating fin on the base plate, is formed with multi-channel between the above-mentioned radiating fin; One wind scooper comprises that one places the mounting panel and at radiating fin top to place the side plate of radiating fin one side; One fan is installed on the wind scooper side plate; Above-mentioned wind scooper comprises that also one extends the retaining wall that is provided with under mounting panel one side direction, wherein the passage of a part of air flow direction radiating fin of fan generation directly blows to other electronic components adjacent with above-mentioned electronic component between another part airflow passes radiating fin and the retaining wall.
Heat abstractor of the present invention is provided with base plate and radiating fin, the heat of one electronic component can be distributed by base plate and radiating fin; Mounting panel one side of heat abstractor wind scooper of the present invention is provided with retaining wall, thereby make and directly blow to other electronic components adjacent between a part of airflow passes radiating fin that fan produces and the retaining wall heat of other electronic components is distributed with above-mentioned electronic component, so the heat that heat abstractor of the present invention not only can distribute the heat of an electronic component other electronic components that also can it is adjacent distributes.
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
[description of drawings]
Fig. 1 is the part three-dimensional exploded view of heat abstractor first embodiment of the present invention.
Fig. 2 is the stereo amplification figure of another angle of wind scooper among Fig. 1.
Fig. 3 is the assembly drawing of Fig. 1.
Fig. 4 is the assembly drawing of another angle of Fig. 1.
Fig. 5 is the amplification and the phantom of wind scooper in the second embodiment of the invention.
[embodiment]
See also Fig. 1, Fig. 1 shows a heat abstractor 8 of first embodiment of the invention, and this heat abstractor 8 comprises a radiator 7, one fans 6 and a wind scooper 5.Radiator 7 is installed on the circuit board 4, this radiator 7 comprise a base plate 70, be parallel to the top board 74 of base plate and place base plate 70 and top board 74 between several dissipation fins 72.Base plate 70 stretches out respectively from its four corner and is provided with four lugs 702.Four fasteners 3 pass respective ledge 702 and place the backboard (not shown) at circuit board 4 back sides to be screwed together, thereby make base plate 70 and central processing unit (not shown) thermal bonding that is installed on the circuit board 4.Top board 74 is provided with a pair of screw 740.The heat pipe 76 of pair of parallel setting is installed in the radiator 7.Each heat pipe 76 roughly is the setting of U type, and it comprises endothermic section 760, is parallel to the heat unit 762 and the vertical connecting portion 750 (consulting Fig. 4) that connects endothermic section 760 and heat unit 762 of endothermic section 760.Endothermic section 760 is contained between base plate 70 and the radiating fin bottom 720, so endothermic section 760 and base plate 70 hot links, and the heat that base plate 70 absorbs can be passed to endothermic section 760 rapidly.Heat unit 762 is contained between top board 74 and the radiating fin top 722, and so the heat that is absorbed by endothermic section 760 can be passed to the top 722 of radiating fin 72 rapidly by heat unit 762.Fan 6 places on the base plate 70 and towards the leading flank of radiating fin 72, so that the air-flow that fan 6 is produced blows in the passage 724 between the radiating fin 72.Passage 724 extends setting along radiating fin 72 vertical directions.The width L of radiating fin 72 is less than the width of fan 6.Fan 6 setting that is square, it comprises a top 60 and four corners 62.Wherein, top 60 is higher than the top of top board 74.Each corner 62 is provided with a hole 620.
See also Fig. 2, the wind scooper 5 of first embodiment of the invention is formed by sheet metal integrated punching bending.This wind scooper 5 comprises that a mounting panel 50 and is from mounting panel 50 vertically extending side plates 52.Mounting panel 50 is from its front side edge 500 centre, and horizontal-extending is provided with a tongue piece 54.This mounting panel 50 is provided with a pair of and screw 740 positioning hole corresponding 540.Mounting panel 50 bottom surfaces are provided with a pair of support column 56, and each support column 56 is roughly cylindrical.First and second adjacent deep bead 502,504 directly extends setting from mounting panel 50 2 adjacent edge marginal lappets.Wherein deep bead 502 is positioned at mounting panel 50 trailing flanks.First and second adjacent retaining wall 506,508 extends setting from the opposite side edge-perpendicular of mounting panel 50, and these first and second retaining wall 506,508 positions are relative with second deep bead, 504 positions.First and second retaining wall 506,508 places the connecting portion 750 position adjacent places (consulting Fig. 4) with heat pipe 76, forms an angle between first retaining wall 506 and second retaining wall 508 and interferes to prevent the wind scooper 5 and the connecting portion 750 of heat pipe 76.Side plate 52 comprises an installed surface 520, and this installed surface 520 is provided with the hole 620 corresponding installing holes 521 with fan 6, and this installed surface 520 is parallel to first deep bead 502.Side plate 52 is provided with an opening 522.The side vertical extent of side plate 52 from opening 522 both sides is provided with a pair of fin 524.Hole 620 by screw (not shown) being passed fan 6 and then be screwed with the installing hole 521 of side plate 52, thus fan 6 is mounted on the installed surface 520.Fan 6 places between the fin 524, and the air communication that its running produces is crossed opening 522 and blowed to radiator 7.
See also Fig. 1 and Fig. 3-4, two location holes 540 by two-screw 82 being extended through mounting panel 50 and then be screwed with two screws 740 of top board 74, thus wind scooper 5 is fixed on the radiator 7.Support column 56 supports wind scooper 5 on top board 74, and it is equivalent to a separator and places between mounting panel 50 and the top board 74 so that form one between the two at interval.Mounting panel 50 tongue pieces 54 place the top 60 of fan 6, first and second deep bead 502,504 place and are used on the top board 74 to prevent that the air-flow that fan 6 produces from flowing out from the top of radiator 7, the radiating fin 72 of first retaining wall 506, second retaining wall 508 and close heat pipe 76 connecting portions 750 forms an air outlet 524, because the width L of radiating fin 72 is less than the width of fan 6, the part air-flow that fan 6 produces can get around radiating fin 72 directly blows to the central processing unit periphery through air outlet 524 transistor (not shown).
See also Fig. 5, Fig. 5 has shown the wind scooper in the second embodiment of the invention, and the wind scooper among this second embodiment is similar to the wind scooper among first embodiment.Its difference is: the support column 56 ' among second embodiment has been replaced location hole 540 ' among support column 56, the second embodiment among first embodiment and has been replaced location hole 540 among first embodiment.Wherein, each support column 56 ' roughly is conical.It is conical that each location hole 540 ' also roughly is, and location hole 540 ' is located at support column 56 ' central authorities and is passed support column 56 ' diapire.
When fan 6 runnings, a part of air-flow of generation blows to radiating fin 72 via opening 522, by radiating fin 72 air-flows the heat that central processing unit produces is brought in the surrounding air.Radiating fin 72 absorbs the heat that central processing unit produces, and the heat that central processing unit produces is distributed rapidly.The transistor that another part airflow passes opening 522 that fan 6 produces and air outlet 524 directly blow to the central processing unit periphery.Because wind scooper 5 is provided with first, second deep bead 502,504 and first, second retaining wall 506,508, so, the air-flow that fan 6 produces can not distribute towards periphery, so, the heat that central processing unit and transistor on every side thereof are produced is distributed rapidly by heat abstractor 8 simultaneously, thereby has improved the radiating efficiency of entire heat dissipation device 8.
During from radiator 7 dismounting wind scoopers 5, screw 82 is disassembled from top board 74 and mounting panel 50.The wind scooper 5 that has fan 6 just disassembles from radiator 7.
The air-flow that the function of wind scooper 5 of the present invention not only guides fan 6 to produce blows to radiating fin 72 and transistor but also has concurrently fan 6 is mounted to function on the radiator 7.
Claims (9)
1. a heat abstractor comprises a base plate, contacts with an electronic component; Majority places the radiating fin on the base plate, is formed with multi-channel between the above-mentioned radiating fin; One wind scooper comprises that one places the mounting panel and at radiating fin top to place the side plate of radiating fin one side; One fan is installed on the wind scooper side plate; It is characterized in that: above-mentioned wind scooper comprises that also one extends the retaining wall that is provided with under mounting panel one side direction, wherein the passage of a part of air flow direction radiating fin of fan generation directly blows to other electronic components adjacent with above-mentioned electronic component between another part airflow passes radiating fin and the retaining wall.
2. heat abstractor as claimed in claim 1, it is characterized in that: above-mentioned heat abstractor further comprises a heat pipe, this heat pipe comprises that one places the endothermic section, on the above-mentioned base plate to place the radiating part and at radiating fin top to connect the connecting portion of endothermic section and radiating part, and this connecting portion is between radiating fin and retaining wall.
3. heat abstractor as claimed in claim 2 is characterized in that: the mounting panel of above-mentioned wind scooper is provided with a support column, and this support column is resisted against the radiating fin top, makes to form one between radiating fin top and the mounting panel at interval.
4. heat abstractor as claimed in claim 2 is characterized in that: above-mentioned wind scooper further comprises first and second deep bead, and this first and second deep bead extends setting and is close proximity to the radiating fin top under adjacent two side direction of above-mentioned mounting panel.
5. heat abstractor as claimed in claim 4 is characterized in that: above-mentioned first deep bead is parallel to side plate, and can prevent that the air-flow that fan produces from flowing out via the radiating fin top.
6. heat abstractor as claimed in claim 2 is characterized in that: above-mentioned retaining wall is adjacent to the connecting portion of heat pipe.
7. heat abstractor as claimed in claim 6 is characterized in that: form an air outlet between retaining wall and the radiating fin.
8. heat abstractor as claimed in claim 2 is characterized in that: above-mentioned base plate comprises four card ears, and four fasteners pass corresponding card ear.
9. heat abstractor as claimed in claim 2 is characterized in that: above-mentioned mounting panel one side horizontal-extending is provided with a tongue piece, and this tongue piece places the fan top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100367346A CN100470777C (en) | 2005-08-18 | 2005-08-18 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100367346A CN100470777C (en) | 2005-08-18 | 2005-08-18 | Heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1917194A true CN1917194A (en) | 2007-02-21 |
| CN100470777C CN100470777C (en) | 2009-03-18 |
Family
ID=37738138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100367346A Expired - Fee Related CN100470777C (en) | 2005-08-18 | 2005-08-18 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100470777C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101466240B (en) * | 2007-12-18 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Radiating device |
| CN102279638A (en) * | 2010-06-10 | 2011-12-14 | 鸿富锦精密工业（深圳）有限公司 | Radiator and electronic device using same |
| CN101662921B (en) * | 2008-08-29 | 2013-02-20 | 富准精密工业(深圳)有限公司 | Heat radiation device and computer equipment with same |
| CN105658026A (en) * | 2014-12-03 | 2016-06-08 | 华为终端（东莞）有限公司 | Electronic terminal |
| CN105700644A (en) * | 2014-11-24 | 2016-06-22 | 鸿富锦精密工业(武汉)有限公司 | Heat-dissipation module |
| CN112462903A (en) * | 2020-11-24 | 2021-03-09 | 苏州浪潮智能科技有限公司 | Heat dissipation device and server with same |
-
2005
- 2005-08-18 CN CNB2005100367346A patent/CN100470777C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101466240B (en) * | 2007-12-18 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Radiating device |
| CN101662921B (en) * | 2008-08-29 | 2013-02-20 | 富准精密工业(深圳)有限公司 | Heat radiation device and computer equipment with same |
| CN102279638A (en) * | 2010-06-10 | 2011-12-14 | 鸿富锦精密工业（深圳）有限公司 | Radiator and electronic device using same |
| CN105700644A (en) * | 2014-11-24 | 2016-06-22 | 鸿富锦精密工业(武汉)有限公司 | Heat-dissipation module |
| CN105658026A (en) * | 2014-12-03 | 2016-06-08 | 华为终端（东莞）有限公司 | Electronic terminal |
| CN105658026B (en) * | 2014-12-03 | 2018-11-13 | 华为终端（东莞）有限公司 | A kind of electric terminal |
| CN112462903A (en) * | 2020-11-24 | 2021-03-09 | 苏州浪潮智能科技有限公司 | Heat dissipation device and server with same |
| CN112462903B (en) * | 2020-11-24 | 2023-06-27 | 苏州浪潮智能科技有限公司 | Heat abstractor and server with same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100470777C (en) | 2009-03-18 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090318 Termination date: 20140818 |
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| EXPY | Termination of patent right or utility model |