CN214378404U

CN214378404U - Chip heat radiation structure

Info

Publication number: CN214378404U
Application number: CN202120648642.8U
Authority: CN
Inventors: 艾健健
Original assignee: Hefei Hanxin Technology Co ltd
Current assignee: Hefei Hanxin Technology Co ltd
Priority date: 2021-03-31
Filing date: 2021-03-31
Publication date: 2021-10-08
Anticipated expiration: 2031-03-31

Abstract

The utility model discloses a chip heat radiation structure, the installation box comprises an installation box body, the interior diapire fixedly connected with of installation box type locating lever of falling L, the surface sliding connection of the type of falling L locating lever has the slip cap, the surface of slip cap set up with the locating hole of the type of falling L locating lever looks adaptation, the top fixedly connected with circuit board body of slip cap, the last fixed surface of circuit board body is connected with the chip body, the lower fixed surface of circuit board body is connected with a plurality of radiating fin. This chip heat radiation structure, through setting up radiator fan, fresh air inlet and louvre, the flow of the air in the installation box of being convenient for, through setting up the heat pipe, be convenient for with the heat conduction of chip body to the radiating fin on, through setting up silicone grease in radiating fin and the heat dissipation chamber, be convenient for make the heat conduction of circuit board body to the radiating fin on, take away the heat through the flow of air to make whole heat radiation structure have good heat dispersion's effect.

Description

Chip heat radiation structure

Technical Field

The utility model relates to a chip manufacturing technical field specifically is a chip heat radiation structure.

Background

Chips, known as integrated circuits or microcircuits, wafers/chips are a way in electronics to miniaturize circuits (including primarily semiconductor devices, including passive components, etc.) and are often fabricated on the surface of semiconductor wafers.

The existing chip is fixedly installed on the upper surface of the circuit board, the heat dissipation mainly drives the chip and the air around the circuit board to flow through the cooling fan to take away the heat, but the heat dissipation mode has poor effect, so that the chip is easy to have a phenomenon of overhigh temperature, and the normal operation of the chip is influenced.

The utility model provides a chip heat radiation structure.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a chip heat radiation structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a chip heat radiation structure, includes the install bin, the interior diapire fixedly connected with of install bin type locating lever, the surface sliding connection of type of falling L locating lever has the slip cap, the surface of slip cap set up with the locating hole of type of falling L locating lever looks adaptation, the top fixedly connected with circuit board body of slip cap, the last fixed surface of circuit board body is connected with the chip body, the lower fixed surface of circuit board body is connected with a plurality of radiating fin, the lower fixed surface of chip body is connected with the heat pipe, radiating cavity has been seted up to radiating fin's inside, fresh air inlet and louvre have been seted up respectively to the both sides of install bin, the inner wall of fresh air inlet passes through fixed column fixedly connected with radiator fan.

Preferably, the quantity of the type of falling L locating lever and sliding sleeve is four, four the type of falling L locating lever is the interior diapire of rectangle array setting at the install bin, four the sliding sleeve is the lower surface of rectangle array setting at the circuit board body.

Preferably, the inner wall of the sliding sleeve is slidably connected with a step-shaped ejecting block, the upper surface of the step-shaped ejecting block is fixedly connected with a resisting spring, and the top end of the resisting spring is fixedly connected with the inner top wall of the sliding sleeve.

Preferably, the bottom end of the heat conduction pipe is fixedly connected to the upper surface of the radiating fin, and the heat conduction pipe and the radiating cavity are filled with silicone grease.

Preferably, the inner wall of the air inlet hole is fixedly connected with a filter screen for preventing sundries from entering the installation box.

Preferably, the material of the heat dissipation fins and the heat conduction pipe is copper.

Advantageous effects

The utility model provides a chip heat radiation structure possesses following beneficial effect:

1. this chip heat radiation structure, through setting up radiator fan, fresh air inlet and louvre, the flow of the air in the installation box of being convenient for, through setting up the heat pipe, be convenient for with the heat conduction of chip body to the radiating fin on, through setting up silicone grease in radiating fin and the heat dissipation chamber, be convenient for make the heat conduction of circuit board body to the radiating fin on, take away the heat through the flow of air to make whole heat radiation structure have good heat dispersion's effect.

2. This chip heat radiation structure, through setting up type locating lever of falling L, slip cap and locating hole, the installation of the circuit board body of being convenient for, through setting up step form kicking block and supporting tight spring, be convenient for support the type locating lever of falling L tightly, make the type locating lever of falling L difficult for droing.

Drawings

FIG. 1 is a schematic view of a front cross-sectional structure of the present invention;

FIG. 2 is an enlarged schematic view of the structure at A of FIG. 1 according to the present invention;

fig. 3 is the side-cut structure schematic diagram of the utility model.

In the figure: the heat dissipation device comprises an installation box 1, an inverted L-shaped positioning rod 2, a sliding sleeve 3, a circuit board body 4, a chip body 5, a heat dissipation fin 6, a heat conduction pipe 7, a heat dissipation cavity 8, a heat dissipation fan 9, a step-shaped top block 10 and a spring 11 abutting against the heat dissipation device.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a chip heat radiation structure, includes install bin 1, install bin 1's interior diapire fixedly connected with type of falling L locating lever 2, and the surface sliding connection of type of falling L locating lever 2 has sliding sleeve 3, and the inner wall sliding connection of sliding sleeve 3 has step form kicking block 10, and the last fixed surface of step form kicking block 10 is connected with and supports tight spring 11, supports the interior roof of top fixed connection at sliding sleeve 3 of tight spring 11.

The locating hole with 2 looks adaptations of type of falling L locating lever is seted up to sliding sleeve 3's surface, sliding sleeve 3's top fixedly connected with circuit board body 4, the quantity of type of falling L locating lever 2 and sliding sleeve 3 is four, four type of falling L locating levers 2 are the interior diapire of rectangle array setting at install bin 1, four sliding sleeve 3 are the lower surface of rectangle array setting at circuit board body 4, through setting up type of falling L locating lever 2, sliding sleeve 3 and locating hole, be convenient for circuit board body 4's installation, through setting up step-like kicking block 10 and supporting tight spring 11, be convenient for support tight type of falling L locating lever 2, make type of falling L locating lever 2 difficult droing.

The upper surface fixedly connected with chip body 5 of circuit board body 4, the lower surface fixedly connected with a plurality of radiating fin 6 of circuit board body 4, the lower surface fixedly connected with heat pipe 7 of chip body 5, the bottom fixed connection of heat pipe 7 is at radiating fin 6's upper surface, and radiating fin 6 and the material of heat pipe 7 are copper.

Radiating cavity 8 has been seted up to radiating fin 6's inside, heat pipe 7 and radiating cavity 8's inside all is filled there is the silicone grease, fresh air inlet and louvre have been seted up respectively to the both sides of install bin 1, the inner wall of fresh air inlet passes through fixed column fixedly connected with radiator fan 9, the inner wall fixedly connected with of fresh air inlet prevents that debris from getting into the inside filter screen of install bin 1, through setting up radiator fan 9, fresh air inlet and louvre, be convenient for the flow of air in install bin 1, through setting up heat pipe 7, be convenient for conduct chip body 5's heat to radiating fin 6 on, through setting up silicone grease in radiating fin 6 and the radiating cavity 8, be convenient for make circuit board body 4's heat conduction to radiating fin 6 on, take away the heat through the flow of air, thereby make whole heat radiation structure have good heat dispersion's effect.

The working principle is as follows: when the chip heat dissipation structure needs to be used, the inverted-L-shaped positioning rod 2, the sliding sleeve 3 and the positioning hole are firstly utilized to install the circuit board body 4 in the installation box 1, the step-shaped jacking block 10 and the abutting spring 11 are utilized to abut against the inverted-L-shaped positioning rod 2, so that the inverted-L-shaped positioning rod 2 is not prone to falling off, in the working process of the chip body 5, the heat dissipation fan 9 is started, air in the installation box 1 flows through the air inlet hole and the heat dissipation holes, heat of the chip body 5 is conducted to the heat dissipation fins 6 through the heat conduction pipes 7, heat of the circuit board body 4 is conducted to the heat dissipation fins 6 through the heat dissipation fins 6 and the silicone grease in the heat dissipation cavity 8, the heat is taken away through the flowing of the air, and the whole heat dissipation structure has a good heat dissipation effect.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A chip heat radiation structure, includes install bin (1), its characterized in that: an inverted L-shaped positioning rod (2) is fixedly connected with the inner bottom wall of the installation box (1), the outer surface of the inverted L-shaped positioning rod (2) is connected with a sliding sleeve (3) in a sliding way, the outer surface of the sliding sleeve (3) is provided with a positioning hole matched with the inverted L-shaped positioning rod (2), the top end of the sliding sleeve (3) is fixedly connected with a circuit board body (4), the upper surface of the circuit board body (4) is fixedly connected with a chip body (5), the lower surface of the circuit board body (4) is fixedly connected with a plurality of radiating fins (6), the lower surface of the chip body (5) is fixedly connected with a heat conduction pipe (7), the heat dissipation structure is characterized in that heat dissipation cavities (8) are formed in the heat dissipation fins (6), air inlet holes and heat dissipation holes are formed in the two sides of the installation box (1) respectively, and the inner walls of the air inlet holes are fixedly connected with heat dissipation fans (9) through fixing columns.

2. A chip heat dissipation structure as recited in claim 1, wherein: the quantity of the inverted L-shaped positioning rods (2) and the quantity of the sliding sleeves (3) are four, four the inverted L-shaped positioning rods (2) are arranged on the inner bottom wall of the installation box (1) in a rectangular array mode, and the sliding sleeves (3) are arranged on the lower surface of the circuit board body (4) in a rectangular array mode.

3. A chip heat dissipation structure as recited in claim 1, wherein: the inner wall of the sliding sleeve (3) is connected with a step-shaped jacking block (10) in a sliding mode, the upper surface of the step-shaped jacking block (10) is fixedly connected with a resisting spring (11), and the top end of the resisting spring (11) is fixedly connected to the inner top wall of the sliding sleeve (3).

4. A chip heat dissipation structure as recited in claim 1, wherein: the bottom fixed connection of heat pipe (7) is in the upper surface of radiating fin (6), the inside of heat pipe (7) and heat dissipation chamber (8) all is filled with the silicone grease.

5. A chip heat dissipation structure as recited in claim 1, wherein: the inner wall of the air inlet hole is fixedly connected with a filter screen which prevents sundries from entering the installation box (1).

6. A chip heat dissipation structure as recited in claim 1, wherein: the heat radiating fins (6) and the heat conducting pipes (7) are made of copper.