CN205540494U - Novel quick -witted case of double -deck high -efficient heat dissipation - Google Patents
Novel quick -witted case of double -deck high -efficient heat dissipation Download PDFInfo
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- CN205540494U CN205540494U CN201620243450.8U CN201620243450U CN205540494U CN 205540494 U CN205540494 U CN 205540494U CN 201620243450 U CN201620243450 U CN 201620243450U CN 205540494 U CN205540494 U CN 205540494U
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Abstract
本实用新型公开了一种新型双层高效散热机箱,包括机箱主体和设于机箱主体中部的主体内腔,其特征在于:所述的主体内腔两侧设置有左散热腔和右散热腔,下方设置有下散热腔,所述的左散热腔、右散热腔和下散热腔内设置有至少一组散热扇组。本实用新型的全方位安装有多台散热风扇,有效提高机箱内外的空气对流速度,极大提高机箱的散热性能、有效延长机体使用寿命。
The utility model discloses a novel double-layer high-efficiency cooling case, which comprises a main body of the case and a main body inner cavity arranged in the middle of the main body of the case. A lower heat dissipation chamber is arranged below, and at least one set of heat dissipation fan groups is arranged in the left heat dissipation chamber, the right heat dissipation chamber and the lower heat dissipation chamber. The utility model is equipped with multiple cooling fans in all directions, which can effectively increase the air convection speed inside and outside the case, greatly improve the heat dissipation performance of the case, and effectively prolong the service life of the machine body.
Description
技术领域technical field
本实用新型涉及电脑机箱结构,尤其是一种新型双层高效散热机箱。The utility model relates to a computer case structure, in particular to a novel double-layer high-efficiency heat dissipation case.
背景技术Background technique
随着电子技术的发展,各种集成电路芯片及电路模块不断涌现,集成电路芯片及电路模块的运算速度不断提升及消耗功率不断增大,相应的散热也随着剧增。为了使其能在正常工作温度下工作,通常在上述发热器件上安装散热器,一般的机箱只安装1-2个散热扇,使机箱内部散热效果不佳,极大影响电脑内部元器件的使用寿命。With the development of electronic technology, various integrated circuit chips and circuit modules continue to emerge. The computing speed and power consumption of integrated circuit chips and circuit modules continue to increase, and the corresponding heat dissipation also increases dramatically. In order to make it work under normal operating temperature, a radiator is usually installed on the above-mentioned heat-generating device, and only 1-2 cooling fans are installed in the general case, which makes the heat dissipation effect inside the case poor, which greatly affects the use of internal components of the computer life.
实用新型内容Utility model content
本实用新型的目的在于针对现有技术的不足,提供一种散热性好、实用性强的一种新型双层高效散热机箱。The purpose of the utility model is to provide a novel double-layer high-efficiency heat dissipation cabinet with good heat dissipation and strong practicability aiming at the deficiencies of the prior art.
为达到上述目的,本实用新型通过以下技术方案实现:In order to achieve the above object, the utility model is realized through the following technical solutions:
一种新型双层高效散热机箱,包括机箱主体和设于机箱主体中部的主体内腔,其特征在于:所述的主体内腔两侧设置有左散热腔和右散热腔,下方设置有下散热腔,所述的左散热腔、右散热腔和下散热腔内设置有至少一组散热扇组。A new double-layer high-efficiency heat dissipation chassis, including a chassis main body and a main body inner cavity located in the middle of the chassis main body, characterized in that: a left heat dissipation chamber and a right heat dissipation cavity are arranged on both sides of the main body inner cavity, and a lower heat dissipation chamber is arranged below Cavity, at least one set of heat dissipation fan groups is arranged in the left heat dissipation chamber, the right heat dissipation chamber and the lower heat dissipation chamber.
进一步说明,所述的左散热腔由左外侧板和左内腔板组成,所述的左外侧板上安装有散热扇组。To further illustrate, the left cooling cavity is composed of a left outer plate and a left inner cavity plate, and a cooling fan group is installed on the left outer plate.
进一步说明,所述的右散热腔由右外侧板和右内腔板组成,所述的右外侧板和右内腔板上均安装有散热扇组。To further illustrate, the right heat dissipation cavity is composed of a right outer plate and a right inner cavity plate, both of which are equipped with cooling fan groups.
进一步说明,所述的下散热腔由左侧板、右侧板以及顶板组成,所述的左侧板、右侧板以及顶板上均安装有散热扇组。To further illustrate, the lower cooling cavity is composed of a left side panel, a right side panel and a top panel, and the left side panel, the right side panel and the top panel are all equipped with cooling fan groups.
进一步说明,所述的左外侧板、右外侧板、右内腔板、左侧板、右侧板以及顶板上均开设有通风孔。To further illustrate, the left outer panel, the right outer panel, the right inner cavity panel, the left panel, the right panel and the top panel are all provided with ventilation holes.
进一步说明,所述的散热扇组包括有散热扇,所述的散热扇通过安装板安装于左外侧板、右外侧板以及右内腔板上,且所述的散热扇位于通风孔内。To further illustrate, the heat dissipation fan group includes a heat dissipation fan, the heat dissipation fan is installed on the left outer plate, the right outer plate and the right inner cavity plate through the mounting plate, and the heat dissipation fan is located in the ventilation hole.
本实用新型的双层高效散热机箱具有以下有益效果:The double-layer high-efficiency heat dissipation chassis of the utility model has the following beneficial effects:
1、机箱上设有多个安装风扇的散热腔,可以装下更多的风扇,增加机箱内外的空气对流速度,极大提高机箱的散热性能、有效延长机体使用寿命。1. There are multiple heat dissipation chambers for installing fans on the chassis, which can accommodate more fans, increase the air convection speed inside and outside the chassis, greatly improve the heat dissipation performance of the chassis, and effectively extend the service life of the body.
2、导线可以隐藏于散热腔内,使机箱更美观。2. The wires can be hidden in the heat dissipation chamber to make the case more beautiful.
附图说明Description of drawings
图1是本实用新型的整体示意图。Fig. 1 is the overall schematic diagram of the utility model.
图2是本实用新型的俯视全剖图。Fig. 2 is a top view full sectional view of the utility model.
图3是本实用新型的左视图。Fig. 3 is a left view of the utility model.
图4是本实用新型的机箱主体去除散热扇视图图。Fig. 4 is a view of the chassis main body of the present invention without the cooling fan.
图5是本实用新型的安装板整体示意图。Fig. 5 is an overall schematic diagram of the mounting plate of the present invention.
具体实施方式detailed description
为了对本实用新型的结构、特征及其功效,能有更进一步地了解和认识,现举一较佳实施例,并结合附图详细说明如下:In order to have a further understanding and understanding of the structure, features and effects of the present utility model, a preferred embodiment is now given, and detailed description is as follows in conjunction with the accompanying drawings:
如图1、图2、图3、图4和图5所示,本实施例所描述的一种新型双层高效散热机箱,它主要包括机箱主体1和设于机箱主体1中部的主体内腔2,主体内腔2两侧设置有左散热腔3和右散热腔4,下方设置有下散热腔5,左散热腔3、右散热腔4和下散热腔5内设置有至少一组散热扇组;As shown in Fig. 1, Fig. 2, Fig. 3, Fig. 4 and Fig. 5, a new double-layer high-efficiency heat dissipation chassis described in this embodiment mainly includes a chassis main body 1 and a main body cavity located in the middle of the chassis main body 1 2. There are left heat dissipation chamber 3 and right heat dissipation chamber 4 on both sides of the main body inner cavity 2, and a lower heat dissipation chamber 5 is arranged below, and at least one set of heat dissipation fans are arranged in the left heat dissipation chamber 3, right heat dissipation chamber 4 and lower heat dissipation chamber 5 Group;
左散热腔3由左外侧板6和左内腔板7组成,右散热腔4由右外侧板8和右内腔板9组成,下散热腔5由左侧板10、右侧板11以及顶板12组成,左外侧板6、右外侧板8、右内腔板9、左侧板10、右侧板11以及顶板12上均安装有散热扇组;The left cooling cavity 3 is composed of the left outer plate 6 and the left inner cavity plate 7, the right cooling cavity 4 is composed of the right outer plate 8 and the right inner cavity plate 9, and the lower cooling cavity 5 is composed of the left side plate 10, the right side plate 11 and the top plate 12 components, the left outer plate 6, the right outer plate 8, the right inner cavity plate 9, the left side plate 10, the right side plate 11 and the top plate 12 are all equipped with cooling fan groups;
左外侧板6、右外侧板8、右内腔板9、左侧板10、右侧板11以及顶板12上均开设有通风孔13;The left outer panel 6, the right outer panel 8, the right inner cavity panel 9, the left panel 10, the right panel 11 and the top panel 12 are provided with ventilation holes 13;
散热扇组包括有散热扇14,该散热扇14设置三台,散热扇14通过安装板15安装于左外侧板6、右外侧板8以及右内腔板9上,且散热扇14位于通风孔13内;The radiating fan group includes a radiating fan 14, and the radiating fan 14 is provided with three sets. The radiating fan 14 is installed on the left outer plate 6, the right outer plate 8 and the right inner cavity plate 9 through the mounting plate 15, and the radiating fan 14 is positioned at the ventilation hole. within 13;
安装板15上设置有安装散热扇14的安装孔a 16以及与左外侧板6、右外侧板8和右内腔板9固定安装的安装孔b 17;The mounting plate 15 is provided with a mounting hole a 16 for installing the cooling fan 14 and a mounting hole b 17 fixedly installed with the left outer plate 6, the right outer plate 8 and the right inner cavity plate 9;
左侧板10、右侧板11以及顶板12上预留有多个安装散热扇14的安装孔c 18。A plurality of installation holes c 18 for installing the cooling fan 14 are reserved on the left side board 10 , the right side board 11 and the top board 12 .
以上所述仅为本实用新型之较佳实施例而已,并非以此限制本实用新型的实施范围,凡熟悉此项技术者,运用本实用新型的原则及技术特征,所作的各种变更及装饰,皆应涵盖于本权利要求书所界定的保护范畴之内。The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the scope of implementation of the present utility model. Those who are familiar with this technology can use the principles and technical characteristics of the present utility model to make various changes and decorations. , should be covered within the scope of protection defined in the claims.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620243450.8U CN205540494U (en) | 2016-03-28 | 2016-03-28 | Novel quick -witted case of double -deck high -efficient heat dissipation |
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| CN201620243450.8U CN205540494U (en) | 2016-03-28 | 2016-03-28 | Novel quick -witted case of double -deck high -efficient heat dissipation |
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| CN205540494U true CN205540494U (en) | 2016-08-31 |
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| CN201620243450.8U Expired - Lifetime CN205540494U (en) | 2016-03-28 | 2016-03-28 | Novel quick -witted case of double -deck high -efficient heat dissipation |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109739317A (en) * | 2019-01-25 | 2019-05-10 | 南阳理工学院 | A combined computer main box with all-round heat dissipation capability |
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2016
- 2016-03-28 CN CN201620243450.8U patent/CN205540494U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109739317A (en) * | 2019-01-25 | 2019-05-10 | 南阳理工学院 | A combined computer main box with all-round heat dissipation capability |
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Granted publication date: 20160831 |