CN112665211A - Multi-temperature-zone direct-cooling refrigerating device - Google Patents
Multi-temperature-zone direct-cooling refrigerating device Download PDFInfo
- Publication number
- CN112665211A CN112665211A CN202011460182.2A CN202011460182A CN112665211A CN 112665211 A CN112665211 A CN 112665211A CN 202011460182 A CN202011460182 A CN 202011460182A CN 112665211 A CN112665211 A CN 112665211A
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- temperature
- evaporator
- refrigeration
- heat
- assembly
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- 238000001816 cooling Methods 0.000 title claims abstract description 27
- 238000005057 refrigeration Methods 0.000 claims abstract description 79
- 239000004065 semiconductor Substances 0.000 claims abstract description 47
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 238000005192 partition Methods 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000000523 sample Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the field of refrigeration equipment, and discloses a multi-temperature-zone direct-cooling refrigeration device which comprises an evaporator, a partition plate, a semiconductor refrigeration assembly, a heat dissipation assembly and a controller. The semiconductor refrigeration assembly comprises a refrigeration end and a heating end, the refrigeration end of the semiconductor refrigeration assembly is arranged on the outer side of the evaporator, and a heat dissipation assembly is arranged on the heating end of the semiconductor refrigeration assembly and used for dissipating heat generated during refrigeration. The device can separate a single evaporator into at least two temperature areas through at least one partition plate, the temperatures of different temperature areas are adjusted by setting the contact area of the semiconductor refrigeration assembly and each temperature area in the evaporator, multi-temperature-area refrigeration control is realized through the single evaporator, the cost is greatly saved, and the reliability of products is improved.
Description
Technical Field
The invention relates to the field of refrigeration equipment, in particular to a multi-temperature-zone direct-cooling refrigeration device.
Background
Generally, the existing direct cooling refrigeration system realizes multiple temperature zones, different temperature zones need different evaporators to realize temperature zone division, the structure is complex, and the product reliability is not high.
Disclosure of Invention
The invention aims to provide a multi-temperature-zone direct-cooling refrigerating device, which can realize the control of a plurality of direct-cooling temperature zones through a single evaporator, greatly save the cost and improve the reliability of products.
In order to achieve the above object, the present invention provides a multi-temperature-zone direct-cooling refrigeration device, comprising:
the evaporator is arranged on the refrigeration equipment;
the evaporator is divided into at least two temperature zones with different volumes by at least one partition plate;
the semiconductor refrigeration assembly comprises a refrigeration end and a heating end, the refrigeration end of the semiconductor refrigeration assembly is arranged on the outer side of the evaporator, and the refrigeration assembly is in contact with the evaporator to transfer refrigeration to the evaporator;
the heat dissipation assembly is arranged at the heating end of the semiconductor refrigeration assembly and used for dissipating heat generated during refrigeration;
and the controller is electrically connected with the semiconductor refrigeration assembly and the heat dissipation assembly.
Preferably, the semiconductor refrigeration assembly comprises a heat conducting plate and a semiconductor chip which are arranged in sequence from the evaporator to the heat dissipation assembly.
Preferably, the heat dissipation assembly includes:
the bottom plate is connected with the heating end of the semiconductor refrigeration assembly;
the heat conducting fins are uniformly distributed on one side, away from the semiconductor refrigeration assembly, of the bottom plate, and the heat conducting fins are riveted with the bottom plate through rivets;
and the heat radiation fan is arranged on one side of the heat conducting fin, which is far away from the bottom plate.
Preferably, a gap is provided between adjacent heat-conducting fins.
Preferably, the gap is 1-5 mm.
Preferably, heat-conducting silica gel is arranged between the bottom plate and the heat-conducting fin.
Preferably, the bottom plate or the heat conducting plate is a regular aluminum plate.
Preferably, a plurality of positioning columns are arranged on the side face of the semiconductor refrigeration assembly, and positioning holes matched with the positioning columns are formed in the side face of the evaporator.
Preferably, the evaporator and the partition are both made of a heat conductive material.
Preferably, a temperature sensing probe is further disposed on the inner side of the evaporator, and the temperature sensing probe is electrically connected with the controller.
Through the technical scheme, the invention discloses a multi-temperature-zone direct-cooling refrigerating device which can divide a single evaporator into at least two temperature zones through at least one partition plate, the temperatures of different temperature zones are adjusted by setting the contact area between a semiconductor refrigerating assembly and each temperature zone in the evaporator, the multi-temperature-zone refrigeration control is realized through the single evaporator, the cost is greatly saved, and the reliability of products is improved.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 shows a schematic structural diagram of a multi-temperature-zone direct-cooling refrigeration device according to an embodiment of the invention;
FIG. 2 illustrates a cross-sectional view of FIG. 1 in accordance with an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an evaporator of a multi-temperature-zone direct-cooling refrigeration device according to an embodiment of the invention;
fig. 4 shows a schematic structural diagram of a semiconductor refrigeration assembly of a multi-temperature-zone direct-cooling refrigeration device according to an embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
Referring to fig. 1-2, the present embodiment discloses a multi-temperature-zone direct-cooling refrigeration device, which includes an evaporator 1, a partition plate 2, a semiconductor refrigeration component 3, a heat dissipation component 4, and a controller. The evaporator 1 is arranged on refrigeration equipment, at least one partition plate 2 is arranged, the evaporator 1 is divided into at least two temperature areas with different volumes by the at least one partition plate 2, the semiconductor refrigeration component 3 comprises a refrigeration end and a heating end, the refrigeration end of the semiconductor refrigeration component 3 is arranged on the outer side of the evaporator 1, and the semiconductor refrigeration component 3 and the evaporator 1 are contacted to transfer cold energy to the evaporator 1, the cold energy is uniformly dispersed into the evaporator 1, and the different temperature areas are different in heat dissipation area through the evaporator 1, so that the temperatures in the at least two temperature areas with different volumes are different, the heat dissipation component 4 is arranged on the heating end of the semiconductor refrigeration component 3 and used for dissipating heat generated during refrigeration, and the controller is electrically connected with the semiconductor refrigeration component 3 and the heat dissipation component 4. The evaporator 1 and the partition plate 2 are made of heat conducting materials which can be metal materials such as aluminum and copper, the heat conducting effect is good, and loss in the heat conducting process is reduced.
Specifically, a partition plate 2 is arranged in the embodiment, the evaporator 1 is divided into two temperature areas with different volumes by the partition plate 2, the semiconductor refrigeration assembly 3 is in contact with the evaporator 1 to transfer cold energy, the volumes of the two temperature areas are different, and the heat dissipation areas of the evaporator 1 are also different, so that the temperatures in the two temperature areas are different, the purpose of realizing multiple temperature areas by using a single evaporator 1 and a single semiconductor refrigeration assembly 3 is realized, the number of materials and the number of welding spots are reduced, the reliability of the evaporator 1 is improved, and the input cost is reduced. In addition, the generated heat can be dissipated through the heat dissipation assembly 4, and the working efficiency of the semiconductor refrigeration assembly 3 is guaranteed. Preferably, the temperature sensing probe 12 is further disposed inside the evaporator 1, and can sense the temperature inside the temperature zones, of course, a display can be disposed outside the refrigeration equipment to display the temperature of each temperature zone, since the heat conductivity coefficient of the evaporator 1 is fixed, the temperature of each temperature zone can be obtained under the condition that the power of the semiconductor refrigeration assembly 3 is constant, a user can set the working power of the semiconductor refrigeration assembly 3 through a controller according to needs, and also can set the temperature, and the power of the semiconductor refrigeration assembly 3 is adjusted through the controller.
Referring to fig. 2, the semiconductor refrigeration assembly 3 includes a heat conduction plate and a semiconductor chip 33 sequentially disposed from the evaporator 1 to the heat dissipation assembly 4, wherein the heat conduction plate may include a first heat conduction plate 31 and a second heat conduction plate 32 sequentially disposed, the first heat conduction plate 31 and the second heat conduction plate 32 are riveted by rivets, and an area of the first heat conduction plate 31 is larger than an area of the second heat conduction plate 32. The first heat transfer plate 31, the second heat transfer plate 32, and the semiconductor chip 33 form a semiconductor cooling or heating system, thereby performing cooling or heating. Heat conduction silica gel is arranged between the first heat conduction plate 31 and the second heat conduction plate 32, so that the heat conduction area is ensured, and the heat conduction effect is improved. First heat-conducting plate 31 and second heat-conducting plate 32 are regular aluminum plate, and semiconductor refrigeration or heating system passes through riveting technology by two aluminum plate and connects, because of aluminum plate is regular aluminum plate shape, and processing is simple.
Specifically, referring to fig. 3 and 4, a plurality of positioning posts 34 are disposed on a side surface of the first heat conducting plate 31, positioning holes 11 are disposed on a side surface of the evaporator 1 and are adapted to the plurality of positioning posts 34, and the evaporator 1 and the semiconductor cooling module 3 are mounted together by the cooperation of the positioning posts 34 and the positioning holes 11.
Referring to fig. 2, the heat dissipation assembly 4 includes a bottom plate 41, a heat conductive sheet 42, and a heat dissipation fan 43. The base plate 41 is connected with the heating end of the semiconductor refrigeration assembly 3, the heat conducting fins 42 are provided with a plurality of heat conducting fins 42, the heat conducting fins 42 are evenly distributed on one side of the base plate 41 far away from the semiconductor refrigeration assembly 3, the heat conducting fins 42 are riveted with the base plate 41 through rivets, and the heat radiating fan 43 is arranged on one side of the heat conducting fins 42 far away from the base plate 41. Become split type riveted structure with current integrative heat conduction structure, the bottom plate 41 is preferred to regular aluminum plate moreover, and its radiating effect is better, and regular aluminum plate processing requires lowly, and easy to process has reduced the processing cost, has further reduced the processing degree of difficulty through rivet riveting moreover, has improved machining efficiency.
In addition, specifically, during assembly, a plurality of heat conductive sheets 42 are first sequentially positioned on the base plate 41, and then riveted by rivets, thereby completing the process. In order to better position the plurality of heat-conducting fins 42, corresponding positioning grooves can be arranged on the bottom plate 41 for positioning, so that the processing time is greatly reduced, and the processing efficiency is improved. Preferably, in order to better ensure the heat conduction area between the bottom plate 41 and the plurality of heat conduction fins 42, heat conduction silicone may be uniformly coated between the plurality of heat conduction fins 42 and the bottom plate 41. In addition, in this embodiment, the bottom plate 41 and the plurality of heat-conducting fins 42 are U-shaped, so that the plurality of heat-conducting fins 42 themselves can form a heat dissipation channel, the heat dissipation effect is better, and the dissipated heat is blown out through the heat dissipation fan 43. For better improvement radiating effect, can set up the clearance between adjacent conducting strip 42, the clearance between a plurality of conducting strip 42 is different, and its mode of arrangement is also different, and different mode of arrangement heat dissipation modes are also different, can be according to the quick adjustment structure of actual need, need not change the mould, and efficiency is higher. In the present embodiment, the gap between the adjacent heat conductive sheets 42 may be 1 to 5mm, preferably 3 mm.
Through the technical scheme, the invention discloses a multi-temperature-zone direct-cooling refrigerating device which can divide a single evaporator into at least two temperature zones through at least one partition plate, the temperatures of different temperature zones are adjusted by setting the contact area between a semiconductor refrigerating assembly and each temperature zone in the evaporator, the multi-temperature-zone refrigeration control is realized through the single evaporator, the cost is greatly saved, and the reliability of products is improved.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention. It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (10)
1. A multi-temperature-zone direct-cooling refrigerating device is characterized by comprising:
the evaporator (1), the said evaporator (1) is set up on the refrigeration plant;
the evaporator (1) is divided into at least two temperature zones with different volumes by at least one partition plate (2), and at least one partition plate (2) is arranged on the partition plate (2);
the semiconductor refrigeration assembly (3) comprises a refrigeration end and a heating end, the refrigeration end of the semiconductor refrigeration assembly (3) is arranged on the outer side of the evaporator (1), the semiconductor refrigeration assembly (3) is in contact with the evaporator (1) to transfer cold to the evaporator (1), and the cold is uniformly dispersed into the evaporator (1), and the heat dissipation areas of different temperature areas through the evaporator (1) are different, so that the temperatures in the at least two temperature areas with different volumes are different;
the heat dissipation assembly (4) is arranged at the heating end of the semiconductor refrigeration assembly (3) and used for dissipating heat generated during refrigeration;
and the controller is electrically connected with the semiconductor refrigeration assembly (3) and the heat dissipation assembly (4).
2. The multi-temperature-zone direct cooling refrigeration device according to claim 1, wherein the semiconductor refrigeration component (3) comprises a heat conducting plate and a semiconductor chip (33) which are arranged in sequence from the evaporator (1) to the heat dissipation component (4).
3. The multi-temperature zone direct cooling refrigeration device according to claim 1, wherein the heat dissipation assembly (4) comprises:
the bottom plate (41), the bottom plate (41) is connected with the heating end of the semiconductor refrigeration component (3);
the heat conducting fins (42) are arranged, the heat conducting fins (42) are uniformly distributed on one side, away from the semiconductor refrigeration assembly (3), of the bottom plate (41), and the heat conducting fins (42) are riveted with the bottom plate (41) through rivets;
and the heat radiation fan (43), wherein the heat radiation fan (43) is arranged on one side of the heat conducting sheet (42) far away from the bottom plate (41).
4. The multi-temperature zone direct cooling refrigeration device according to claim 3, wherein a gap is provided between adjacent heat-conducting fins (42).
5. The multi-temperature zone direct cooling refrigeration device according to claim 4, wherein the gap is 1-5 mm.
6. The multi-temperature-zone direct-cooling refrigeration device according to claim 3, wherein a heat-conducting silica gel is arranged between the bottom plate (41) and the heat-conducting fin (42).
7. The multi-temperature-zone direct cooling refrigeration device according to any one of claims 2-6, wherein the bottom plate (41) or the heat conducting plate is a regular aluminum plate.
8. The multi-temperature-zone direct-cooling refrigeration device according to claim 1, wherein a plurality of positioning columns (34) are arranged on the side surface of the semiconductor refrigeration component (3), and positioning holes (11) matched with the positioning columns (34) are arranged on the side surface of the evaporator (1).
9. The multi-temperature zone direct cooling refrigeration device according to claim 1, characterized in that the evaporator (1) and the partition plate (2) are both made of heat conductive material.
10. The multi-temperature-zone direct cooling refrigeration device according to claim 1, wherein a temperature sensing probe (12) is further disposed inside the evaporator (1), and the temperature sensing probe (12) is electrically connected to the controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011460182.2A CN112665211A (en) | 2020-12-11 | 2020-12-11 | Multi-temperature-zone direct-cooling refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011460182.2A CN112665211A (en) | 2020-12-11 | 2020-12-11 | Multi-temperature-zone direct-cooling refrigerating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112665211A true CN112665211A (en) | 2021-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011460182.2A Pending CN112665211A (en) | 2020-12-11 | 2020-12-11 | Multi-temperature-zone direct-cooling refrigerating device |
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| Country | Link |
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| CN (1) | CN112665211A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113416996A (en) * | 2021-07-12 | 2021-09-21 | 深圳承启生物科技有限公司 | Electrophoresis liquid cooling device and have its electrophoresis capping |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2811886Y (en) * | 2005-03-15 | 2006-08-30 | 王龙岩 | Semiconductor refrigerator |
| CN206648382U (en) * | 2017-03-27 | 2017-11-17 | 陈文杰 | A kind of cold compartment of refrigerator of multi-temperature zone |
| CN211261349U (en) * | 2019-08-23 | 2020-08-14 | 涂春生 | Miniature portable refrigerator |
-
2020
- 2020-12-11 CN CN202011460182.2A patent/CN112665211A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2811886Y (en) * | 2005-03-15 | 2006-08-30 | 王龙岩 | Semiconductor refrigerator |
| CN206648382U (en) * | 2017-03-27 | 2017-11-17 | 陈文杰 | A kind of cold compartment of refrigerator of multi-temperature zone |
| CN211261349U (en) * | 2019-08-23 | 2020-08-14 | 涂春生 | Miniature portable refrigerator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113416996A (en) * | 2021-07-12 | 2021-09-21 | 深圳承启生物科技有限公司 | Electrophoresis liquid cooling device and have its electrophoresis capping |
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Application publication date: 20210416 |