CN210224010U - Heat radiator for power semiconductor composite device - Google Patents
Heat radiator for power semiconductor composite device Download PDFInfo
- Publication number
- CN210224010U CN210224010U CN201921289525.6U CN201921289525U CN210224010U CN 210224010 U CN210224010 U CN 210224010U CN 201921289525 U CN201921289525 U CN 201921289525U CN 210224010 U CN210224010 U CN 210224010U
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- fixedly connected
- heat
- air
- box
- heat dissipation
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Abstract
The utility model discloses a heat abstractor of power semiconductor composite device, including the box, the outside cover of box is equipped with the insulating layer, and the inside of box is provided with semiconductor device, fixedly connected with fixed block between semiconductor device and the box, the top fixedly connected with heat-conducting plate of semiconductor device, the first heat dissipation strip of top fixedly connected with of heat-conducting plate. The utility model discloses a be provided with the air-blower, the breather pipe, semiconductor fin and air diffuser, a large amount of air are gone into to the air-blower drum, utilize semiconductor fin's work, refrigerate the air current, inside the pipe flows in the box through air diffuser, the cooling treatment of ventilating, through being provided with the fan, gas pocket and filter screen, the inside circulation of air is accelerated to the fan, in time with high-temperature gas discharge, improve cooling effect and speed, prevent that the high temperature from leading to the component can not normally work, influence the stability and the reliability of its operation, the filter screen blocks the inside that the dust got into the box, reduce the destruction to equipment.
Description
Technical Field
The utility model relates to a semiconductor device technical field specifically is a heat abstractor of power semiconductor composite device.
Background
The power electronic device is a semiconductor device with small heat equivalent and sensitive heat generation, and all parameters of the semiconductor device are almost related to heat characteristics, so that the over-high junction temperature can damage the normal working condition of the element and influence the stability and reliability of the operation of the element.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat abstractor of power semiconductor composite device has solved the high temperature and can lead to the destruction of the normal behavior of component, influences the stability of its operation and the problem of reliability.
In order to achieve the above object, the utility model provides a following technical scheme: a heat dissipation device of a power semiconductor composite device comprises a box body, wherein a heat insulation layer is sleeved on the outer side of the box body, a semiconductor device is arranged inside the box body, a fixed block is fixedly connected between the semiconductor device and the box body, a heat conduction plate is fixedly connected to the top of the semiconductor device, a first heat dissipation strip is fixedly connected to the top of the heat conduction plate, a second heat dissipation strip is arranged on the right side of the first heat dissipation strip, a case is fixedly connected to the left side of the box body, an air blower is fixedly arranged inside the case, a ventilation pipe is fixedly connected to an air outlet of the air blower, semiconductor cooling fins are fixedly connected inside the ventilation pipe, the right end of the ventilation pipe penetrates through the bottom of the heat insulation layer and extends into the box body, a gas collection pipe is fixedly connected to one end of the, the fixedly connected with condenser of box, the right side fixedly connected with condenser pipe of condenser, the cooling water pipe is crooked to coil and is followed in one side of semiconductor device and condenser pipe's outside cover and is equipped with fin group.
Preferably, first heat dissipation strip and second heat dissipation strip are the equidistance interval setting, and the radiating groove has been seted up on the surface of first heat dissipation strip.
Preferably, the right end of the cooling water pipe penetrates through the right side plate of the box body and extends to the outer side of the heat insulation layer, and one end of the cooling water pipe is fixedly connected with a water pump.
Preferably, the right side fixedly connected with water tank of insulating layer, water pump fixed mounting is in the inside of water tank, the bottom fixedly connected with drain pipe of water tank.
Preferably, the inner wall of the right side plate of the box body is fixedly connected with a fan, the right side of the box body is provided with an air hole communicated with the fan, and the right side of the heat insulation layer is fixedly connected with a filter screen communicated with the air hole.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a be provided with the heat-conducting plate, first heat dissipation strip, second heat dissipation strip and radiating groove, the heat-conducting plate conducts the heat, give first heat conduction strip with semiconductor device's temperature transfer, thereby dispel the heat and cool down, radiating groove increase heat radiating area, supplementary first heat dissipation strip dispels the heat, second heat dissipation strip and the cooperation of first heat dissipation strip, prevent that first heat dissipation strip high temperature from influencing heat conduction and radiating effect, thereby reduce the influence that the high temperature caused to equipment, ensure equipment's normal function, through being provided with the condenser, condenser pipe, fin group, water tank and water pump, the condenser accelerates the cooling of the inside air of box, reduce the temperature that the device function produced, fin group accelerates the cooling of water, a part of heat is walked in the flow through water, the water pump is collected the cooling water extraction, prevent to cause the damage to equipment.
2. The utility model discloses a be provided with the air-blower, the breather pipe, semiconductor fin and air diffuser, a large amount of air are gone into to the air-blower drum, utilize semiconductor fin's work, refrigerate the air current, inside the pipe flows in the box through air diffuser, the cooling treatment of ventilating, through being provided with the fan, gas pocket and filter screen, the inside circulation of air is accelerated to the fan, in time with high-temperature gas discharge, improve cooling effect and speed, prevent that the high temperature from leading to the component can not normally work, influence the stability and the reliability of its operation, the filter screen blocks the inside that the dust got into the box, reduce the destruction to equipment.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a front view of the box body of the present invention.
In the figure: the heat-conducting type air-cooling device comprises a vent pipe 1, a case 2, an air blower 3, a cooling water pipe 4, a second heat-radiating strip 5, a first heat-radiating strip 6, a heat-conducting plate 7, a heat-radiating sheet group 8, a case body 9, a heat-insulating layer 10, a fan 11, air holes 12, a filter screen 13, a condenser 14, a water pump 15, a water tank 16, a gas collecting pipe 17, a gas dispersing pipe 18, a fixed block 19, a semiconductor heat-radiating sheet 20 and a.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-2, an embodiment of the present invention provides a heat dissipation apparatus for a power semiconductor composite device, including a box 9, a heat insulation layer 10 is sleeved on an outer side of the box 9, the heat insulation layer 10 is disposed to isolate the influence of an external high temperature environment on components inside the box 9, a semiconductor device 21 is disposed inside the box 9, a fixing block 19 is fixedly connected between the semiconductor device 21 and the box 9, a heat conduction plate 7 is fixedly connected to a top of the semiconductor device 21, a first heat dissipation strip 6 is fixedly connected to a top of the heat conduction plate 7, the heat conduction plate 7 conducts heat, and transmits the temperature of the semiconductor device 21 to the first heat dissipation strip 6, so as to dissipate heat and cool, a second heat dissipation strip 5 is disposed on a right side of the first heat dissipation strip 6, the first heat dissipation strip 6 and the second heat dissipation strip 5 are disposed at equal intervals, and a heat dissipation groove is disposed, the heat dissipation groove increases the heat dissipation area, assists the first heat dissipation strip 6 to dissipate heat, the second heat dissipation strip 5 is matched with the first heat dissipation strip 6 to prevent the first heat dissipation strip 6 from having too high temperature and influencing the heat conduction and heat dissipation effects, thereby reducing the influence of high temperature on the equipment and ensuring the normal operation of the equipment, the left side of the box body 9 is fixedly connected with a box 2, the inside of the box 2 is fixedly provided with an air blower 3, the air outlet of the air blower 3 is fixedly connected with a ventilation pipe 1, a large amount of air is blown inwards through the ventilation pipe 1 by the operation of the air blower 3, the inside of the ventilation pipe 1 is fixedly connected with a semiconductor cooling fin 20, the air is refrigerated and cooled by the work of the semiconductor cooling fin 20, the right end of the ventilation pipe 1 penetrates through the bottom of the heat insulation layer 10 and extends to the inside of the box body 9, one end of the ventilation pipe 1 is fixedly, by arranging the air blower 3, the vent pipe 1, the semiconductor cooling fin 20 and the air diffusing pipe 18, a large amount of air is blown into the air blower 3, air flow is refrigerated by utilizing the work of the semiconductor cooling fin 20 and flows into the box body 9 through the air diffusing pipe 18 to be ventilated and cooled, the box body 9 is fixedly connected with the condenser 14, the right side of the condenser 14 is fixedly connected with the cooling water pipe 4, the cooling water pipe 4 is bent and coiled on one side of the semiconductor device 21, the outer side of the cooling water pipe 4 is sleeved with the cooling fin group 8, the right end of the cooling water pipe 4 penetrates through the right side plate of the box body 9 and extends to the outer side of the heat insulation layer 10, one end of the cooling water pipe 4 is fixedly connected with the water pump 15, the condenser 14 accelerates the cooling of the air in the box body 9 by arranging the condenser 14, the cooling water pipe 4, the cooling fin group, walk partly heat through the flow of water, water pump 15 collects the cooling water extraction, prevent to cause the damage to equipment, the right side fixedly connected with water tank 16 of insulating layer 10, water pump 15 fixed mounting is in the inside of water tank 16, the bottom fixedly connected with drain pipe of water tank 16, fixedly connected with fan 11 on the inner wall of box 9 right side board, the communicating gas pocket 12 with fan 11 has been seted up on the right side of box 9, through being provided with fan 11, gas pocket 12 and filter screen 13, fan 11 accelerates inside circulation of air, in time discharge high-temperature gas, improve cooling effect and speed, prevent that the high temperature from leading to the component can not normally work, influence its stability and reliability of operation, the right side fixedly connected with of insulating layer 10 and the communicating filter screen 13 of gas pocket 12, filter screen 13 blocks the inside that the dust got into box 9, reduce the destruction to equipment.
The working principle is as follows: the heat conducting plate 7 conducts heat, the temperature of the semiconductor device 21 is transmitted to the first heat conducting strip 6, heat dissipation and cooling are carried out, the heat dissipation groove increases the heat dissipation area, the first heat dissipation strip 6 is assisted to dissipate heat, the second heat dissipation strip 5 is matched with the first heat dissipation strip 6 to prevent the first heat dissipation strip 6 from being overhigh in temperature, the condenser 14 accelerates the cooling of air in the box body 9 and reduces the temperature generated by the operation of the device, the heat dissipation fin group 8 accelerates the cooling of water, partial heat is removed through the flowing of the water, the water pump 15 extracts and collects the cooling water, the blower 3 blows a large amount of air, the air flow is refrigerated by utilizing the work of the semiconductor heat dissipation fins 20, the air flow flows into the box body 9 through the air dissipation pipe 18 to carry out ventilation and cooling treatment, the fan 11 accelerates the circulation of the air in the box body, high-temperature gas is discharged in time, the cooling effect and the cooling, the filter net 13 blocks dust from entering the inside of the case 9.
In summary, the following steps: the heat dissipation device of the power semiconductor composite device is provided with a heat conduction plate 7, a first heat dissipation strip 6, a second heat dissipation strip 5 and a heat dissipation groove, wherein the heat conduction plate 7 conducts heat and transfers the temperature of a semiconductor device 21 to the first heat conduction strip 6 so as to dissipate heat and cool, the heat dissipation groove increases the heat dissipation area and assists the first heat dissipation strip 6 to dissipate heat, the second heat dissipation strip 5 is matched with the first heat dissipation strip 6 to prevent the first heat dissipation strip 6 from having overhigh temperature and influencing the heat conduction and heat dissipation effects so as to reduce the influence of high temperature on equipment and ensure the normal operation of the equipment, the condenser 14 accelerates the cooling of air in the box body 9, reduces the temperature generated by the device, the heat dissipation strip 8 accelerates the cooling of water, and removes a part of heat through the flow of water, water pump 15 collects the cooling water extraction, prevent to cause the damage to equipment, through being provided with air-blower 3, breather pipe 1, semiconductor fin 20 and air diffuser 18, a large amount of air are bloated to air-blower 3, utilize semiconductor fin 20's work, refrigerate the air current, inside 18 inflow box 9 of air diffuser, the cooling of ventilating is handled, through being provided with fan 11, gas pocket 12 and filter screen 13, fan 11 accelerates inside circulation of air, in time discharge high-temperature gas, improve cooling effect and speed, prevent that the high temperature from leading to the component can not normally work, influence the stability and the reliability of its operation, filter screen 13 blocks the inside that the dust got into box 9, reduce the destruction to equipment.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The expression "comprising an element defined by a cited structure does not exclude the presence of further identical elements in the process, method, article or apparatus comprising said element" and the electrical elements appearing therein are all electrically connected to an external master controller and to the 220V or 110V mains supply, and the master controller may be a conventionally known apparatus, for example a computer, which controls it.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a heat abstractor of power semiconductor composite device, includes box (9), its characterized in that: the heat insulation layer (10) is sleeved on the outer side of the box body (9), a semiconductor device (21) is arranged inside the box body (9), a fixed block (19) is fixedly connected between the semiconductor device (21) and the box body (9), a heat conduction plate (7) is fixedly connected to the top of the semiconductor device (21), a first heat dissipation strip (6) is fixedly connected to the top of the heat conduction plate (7), a second heat dissipation strip (5) is arranged on the right side of the first heat dissipation strip (6), a case (2) is fixedly connected to the left side of the box body (9), an air blower (3) is fixedly installed inside the case (2), a ventilation pipe (1) is fixedly connected to an air outlet of the air blower (3), semiconductor cooling fins (20) are fixedly connected to the inside of the ventilation pipe (1), and the right end of the ventilation pipe (1) penetrates through the bottom of the heat insulation layer (10) and extends, the one end fixedly connected with gas collecting pipe (17) of ventilation pipe (1), top fixedly connected with gas diffusion pipe (18) of gas collecting pipe (17), fixedly connected with condenser (14) of box (9), the right side fixedly connected with cooling water pipe (4) of condenser (14), the outside cover that cooling water pipe (4) are bent to coil and are leaned on one side of semiconductor device (21) and cooling water pipe (4) is equipped with fin group (8).
2. The heat dissipating device of a power semiconductor composite device according to claim 1, wherein: first heat dissipation strip (6) and second heat dissipation strip (5) set up for the equidistance interval, and the radiating groove has been seted up on the surface of first heat dissipation strip (6).
3. The heat dissipating device of a power semiconductor composite device according to claim 1, wherein: the right-hand member of cooling water pipe (4) runs through the right side board of box (9) and extends to the outside of insulating layer (10), the one end fixedly connected with water pump (15) of cooling water pipe (4).
4. The heat dissipating device of a power semiconductor composite device according to claim 3, wherein: the right side fixedly connected with water tank (16) of insulating layer (10), water pump (15) fixed mounting is in the inside of water tank (16), the bottom fixedly connected with drain pipe of water tank (16).
5. The heat dissipating device of a power semiconductor composite device according to claim 1, wherein: the fan (11) is fixedly connected to the inner wall of the right side plate of the box body (9), the air hole (12) communicated with the fan (11) is formed in the right side of the box body (9), and the filter screen (13) communicated with the air hole (12) is fixedly connected to the right side of the heat insulation layer (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921289525.6U CN210224010U (en) | 2019-08-09 | 2019-08-09 | Heat radiator for power semiconductor composite device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921289525.6U CN210224010U (en) | 2019-08-09 | 2019-08-09 | Heat radiator for power semiconductor composite device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210224010U true CN210224010U (en) | 2020-03-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921289525.6U Expired - Fee Related CN210224010U (en) | 2019-08-09 | 2019-08-09 | Heat radiator for power semiconductor composite device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210224010U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111506133A (en) * | 2020-05-03 | 2020-08-07 | 夏玮玮 | Temperature control equipment for semiconductor production |
| CN111629561A (en) * | 2020-05-09 | 2020-09-04 | 安徽春辉仪表线缆集团有限公司 | Automatic change instrument and meter heat-proof device |
| CN112802805A (en) * | 2020-12-22 | 2021-05-14 | 湖南工业大学 | Power semiconductor device with temperature detection function for rolling mill |
| CN112808012A (en) * | 2020-12-18 | 2021-05-18 | 成都合达自动化设备有限公司 | Automatic sintering plugging equipment of medical hollow fiber membrane filter |
-
2019
- 2019-08-09 CN CN201921289525.6U patent/CN210224010U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111506133A (en) * | 2020-05-03 | 2020-08-07 | 夏玮玮 | Temperature control equipment for semiconductor production |
| CN111629561A (en) * | 2020-05-09 | 2020-09-04 | 安徽春辉仪表线缆集团有限公司 | Automatic change instrument and meter heat-proof device |
| CN112808012A (en) * | 2020-12-18 | 2021-05-18 | 成都合达自动化设备有限公司 | Automatic sintering plugging equipment of medical hollow fiber membrane filter |
| CN112802805A (en) * | 2020-12-22 | 2021-05-14 | 湖南工业大学 | Power semiconductor device with temperature detection function for rolling mill |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200331 Termination date: 20210809 |
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| CF01 | Termination of patent right due to non-payment of annual fee |