CN218388060U - Built-in PCB heat radiation structure of heating box - Google Patents
Built-in PCB heat radiation structure of heating box Download PDFInfo
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- CN218388060U CN218388060U CN202222088460.7U CN202222088460U CN218388060U CN 218388060 U CN218388060 U CN 218388060U CN 202222088460 U CN202222088460 U CN 202222088460U CN 218388060 U CN218388060 U CN 218388060U
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- pcb
- heat dissipation
- air duct
- pcb board
- wind channel
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 64
- 230000005855 radiation Effects 0.000 title claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims abstract description 90
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000001816 cooling Methods 0.000 abstract description 10
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 230000002035 prolonged effect Effects 0.000 abstract 1
- XBVSGJGMWSKAKL-UHFFFAOYSA-N 1,3,5-trichloro-2-(3,5-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(C=2C(=CC(Cl)=CC=2Cl)Cl)=C1 XBVSGJGMWSKAKL-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- REHONNLQRWTIFF-UHFFFAOYSA-N 3,3',4,4',5-pentachlorobiphenyl Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC(Cl)=C(Cl)C(Cl)=C1 REHONNLQRWTIFF-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003434 inspiratory effect Effects 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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Abstract
The utility model relates to a built-in PCB board heat radiation structure of heating box, heating box include the shell and set up the wind channel device in the shell, and the wind channel device includes wind channel PCB board, and from last wind channel, axial fan, heating pipe and the lower wind channel that sets gradually extremely down, and built-in PCB board heat radiation structure includes: the air duct PCB is arranged in an air duct PCB cavity enclosed by the side surface of the shell and a semi-closed cavity at the connecting side of the upper air duct and the lower air duct, and the fan PCB is fixed at the central position of the lower air duct. Through the utility model discloses a by the wind channel PCB board cold wind flow direction of heat dissipation grid, wind channel PCB board cavity, the first radiating hole formation and by axial fan, second louvre, first heat dissipation breach, heat dissipation track, second heat dissipation breach, wind channel PCB board cavity, the fan PCB board cold wind flow direction that heat dissipation grid and/or first radiating hole formation realized cooling wind channel PCB board and fan PCB board, made its temperature state work that is fit for and prolonged its life.
Description
Technical Field
The utility model relates to a heating technical field, concretely relates to built-in PCB board heat radiation structure of heating box.
Background
In the areas without central heating, single or multi-person heating equipment is commonly adopted, the overall temperature of the heating equipment in the box body is higher when the heating equipment is used, partial accessories in the box body, particularly a PCB (printed Circuit Board), are easy to be shortened in service life or directly damaged, and the heating equipment needs to be maintained frequently or shortened in service life.
SUMMERY OF THE UTILITY MODEL
In order to solve among the prior art heating installation box because of the higher defect that shortens or directly damages to the built-in PCB board life-span of box internal temperature, the utility model discloses a set up PCB board heat radiation structure in order to reduce PCB board place area temperature in the heating box.
The utility model provides a technical scheme that its technical problem adopted as follows:
the utility model provides a built-in PCB board heat radiation structure of heating box, heating box include the shell and set up the wind channel device in the shell, and the wind channel device includes wind channel PCB board, reaches from last to last wind channel, axial fan, heating pipe and the lower wind channel that sets gradually down, and built-in PCB board heat radiation structure includes: the air duct PCB is arranged in an air duct PCB cavity enclosed by the side surface of the shell and the semi-closed cavity at the connecting side of the upper air duct and the lower air duct, so that the air duct PCB is isolated from a high-temperature area.
Further, the built-in PCB heat radiation structure further comprises: the side of the air duct PCB board cavity on the side face of the shell is provided with a heat dissipation grid, cold air flows into the air duct PCB board cavity through the heat dissipation grid, and warm air in the air duct PCB board cavity is discharged out of the box body.
Further, the built-in PCB heat radiation structure further comprises: a plurality of first radiating holes which are arranged side by side at intervals are formed in the upper portion of the side of the air duct PCB cavity of the upper air duct, and the radiating grids, the air duct PCB cavity and the first radiating holes jointly form an air duct PCB cold air flow direction.
Further, the built-in PCB heat radiation structure further comprises: the cold end of the heating pipe faces towards the air duct PCB cavity, and the influence of the heating pipe on the air duct PCB cavity is reduced.
Further, the air duct device further includes a fan PCB board connected to the axial fan, so that the heat dissipation structure of the built-in PCB board further includes: the fan PCB is fixed at the central position of the lower air duct, so that the fan PCB is positioned in a relatively cold area of the air duct device.
Further, the built-in PCB heat radiation structure still includes: the lower air duct is provided with a plurality of second radiating holes which are arranged at intervals along the peripheral side of the fan PCB board, so that when cold air sucked by the upper air duct passes through the axial flow fan, part of the cold air flows through the lower air duct through the second radiating holes, and the fan PCB board is cooled.
Further, the built-in PCB heat radiation structure still includes: and a heat dissipation track is arranged between the lower surface of the lower air duct and the cavity side of the air duct PCB facing the periphery of the air duct PCB from the periphery side of the fan PCB facing the periphery of the air duct PCB, and cold air flowing through the lower air duct from the second heat dissipation hole is guided to enter the cavity of the air duct PCB.
Further, the heat dissipation track includes: the lower air channel faces towards the outer peripheral side of a fan PCB of the air channel PCB cavity is provided with a first heat dissipation notch, the lower air channel faces towards the periphery of the fan PCB, the side of the fan PCB cavity is provided with a second heat dissipation notch, the lower air channel lower surface from the first heat dissipation notch to the second heat dissipation notch is set to be a slope from low to high, and the slope can guide more cold air to flow into the air channel PCB cavity from the second heat dissipation hole through the heat dissipation track.
The beneficial effects of the utility model are that:
in a first aspect, the utility model discloses a wind channel PCB board cold wind flow direction that heat dissipation grid, wind channel PCB board cavity, first radiating hole formed flows through the wind channel PCB board with the outer cold air of box and realizes cooling duct PCB board to make the wind channel PCB board at the temperature state work that is fit for and prolong the life of wind channel PCB board.
The second aspect, the utility model discloses an axial fan, the second louvre, first heat dissipation breach, heat dissipation track, second heat dissipation breach, wind channel PCB board cavity, the fan PCB board cold wind flow direction that heat dissipation grid and/or first heat dissipation hole formed will go up the inspiratory cold air flow of wind channel and cool off fan PCB board when fan PCB board and wind channel PCB board cavity realization cooling fan PCB board to make fan PCB board and wind channel PCB board work and prolong its life at suitable temperature state.
Drawings
FIG. 1 is a schematic structural view of a heating box provided by an embodiment of the present invention;
fig. 2 is a schematic view of a heat dissipation structure of a PCB board of an air duct provided in an embodiment of the present invention;
fig. 3 is a half-sectional view of a heat dissipation structure of a PCB board of an air duct according to an embodiment of the present invention;
fig. 4 is a schematic view of a heat dissipation structure of a PCB board of a fan according to an embodiment of the present invention;
reference numerals:
1-a heating box body; 11-a housing; 12-an air duct device; 121-duct PCB; 122-upper air duct; 123-axial fan; 124-heating pipes; 125-lower air duct; 126-air duct PCB board cavity; 111-a heat dissipation grid; 1221-first louvers; 1241-heating the cold end of the tube; 1211-air duct PCB cold air flow direction; 1231-fan PCB board; 1251-second louvers; 1252-heat sink rails; 1253-first heat dissipation notch; 1254-second heat dissipation gap.
Detailed Description
The invention will be further described with reference to the accompanying drawings and the following detailed description:
referring to fig. 1, fig. 2 and fig. 3, the utility model provides a built-in PCB board heat radiation structure of heating box, heating box 1 includes shell 11 and the air duct device 12 who sets up in the shell, and air duct device 12 includes wind channel PCB board 121, and from last wind channel 122, axial fan 123, heating pipe 124 and the lower wind channel 125 that sets gradually under to, and built-in PCB board heat radiation structure includes: the air duct PCB board 121 is disposed in an air duct PCB board cavity 126 defined by the side of the housing 11 and the semi-closed cavity at the side where the upper air duct 122 and the lower air duct 125 are connected, thereby isolating the air duct PCB board 121 from a high temperature area.
Specifically, the heating box 1 and the air duct device 12 thereof work on the principle that the upper air duct 122 is provided with an air inlet, the axial flow fan 123 discharges air, the heating pipe 124 heats, hot air is heated by the cooperation of the upper air duct and the lower air duct, and the hot air is heated by cold air through the close-closed state of the use mode, so that the heating body can be heated discontinuously, the axial flow fan 123 blows continuously, the energy-saving heat preservation effect is realized, or the heating pipe 124 reduces the self heating power according to the temperature rise through constant temperature, and the energy-saving constant temperature effect is realized. However, in such a close-closed state, the air duct PCB 121 and the fan PCB 1231 built in the heating cabinet 1 are in a high temperature state for a long time, and are easily damaged or have a short service life. The air duct PCB 121 is placed in the air duct PCB cavity 126 to be isolated from the warm air area, so that the air duct PCB 121 is located in a relatively low temperature area in the heating box 1 and is protected.
Preferably, the built-in PCB heat dissipation structure further includes: the side of the air duct PCB cavity 126 on the side of the housing 11 is provided with a heat dissipation grid 111, and cold air flows into the air duct PCB cavity 126 through the heat dissipation grid 111 and relatively warm air in the air duct PCB cavity 126 is discharged out of the heating box 1.
Specifically, the heat dissipation grids 111 can convect the cold air outside the heating box 1 and the relatively warm air inside the air duct PCB cavity 126, thereby cooling the air duct PCB 121, and meanwhile, the heat dissipation grids 111 have a function of protecting the air duct PCB 121 from being damaged by the invasion of foreign objects.
Preferably, the built-in PCB board heat dissipation structure further includes: the upper portion of the air duct PCB cavity 126 side of the upper air duct 122 is provided with a plurality of first heat dissipation holes 1221 spaced side by side, and the heat dissipation grid 111, the air duct PCB cavity 126 and the first heat dissipation holes 1221 together form a cold air flow direction of the air duct PCB 121.
Specifically, cold air flows out of the upper air duct 122 through the heat dissipation grid 111, the air duct PCB board cavity 126 and the first heat dissipation holes 1221, and during wind, the cold air can also flow out of the heat dissipation grid 111 through the first heat dissipation holes 1221 and the air duct PCB board cavity 126, so that relatively warm air in the air duct PCB board cavity 126 can flow out through the heat dissipation grid 1111221 and/or the first heat dissipation holes.
Preferably, the built-in PCB board heat dissipation structure further includes: the heat pipe cold end 1241 faces the duct PCB board cavity 126, reducing the effect of the heat pipe 124 on the temperature of the duct PCB board cavity 126.
Specifically, in order to make the heating tube 124 in a safe working state, the conductive circuit and the heating wire are separated in design, the conductive circuit part is the cooling tube cold end 1241, and the cooling tube cold end 1241 faces the air duct PCB board 121, so that heating of the air duct PCB board cavity 126 is greatly reduced.
Preferably, referring to fig. 4, the air duct device 12 further includes a fan PCB 1231 connected to the axial fan 123, so that the built-in PCB heat dissipation structure further includes: the fan PCB 1231 is fixed to the center of the lower duct 125 such that the fan PCB 1231 is located in a relatively cool area of the heating cabinet.
Specifically, the cold air from the axial fan 123 is heated by the heating pipe 124, diffused and output to the heating box 1, and is located at the center of the lower air duct 125 where the cold air is collected, which is a relatively cold area in the heating box 1.
Preferably, the built-in PCB board heat dissipation structure further includes: the lower duct 125 is provided with a plurality of second heat dissipation holes 1251 arranged at intervals along the outer circumferential side of the fan PCB 1231, so that the cool air sucked in the upper duct 122 partially flows through the lower duct 125 through the second heat dissipation holes 1251 when passing through the axial fan 123, thereby cooling the fan PCB 1231.
Specifically, although the fan PCB 1231 is located in a relatively cold area at the center of the lower air duct 125, since the whole heating cabinet 1 is at a high temperature, the cold air collected at the center of the lower air duct 125 gradually becomes hot, and the fan PCB 1231 still treats a state of a high temperature, and needs to keep continuously cooling the cold air. By providing the second heat dissipation hole 1251 at the periphery of the fan PCB 1231, a part of the cold air passing through the axial flow fan 123 can continuously flow out of the lower air duct 125 through the second heat dissipation hole 1251, thereby continuously cooling the fan PCB 1231.
Preferably, the built-in PCB board heat dissipation structure further includes: a heat dissipation rail 1252 is provided on the lower surface of the lower duct 125 from the outer peripheral side of the fan PCB 1231 facing the duct PCB cavity 126 to the side of the duct PCB cavity 126 facing the outer periphery of the fan PCB 1231, so as to guide the cold air flowing through the lower duct 125 from the second heat dissipation hole 1251 into the duct PCB cavity 126.
Specifically, the cold air flowing out of the lower air duct 125 through the second heat dissipation holes 1251 can cool the warm air of the heating box 1 to influence the heating effect or increase the heating power, and the heat dissipation rails 1252 are adopted to guide the cold air to the air duct PCB cavity 126, so that on one hand, the influence of the cold air to the heating effect in the heating box 1 is reduced, and on the other hand, the air duct PCB 121 can be cooled.
Further, the heat dissipation rail 1252 includes: the first heat dissipation notch 1252 is arranged on the outer peripheral side of the fan PCB 1231 of the lower air duct 125 facing the air duct PCB cavity 126, the second heat dissipation notch 1254 is arranged on the side of the air duct PCB cavity 126 facing the periphery of the fan PCB 1231 of the lower air duct 125, the lower surface of the lower air duct 125 from the first heat dissipation notch 1253 to the second heat dissipation notch 1254 is set to be a slope from low to high, and the slope can guide more cold air to flow to the air duct PCB cavity 126 from the second heat dissipation notch 1251 through the heat dissipation rail 1252.
Specifically, a slope surface from low to high is adopted, so that cold air can flow out from low to high along the heat dissipation track 1252 to form a relatively concentrated wind pressure, and the guiding effect is better.
In sum, as a novel heating device, the air duct PCB 126 is independently placed in a cavity in consideration of the overall safety in the use state of power-on heating, so that the safety of temperature resistance, flame retardance and the like in the use state is ensured. In order to ensure the air circulation of the air duct PCB 121 in the use state, the air duct PCB cavity 126 is integrally located on the side of the heating box 1, the ventilation and heat dissipation grid 111 is arranged on the side panel of the heating box 1, and the upper air duct 122 is provided with the first heat dissipation hole 1221. The axial fan 123 is disposed in the accommodating cavity between the upper air duct 122 and the lower air duct 125, the fan PCB 1231 is fixed at the center of the lower air duct 125, considering that the fan PCB is located in the heating box 1, and the axial fan 123 and the fan PCB 1231 can generate a certain amount of heat during operation, considering the safety of the fan PCB 1231 under use, the lower air duct 125 is provided with the second heat dissipation holes 1251 which are arranged intermittently, while ensuring installation, the heat is dissipated below the lower air duct 125, meanwhile, the lower surface of the lower air duct 125 is provided with the heat dissipation rail 1252 connected to the air duct PCB cavity 126, the heat on the fan PCB 1231 is transferred outwards through the second heat dissipation holes 1251 and the heat dissipation rail 1252, and the outside cold air can also reach the fan PCB 1231 through the heat dissipation rail 1252 and the second heat dissipation holes 1251, so as to achieve the cooling effect.
Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes are intended to fall within the scope of the claims.
It should be noted that: the embodiments described above are only a part of the embodiments of the present invention, and not all of them. As used in the examples and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Claims (8)
1. The built-in PCB board heat radiation structure of heating box, the heating box includes the shell and sets up the wind channel device in the shell, the wind channel device includes wind channel PCB board, and from last wind channel, axial fan, heating pipe and the lower wind channel that sets gradually extremely down, its characterized in that, built-in PCB board heat radiation structure includes: the air duct PCB is arranged in an air duct PCB cavity enclosed by the side surface of the shell and a semi-closed cavity at the connecting side of the upper air duct and the lower air duct.
2. The built-in PCB panel heat dissipation structure of heating cabinet of claim 1, further comprising: and a heat dissipation grid is arranged on the cavity side of the air duct PCB on the side surface of the shell.
3. The built-in PCB panel heat dissipation structure of heating cabinet of claim 2, wherein the built-in PCB panel heat dissipation structure further comprises: the upper portion of the cavity side of the air duct PCB board of the upper air duct is provided with a plurality of first heat dissipation holes which are arranged side by side at intervals.
4. The built-in PCB panel heat dissipation structure of heating cabinet of claim 1, further comprising: the cold end of the heating pipe faces towards the air duct PCB cavity.
5. The built-in PCB panel heat dissipation structure of heating cabinet of claim 1, wherein the air duct device further comprises a fan PCB panel, the built-in PCB panel heat dissipation structure further comprising: the fan PCB is fixed at the center of the lower air duct.
6. The built-in PCB heat dissipation structure of heating box of claim 5, further comprising: and the lower air duct is provided with a plurality of second heat dissipation holes which are arranged at intervals along the peripheral side of the fan PCB.
7. The built-in PCB heat dissipation structure of heating box of claim 5, further comprising: and a heat dissipation track is arranged between the lower surface of the lower air duct and the side of the air duct PCB cavity facing the periphery of the fan PCB cavity.
8. The built-in PCB panel heat dissipation structure of heating cabinet of claim 7, wherein the heat dissipation rail comprises: the fan PCB board periphery is gone up the orientation wind channel PCB board cavity side sets up first heat dissipation breach, down the wind channel orientation fan PCB board periphery fan PCB board cavity side sets up the second heat dissipation breach, will follow first heat dissipation breach to the lower wind channel lower surface of second heat dissipation breach set up to domatic by low to high.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222088460.7U CN218388060U (en) | 2022-08-09 | 2022-08-09 | Built-in PCB heat radiation structure of heating box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222088460.7U CN218388060U (en) | 2022-08-09 | 2022-08-09 | Built-in PCB heat radiation structure of heating box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218388060U true CN218388060U (en) | 2023-01-24 |
Family
ID=84966248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222088460.7U Active CN218388060U (en) | 2022-08-09 | 2022-08-09 | Built-in PCB heat radiation structure of heating box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218388060U (en) |
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2022
- 2022-08-09 CN CN202222088460.7U patent/CN218388060U/en active Active
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