CN1549339A - Functional module with built-in radiating fin - Google Patents
Functional module with built-in radiating fin Download PDFInfo
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- CN1549339A CN1549339A CNA031368557A CN03136855A CN1549339A CN 1549339 A CN1549339 A CN 1549339A CN A031368557 A CNA031368557 A CN A031368557A CN 03136855 A CN03136855 A CN 03136855A CN 1549339 A CN1549339 A CN 1549339A
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- circuit board
- radiating fin
- functional module
- heat
- ground plane
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Abstract
The present invention provides a functional module with built-in radiating fin. It includes a first circuit board, a second circuit board and a radiating fin, in which the first circuit board has a first surface, on the first surface a first grounding layer is set, the second circuit board is coupled with the first circuit board, and has a second surface which is opposite to the first surface, and on the second surface a second grounding layer is set, the radiating fin is placed between the first circuit board and second circuit board in the mode of that said radiating fin is respectively connected with first grounding layer and second grounding layer.
Description
Technical field
The present invention relates to a kind of functional module, particularly relate to the functional module that has radiating fin in a kind of.
Background technology
Along with the progress of semiconductor fabrication process, the running speed of electronic component is more and more faster, and greater functionality is integrated in the single element, thus cause element radiating, signal quality, and design such as the anti-system of electromagnetic radiation on difficulty.
Generally speaking, normally reach the connection of signal each other between the electronic component via circuit board, please refer to Fig. 1, in computer system 10, central processing unit (CPU) 1, chipset (Chipset) 2, painting processor (CPU) 3 or drawing interface (AGP) 3, all be arranged on the motherboard of making by printed circuit board (PCB) 7, and be disposed at zones different on the motherboard with electronic component such as dynamic random access memory (DRAM) 4.Above-mentioned these electronic components all can produce heat when running, in order to solve its heat dissipation problem, the existing means of being taked are to propose solution respectively at each element.
As follows at the radiating mode that each high heater element adopted in the computer system in the past: the heat dissipation element that central processing unit often uses adds fan as radiating fin, heat pipe, and the heat dissipation element that chipset, painting processor often use then is radiating fin and/or fan.As shown in Figure 2, the heat radiation group of often using in notebook computer 20 is configured on the central processing unit of computer system 10, and this radiating module 20 is made up of equal backing 21, heat pipe 22, radiating fin 23 and fan 24, wherein all backing 21 usefulness so that originally concentrated on heat energy uniformly dispersing on the central processing unit at the bigger equal backing 21 of area, to reduce the heat density on surface, heat pipe 22 then is in order to be delivered to heat on the radiating fin 23 fast and effectively, disperse heat energy by larger area Fin sheet 23 again, utilize fan 24 that the torrid zone is gone out system afterwards again.
If want effectively to solve simultaneously the heat dissipation problem of these high heater elements on the motherboard, above-mentioned settling mode can't satisfy such radiating requirements, therefore must import more effective radiating mode and heat dissipation element.But these more effective heat dissipation elements only are applicable to smooth surface usually, promptly, if these heat dissipation elements are applied on the aforesaid high heater element, then will in the face of how with above-mentioned high efficiency heat radiation element application in the problem that is dispersed in each the high heater element on the motherboard.
Summary of the invention
The object of the present invention is to provide a kind of functional module, The built-in has radiating fin.
According to the present invention, the functional module that has radiating fin in a kind of is provided, it comprises a first circuit board, a second circuit board and a radiating fin, wherein first circuit board has a first surface, and first surface is provided with one first ground plane, second circuit board and first circuit board coupling, and has a second surface, and second surface is relative with first surface, and be provided with one second ground plane thereon, radiating fin with respectively and the mode of first ground plane, the second ground plane butt be arranged between first circuit board and the second circuit board.
In a preferred embodiment, first circuit board also has one the 3rd surface, and it is positioned at the opposing face of first surface, and be provided with one first element thereon, and second circuit board also has one the 4th surface, and it is positioned at the opposing face of second surface, and is provided with one second element thereon.
Will be appreciated that first ground plane and second ground plane can be made of copper, and its thickness is not less than 1.5mil.
In another preferred embodiment, functional module also comprises a winding displacement, is connected with first circuit board and second circuit board respectively, in order to conducting first circuit board and second circuit board.
In another preferred embodiment, functional module also comprises a fan, and itself and radiating fin adjacency are in order to go out the torrid zone on the above-mentioned functions module.
In another preferred embodiment, functional module also comprises one first equal backing and one second equal backing, wherein the first equal backing is between the radiating fin and first ground plane, in order to the heat on the even dispersion first circuit board, and the second equal backing is between the radiating fin and second ground plane, in order to the heat on the even dispersion second circuit board.
Again, the first equal backing and this second equal backing can be made by copper, aluminium, metal or nonmetallic composite, and its coefficient of heat conduction to be not less than 100W/mK be preferable.
In another preferred embodiment, functional module also comprises one first knitting layer and one second knitting layer, wherein first knitting layer is between the radiating fin and first ground plane, in order to engage radiating fin and first circuit board, and second knitting layer is between the radiating fin and second ground plane, in order to engage radiating fin and second circuit board.
Again, first knitting layer and second knitting layer can be made by brazing, soldering, thermal medium material (ThermalInterface Material) or heat-conducting cream (Grease).
Again in the present invention, the functional module that has radiating fin in the another kind is provided, it comprises a first circuit board, a second circuit board and a radiating fin, wherein first circuit board has a first surface, and first surface is provided with one first heat-conducting layer, second circuit board and first circuit board coupling, and has a second surface, and second surface is relative with first surface, and be provided with one second heat-conducting layer thereon, radiating fin with respectively and the mode of first heat-conducting layer, the second heat-conducting layer butt be arranged between first circuit board and the second circuit board.
Description of drawings
Fig. 1 is the schematic diagram of existing computer system;
Fig. 2 is the schematic diagram on the central processing unit that a traditional heat-dissipating module is arranged at computer system among Fig. 1;
Fig. 3 is the schematic diagram of functional module of the present invention;
Fig. 4 a is the exploded view that has in of the present invention in the functional module of radiating fin;
Fig. 4 b is the constitutional diagram that has the functional module of radiating fin in of the present invention;
Fig. 5 a is the side schematic view of a variation that has the functional module of radiating fin in of the present invention;
Fig. 5 b is the side schematic view of another variation that has the functional module of radiating fin in of the present invention;
Fig. 6 is the schematic diagram of another variation of the functional module that has radiating fin in of the present invention;
Fig. 7 a is the cutaway view of Layer increasing method circuit board; And
Fig. 7 b is the cutaway view of perforation method circuit board.
Embodiment
Because electronic component running speed is more and more faster, computer Front Side Bus (Front Side Bus, FSB) transmission speed is also by 333MHz, 400Mhz, 533MHz, progressively increase to 800MHz or higher speed, and more function also is integrated in the one chip, especially be positioned at the related elements on the Front Side Bus, for example: central processing unit (CPU), north bridge chips (North Bridge), painting processor (CPU) etc.
Because the increase of element arithmetic speed and function, thus cause element radiating, signal quality, and design such as the anti-system of electromagnetic radiation on difficulty, cause most motherboard problem all to be created in the design of Front Side Bus.In addition, the result that element arithmetic speed and function increase also causes the outer pin number of element to increase, and causes the employed circuit board of system towards high density interconnect substrate (High DensityInterconnect, HDI) development.
The present invention is integrated into high speed, high density components one functional module, and solves the heat dissipation problem of each element in the functional module simultaneously.In the present invention, can with such as: central processing unit (CPU), north bridge chips (North Bridge), painting processor (GPU) or drawing interface (AGP), dynamic random access memory (DRAM), drawing memory (GRAM) etc. need the high speed element of high-speed transfer signal, be arranged on the high density interconnect substrate (HDI), these high speed elements can connect its function via the high density interconnect substrate, and become a functional module independently.And this functional module can be electrically connected with the printed circuit board (PCB) at other element places again in modes such as connector, winding displacement or solderings, forms complete computer motherboard system.Can solve the problem that produces because of high speed element thus, and reduce cost effectively.
See also Fig. 3, its shown state for a kind of functional module 30 among the present invention.When the element that will be integrated into functional module more for a long time, in the time of perhaps the element of difference in functionality will being integrated in the same functional module, can be according to function, the characteristic of these elements, it is configured in respectively on two surfaces of functional module 30, for example with surface adhering technology (SMT) with arrangements of components on the surface of functional module 30.Based on the consideration of supply line and high-frequency signal quality, therefore in functional module 30, be provided with a ground plane 31.
Yet, when concentrating on high speed element on the functional module, also the thermal source that was scattered in whole electronic installation originally all can be concentrated on this functional module; Moreover, because these high speed elements concentrate on the relative less area, so be difficult to propose the solution of dispelling the heat respectively at each element.
In order effectively the heat that each high heater element produced in the functional module to be delivered to the external world, in an embodiment of the present invention, the two-sided functional module (as 30 among Fig. 3) that is equipped with element can be changed, be re-used heat dissipation element to solve the heat dissipation problem of functional module.Have the functional module 100 of radiating fin in Fig. 4 a, Fig. 4 b demonstration is of the present invention, will be appreciated that the design principle of functional module 100 of the present invention, be to be equipped with the functional module (as shown in Figure 3) of element on originally two-sided, taking apart is the circuit board that two single faces are provided with element, and this will be in following detailed description.
It should be noted that above-mentioned first ground plane 112 and second ground plane 122 also can be respectively as voltage planes.
Radiating fin 130 with respectively and the mode of first ground plane 112, second ground plane, 122 butts be arranged between first circuit board 110 and the second circuit board 120.
Have in of the present invention radiating fin functional module 100 basic comprising as mentioned above, during fabrication, utilize winding displacement 140 to connect first circuit board 110 and second circuit board 120 earlier, and make second ground plane 122 of first ground plane 112 of first circuit board 110 and second circuit board 120 relative, shown in Fig. 4 a, at last, radiating fin 130 is arranged between first circuit board 110 and the second circuit board 120, and the gas channel in the radiating fin 130 is not hindered by winding displacement 140, can obtain functional module 100 of the present invention, shown in Fig. 4 b.
In addition, the ifs circuit plate is because the restriction of manufacture craft cause its ground plane thickness deficiency, and the heat that circuit board is produced can't be disperseed uniformly, then can add equal backing on ground plane by ground plane; Know clearly it, with reference to figure 5a, functional module 100 also can comprise one first equal backing 115 and one second equal backing 125, wherein the first equal backing 115 is between the radiating fin 130 and first ground plane 112, in order to the heat on the even dispersion first circuit board 110, and the second equal backing 125 is between the radiating fin 130 and second ground plane 122, in order to the heat on the even dispersion second circuit board 120.
In addition, if radiating fin 130 pedestals own have had suitable thickness, the pedestal that is the radiating fin 130 and first ground plane 112, second ground plane, 122 butts has certain thickness, it can be considered as a good equal backing, therefore can not need use the first equal backing 115 and the second equal backing 125.
Again, the first equal backing 115 and the second equal backing 125 can be made by copper, aluminium, metal or nonmetallic composite, and its coefficient of heat conduction to be not less than 100W/mK be preferable.
In addition, with reference to figure 5b, functional module 100 also can comprise one first knitting layer 116 and one second knitting layer 126, wherein first knitting layer 116 is between the radiating fin 130 and first ground plane 112, in order to engage radiating fin 130 and first circuit board 110, and second knitting layer 126 is between the radiating fin 130 and second ground plane 122, in order to engage radiating fin 130 and second circuit board 120.
Again, first knitting layer 116 and second knitting layer 126 can be made by brazing, soldering, thermal medium material (Thermal Interface Material) or heat-conducting cream (Grease).
In addition, the conduction mode between first circuit board 110 and the second circuit board 120 is not limited to utilize winding displacement, for example, can utilize connector, groove shape connector etc.
Again, functional module 100 also can comprise a fan 150, and as shown in Figure 6, it is provided with in the mode with radiating fin 130 adjacency, in order to the torrid zone on the functional module 100 is gone out.
Again, at functional module 100 employed circuit boards 110,120 can be to utilize Layer increasing method (Build-up) to make blind, the formed circuit board of buried via hole on copper coin (or metallic plate), shown in Fig. 7 a, or adopt the through hole printed circuit board (PCB), shown in Fig. 7 b, in order to prevent that scolding tin enters via 117 in the surface adhering manufacture craft, or prevent non-ground hole and ground connection copper face, can comply with existing technology covering place solder flux 118 on part via 117 because of the tin sticky short circuit.
As mentioned above, principle of the present invention be utilize design will be originally on two-sided the single-piece functional module of setting element, taking apart is two two pieces type functional modules of setting element on single face respectively, and the back side of each sheet circuit board is equipped with ground connection (or power supply) copper face, utilize this smooth ground connection (or power supply) copper face and radiating fin to mutually combine, and form a sandwich shape structure, can be fast and conduct heat to radiating fin equably, then can go out then by the torrid zone of fan with functional module.
Again, in this sandwich style radiating module structure, ground connection (or power supply) copper face of being reserved on each circuit board is promptly being played the part of all roles of backing, the heat of all elements in each circuit board is scattered in uniformly the surface of ground connection (or power supply) copper face, and ground connection (or power supply) copper face and radiating fin promptly engage, structure wherein do not need the pipeline passed on as heat by heat pipe, so can reduce the extra cost that produces because of heat pipe or the increase of thermal resistance effectively again.
Though disclosed the present invention in conjunction with above preferred embodiment; yet it is not in order to limit the present invention; any skilled personnel can do a little change and retouching, so protection scope of the present invention should be with being as the criterion that claim was defined without departing from the spirit and scope of the present invention.
Claims (26)
1. have the functional module of radiating fin in one kind, comprising:
One first circuit board has a first surface, and wherein this first surface is provided with one first ground plane;
One second circuit board with this first circuit board coupling, and has a second surface, and wherein this second surface is relative with this first surface, and is provided with one second ground plane thereon;
One radiating fin, with respectively and the mode of this first ground plane, this second ground plane butt be arranged between this first circuit board and this second circuit board.
2. have the functional module of radiating fin in as claimed in claim 1, wherein this first circuit board also has one the 3rd surface, and it is positioned at the opposing face of this first surface, and is provided with one first element thereon.
3. have the functional module of radiating fin in as claimed in claim 1, wherein this second circuit board also has one the 4th surface, and it is positioned at the opposing face of this second surface, and is provided with one second element thereon.
4. have the functional module of radiating fin in as claimed in claim 1, wherein this first ground plane and second ground plane are made of copper.
5. have the functional module of radiating fin in as claimed in claim 1, also comprise a winding displacement, be connected with this first circuit board and this second circuit board respectively, in order to this first circuit board of conducting and this second circuit board.
6. have the functional module of radiating fin in as claimed in claim 1, also comprise a connector, be connected with this first circuit board and this second circuit board respectively, in order to this first circuit board of conducting and this second circuit board.
7. have the functional module of radiating fin in as claimed in claim 6, wherein this connector comprises groove shape connector.
8. have the functional module of radiating fin in as claimed in claim 1, also comprise:
One first equal backing is between this radiating fin and this first ground plane, in order to the heat on this first circuit board of even dispersion; And
One second equal backing is between this radiating fin and this second ground plane, in order to the heat on this second circuit board of even dispersion.
9. have the functional module of radiating fin in as claimed in claim 8, wherein the material of this first equal backing and this second equal backing is selected from the group that is made up of copper, aluminium, metallic composite and nonmetallic composite.
10. have the functional module of radiating fin in as claimed in claim 1, also comprise:
One first knitting layer is between this radiating fin and this first ground plane, in order to engage this radiating fin and this first circuit board; And
One second knitting layer is between this radiating fin and this second ground plane, in order to engage this radiating fin and this second circuit board;
11. have the functional module of radiating fin in as claimed in claim 10, wherein the material of this first knitting layer and this second knitting layer is selected from group and the combination of being made up of brazing, soldering, thermal medium material and heat-conducting cream thereof.
12. have the functional module of flat heat dissipation element in as claimed in claim 1, also comprise a fan, with this radiating fin adjacency, in order to the torrid zone on the above-mentioned functions module is gone out.
13. have the functional module of radiating fin in one kind, comprising:
One first circuit board has a first surface, and wherein this first surface is provided with one first heat-conducting layer;
One second circuit board with this first circuit board coupling, and has a second surface, and wherein this second surface is relative with this first surface, and is provided with one second heat-conducting layer thereon;
One radiating fin, with respectively and the mode of this first heat-conducting layer, this second heat-conducting layer butt be arranged between this first circuit board and this second circuit board.
14. have the functional module of radiating fin in as claimed in claim 13, the ground plane that wherein this first heat-conducting layer ground plane that is this first circuit board, and this second heat-conducting layer is this second circuit board.
15. have the functional module of radiating fin in as claimed in claim 13, wherein this first circuit board also has one the 3rd surface, it is positioned at the opposing face of this first surface, and is provided with one first element thereon.
16. have the functional module of radiating fin in as claimed in claim 13, wherein this second circuit board also has one the 4th surface, it is positioned at the opposing face of this second surface, and is provided with one second element thereon.
17. have the functional module of radiating fin in as claimed in claim 13, wherein this first heat-conducting layer and second heat-conducting layer are made of copper.
18. have the functional module of radiating fin in as claimed in claim 13, also comprise a winding displacement, be connected with this first circuit board and this second circuit board respectively, in order to this first circuit board of conducting and this second circuit board.
19. have the functional module of radiating fin in as claimed in claim 13, also comprise a connector, be connected with this first circuit board and this second circuit board respectively, in order to this first circuit board of conducting and this second circuit board.
20. have the functional module of radiating fin in as claimed in claim 19, wherein this connector comprises groove shape connector.
21. have the functional module of radiating fin in as claimed in claim 13, also comprise:
One first equal backing is between this radiating fin and this first heat-conducting layer, in order to the heat on this first circuit board of even dispersion; And
One second equal backing is between this radiating fin and this second heat-conducting layer, in order to the heat on this second circuit board of even dispersion.
22. have the functional module of radiating fin in as claimed in claim 21, wherein the material of this first equal backing and this second equal backing is selected from by copper, aluminium, metallic composite, reaches the group that nonmetallic composite is formed.
23. have the functional module of radiating fin in as claimed in claim 13, also comprise:
One first knitting layer is between this radiating fin and this first heat-conducting layer, in order to engage this radiating fin and this first circuit board; And
One second knitting layer is between this radiating fin and this second heat-conducting layer, in order to engage this radiating fin and this second circuit board.
24. have the functional module of radiating fin in as claimed in claim 23, wherein the material of this first knitting layer and this second knitting layer is selected from group and the combination of being made up of brazing, soldering, thermal medium material and heat-conducting cream thereof.
25. have the functional module of flat radiating fin in as claimed in claim 13, also comprise a fan, with this radiating fin adjacency, in order to the torrid zone on the above-mentioned functions module is gone out.
26. have the functional module of radiating fin in as claimed in claim 13, the voltage plane that wherein this first heat-conducting layer voltage plane that is this first circuit board, and this second heat-conducting layer is this second circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031368557A CN1309062C (en) | 2003-05-23 | 2003-05-23 | Functional module with built-in radiating fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031368557A CN1309062C (en) | 2003-05-23 | 2003-05-23 | Functional module with built-in radiating fin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1549339A true CN1549339A (en) | 2004-11-24 |
| CN1309062C CN1309062C (en) | 2007-04-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031368557A Expired - Fee Related CN1309062C (en) | 2003-05-23 | 2003-05-23 | Functional module with built-in radiating fin |
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| Country | Link |
|---|---|
| CN (1) | CN1309062C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108541200A (en) * | 2018-06-27 | 2018-09-14 | 扬州市玄裕电子有限公司 | A kind of high efficiency composition radiating circuit plate |
| CN108882502A (en) * | 2017-05-11 | 2018-11-23 | 裕晨科技股份有限公司 | Circuit board with heat conduction and heat dissipation functions |
| CN110769638A (en) * | 2019-09-28 | 2020-02-07 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Method for light-weight integrated electronic equipment rack structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6487078B2 (en) * | 2000-03-13 | 2002-11-26 | Legacy Electronics, Inc. | Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
-
2003
- 2003-05-23 CN CNB031368557A patent/CN1309062C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882502A (en) * | 2017-05-11 | 2018-11-23 | 裕晨科技股份有限公司 | Circuit board with heat conduction and heat dissipation functions |
| CN108882502B (en) * | 2017-05-11 | 2020-06-16 | 裕晨科技股份有限公司 | Circuit board with heat conduction and heat dissipation functions |
| CN108541200A (en) * | 2018-06-27 | 2018-09-14 | 扬州市玄裕电子有限公司 | A kind of high efficiency composition radiating circuit plate |
| CN108541200B (en) * | 2018-06-27 | 2024-05-07 | 江苏乔芯科技有限公司 | High-efficient compound heat dissipation circuit board |
| CN110769638A (en) * | 2019-09-28 | 2020-02-07 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Method for light-weight integrated electronic equipment rack structure |
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| Publication number | Publication date |
|---|---|
| CN1309062C (en) | 2007-04-04 |
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Granted publication date: 20070404 Termination date: 20160523 |