CN219980840U - Intelligent gateway for Internet of things - Google Patents
Intelligent gateway for Internet of things Download PDFInfo
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- CN219980840U CN219980840U CN202321211402.7U CN202321211402U CN219980840U CN 219980840 U CN219980840 U CN 219980840U CN 202321211402 U CN202321211402 U CN 202321211402U CN 219980840 U CN219980840 U CN 219980840U
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- gateway
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- air
- intelligent gateway
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- 239000004065 semiconductor Substances 0.000 claims abstract description 42
- 238000005057 refrigeration Methods 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 238000007664 blowing Methods 0.000 claims 5
- 230000017525 heat dissipation Effects 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 10
- 239000000428 dust Substances 0.000 abstract description 8
- 230000006855 networking Effects 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 15
- 230000005855 radiation Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005679 Peltier effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model provides an intelligent gateway for the Internet of things, and relates to the technical field of gateways. An intelligent gateway for the Internet of things. This intelligent gateway for thing networking includes gateway main part and the shell and the radiator unit of installation gateway main part, and radiator unit includes semiconductor refrigeration piece, air supply air current generator and a plurality of fin. The semiconductor refrigerating sheet is arranged on the shell, the refrigerating surface of the semiconductor refrigerating sheet faces into the shell, the radiating fins are sequentially and uniformly arranged on the heating surface of the semiconductor refrigerating sheet at intervals, the radiating fins are provided with through holes, the through holes are all positioned on the same axis to form an air supply channel, the shell is provided with a mounting frame, and the air supply generator is aligned to the opening end on one side of the air supply channel. This intelligent gateway for thing networking can realize the heat dissipation fast effectual, reduces gateway temperature and guarantees gateway normal operating, and its heat dissipation process can not make the air current enter into inside the gateway moreover, can not make dust etc. cause the influence to gateway normal operating.
Description
Technical Field
The utility model relates to the technical field of gateways, in particular to an intelligent gateway for the Internet of things.
Background
The gateway is also called gateway connector and protocol converter. The gateway realizes network interconnection above the network layer, is a complex network interconnection device, and is only used for network interconnection with two different higher-layer protocols. The gateway may be used for both wide area network and local area network interconnections. A gateway is a computer system or device that acts as a translation rendition. With the increasing intellectualization and modernization of network environment, the requirements on the gateway and the like are higher, the functions and the plug-ins integrated by the gateway are more and more, and the working states, particularly fault states, of all the functional modules are generally set with light indicators, but the existing light indicators are not obvious, and the light alarms which can not be found out are sometimes not carefully observed. Patent application number CN202122347472.2 discloses an intelligent gateway, and it directly sets up the light trap on last casing, sets up the light-transmitting plate on the light trap, and the light warning that the pilot lamp in the casing sent can be followed the light-transmitting plate and is passed through, makes things convenient for people to timely observation light warning that appears. However, at least the following problems remain in the technical solutions disclosed in the above patents: in this technical scheme, each electrical component can produce a large amount of heat when the gateway is used, can not in time dispel the heat can lead to the gateway high temperature, causes the gateway trouble easily. The existing heat dissipation component is characterized in that an airflow is adopted to dissipate heat through fan lamp equipment to dissipate heat of the gateway. However, the air flow also brings in a large amount of dust and other impurities, which affect the operation of the gateway.
Disclosure of Invention
The utility model aims to provide an intelligent gateway for the Internet of things, which can quickly and effectively realize heat dissipation, reduce the temperature of the gateway and ensure the normal operation of the gateway, and the heat dissipation process can not enable air flow to enter the gateway and can not cause dust and the like to influence the normal operation of the gateway.
Embodiments of the present utility model are implemented as follows:
the embodiment of the utility model provides an intelligent gateway for the Internet of things, which comprises a gateway main body and a shell for installing the gateway main body, wherein the intelligent gateway comprises a radiating component, the radiating component comprises a semiconductor refrigerating sheet, an air supply flow generator and a plurality of radiating fins, a radiating opening is formed in the shell, the semiconductor refrigerating sheet is arranged on the shell, the semiconductor refrigerating sheet is arranged at the radiating opening in a covering manner, a refrigerating surface of the semiconductor refrigerating sheet faces into the shell, the radiating fins are sequentially and uniformly arranged on a heating surface of the semiconductor refrigerating sheet at intervals, through holes are formed in the radiating fins, the through holes are all positioned on the same axis to form an air supply channel, a mounting frame is arranged on the shell, and the air supply flow generator is aligned to an opening end at one side of the air supply channel.
In some embodiments of the present utility model, the air flow generator includes an air-supplying fan and an air-discharging fan, the air-supplying fan is disposed at one end of the air-supplying channel, and the air-discharging fan is disposed at the other end of the air-supplying channel.
In some embodiments of the present utility model, a plurality of fine holes are uniformly spaced on any of the heat dissipation fins.
In some embodiments of the utility model, the inner wall of the housing is covered with a heat insulating layer.
In some embodiments of the utility model, a plurality of temperature detectors are provided on the housing.
In some embodiments of the present utility model, the plurality of temperature detectors are connected to a same control unit, and the control unit is connected to a display, and the display is disposed on the housing.
In some embodiments of the utility model, the control unit is connected to a command input.
Compared with the prior art, the embodiment of the utility model has at least the following advantages or beneficial effects:
the utility model provides an intelligent gateway for the Internet of things, which comprises a gateway main body and a shell for installing the gateway main body. The intelligent gateway for the Internet of things comprises a heat dissipation component. The gateway main body is a main component for realizing gateway functions. The gateway body is disposed within a housing that serves to isolate and protect the gateway body.
The heat dissipation assembly comprises a semiconductor refrigerating sheet, an air supply flow generator and a plurality of heat dissipation fins. The shell is provided with a heat radiation opening, the semiconductor refrigerating sheet is arranged on the shell, the semiconductor refrigerating sheet is arranged at the heat radiation opening and covered in the shell, the refrigerating surface of the semiconductor refrigerating sheet faces into the shell, the heat radiation fins are sequentially and evenly arranged on the heating surface of the semiconductor refrigerating sheet at intervals, the plurality of heat radiation fins are provided with through holes, the through holes are all positioned on the same axis to form an air supply channel, the shell is provided with a mounting rack, and the air supply flow generator is aligned to the opening end on one side of the air supply channel.
The semiconductor refrigerating sheet is a heat pump, which is a prior art, and utilizes the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and refrigeration can be realized. When refrigerating, the other end face generates heat. Therefore, the refrigerating surface is one surface of the semiconductor for refrigerating and absorbing heat, the interior of the shell can be effectively radiated and cooled, and the heat of the heating surface can be rapidly taken away by the radiating fins, so that the refrigerating effect of the semiconductor for refrigerating the interior of the shell is better. The through holes can form an air supply channel, and the air flow generator flows in the air supply channel, so that the air flow can take away a large amount of heat on the surfaces of the radiating fins in the flowing process, and the radiating fins are cooled. After the cooling fin is cooled, the cooling fin can quickly exchange heat with a heating surface to take away heat. The circulation can realize continuous heat dissipation and cooling of the inner network main body in the shell. The above process also does not allow air flow into the interior of the housing at all, and dust and the like are prevented from entering the interior of the housing.
Therefore, this intelligent gateway for thing networking can realize dispelling the heat fast effectual, reduces the gateway temperature and guarantees gateway normal operating, and its heat dissipation process can not make the air current enter into inside the gateway moreover, can not make dust etc. cause the influence to gateway normal operating.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic cross-sectional view of an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a heat dissipation fin according to an embodiment of the present utility model;
fig. 3 is a control block diagram of the control unit in the embodiment of the present utility model.
Icon: the gateway comprises a gateway main body, a 2-shell, a 3-semiconductor refrigerating sheet, a 4-air supply fan, 5-radiating fins, 6-radiating ports, 7-through holes, 8-air supply channels, 9-mounting frames, 10-fine holes, 11-heat insulation layers, 12-temperature detectors, 13-displays and 14-air outlet fans.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples
Referring to fig. 1-3, fig. 1 is a schematic cross-sectional structure of an embodiment of the present utility model; fig. 2 is a schematic structural view of a heat dissipating fin 5 according to an embodiment of the present utility model; fig. 3 is a control block diagram of the control unit in the embodiment of the present utility model. The embodiment provides an intelligent gateway for the Internet of things, which comprises a gateway main body 1 and a shell 2 for installing the gateway main body 1. The intelligent gateway for the Internet of things comprises a heat dissipation component. The gateway main body 1 is a main component for realizing a gateway function. The gateway body 1 is disposed in a housing 2, and the housing 2 serves to isolate and protect the gateway body 1.
In the present embodiment, the above-described heat dissipating assembly includes the semiconductor cooling fin 3, the supply air flow generator, and the plurality of heat dissipating fins 5. The shell 2 is provided with a heat radiation opening 6, the semiconductor refrigerating sheet 3 is arranged on the shell 2, the semiconductor refrigerating sheet 3 is arranged at the position of the heat radiation opening 6 in a covering way, the refrigerating surface of the semiconductor refrigerating sheet 3 faces into the shell 2, the heat radiation fins 5 are sequentially and uniformly arranged on the heating surface of the semiconductor refrigerating sheet 3 at intervals, the plurality of heat radiation fins 5 are provided with through holes 7, the plurality of through holes 7 are all positioned on the same axis to form an air supply channel 8, the shell 2 is provided with a mounting rack 9, and the air supply flow generator is aligned with the opening end on one side of the air supply channel 8.
In this embodiment, the semiconductor refrigeration sheet 3 is a heat pump, which is a prior art technology, and uses the Peltier effect of semiconductor materials to absorb heat and release heat at two ends of a couple when direct current passes through the couple formed by connecting two different semiconductor materials in series, so as to realize refrigeration. When refrigerating, the other end face generates heat. Therefore, the cooling surface is the surface of the semiconductor for cooling and absorbing heat, so that the interior of the shell 2 can be effectively cooled, and the heat of the heating surface can be quickly taken away by the heat dissipation fins 5, so that the cooling effect of the semiconductor for cooling the interior of the shell is better. The through holes 7 can form an air supply channel 8, and the air flow generator flows in the air supply channel 8, so that the air flow can take away a large amount of heat on the surface of the radiating fin 5 in the flowing process, and the radiating fin 5 is cooled. After the cooling fin 5 is cooled, the cooling fin can quickly exchange heat with a heating surface to take away heat. The circulation can realize continuous heat dissipation and cooling of the in-shell network main body 1. The above process does not cause the air flow to enter the inside of the housing 2 at all, and also prevents dust and the like from entering the housing 2.
Therefore, this intelligent gateway for thing networking can realize dispelling the heat fast effectual, reduces the gateway temperature and guarantees gateway normal operating, and its heat dissipation process can not make the air current enter into inside the gateway moreover, can not make dust etc. cause the influence to gateway normal operating.
In some implementations of the present embodiment, the blower flow generator includes a blower fan 4 and an air outlet fan 14, the blower fan 4 is disposed at one end of the blower duct 8, and the air outlet fan 14 is disposed at the other end of the blower duct 8.
In this embodiment, the blower fan 4 is used to generate an air flow, and the air flow is sent along one end of the air supply channel 8, so that the air flow flows along the air supply channel 8 under a certain pressure. The air outlet fan 14 is used for generating negative pressure at the other end of the air supply channel 8 and guiding the air flow to be discharged along the negative pressure. Therefore, the air flow can be guided better, the flow speed of the air flow can be increased, and the heat dissipation efficiency is improved.
In some implementations of the present embodiment, a plurality of fine holes 10 are uniformly spaced on any of the heat dissipation fins 5. The plurality of pores 10 can increase the contact area between the air flow and the heat dissipation fins 5, thereby further improving the heat dissipation efficiency.
In some implementations of the present embodiment, the inner wall of the housing 2 is covered with a heat insulating layer 11. In the present embodiment, the heat insulating layer 11 prevents heat exchange between the inside and the outside of the housing 2. After the semiconductor cooling fin 3 is started, the temperature inside the casing 2 is rapidly lowered, and even lowered below the external environment. At this time, the heat insulating layer 11 has a heat insulating effect, and prevents heat exchange between the inside and the outside, thereby increasing the temperature in the housing 2.
In some implementations of the present embodiment, a plurality of temperature detectors 12 are provided on the housing 2. In the present embodiment, the above-described temperature detector 12 is used to detect a temperature change in the housing 2 in real time.
In some implementations of the present embodiment, the same control unit is connected to the plurality of temperature detectors 12, the control unit is connected to a display 13, and the display 13 is disposed on the housing 2. After the temperature detector 12 is connected to the control unit, the control unit can receive the temperature information and analyze and calculate to obtain the temperature information of the flatness in the housing 2. The control unit can judge whether the flatness temperature exceeds the rated value, if so, the control unit judges that the temperature in the shell 2 is too high and controls the display 13 to display that the temperature is too high.
Further, in the present embodiment, the semiconductor refrigeration sheet 3 is connected to a corresponding refrigeration control circuit, and the refrigeration control circuit is connected to the control unit. Thus, when the control unit judges that the temperature in the shell 2 is too high, the unit can control the refrigeration control circuit to work, so that the semiconductor refrigeration piece 3 is electrified to perform refrigeration. Likewise, if the rated value is not exceeded, the control unit controls the refrigeration control circuit to stop operating.
In some implementations of this embodiment, the control unit is connected to a command input. The command input terminal is used for inputting control commands.
When the semiconductor refrigerating device is used, the control unit starts the semiconductor refrigerating piece 3, the refrigerating surface is the surface of the semiconductor for refrigerating and absorbing heat, the interior of the shell 2 can be effectively radiated and cooled, and the radiating fins 5 can rapidly take away the heat of the heating surface, so that the refrigerating effect of the semiconductor for refrigerating the interior of the shell is better. The through holes 7 can form an air supply channel 8, and the air flow generator flows in the air supply channel 8, so that the air flow can take away a large amount of heat on the surface of the radiating fin 5 in the flowing process, and the radiating fin 5 is cooled. After the cooling fin 5 is cooled, the cooling fin can quickly exchange heat with a heating surface to take away heat. The circulation can realize continuous heat dissipation and cooling of the in-shell network main body 1. The above process does not cause the air flow to enter the inside of the housing 2 at all, and also prevents dust and the like from entering the housing 2.
The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (7)
1. The utility model provides an intelligent gateway for internet of things, includes the gateway main part and installs the shell of gateway main part, its characterized in that, including radiator unit, radiator unit includes semiconductor refrigeration piece, air supply flow generator and a plurality of fin, the thermovent has been seted up on the shell, semiconductor refrigeration piece set up in on the shell, just semiconductor refrigeration piece is established the cover and is located thermovent department, the refrigeration face of semiconductor refrigeration piece is towards in the shell, fin in proper order even interval set up in the heating face of semiconductor refrigeration piece, a plurality of the through-hole has all been seted up on the fin, a plurality of the through-hole all is located same axis, forms the air supply passageway, be provided with the mounting bracket on the shell, air supply flow generator aim at in the open end of air supply passageway one side.
2. The intelligent gateway for internet of things according to claim 1, wherein the air-blowing flow generator comprises an air-blowing fan, the air-blowing fan is disposed at one end of the air-blowing passage, and an air-out fan is disposed at the other end of the air-blowing passage.
3. The intelligent gateway for internet of things according to claim 1, wherein a plurality of fine holes are uniformly spaced on any of the heat radiating fins.
4. The intelligent gateway for the internet of things according to claim 1, wherein the inner wall of the housing is covered with a heat insulating layer.
5. The intelligent gateway for internet of things according to any one of claims 1-4, wherein a plurality of temperature detectors are provided on the housing.
6. The intelligent gateway for internet of things according to claim 5, wherein a plurality of the temperature detectors are connected to a same control unit, the control unit is connected to a display, and the display is disposed on the housing.
7. The intelligent gateway for the internet of things according to claim 6, wherein the control unit is connected with a command input terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321211402.7U CN219980840U (en) | 2023-05-18 | 2023-05-18 | Intelligent gateway for Internet of things |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321211402.7U CN219980840U (en) | 2023-05-18 | 2023-05-18 | Intelligent gateway for Internet of things |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219980840U true CN219980840U (en) | 2023-11-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321211402.7U Active CN219980840U (en) | 2023-05-18 | 2023-05-18 | Intelligent gateway for Internet of things |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219980840U (en) |
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2023
- 2023-05-18 CN CN202321211402.7U patent/CN219980840U/en active Active
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