CN112918930A - Heat dissipation storage device for semiconductor chip - Google Patents
Heat dissipation storage device for semiconductor chip Download PDFInfo
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- CN112918930A CN112918930A CN202110100288.XA CN202110100288A CN112918930A CN 112918930 A CN112918930 A CN 112918930A CN 202110100288 A CN202110100288 A CN 202110100288A CN 112918930 A CN112918930 A CN 112918930A
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- semiconductor chip
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/70—Containers, packaging elements or packages, specially adapted for particular articles or materials for materials not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
- B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
- B65D81/263—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for ventilating the contents
Abstract
The invention discloses a heat dissipation storage device for a semiconductor chip, which comprises a supporting plate, wherein lower supporting seats are connected to the left side and the right side of the supporting plate, an electric push rod is connected to the top of each lower supporting seat, an upper supporting seat is connected to the top of each electric push rod, a sleeve is connected between the two groups of upper supporting seats, four groups of through grooves are circumferentially formed in the upper end of the sleeve, a micro fan is installed in each through groove, a rotating shaft is rotatably connected to the center of the top of the supporting plate, a storage assembly is connected to the top of each rotating shaft, four groups of steering grooves are circumferentially formed in the supporting plate, heat conducting columns are hermetically and rotatably connected in the steering grooves, heat exchange cavities are formed; the semiconductor chip storage device is reasonable in structural design, the upper end of the placing seat can be popped out, a semiconductor chip can be conveniently taken out, heat of a storage environment can be effectively absorbed, the semiconductor chip can be stored, air in the sleeve can be led out, and heat dissipation in the sleeve is accelerated.
Description
Technical Field
The invention relates to the technical field of semiconductor chip related equipment, in particular to a heat dissipation storage device for a semiconductor chip.
Background
The semiconductor, which is a material having a conductivity between conductor and insulator at normal temperature, has been widely used in radio, television and temperature measurement, for example, diodes are devices made of semiconductors, and a semiconductor is a material having a controllable conductivity ranging from insulator to conductor, and has great importance in view of technology and economic development, most of today's electronic products, such as computers, mobile phones or digital audio recorders, have a close relationship with semiconductors, and common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one of various semiconductor materials in commercial application.
The semiconductor chip is a semiconductor device which is manufactured by etching and wiring on a semiconductor wafer and can realize a certain function, not only is a silicon chip, but also commonly comprises semiconductor materials such as gallium arsenide and germanium, and the semiconductor chip needs to be stored after production, so that a storage device is needed, but the existing storage device cannot carry out heat dissipation treatment on heat in a storage space, and great inconvenience is brought to storage work.
Disclosure of Invention
The present invention is directed to a heat dissipation storage device for semiconductor chips, which overcomes the problems of the prior art.
In order to achieve the technical purpose and achieve the technical effect, the invention provides the following technical scheme:
the utility model provides a semiconductor chip is with heat dissipation storage device, includes the layer board, the layer board bottom is connected with the stand, the left and right sides of layer board is connected with the undersetting, the top of undersetting is connected with electric putter, electric putter's top is connected with the upper bracket, and is two sets of be connected with the sleeve between the upper bracket, four groups of logical grooves have been seted up to telescopic upper end circumference, logical inslot is installed micro fan, the top center of layer board is rotated and is connected with the rotation axis, the top of rotation axis is connected with storage component.
Preferably, in the heat dissipation storage device for the semiconductor chip, four groups of steering grooves are circumferentially formed in the supporting plate, the steering grooves are connected with heat conducting columns in a sealing and rotating mode, heat exchange cavities are formed in the upper end and the lower end of each heat conducting column, a liquid storage tank is connected to the bottom of the supporting plate, cooling liquid is filled in the liquid storage tank, a liquid inlet pipe is communicated between the bottom of the inner wall of the liquid storage tank and the steering grooves, a liquid outlet pipe is communicated between the upper portion of the inner wall of the liquid storage tank and the steering grooves, two connecting pipes are installed at the end portions of the heat exchange cavities, the inner wall of each heat exchange cavity is connected with a memory spring, the end portions of the memory springs are connected with.
Preferably, in a heat dissipation storage device for semiconductor chip, the storage subassembly includes the storage box that a plurality of groups circumference distributes, storage box one end rigid coupling rotation axis, the spout has been seted up to the inner wall symmetry of storage box, sliding connection has the slider in the spout, and is two sets of be connected with between the slider and place the seat, the inner chamber bottom of storage box is connected with the spring beam, the top of spring beam is connected with the kicking block, the seat is placed to kicking block upper end butt, the outer wall activity of storage box is pegged graft and is had the horizon bar, the one end that the horizon bar stretched into the spout is connected with the voussoir, the slider tip has been seted up with voussoir matched with draw-in groove, the one end that the horizon bar stretches out the storage.
Preferably, in the heat dissipation storage device for the semiconductor chip, a piezoelectric block is connected to the top of the inner cavity of the liquid storage tank, the piezoelectric block is coupled to the micro-fan, an elastic sheet is arranged below the piezoelectric block, and a top rod is connected to the top of the elastic sheet.
Preferably, in the heat dissipation storage device for the semiconductor chip, an outer wall of the storage box is provided with a storage identifier.
Preferably, in the heat dissipation storage device for the semiconductor chip, the memory spring is made of a memory alloy material and contracts when reaching a deformation temperature.
Preferably, in the heat dissipation storage device for the semiconductor chip, the pipe orifices of the two connecting pipes correspond to the liquid outlet pipe and the liquid inlet pipe.
Preferably, in the heat dissipation storage device for a semiconductor chip, a dust screen is mounted at an upper end of the micro fan.
Preferably, in the heat dissipation storage device for the semiconductor chip, the supporting plate and the sleeve are made of insulating materials.
Compared with the prior art, the invention has the beneficial effects that:
1. the semiconductor chip taking device is reasonable in structural design, the supporting plate is supported through the stand column, the semiconductor chip can be stored through the storage assembly, the semiconductor chip is contained in the placing seat and then pressed downwards, the sliding block is matched with the sliding groove for guiding, the placing seat extends into the storage box, the lower end of the placing seat is abutted to the top block, the spring rod is compressed and contracted, the wedge block can be clamped with the clamping groove in the end portion of the sliding block, the upper support is driven to ascend through the electric push rod when the chip is taken, the sleeve is separated from the supporting plate, the horizontal rod is pulled outwards through the shifting block, the wedge block is separated from the clamping groove after the stretching spring is stretched, the spring rod drives the top block;
2. when the temperature of the storage environment in the sleeve is higher, the heat in the sleeve enters the heat exchange cavity through the heat conduction column, the temperature of the memory spring at the upper end firstly rises to reach the deformation temperature and then contracts, so that when the piston block moves, the connecting pipe is communicated with the liquid inlet pipe to absorb the cooling liquid from the liquid storage tank, the gravity center of the heat conduction column moves upwards to drive the heat conduction column to rotate, the positions of the two groups of heat exchange cavities are switched, one side at the bottom of the supporting plate dissipates the internal heat and further extends the memory spring, so that the cooling liquid in the heat exchange cavity is extruded into the liquid storage tank through the liquid outlet pipe, meanwhile, the other group of heat exchange cavities rotates into the sleeve, and the memory spring in the heat exchange cavity is repeatedly extended and contracted to drive the heat conduction column to continuously rotate, so that the cooling liquid circularly flows in the heat exchange cavity and the liquid storage, the heat of a storage environment can be effectively absorbed, and the storage of the semiconductor chip is facilitated;
3. according to the invention, the piezoelectric block, the elastic sheet and the ejector rod are arranged in the liquid storage tank, when the two memory springs drive the piston block to move, due to asynchronous liquid absorption and liquid discharge, the pressure inside the liquid storage tank is changed, the elastic sheet is deformed up and down on the inner wall of the liquid storage tank, the ejector rod continuously extrudes the piezoelectric block, current is continuously generated on the piezoelectric block, the piezoelectric block is coupled with the micro fan, airflow traction is carried out after the micro fan is started, air in the sleeve can be led out, and heat dissipation in the sleeve is accelerated.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without inventive labor.
FIG. 1 is an overall block diagram of the present invention;
FIG. 2 is a schematic structural view of a heat conductive pillar according to the present invention;
FIG. 3 is a schematic view of a reservoir of the present invention;
FIG. 4 is a schematic view of the storage case of the present invention;
FIG. 5 is an enlarged view of a portion of FIG. 4 at A;
fig. 6 is a bottom view of the pallet of the present invention.
In the figure: 1. a support plate; 2. a column; 3. a lower support; 4. an electric push rod; 5. an upper support; 6. a sleeve; 7. a micro fan; 8. a rotating shaft; 9. a storage component; 10. a heat-conducting column; 11. a heat exchange cavity; 12. a liquid storage tank; 13. a liquid inlet pipe; 14. a liquid outlet pipe; 15. a connecting pipe; 16. a memory spring; 17. a piston block; 901. a storage box; 902. a chute; 903. a slider; 904. a placing seat; 905. a spring lever; 906. a top block; 907. a horizontal bar; 908. a wedge block; 909. a card slot; 910. shifting blocks; 911. an extension spring; 121. a piezoelectric block; 122. an elastic sheet; 123. and a push rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present embodiment is a heat dissipation storage device for semiconductor chips, including a supporting plate 1, a column 2 is connected to the bottom of the supporting plate 1, lower supports 3 are connected to the left and right sides of the supporting plate 1, an electric push rod 4 is connected to the top of the lower support 3, an upper support 5 is connected to the top of the electric push rod 4, a sleeve 6 is connected between the two sets of upper supports 5, four sets of through grooves are circumferentially formed in the upper end of the sleeve 6, a micro fan 7 is installed in the through grooves, a rotating shaft 8 is rotatably connected to the center of the top of the supporting plate 1, and a storage assembly.
Four groups of steering grooves are circumferentially arranged on the supporting plate 1, the steering grooves are internally and rotatably connected with heat conducting columns 10 in a sealing mode, heat exchange cavities 11 are formed in the upper end and the lower end of each heat conducting column 10, the bottom of the supporting plate 1 is connected with a liquid storage tank 12, cooling liquid is filled in the liquid storage tank 12, a liquid inlet pipe 13 is communicated between the bottom of the inner wall of the liquid storage tank 12 and the steering grooves, a liquid outlet pipe 14 is communicated between the upper portion of the inner wall of the liquid storage tank 12 and the steering grooves, two connecting pipes 15 are installed at the end portions of the heat exchange cavities 11, the inner walls of the heat exchange cavities 11 are connected with memory springs 16, the end.
Storage assembly 9 includes storage box 901 of a plurality of groups circumference distribution, storage box 901 one end rigid coupling rotation axis 8, spout 902 has been seted up to the inner wall symmetry of storage box 901, sliding connection has slider 903 in the spout 902, be connected with between two sets of sliders 903 and place seat 904, the inner chamber bottom of storage box 901 is connected with spring rod 905, spring rod 905's top is connected with kicking block 906, seat 904 is placed to kicking block 906 upper end butt, the outer wall activity of storage box 901 is pegged graft and is had horizontal pole 907, the one end that horizontal pole 907 stretched into spout 902 is connected with voussoir 908, the draw-in groove 909 with voussoir 908 matched with is seted up to slider 903 tip, the one end that horizontal pole 907 stretched out storage box 901 is connected with shifting block 910.
The top of the inner cavity of the liquid storage tank 12 is connected with a piezoelectric block 121, the piezoelectric block 121 is coupled with the micro-fan 7, an elastic sheet 122 is arranged below the piezoelectric block 121, the top of the elastic sheet 122 is connected with an ejector rod 123, the ejector rod 123 is driven to move through the elastic sheet 122, and the ejector rod 123 extrudes the piezoelectric block 121 to continuously generate current.
The outer wall of storage box 901 is equipped with the storage sign, is convenient for mark storage box 901 to categorised storage chip of placing.
The memory spring 16 is made of memory alloy material and contracts when reaching a deformation temperature, so as to drive the piston block 17 to move, and further draw the cooling liquid into the heat exchange cavity 11.
The pipe orifices of the two connecting pipes 15 correspond to the liquid outlet pipe 14 and the liquid inlet pipe 13, so that the cooling liquid can be guided in a drainage manner.
The upper end of the micro fan 7 is provided with a dustproof filter screen, so that dust and impurities can be prevented from entering.
The supporting plate 1 and the sleeve 6 are made of insulating materials, and the safety coefficient is high.
The specific implementation manner of this embodiment is:
when the device is used, the supporting plate 1 is supported through the stand column 2, semiconductor chips can be stored through the storage assembly 9, the semiconductor chips are put into the placing seat 904 and then pressed downwards, the sliding block 903 is used for being matched with the sliding groove 902 for guiding, the placing seat 904 extends into the storage box 901, the lower end of the placing seat 904 is abutted to the top block 906, the spring rod 905 is compressed and contracted, the wedge 908 can be clamped with the clamping groove 909 at the end part of the sliding block 903, the upper support 5 is driven to ascend through the electric push rod 4 when the chips are taken out, the sleeve 6 is separated from the supporting plate 1, the horizontal rod 907 is pulled outwards through the shifting block 910, the wedge 908 is separated from the clamping groove 909 after the stretching spring 911 is stretched, the spring rod 905 drives the top block 906 to elastically reset, the upper;
when the temperature of the storage environment in the sleeve 6 is high, by arranging the heat exchange cavity 11, the memory spring 16, the piston block 17 and the liquid storage tank 12, the heat in the sleeve 6 enters the heat exchange cavity 11 through the heat conduction column 10, the temperature of the memory spring 16 at the upper end firstly rises to reach the deformation temperature and then contracts, so that when the piston block 17 moves, the connecting pipe 15 is communicated with the liquid inlet pipe 13 to absorb the cooling liquid from the liquid storage tank 12, the center of gravity of the heat conduction column 10 moves upwards, so as to drive the heat conduction column 10 to rotate, the positions of the two groups of heat exchange cavities 11 are switched, the heat in the heat exchange cavities 11 is dissipated from one side of the bottom of the supporting plate 1, so that the memory spring 16 extends, so that the cooling liquid in the heat exchange cavities 11 is extruded into the liquid storage tank 12 through the liquid outlet pipe 14, meanwhile, the other group of heat exchange cavities 11 rotates into the sleeve 6, so that, the cooling liquid circularly flows in the heat exchange cavity 11 and the liquid storage tank 12, so that the heat of the storage environment can be effectively absorbed, and the storage of the semiconductor chip is facilitated;
set up piezoelectric block 121 in the liquid storage pot 12, flexure strip 122 and ejector pin 123, when two memory spring 16 drive piston block 17 and remove, because asynchronous imbibition and flowing back, make the inside pressure of liquid storage pot 12 change, and then make flexure strip 122 deform from top to bottom at liquid storage pot 12 inner wall, make ejector pin 123 constantly extrude piezoelectric block 121, make constantly produce the electric current on the piezoelectric block 121, piezoelectric block 121 coupling micro-fan 7, make carry out the air current after micro-fan 7 starts and draw, can draw the air of sleeve 6, and then accelerate the heat dissipation in the sleeve 6.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (9)
1. A heat dissipation storage device for a semiconductor chip, comprising a support plate (1), characterized in that: the utility model discloses a storage device, including layer board (1), electric putter (4), upper bracket (5), two sets of upper bracket (5), sleeve (6) have been seted up to the upper end circumference of sleeve (6), it installs micro-fan (7) to lead to the inslot, the top center of layer board (1) is rotated and is connected with rotation axis (8), the top of rotation axis (8) is connected with storage component (9).
2. The heat-dissipating storage device for a semiconductor chip as set forth in claim 1, wherein: four groups of steering grooves have been seted up to layer board (1) circumference, it is connected with heat conduction post (10) to turn to the inslot sealed rotation, heat transfer chamber (11) have been seted up at the upper and lower both ends of heat conduction post (10), the bottom of layer board (1) is connected with liquid storage pot (12), liquid storage pot (12) intussuseption is filled with the coolant liquid, the intercommunication has feed liquor pipe (13) between the inner wall bottom of liquid storage pot (12) and the steering groove, the intercommunication has drain pipe (14) between the inner wall top of liquid storage pot (12) and the steering groove, two connecting pipes (15) are installed to the tip of heat transfer chamber (11), the inner wall of heat transfer chamber (11) is connected with memory spring (16), the end connection of memory spring (16) has piston block (17), piston block (17) lateral wall sealing sliding connection heat transfer.
3. The heat-dissipating storage device for a semiconductor chip as set forth in claim 1, wherein: the storage component (9) comprises a plurality of sets of storage boxes (901) distributed in the circumferential direction, one end of each storage box (901) is fixedly connected with a rotating shaft (8), sliding grooves (902) are symmetrically formed in the inner wall of each storage box (901), sliding blocks (903) are connected in the sliding grooves (902) in a sliding mode, a placing seat (904) is connected between the two sets of sliding blocks (903), a spring rod (905) is connected to the bottom of an inner cavity of each storage box (901), a top block (906) is connected to the top of each spring rod (905), the upper end of each top block (906) abuts against the placing seat (904), a horizontal rod (907) is movably inserted into the outer wall of each storage box (901), one end, extending into each sliding groove (902), of each horizontal rod (907) is connected with a wedge block (908), a clamping groove (909) matched with each wedge block (908) is formed in the end of each sliding block (, an extension spring (911) is connected between the shifting block (910) and the storage box (901).
4. The heat-dissipating storage device for a semiconductor chip as set forth in claim 2, wherein: the top of the inner cavity of the liquid storage tank (12) is connected with a piezoelectric block (121), the piezoelectric block (121) is coupled with the micro-fan (7), an elastic sheet (122) is arranged below the piezoelectric block (121), and the top of the elastic sheet (122) is connected with a mandril (123).
5. The heat-dissipating storage device for a semiconductor chip as set forth in claim 3, wherein: the outer wall of the storage box (901) is provided with a storage identifier.
6. The heat-dissipating storage device for a semiconductor chip as set forth in claim 2, wherein: the memory spring (16) is made of memory alloy materials and contracts when reaching a deformation temperature.
7. The heat-dissipating storage device for a semiconductor chip as set forth in claim 2, wherein: the pipe orifices of the two connecting pipes (15) correspond to the liquid outlet pipe (14) and the liquid inlet pipe (13).
8. The heat-dissipating storage device for a semiconductor chip as set forth in claim 1, wherein: and a dustproof filter screen is arranged at the upper end of the micro fan (7).
9. The heat-dissipating storage device for a semiconductor chip as set forth in claim 1, wherein: the supporting plate (1) and the sleeve (6) are both made of insulating materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110100288.XA CN112918930B (en) | 2021-01-24 | 2021-01-24 | Heat dissipation storage device for semiconductor chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110100288.XA CN112918930B (en) | 2021-01-24 | 2021-01-24 | Heat dissipation storage device for semiconductor chip |
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| CN112918930B CN112918930B (en) | 2022-07-22 |
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| CN115158832A (en) * | 2022-07-22 | 2022-10-11 | 广州祈阳科技有限公司 | Heat dissipation storage device for semiconductor chip |
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|---|---|
| CN112918930B (en) | 2022-07-22 |
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