CN220066818U

CN220066818U - Double-row intensive bus duct with efficient heat dissipation

Info

Publication number: CN220066818U
Application number: CN202321142035.XU
Authority: CN
Inventors: 郑有; 王柱; 陈银国
Original assignee: Zhejiang Dongyu Busbar Bridge Co ltd
Current assignee: Zhejiang Dongyu Busbar Bridge Co ltd
Priority date: 2023-05-09
Filing date: 2023-05-09
Publication date: 2023-11-21
Anticipated expiration: 2033-05-09

Abstract

The utility model relates to the technical field of bus duct heat dissipation and discloses a double-row intensive bus duct with high-efficiency heat dissipation, which comprises a bus duct body, wherein a cover plate is arranged on the top surface of the bus duct body, the top surface of the cover plate is fixedly connected with a shell, an axial flow fan is arranged on the top surface of the shell, a guide plate is fixedly connected in the shell, a semiconductor refrigerating sheet is arranged on the top surface of the guide plate, the top surface of the semiconductor refrigerating sheet is fixedly connected with a radiating sheet, fins are fixedly connected on the outer surface of the radiating sheet, a molecular sieve block is arranged in the shell, and an air inlet channel is formed on the outer surface of the molecular sieve block. According to the utility model, the axial flow fan is used for generating negative pressure in the bus duct body and the shell, so that external air is forced to enter the shell from the air holes, and the external air is cooled by the semiconductor refrigerating sheet and the guide plate and then enters the air inlet channel of the molecular sieve block, so that the external air is cooled, and finally dry and cold air is formed to enter the bus duct body for heat dissipation, and the bus duct body has a good heat dissipation effect due to the integral structure.

Description

Double-row intensive bus duct with efficient heat dissipation

Technical Field

The utility model relates to the technical field of bus duct heat dissipation, in particular to a double-row intensive bus duct capable of efficiently dissipating heat.

Background

The bus duct is a closed metal device composed of copper and aluminum bus columns, is used for distributing larger power for each element of a dispersion system, and is increasingly used for replacing wires and cables in the project of indoor low-voltage power transmission trunk engineering, is used as auxiliary equipment of power supply and distribution equipment in industrial and mining, enterprises and public institutions and high-rise buildings, and is particularly suitable for reconstruction of workshops and old enterprises.

Because the internal bus current of the intensive bus duct is larger, a large amount of heat is generated in work, however, the current bus duct has certain heat dissipation performance by means of self materials and the heat dissipation holes are formed in the external surface of the current bus duct to dissipate the heat in the current bus duct, and under the condition of higher weather temperature, the heat dissipation effect cannot be achieved well by purely relying on the bus duct. In view of this, we propose a double-row dense bus duct with efficient heat dissipation to solve the above problems.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides the double-row intensive bus duct with high-efficiency heat dissipation, has the advantages of good heat dissipation effect and the like, and solves the technical problems.

(II) technical scheme

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high-efficient radiating double intensive bus duct, includes the bus duct body, the top surface installation apron of bus duct body, the top surface fixed connection casing of apron, the axial fan is installed to the top surface of casing, just fixed connection baffle in the casing, the semiconductor refrigeration piece is installed to the top surface of baffle, the top surface fixed connection fin of semiconductor refrigeration piece, the surface fixed connection fin of fin, set up the molecular sieve piece in the casing, the inlet channel is seted up to the molecular sieve piece surface, just the top surface of molecular sieve piece sets up the heater, install humidity transducer in the casing, this internal temperature sensor and the controller of setting of bus duct, the bleeder vent is seted up to the both sides face of casing.

Preferably, the upper surface of the cover plate is provided with a plurality of strip-shaped through holes in a penetrating way, and an axial flow fan is arranged above the strip-shaped through holes.

Through the technical scheme, the fan blade of the axial flow fan is positioned in the shell, the lower part of the fan blade is the strip-shaped through hole of the cover plate, when the axial flow fan is started, air in the shell can be pumped through the strip-shaped through hole, the air in the bus duct body can be pumped to the outside, and thus, the outside fresh air enters the shell from the air holes, and then enters the bus duct body through the strip-shaped through hole of the cover plate, so that the air circulation in the bus duct body can be enhanced, and the heat dissipation is facilitated.

Preferably, the guide plate is made of metal copper, and the upper surface of the guide plate is fixedly connected with the cold end of the semiconductor refrigeration piece.

Through the technical scheme, after the outside air enters the shell through the air holes, the cold end of the semiconductor refrigerating sheet can continuously refrigerate the guide plate, the guide plate generates low temperature, and the outside air contacts the guide plate after entering, so that the outside air is further cooled, and heat generated by the hot end of the semiconductor refrigerating sheet is dissipated through the radiating fin and the fin.

Preferably, the left side and the right side of the molecular sieve block are provided with air inlet channels in a penetrating way.

Through above-mentioned technical scheme, outside air is through in semiconductor refrigeration piece and baffle cooling back or enter into the air inlet channel of molecular sieve piece, and molecular sieve piece can absorb the moisture in the cooling air, so makes refrigerated air turn into dry cold air, and then dry cold air is in entering into the bus duct body through the strip through-hole of apron, cools down the busbar, and overall structure makes the cooling effect of busbar good.

Preferably, the heater is electrically connected with the humidity sensor.

Through above-mentioned technical scheme, the moisture in the long-term filtration absorption cooling air of molecular sieve piece can make the molecular sieve piece become moist, can detect the air that flows from the air inlet channel through humidity transducer, if the setting value of humidity transducer is crossed to the moisture in the air, then the heater starts to heat molecular sieve piece, and then makes molecular sieve piece obtain the drying.

Preferably, the temperature sensor, the axial flow fan and the controller are electrically connected.

Through the technical scheme, the temperature sensor can monitor the temperature change in the bus duct body in real time, and if the temperature in the bus duct body rises to exceed the set value of the temperature sensor, the temperature sensor sends a signal to the controller, and the controller immediately starts the axial flow fan, so that heat dissipation can be carried out in the bus duct body.

Compared with the prior art, the utility model provides the double-row intensive bus duct with high-efficiency heat dissipation, which has the following beneficial effects:

1. according to the utility model, the axial flow fan can generate negative pressure in the bus duct body and the shell, so that external air is forced to enter the shell from the air holes, and the external air is cooled by the semiconductor refrigerating sheet and the guide plate and then enters the air inlet channel of the molecular sieve block, so that the external air can be cooled, and finally dry and cold air is formed to enter the bus duct body for heat dissipation, and the bus duct body has a good heat dissipation effect due to the integral structure.

2. According to the utility model, the air flowing out of the air inlet channel can be detected through the humidity sensor, and if the moisture in the air is larger than the set value of the humidity sensor, the heater is started to heat the molecular sieve block, so that the molecular sieve block is dried, and the molecular sieve block can be recycled.

Drawings

FIG. 1 is a schematic perspective view of the structure of the present utility model;

FIG. 2 is a schematic top view of the structure of the present utility model;

FIG. 3 is a schematic cross-sectional view of the structure of the present utility model.

Wherein: 1. a bus duct body; 2. a cover plate; 3. a housing; 4. an axial flow fan; 5. a guide plate; 6. a semiconductor refrigeration sheet; 7. a heat sink; 8. a fin; 9. a molecular sieve block; 10. an air intake passage; 11. a heater; 12. a humidity sensor; 13. a temperature sensor; 14. a controller; 15. and (5) ventilation holes.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, a high-efficiency radiating double-row intensive bus duct comprises a bus duct body 1, a cover plate 2 is installed on the top surface of the bus duct body 1, the top surface of the cover plate 2 is fixedly connected with a shell 3, an axial flow fan 4 is installed on the top surface of the shell 3, a guide plate 5 is fixedly connected in the shell 3, a semiconductor refrigerating sheet 6 is installed on the top surface of the guide plate 5, a radiating fin 7 is fixedly connected with the outer surface of the radiating fin 7, a molecular sieve block 9 is arranged in the shell 3, an air inlet channel 10 is formed in the outer surface of the molecular sieve block 9, a heater 11 is arranged on the top surface of the molecular sieve block 9, a humidity sensor 12 is installed in the shell 3, a temperature sensor 13 and a controller 14 are arranged in the bus duct body 1, and ventilation holes 15 are formed in two side surfaces of the shell 3.

Specifically, the upper surface of the cover plate 2 is provided with a plurality of strip-shaped through holes in a penetrating way, and an axial flow fan 4 is arranged above the strip-shaped through holes. The advantage is that the flabellum of axial fan 4 is in casing 3, and the below of flabellum is the strip through-hole of apron 2, can pump the air in the casing 3 after axial fan 4 starts, can pump the air in the bus duct body 1 through the strip through-hole, so can pump the hot air in the bus duct body 1 to outside, external fresh air gets into in the casing 3 from bleeder vent 15, and then enters into the bus duct body 1 through the strip through-hole of apron 2, so can strengthen the circulation of air in the bus duct body 1, is favorable to the heat dissipation.

Specifically, the guide plate 5 is made of metal copper, and the upper surface of the guide plate 5 is fixedly connected with the cold end of the semiconductor refrigerating sheet 6. The advantage is, after the external air enters into casing 3 through bleeder vent 15, the cold junction of semiconductor refrigeration piece 6 can constantly refrigerate baffle 5, and baffle 5 produces the low temperature, and the external air contacts baffle 5 after entering to further cool off external air, the heat that the hot junction of semiconductor refrigeration piece 6 produced is distributed away through fin 7 and fin 8.

Specifically, the left and right sides of the molecular sieve block 9 are provided with air inlet passages 10. The advantage is, in the air inlet channel 10 of molecular sieve piece 9 is cooled down after the outside air passes through semiconductor refrigeration piece 6 and baffle 5 or enters into, the molecular sieve piece 9 can absorb the moisture in the cooling air, so make the cooling air turn into dry cold air, in the dry cold air enters into bus duct body 1 through the strip through-hole of apron 2 afterwards, cool down the generating line, overall structure makes the cooling effect of generating line good.

Specifically, the heater 11 is electrically connected to the humidity sensor 12. The molecular sieve block 9 has the advantages that moisture in the cooling air is filtered and adsorbed for a long time by the molecular sieve block 9, so that the molecular sieve block 9 becomes wet, the air flowing out of the air inlet channel 10 can be detected by the humidity sensor 12, and if the moisture in the air is larger than the set value of the humidity sensor 12, the heater 11 is started to heat the molecular sieve block 9, so that the molecular sieve block 9 is dried.

Specifically, the temperature sensor 13, the axial fan 4 and the controller 14 are electrically connected. The temperature sensor 13 has the advantages that the temperature sensor 13 can monitor the temperature change in the bus duct body 1 in real time, and if the temperature in the bus duct body 1 rises to exceed the set value of the temperature sensor 13, the temperature sensor 13 sends a signal to the controller 14, and the controller 14 immediately starts the axial flow fan 4, so that heat dissipation can be performed in the bus duct body 1.

When the device is used, firstly, the temperature sensor 13 monitors the temperature change in the bus duct body 1 in real time, if the temperature exceeds a set value, the controller 14 immediately starts the axial flow fan 4, the axial flow fan 4 enables the shell 3 and the bus duct body 1 to generate negative pressure, external air is forced to enter the shell 3 from the air holes 15, the cold end of the semiconductor refrigerating sheet 6 can continuously refrigerate the guide plate 5, the guide plate 5 generates low temperature, the external air is contacted with the guide plate 5 after entering, so that the external air is further cooled, then the air in a cold area enters the air inlet channel 10 of the molecular sieve block 9, the molecular sieve block 9 can absorb moisture in the cooling air, so that the cooled air is converted into dry cooling air, and finally the dry cooling air enters the bus duct body 1 through the strip-shaped through holes of the cover plate 2 to cool the bus; the humidity sensor 12 can detect the air flowing out of the air inlet channel 10, and if the moisture in the air is larger than the set value of the humidity sensor 12, the heater 11 is started to heat the molecular sieve block 9, so that the molecular sieve block 9 is dried.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high-efficient radiating double intensive bus duct, includes bus duct body (1), its characterized in that: the bus duct comprises a bus duct body (1), wherein a cover plate (2) is arranged on the top surface of the bus duct body (1), a shell (3) is fixedly connected with the top surface of the cover plate (2), an axial flow fan (4) is arranged on the top surface of the shell (3), a guide plate (5) is fixedly connected in the shell (3), a semiconductor refrigerating sheet (6) is arranged on the top surface of the guide plate (5), a radiating fin (7) is fixedly connected with the top surface of the semiconductor refrigerating sheet (6), a fin (8) is fixedly connected with the outer surface of the radiating fin (7), a molecular sieve block (9) is arranged in the shell (3), an air inlet channel (10) is formed in the outer surface of the molecular sieve block (9), a heater (11) is arranged on the top surface of the molecular sieve block (9), a humidity sensor (12) is arranged in the shell (3), a temperature sensor (13) and a controller (14) are arranged in the bus duct body (1), and ventilation holes (15) are formed in two side surfaces of the shell (3).

2. The efficient heat dissipation double-row intensive bus duct as set forth in claim 1, wherein: the upper surface of apron (2) runs through and sets up a plurality of strip through-hole, the top of strip through-hole sets up axial fan (4).

3. The efficient heat dissipation double-row intensive bus duct as set forth in claim 1, wherein: the guide plate (5) is made of metal copper, and the upper surface of the guide plate (5) is fixedly connected with the cold end of the semiconductor refrigerating sheet (6).

4. The efficient heat dissipation double-row intensive bus duct as set forth in claim 1, wherein: the left side and the right side of the molecular sieve block (9) are provided with air inlet channels (10) in a penetrating way.

5. The efficient heat dissipation double-row intensive bus duct as set forth in claim 1, wherein: the heater (11) is electrically connected with the humidity sensor (12).

6. The efficient heat dissipation double-row intensive bus duct as set forth in claim 1, wherein: the temperature sensor (13), the axial flow fan (4) and the controller (14) are electrically connected.