CN1261887C - Computer front end bus module set - Google Patents
Computer front end bus module set Download PDFInfo
- Publication number
- CN1261887C CN1261887C CN 03122544 CN03122544A CN1261887C CN 1261887 C CN1261887 C CN 1261887C CN 03122544 CN03122544 CN 03122544 CN 03122544 A CN03122544 A CN 03122544A CN 1261887 C CN1261887 C CN 1261887C
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- CN
- China
- Prior art keywords
- front side
- side bus
- high density
- bus module
- density interconnect
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Abstract
The present invention relates to a computer front end bus module set which comprises a high density interconnected base plate, a plurality of high speed elements and an electromagnet shielding casing, wherein the high speed elements are arranged on the high density interconnected base plate, and are mutually electrically connected; the electromagnet shielding casing is coated on the high speed elements and the density interconnected base plate.
Description
Technical field
The present invention relates to a kind of computer function module, particularly relate to a kind of will be positioned at the high speed element modularity on the Front Side Bus and be easy to the upgrading use computing machine Front Side Bus module.
Background technology
Speed with work computing machine Front Side Bus increases calamity day by day, by 333MHz, 400MHz, 533MHz, progressively be increased to 800MHz, at present the mainboard architecture one of notebook computer all concentrates on all systemic-functions on the motherboard-has faced the difficulty that design is carried out.
Because the lifting of Front Side Bus speed has caused the increase of element heating, signal quality, and electromagnetic radiation prevent the difficulty that designs, make most motherboard problems all be created in the design of Front Side Bus.But the change of Front Side Bus design, also with the related circuit that has influence on other non-Front Side Bus of motherboard, in addition, in order to cater to the fast-changing situation of the market demand, specification change in the design such as relevant industrial design, output/input, storage, power supply, also, make to fall short of specifications original Front Side Bus up to specification design because of above-mentioned design alteration with the related circuit that has influence on the motherboard Front Side Bus.So under the reciprocal effect, the chance of motherboard change design will be increased, also directly have influence on the time and the cost of motherboard research and development.
In addition, along with the precision of semiconductor fabrication process is improved, increasing function is incorporated on the same chip, especially is positioned at the related elements (for example: central processor CPU, north bridge chips North Bridge, drawing chip GPU etc.) on the Front Side Bus.And the result that element arithmetic speed and function increase has also caused the increase of outer pin number, thereby the printed circuit board (PCB) on the flog system uses towards high density interconnect substrate (High Density Interconnect, HDI) development.Though the high density interconnect substrate has preferable signal quality and highdensity connecting line can be provided, but the price of high density interconnect substrate usually is the several times of general traditional printing circuit board, and and nonsystematic on all electronic components all be at a high speed, highdensity element, that is the electronic component in the system is not to need all to connect by the signal that the high density interconnect substrate is reached to each other, therefore, using the high density interconnect substrate to replace the traditional printing circuit board for part Front Side Bus element, is not meet economic benefit by contrast.
Summary of the invention
In view of this, purpose of the present invention just is to provide a kind of computing machine Front Side Bus module, will be positioned at the high speed element modularity on the Front Side Bus, once to solve problems such as the system radiating that brought because of high speed element, electromagnetic radiation, signal quality.
For reaching above-mentioned purpose, the invention provides a kind of computing machine Front Side Bus module, comprising: a high density interconnect substrate (High Density Interconnect, HDI); A plurality of high speed elements, for example: central processing unit (CPU), north bridge chips (North Bridge), storer (RAM) etc. are disposed on the high density interconnect substrate, and are electrically connected to each other; And an ELECTROMAGNETIC OBSCURANT shell, coat above-mentioned high speed element and high density interconnect and connect substrate.
Preferably, this computing machine Front Side Bus module also comprises a heat dissipation element, with described a plurality of high speed element hot tie-ins, in order to the heat that described a plurality of high speed element produced is passed to outside this computing machine Front Side Bus module.
The present invention also provides a kind of motherboard, comprising: a main circuit board; One high density interconnect substrate (HighDensity Interconnect, HDI), be electrically connected on above-mentioned main circuit board, and the above-specified high density interconnect substrates is provided with north bridge chips (North Bridge), storer (RAM) and central processing unit high speed elements such as (CPU) and sees through the electrical connection of above-specified high density interconnect substrates each other: and an ELECTROMAGNETIC OBSCURANT shell, coat the above-specified high density interconnect substrates, wherein north bridge chips (North Bridge), storer (RAM), central processing unit (CPU) are formed a Front Side Bus module.
Preferably, this motherboard also comprises a heat dissipation element, with described a plurality of high speed element hot tie-ins, in order to the heat that described a plurality of high speed element produced is passed to outside this computing machine Front Side Bus module.
Description of drawings
For above-mentioned and other purposes of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and be described in detail below in conjunction with the accompanying drawings:
Fig. 1 shows computing machine Front Side Bus framework;
Fig. 2 shows Front Side Bus module of the present invention.
The reference numeral explanation
11 1 central processing units;
12 1 north bridge chips;
13 1 drawing chips;
14 1 storeies;
15-drawing storer;
The 16-South Bridge chip;
20 1 Front Side Bus modules;
21 1 high density interconnect substrates;
22-ELECTROMAGNETIC OBSCURANT shell;
23 1 main circuit boards;
The 24-winding displacement;
25-power supply supply module.
Embodiment
Fig. 1 shows the framework of computing machine Front Side Bus.Include in the framework of general computing machine Front Side Bus: central processing unit (CPU) 11, north bridge chips (North Bridge) 12, drawing chip (GPU or AGP) 13, storer (DRAM) 14.And drawing storer (GRAM) 15.Please refer to Fig. 1, wherein the interface between north bridge chips 12 and South Bridge chip 16 is the low speed transmissions interface, between all the other north bridge chips 12 and the central processing unit 11, between north bridge chips 12 and drawing chip or the drawing interface 13, be the high-speed transfer interface between north bridge chips 12 and the storer 14, so, be arranged in the element of Fig. 1 dotted line top, possessed the condition of independent particle system basically.
Therefore, in the present invention, will such as: central processing unit (CPU), north bridge chips (NorthBridge), drawing chip (GPU or AGP), storer (DRAM) and drawing storer (GRAM) etc. need the high speed element of high-speed transfer signal, directly be integrated into a module, be located at a high density interconnect substrate (high Density Interconnect HDI) 21, become a Front Side Bus module 20, as shown in Figure 2; Other peripheral equipment is then connected by South Bridge chip, non-circuit and the element (as: output/input or the circuit that stores) (not indicating among the figure) that belongs to Front Side Bus then remaines in the printed circuit board (PCB) of main circuit board 23 originally, and this front end bus module 20, can be again in modes such as connector, winding displacement 24 or solderings, be connected with main circuit board 23 forming circuits, and be configured to a complete computer main frame panel system.
The generation specification platform (Plat form) of general computing machine, be to develop with the speed of Front Side Bus to be its emphasis, therefore the Front Side Bus modularity with computing machine of the present invention promptly is in the upgrading computer process in the future, does not need complete machine to change motherboard, and only need change this computing machine Front Side Bus module, promptly can reach the upgrading purpose, and the South Bridge chip of rear end institute coupling part, owing to be not the main outfit of upgrading computer, so still can continue use, to save loss economically.
In addition, because the element of high-speed line and generation electromagnetic radiation all is incorporated in this computing machine Front Side Bus module 20, therefore can do the anti-system measure of effective electromagnetic radiation at element in this module and circuit, that is outside this front end bus module 20, coat computing machine Front Side Bus module 20 with ELECTROMAGNETIC OBSCURANT shell 22, measure as the electromagnetic radiation control, in order to the electromagnetic radiation that element and circuit produced is isolated from the shell, make it be unlikely the problem that the external world causes the electromagnetic radiation of computing machine complete machine that is radiated, can also the electromagnetic radiation that module is outer be denial in outside the ELECTROMAGNETIC OBSCURANT shell 22, prevent that the external electromagnetic radiation from producing interference for Front Side Bus module high speed element and circuit.And the material of ELECTROMAGNETIC OBSCURANT shell 22 comprises conductor or conductive material, for example: aluminium or copper.
In this front end bus module 20 because gathered the element of all computer architecture high speeds, high heating, so the heat dissipation problem of this front end bus module 20 can utilize the high efficiency heat radiation element of recent invention certainly to be separated.Use such as flat plate heat tube, miniature radiating fin (Micro Fin), steam chamber (vapor chamber) or water-cooled element high-level efficiency heat dissipation elements such as (Water cooling), when solving this heat dissipation problem smoothly, and do not need as traditional main substrate, disperse owing to produce the element of high heat, and need heat radiation respectively.
This front end bus module 20 is because need flow through a large amount of electric currents to supply its power supply, so the metal needs of its joint face is wanted suitable thickness, can bear passing through of big electric current on the one hand, then can provide less resistance on the other hand, to reduce direct current pressure drop in the circuit, make that supply line's quality is more stable.So joint face is preferably in the mode of face contact, face conducting or multiple spot conducting, replace general some contact commonly used, the mode of line conducting, therefore, can use the supply line that sectional area is big, impedance is lower, live width is bigger to connect power supply supply module 25 among the present invention, hold the required electric power of bus module 20 before this with supply; And power supply supply module 25 can place (as shown in Figure 2) on the main circuit board 23, or supplying module 25 with power supply places on the high density interconnect substrate 21 with Front Side Bus module 20 places (figure does not indicate), be connected on this front end bus module 20 in modes such as soldering, connector or winding displacements 24 again, if this power supply supply module 25 is placed on the high density interconnect substrate 21, then can select to be arranged on the same side or opposite side with Front Side Bus module 20 high speed element places.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; those skilled in the art can do a little change and retouching without departing from the spirit and scope of the present invention, so protection scope of the present invention should be as the criterion by the accompanying Claim person of defining.
Claims (27)
1, a kind of computing machine Front Side Bus module comprises:
One high density interconnect substrate; And
A plurality of high speed elements are disposed on this high density interconnect substrate, and are electrically connected to each other,
Wherein said a plurality of high speed element comprises:
One north bridge chips is disposed on this high density interconnect substrate;
One central processing unit is disposed on this high density interconnect substrate, and is electrically connected with this north bridge chips via this high density interconnect substrate; And
One storer is disposed on this high density interconnect substrate, and is electrically connected with this north bridge chips via this high density interconnect substrate.
2, computing machine Front Side Bus module as claimed in claim 1, wherein said a plurality of high speed elements also comprise a drawing chip, are disposed on this high density interconnect substrate, and are electrically connected with this north bridge chips via this high density interconnect substrate.
3, computing machine Front Side Bus module as claimed in claim 1, wherein said a plurality of high speed elements also comprise a drawing interface, are disposed on this high density interconnect substrate and via this high density interconnect substrate to be electrically connected with this north bridge chips.
4, computing machine Front Side Bus module as claimed in claim 1 also comprises an ELECTROMAGNETIC OBSCURANT shell, coats described a plurality of high speed element and this high density interconnect substrate.
5, computing machine Front Side Bus module as claimed in claim 4, wherein the material of this ELECTROMAGNETIC OBSCURANT shell is a conductor.
6, computing machine Front Side Bus module as claimed in claim 1 also comprises power supply supply module, is electrically connected with described a plurality of high speed elements via this high density interconnect substrate, to provide described a plurality of high speed element required power supply.
7, computing machine Front Side Bus module as claimed in claim 6, wherein this power supply supply module and described a plurality of high speed element are disposed at the same side of this high density interconnect substrate.
8, computing machine Front Side Bus module as claimed in claim 6, wherein this power supply supply module and described a plurality of high speed element are disposed at the both sides of this high density interconnect substrate respectively.
9, computing machine Front Side Bus module as claimed in claim 1 also comprises a heat dissipation element, with described a plurality of high speed element hot tie-ins, in order to the heat that described a plurality of high speed element produced is passed to outside this computing machine Front Side Bus module.
10, computing machine Front Side Bus module as claimed in claim 9, wherein this heat dissipation element is selected from by flat plate heat tube, miniature radiating fin, steam chamber, reaches group and combination thereof that the water-cooled element is constituted.
11, a kind of motherboard comprises:
One main circuit board;
One Front Side Bus module is electrically connected on this main circuit board; And
One ELECTROMAGNETIC OBSCURANT shell coats this Front Side Bus module,
Wherein this Front Side Bus module comprises:
One high density interconnect substrate; And
A plurality of high speed elements are disposed on this high density interconnect substrate, and are electrically connected to each other,
And wherein said a plurality of high speed element comprises:
One north bridge chips;
One storer; And
One central processing unit, wherein this north bridge chips, this storer and this central processing unit all are arranged on this high density interconnect substrate, and see through this high density interconnect substrate electrical connection each other.
12, motherboard as claimed in claim 11, wherein said a plurality of high speed elements also comprise a drawing chip, are disposed on this high density interconnect substrate, and are electrically connected with this north bridge chips via this high density interconnect substrate.
13, motherboard as claimed in claim 11, wherein said a plurality of high speed elements also comprise a drawing interface, are disposed on this high density interconnect substrate, and are electrically connected with this north bridge chips via this high density interconnect substrate.
14, motherboard as claimed in claim 11, wherein this Front Side Bus module utilizes a connector to be electrically connected with this main circuit board, with transmission signals.
15, motherboard as claimed in claim 11, wherein this Front Side Bus module utilizes a winding displacement to be electrically connected with this main circuit board, with transmission signals.
16, motherboard as claimed in claim 11, wherein this Front Side Bus module utilizes the mode of soldering to be electrically connected with this main circuit board, with transmission signals.
17, motherboard as claimed in claim 11, wherein this ELECTROMAGNETIC OBSCURANT shell is the conductive material made.
18. motherboard as claimed in claim 11, it more comprises power supply supply module, is arranged at this main circuit board, and is electrically connected with this Front Side Bus module.
19. motherboard as claimed in claim 18, wherein this Front Side Bus module utilizes the mode of soldering to be electrically connected with this power supply supply module.
20. motherboard as claimed in claim 18, wherein this Front Side Bus module utilizes a winding displacement to be electrically connected with this power supply supply module.
21. motherboard as claimed in claim 18, wherein this Front Side Bus module utilizes a connector to be electrically connected with this power supply supply module.
22. motherboard as claimed in claim 11, it more comprises power supply supply module, is arranged at the high density interconnect substrate, and is electrically connected with this Front Side Bus module.
23. motherboard as claimed in claim 22, wherein this Front Side Bus module utilizes the mode of soldering to be electrically connected with this power supply supply module.
24. motherboard as claimed in claim 22, wherein this Front Side Bus module utilizes a winding displacement to be electrically connected with this power supply supply module.
25. motherboard as claimed in claim 22, wherein this Front Side Bus module utilizes a connector to be electrically connected with this power supply supply module.
26. motherboard as claimed in claim 11 also comprises a heat dissipation element, with described a plurality of high speed element hot tie-ins, in order to the heat that described a plurality of high speed element produced is passed to outside this computing machine Front Side Bus module.
27. motherboard as claimed in claim 26, wherein this heat dissipation element is selected from by flat plate heat tube, miniature radiating fin, steam chamber, reaches group and combination thereof that the water-cooled element is constituted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03122544 CN1261887C (en) | 2003-04-17 | 2003-04-17 | Computer front end bus module set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03122544 CN1261887C (en) | 2003-04-17 | 2003-04-17 | Computer front end bus module set |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1538307A CN1538307A (en) | 2004-10-20 |
| CN1261887C true CN1261887C (en) | 2006-06-28 |
Family
ID=34321044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03122544 Expired - Fee Related CN1261887C (en) | 2003-04-17 | 2003-04-17 | Computer front end bus module set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1261887C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7624297B2 (en) * | 2006-12-13 | 2009-11-24 | International Business Machines Corporation | Architecture for a physical interface of a high speed front side bus |
-
2003
- 2003-04-17 CN CN 03122544 patent/CN1261887C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1538307A (en) | 2004-10-20 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060628 Termination date: 20160417 |
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| CF01 | Termination of patent right due to non-payment of annual fee |