CN108541200B - High-efficient compound heat dissipation circuit board - Google Patents
High-efficient compound heat dissipation circuit board Download PDFInfo
- Publication number
- CN108541200B CN108541200B CN201810677690.2A CN201810677690A CN108541200B CN 108541200 B CN108541200 B CN 108541200B CN 201810677690 A CN201810677690 A CN 201810677690A CN 108541200 B CN108541200 B CN 108541200B
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- China
- Prior art keywords
- circuit board
- temperature sensor
- liquid
- valve
- heat dissipation
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Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 49
- 150000001875 compounds Chemical class 0.000 title description 3
- 239000000110 cooling liquid Substances 0.000 claims abstract description 30
- 238000009423 ventilation Methods 0.000 claims abstract description 21
- 239000002131 composite material Substances 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims description 87
- 238000001816 cooling Methods 0.000 claims description 10
- 239000002826 coolant Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 239000013039 cover film Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a high-efficiency composite heat dissipation circuit board which comprises a controller, a first circuit board, a second circuit board, a heat dissipation plate, a first support and a second support, wherein a first ventilation channel is arranged in the first circuit board, a second ventilation channel is arranged in the second circuit board, and a first cooling liquid channel and a second cooling liquid channel are arranged in the heat dissipation plate. And the first circuit board is provided with a first temperature sensor, the second circuit board is provided with a second temperature sensor, and intelligent heat dissipation of the first circuit board and the second circuit board can be realized through the control of the controller. The circuit board has good heat dissipation effect, and can realize reasonable heat dissipation of the first circuit board and the second circuit board according to the use condition.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a high-efficiency composite heat dissipation circuit board.
Background
With the development of electronic informatization, a wiring board becomes an indispensable component in many electronic devices. The circuit board integrates a plurality of song electronic devices, so the volume is small, a plurality of circuit boards are integrated for use, more functions can be integrated, however, the electronic devices have small internal space and difficult heat dissipation. Some electronic devices adopt water cooling for heat dissipation, and although the heat dissipation effect is good, the power of the electronic devices is increased by using a liquid pump.
Disclosure of Invention
The invention aims to: the invention aims to overcome the defects of the prior art and provides a high-efficiency composite heat dissipation circuit board.
The technical scheme is as follows: the circuit board comprises a controller, a first circuit board, a second circuit board, a heat radiating plate, a first support and a second support, wherein the first circuit board sequentially comprises a first base layer, a first circuit layer and a first covering film layer from top to bottom, the second circuit board sequentially comprises a second covering film layer, a second circuit layer and a second base layer from top to bottom, the first support comprises a first upper transverse plate, a first lower transverse plate and a first vertical plate connected with the first upper transverse plate and the first lower transverse plate, the second support comprises a second upper transverse plate, a second lower transverse plate and a second vertical plate connected with the second upper transverse plate and the second lower transverse plate, the first upper transverse plate and the second upper transverse plate are connected with the first base layer, the first base layer is internally provided with a plurality of first ventilation channels, one ends of the first ventilation channels are all connected with a first air inlet pipe, the first air inlet pipe is provided with a plurality of first fans, the other ends of the first ventilation channels are all connected with a plurality of second air inlet pipes, the second ventilation channels are all connected with the second ventilation channels are all arranged at the second air inlet pipe, and the second air inlet pipe is connected with the second ventilation channels are all connected with the second air inlet pipe; the first vertical plate is provided with a first fixing frame, the second vertical plate is provided with a second fixing frame, the first fixing frame and the second fixing frame are both connected with the heat dissipation plate, the upper surface of the heat dissipation plate is fixedly provided with a plurality of first heat dissipation fins, and the lower surface of the heat dissipation plate is provided with a plurality of second heat dissipation fins; the cooling plate is internally provided with a first liquid inlet channel, a first liquid outlet channel, a second liquid inlet channel, a second liquid outlet channel, a plurality of first cooling liquid channels and a plurality of second cooling liquid channels, one ends of the first cooling liquid channels are connected with the first liquid inlet channel, the other ends of the first cooling liquid channels are connected with the first liquid outlet channel, one ends of the second cooling liquid channels are connected with the second liquid inlet channel, the other ends of the second cooling liquid channels are connected with the second liquid outlet channel, the first liquid inlet channel and the second liquid inlet channel are connected with liquid inlet pipes, the liquid inlet pipes are provided with liquid pumps, the first liquid inlet channels are provided with first valves, the second liquid inlet channels are provided with second valves, the first circuit board is provided with a first temperature sensor, and the second circuit board is provided with a second temperature sensor; the first temperature sensor, the second temperature sensor, the first fan, the second fan, the first valve, the second valve and the liquid pump are all connected with the controller.
Further, the surface of the first radiating fin is provided with a plurality of first hemispherical bulges.
Further, the surface of the second radiating fin is provided with a plurality of second hemispherical bulges.
Further, the first air inlet pipe, the second air inlet pipe and the liquid inlet pipe all penetrate through the second vertical plate; the first air outlet pipe, the second air outlet pipe and the liquid outlet pipe all penetrate through the first vertical plate.
Further, the first fixing frame and the second fixing frame are respectively provided with two fixing frames.
Further, the number of the first ventilation channels and the second ventilation channels is more than or equal to 5.
Further, the plurality of first cooling liquid channels are located at the same level, and the plurality of second cooling liquid channels are located at the same level.
Further, the first cooling liquid channel is closer to one side of the first circuit board, and the second cooling liquid channel is closer to one side of the second circuit board.
Further, in the heat dissipation process, the controller controls the first fan and the second fan to be started, and when the measured value of the first temperature sensor is larger than a set threshold value and the measured value of the second temperature sensor is not larger than the set threshold value, the liquid pump and the first valve are started, and the second valve is closed; when the measured value of the first temperature sensor is not greater than the set threshold value and the measured value of the second temperature sensor is greater than the set threshold value, the liquid pump and the second valve are opened, and the first valve is closed; when the measured value of the first temperature sensor is larger than a set threshold value and the measured value of the second temperature sensor is larger than the set threshold value, opening the liquid pump, the first valve and the second valve; the liquid pump, the first valve, and the second valve are closed when the measured value of the first temperature sensor is not greater than the set threshold value and the measured value of the second temperature sensor is not greater than the set threshold value.
Further, in the heat dissipation process, the controller controls the liquid pump to be started with the first power, the first valve is opened, and the second valve is closed when the measured value of the first temperature sensor is larger than a set threshold value and the measured value of the second temperature sensor is not larger than the set threshold value; when the measured value of the first temperature sensor is not greater than the set threshold value and the measured value of the second temperature sensor is greater than the set threshold value, the liquid pump is started with the first power, the second valve is opened, and the first valve is closed; when the measured value of the first temperature sensor is larger than a set threshold value and the measured value of the second temperature sensor is larger than the set threshold value, the liquid pump is opened at a second power, and the first valve and the second valve are opened; the second power is greater than the first power.
The beneficial effects are that: the circuit board adopts a compound heat dissipation mode, and air cooling heat dissipation is adopted in common cases, so that when the temperature of the circuit board rises to a certain degree, water cooling heat dissipation can be started, and the heat dissipation effect is good.
Drawings
FIG. 1 is a schematic diagram of a circuit board according to the present invention;
FIG. 2 is a first vent passage layout on a first circuit board;
FIG. 3 is a schematic diagram of a first coolant line layout on a heat sink.
Detailed Description
Reference numerals: 1.1 a first base layer; 1.2 a first circuit layer; 1.3 a first cover film layer; 1.4 a first ventilation channel; 1.5 a first air inlet pipe; 1.6, a first air outlet pipe; 1.7 a first fan; 2.1 a second base layer; 2.2a second circuit layer; 2.3 a second cover film layer; 2.5 a second air inlet pipe; 2.6 a second air outlet pipe; 2.7 a second fan; 4.1 a first upper cross plate; 4.2 a first lower cross plate; 4.3 a first riser; 4.4 a first fixing frame; 5.1 a second upper cross plate; 5.2 a second lower cross plate; 5.3 second riser; 5.4 a second fixing frame; 6, radiating plates; 6.1 first radiating fins; 6.2 second radiating fins; 6.3 liquid inlet pipe; 6.4 liquid pump; 6.5 a liquid outlet pipe; 7.1 a first liquid inlet channel; 7.2 a first liquid outlet channel; 7.3 a first coolant passage; 7.4 a first valve; 8.1 a second liquid inlet channel; 8.2 a second liquid outlet channel; 8.3 a second coolant passage; 8.4 second valve.
The circuit board comprises a controller, a first circuit board, a second circuit board, a heat dissipation plate, a first bracket and a second bracket, wherein the first circuit board sequentially comprises a first base layer 1.1, a first circuit layer 1.2 and a first covering film layer 1.3 from top to bottom, the second circuit board sequentially comprises a second covering film layer 2.3, a second circuit layer 2.2 and a second base layer 2.1 from top to bottom, the first bracket comprises a first upper transverse plate 4.1, a first lower transverse plate 4.2 and a first vertical plate 4.3 connected with the first upper transverse plate and the second transverse plate, the second bracket comprises a second upper transverse plate 5.1, a second lower transverse plate 5.2 and a second vertical plate 5.3 connected with the second upper transverse plate and the second lower transverse plate, the first upper transverse plate 4.1 and the second upper transverse plate 5.1 are connected with the first base layer, the first lower transverse plate 4.2 and the second lower transverse plate 5.2 are connected with the second base layer, a plurality of first ventilation channels are arranged in the first base layer, one ends of the first ventilation channels are connected with a first air inlet pipe, a first fan 1.7 is arranged at the first air inlet pipe 1.5, the other ends of the first ventilation channels are connected with a first air outlet pipe, a plurality of second ventilation channels are arranged in the second base layer, one ends of the second ventilation channels are connected with a second air inlet pipe 2.5, a second fan 2.7 is arranged at the second air inlet pipe, and the other ends of the second ventilation channels are connected with a second air outlet pipe; the first vertical plate is provided with a first fixing frame, the second vertical plate is provided with a second fixing frame, the first fixing frame and the second fixing frame are both connected with the heat dissipation plate, the upper surface of the heat dissipation plate is fixedly provided with a plurality of first heat dissipation fins 6.1, and the lower surface of the heat dissipation plate is provided with a plurality of second heat dissipation fins 6.2; the heat dissipation plate is internally provided with a first liquid inlet channel 7.1, a first liquid outlet channel 7.2, a second liquid inlet channel 8.1, a second liquid outlet channel 8.2, a plurality of first cooling liquid channels 7.3 and a plurality of second cooling liquid channels 8.3, one ends of the first cooling liquid channels 7.3 are connected with the first liquid inlet channel, the other ends of the first cooling liquid channels are connected with the first liquid outlet channel, one ends of the second cooling liquid channels 8.3 are connected with the second liquid inlet channel, the other ends of the second cooling liquid channels are connected with the second liquid outlet channel, the first liquid inlet channel and the second liquid inlet channel are connected with a liquid inlet pipe, the first liquid outlet channel and the second liquid outlet channel are connected with a liquid outlet pipe 6.5, a liquid pump 6.4 is arranged at the liquid inlet pipe 6.3, a first valve 7.4 is arranged at the first liquid inlet channel, a second valve 8.4 is arranged at the second liquid inlet channel, a first temperature sensor is further arranged at the first circuit board, and a second temperature sensor is further arranged at the second circuit board; the first temperature sensor, the second temperature sensor, the first fan, the second fan, the first valve, the second valve and the liquid pump are all connected with the controller.
The surface of the first heat radiating fin 6.1 has a plurality of first hemispherical protrusions. The surface of the second heat dissipation fin 6.2 is provided with a plurality of second hemispherical bulges. The first air inlet pipe 1.5, the second air inlet pipe 1.6 and the liquid inlet pipe all penetrate through the second vertical plate; the first air outlet pipe, the second air outlet pipe and the liquid outlet pipe all penetrate through the first vertical plate. The first fixing frame and the second fixing frame are respectively provided with two fixing frames. The number of the first ventilation channels and the second ventilation channels is more than or equal to 5. The first cooling liquid channels are located at the same horizontal height, the second cooling liquid channels are located at the same horizontal height, the first cooling liquid channels are closer to one side of the first circuit board, and the second cooling liquid channels are closer to one side of the second circuit board.
In the heat dissipation process, the controller controls the first fan and the second fan to be started, and when the measured value of the first temperature sensor is larger than a set threshold value and the measured value of the second temperature sensor is not larger than the set threshold value, the liquid pump and the first valve are started, and the second valve is closed; when the measured value of the first temperature sensor is not greater than the set threshold value and the measured value of the second temperature sensor is greater than the set threshold value, the liquid pump and the second valve are opened, and the first valve is closed; when the measured value of the first temperature sensor is larger than a set threshold value and the measured value of the second temperature sensor is larger than the set threshold value, opening the liquid pump, the first valve and the second valve; the liquid pump, the first valve, and the second valve are closed when the measured value of the first temperature sensor is not greater than the set threshold value and the measured value of the second temperature sensor is not greater than the set threshold value.
More specifically, during the heat dissipation process, the controller controls the liquid pump to be opened with the first power, the first valve is opened, and the second valve is closed when the measured value of the first temperature sensor is larger than the set threshold value and the measured value of the second temperature sensor is not larger than the set threshold value; when the measured value of the first temperature sensor is not greater than the set threshold value and the measured value of the second temperature sensor is greater than the set threshold value, the liquid pump is started with the first power, the second valve is opened, and the first valve is closed; when the measured value of the first temperature sensor is larger than a set threshold value and the measured value of the second temperature sensor is larger than the set threshold value, the liquid pump is opened at a second power, and the first valve and the second valve are opened; the second power is greater than the first power.
Under normal conditions, the circuit board of the invention only needs to perform air cooling and heat dissipation through the first fan and the second fan. When one of the first temperature sensor and the second temperature sensor detects that the temperature is too high, the liquid pump is started, so that cooling liquid passes through the cooling liquid channel in the cooling plate to cool the circuit board. And intelligent heat dissipation is realized. When the temperature of a certain circuit board is too high, the circuit board is subjected to water cooling, and when two circuit boards are required to be subjected to water cooling, the two circuit boards are subjected to water cooling. This can provide the necessary heat dissipation effect to the circuit board and can avoid the waste that the radiating element is opened always and causes.
While the invention has been shown and described with respect to the preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the scope of the invention as defined in the following claims.
Claims (7)
1. The high-efficiency composite heat dissipation circuit board is characterized by comprising a controller, a first circuit board, a second circuit board, a heat dissipation plate, a first support and a second support, wherein the first circuit board sequentially comprises a first base layer, a first circuit layer and a first covering film layer from top to bottom, the second circuit board sequentially comprises a second covering film layer, a second circuit layer and a second base layer from top to bottom, the first support comprises a first upper transverse plate, a first lower transverse plate and a first vertical plate connected with the first upper transverse plate and the first lower transverse plate, the second support comprises a second upper transverse plate, a second lower transverse plate and a second vertical plate connected with the second upper transverse plate and the second lower transverse plate, the first upper transverse plate and the second upper transverse plate are connected with the first base layer, one end of each first channel is connected with the first air inlet pipe, the other end of each first channel is connected with the second air inlet pipe, the second end of each second channel is connected with the second air inlet pipe, and the second air pipe is connected with the second air inlet pipe; the first vertical plate is provided with a first fixing frame, the second vertical plate is provided with a second fixing frame, the first fixing frame and the second fixing frame are both connected with the heat dissipation plate, the upper surface of the heat dissipation plate is fixedly provided with a plurality of first heat dissipation fins, and the lower surface of the heat dissipation plate is provided with a plurality of second heat dissipation fins; the cooling plate is internally provided with a first liquid inlet channel, a first liquid outlet channel, a second liquid inlet channel, a second liquid outlet channel, a plurality of first cooling liquid channels and a plurality of second cooling liquid channels, one ends of the first cooling liquid channels are connected with the first liquid inlet channel, the other ends of the first cooling liquid channels are connected with the first liquid outlet channel, one ends of the second cooling liquid channels are connected with the second liquid inlet channel, the other ends of the second cooling liquid channels are connected with the second liquid outlet channel, the first liquid inlet channel and the second liquid inlet channel are connected with liquid inlet pipes, the liquid inlet pipes are provided with liquid pumps, the first liquid inlet channels are provided with first valves, the second liquid inlet channels are provided with second valves, the first circuit board is provided with a first temperature sensor, and the second circuit board is provided with a second temperature sensor; the first temperature sensor, the second temperature sensor, the first fan, the second fan, the first valve, the second valve and the liquid pump are all connected with the controller; the surface of the first radiating fin is provided with a plurality of first hemispherical bulges; in the heat dissipation process, the controller controls the first fan and the second fan to be started, and when the measured value of the first temperature sensor is larger than a set threshold value and the measured value of the second temperature sensor is not larger than the set threshold value, the liquid pump and the first valve are started, and the second valve is closed; when the measured value of the first temperature sensor is not greater than the set threshold value and the measured value of the second temperature sensor is greater than the set threshold value, the liquid pump and the second valve are opened, and the first valve is closed; when the measured value of the first temperature sensor is larger than a set threshold value and the measured value of the second temperature sensor is larger than the set threshold value, opening the liquid pump, the first valve and the second valve; the liquid pump, the first valve, and the second valve are closed when the measured value of the first temperature sensor is not greater than the set threshold value and the measured value of the second temperature sensor is not greater than the set threshold value.
2. The efficient composite heat dissipating circuit board of claim 1, wherein the surface of the second heat dissipating fin has a plurality of second hemispherical protrusions.
3. The efficient composite heat dissipation circuit board of claim 1, wherein the first air inlet pipe, the second air inlet pipe and the liquid inlet pipe all pass through the second vertical plate; the first air outlet pipe, the second air outlet pipe and the liquid outlet pipe all penetrate through the first vertical plate.
4. The efficient composite heat dissipation circuit board as recited in claim 1, wherein the first and second fixing frames are two.
5. The efficient composite heat dissipation circuit board of claim 1, wherein the number of the first ventilation channels and the second ventilation channels is greater than or equal to 5.
6. The efficient composite heat-dissipating circuit board of claim 1, wherein the first plurality of coolant channels are at a same level and the second plurality of coolant channels are at a same level, the first coolant channels being closer to the first circuit board side and the second coolant channels being closer to the second circuit board side.
7. The efficient composite heat-dissipating circuit board of claim 1, wherein the controller controls the liquid pump to open at the first power when the measured value of the first temperature sensor is greater than the set threshold and the measured value of the second temperature sensor is not greater than the set threshold, the first valve being open and the second valve being closed during heat dissipation; when the measured value of the first temperature sensor is not greater than the set threshold value and the measured value of the second temperature sensor is greater than the set threshold value, the liquid pump is started with the first power, the second valve is opened, and the first valve is closed; when the measured value of the first temperature sensor is larger than the set threshold value and the measured value of the second temperature sensor is larger than the set threshold value, the liquid pump is opened at the second power, the first valve is opened, and the second valve is opened; the second power is greater than the first power.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810677690.2A CN108541200B (en) | 2018-06-27 | 2018-06-27 | High-efficient compound heat dissipation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810677690.2A CN108541200B (en) | 2018-06-27 | 2018-06-27 | High-efficient compound heat dissipation circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN108541200A CN108541200A (en) | 2018-09-14 |
| CN108541200B true CN108541200B (en) | 2024-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810677690.2A Active CN108541200B (en) | 2018-06-27 | 2018-06-27 | High-efficient compound heat dissipation circuit board |
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| Country | Link |
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| CN (1) | CN108541200B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111970906B (en) * | 2020-08-24 | 2022-03-15 | 浙江集迈科微电子有限公司 | Phased array radar heat abstractor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1549339A (en) * | 2003-05-23 | 2004-11-24 | 广达电脑股份有限公司 | Functional module with built-in radiating fin |
| FR3030181A1 (en) * | 2014-12-11 | 2016-06-17 | Thales Sa | BOX OF ELECTRONIC EQUIPMENT ON BOARD AND CALCULATOR AVIONIQUE COMPRISING SUCH A BOX |
| CN206260197U (en) * | 2016-12-09 | 2017-06-16 | 黄祥彬 | Wiring board element protection pad with heat sinking function |
| CN208402322U (en) * | 2018-06-27 | 2019-01-18 | 扬州市玄裕电子有限公司 | A kind of high efficiency composition radiating circuit plate |
-
2018
- 2018-06-27 CN CN201810677690.2A patent/CN108541200B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1549339A (en) * | 2003-05-23 | 2004-11-24 | 广达电脑股份有限公司 | Functional module with built-in radiating fin |
| FR3030181A1 (en) * | 2014-12-11 | 2016-06-17 | Thales Sa | BOX OF ELECTRONIC EQUIPMENT ON BOARD AND CALCULATOR AVIONIQUE COMPRISING SUCH A BOX |
| CN206260197U (en) * | 2016-12-09 | 2017-06-16 | 黄祥彬 | Wiring board element protection pad with heat sinking function |
| CN208402322U (en) * | 2018-06-27 | 2019-01-18 | 扬州市玄裕电子有限公司 | A kind of high efficiency composition radiating circuit plate |
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| CN108541200A (en) | 2018-09-14 |
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Effective date of registration: 20240411 Address after: No. 169-2 Xingqu Road, Chengnan Economic New Area, Gaoyou City, Yangzhou City, Jiangsu Province, 225600 Applicant after: Jiangsu Qiaoxin Technology Co.,Ltd. Country or region after: China Address before: 225600 Gaoyou South economic new area, Yangzhou City, Jiangsu Province Applicant before: YANGZHOU XUANYU ELECTRONICS Co.,Ltd. Country or region before: China |
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