CN113416996A - Electrophoresis liquid cooling device and have its electrophoresis capping - Google Patents
Electrophoresis liquid cooling device and have its electrophoresis capping Download PDFInfo
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- CN113416996A CN113416996A CN202110783439.6A CN202110783439A CN113416996A CN 113416996 A CN113416996 A CN 113416996A CN 202110783439 A CN202110783439 A CN 202110783439A CN 113416996 A CN113416996 A CN 113416996A
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- 238000001962 electrophoresis Methods 0.000 title claims abstract description 125
- 239000007788 liquid Substances 0.000 title claims abstract description 99
- 238000001816 cooling Methods 0.000 title claims abstract description 68
- 239000004065 semiconductor Substances 0.000 claims abstract description 67
- 238000005192 partition Methods 0.000 claims abstract description 42
- 238000005057 refrigeration Methods 0.000 claims abstract description 42
- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 238000003825 pressing Methods 0.000 claims description 51
- 239000012530 fluid Substances 0.000 claims description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 239000012782 phase change material Substances 0.000 claims description 9
- 239000000110 cooling liquid Substances 0.000 claims description 8
- 230000003014 reinforcing effect Effects 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 5
- 238000012546 transfer Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 10
- 238000002474 experimental method Methods 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 8
- 239000000523 sample Substances 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000001262 western blot Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 102000004169 proteins and genes Human genes 0.000 description 2
- 108090000623 proteins and genes Proteins 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 231100000027 toxicology Toxicity 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/22—Servicing or operating apparatus or multistep processes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application relates to the field of electrophoresis equipment, in particular to an electrophoresis liquid cooling device and an electrophoresis tank cover with the same. The electrophoresis liquid cooling device comprises a semiconductor refrigerating sheet and a heat conducting assembly, wherein the heat conducting assembly is used for transferring heat of electrophoresis liquid to the semiconductor refrigerating sheet and is connected with one surface of the semiconductor refrigerating sheet; the other side of the semiconductor refrigeration piece is connected with a heat dissipation assembly, one end of the heat conduction assembly, which is far away from the semiconductor refrigeration piece, is provided with a circulating flow guide assembly, the circulating flow guide assembly comprises a partition plate, a flow guide plate and a circulating flow guide pipe which are oppositely arranged, and the lower part of the heat conduction assembly is arranged between the partition plate and the flow guide plate; the opening of the circulation draft tube is arranged between the partition plate and the guide plate and faces the lower part of the heat conducting assembly. The electrophoresis tank cover comprises the electrophoresis liquid cooling device. The application provides an electrophoresis liquid cooling device, the circular telegram can be moved, can cool down electrophoresis liquid high-efficiently to easy and simple to handle, economical and practical, the security performance is high.
Description
Technical Field
The application relates to the field of electrophoresis equipment, in particular to an electrophoresis liquid cooling device and an electrophoresis tank cover with the same.
Background
The phenomenon in which charged particles move under the action of an electric field toward an electrode of opposite polarity to the charged particles is called electrophoresis. The electrophoresis technology is a technology for separating charged particles by using different moving speeds in an electric field, and is widely applied to various fields such as analytical chemistry, biochemistry, clinical chemistry, toxicology, pharmacology, immunology, microbiology, food chemistry, and the like. For example, in a Western Blot experiment commonly used in a biological experiment, in the steps of electrophoresis and membrane conversion, a large amount of heat is generated in an electrophoresis tank of an electrophoresis apparatus, and an electrophoresis solution must be efficiently and quickly cooled, otherwise, the experiment effect is affected.
At present, two ways of cooling the electrophoresis solution are mainly adopted, wherein one way is to directly place an ice box into an electrophoresis tank to cool the electrophoresis solution, and the ice box needs to be frozen in advance; the other method is to put the whole electrophoresis tank into crushed ice for cooling, and the electrophoresis tank is a plastic shell and is thick, so that the method has low refrigeration efficiency and does not meet the experimental safety specification.
With respect to the related art among the above, the inventors consider that there is a drawback in that the cooling efficiency is low.
Disclosure of Invention
In order to solve the problem of low refrigeration efficiency in the background art, the present application provides an electrophoresis liquid cooling device and an electrophoresis tank cover having the same.
The application provides an electrophoresis liquid cooling device and have its electrophoresis tank lid adopts following technical scheme:
an electrophoresis liquid cooling device comprises a semiconductor refrigerating sheet and a heat conducting assembly used for transferring heat of electrophoresis liquid to the semiconductor refrigerating sheet, wherein the heat conducting assembly is connected with one surface of the semiconductor refrigerating sheet; the other side of the semiconductor refrigeration piece is connected with a heat dissipation assembly, one end of the heat conduction assembly, which is far away from the semiconductor refrigeration piece, is provided with a circulating flow guide assembly, the circulating flow guide assembly comprises a partition plate, a flow guide plate and a circulating flow guide pipe which are oppositely arranged, and the lower part of the heat conduction assembly is arranged between the partition plate and the flow guide plate; the opening of circulation honeycomb duct set up in the baffle with between the guide plate and towards the lower part of heat conduction subassembly.
By adopting the technical scheme, the semiconductor refrigerating sheet is provided with the heat absorbing surface and the heat releasing surface after being electrified, the heat conducting assembly is connected with the heat absorbing surface of the semiconductor refrigerating sheet, and the heat of the electrophoretic liquid is transferred to the heat absorbing surface through the heat conducting assembly to be absorbed, so that the electrophoretic liquid is efficiently cooled; the heat dissipation assembly is connected with the heat release surface of the semiconductor refrigeration piece, and transfers heat to air far away from the semiconductor refrigeration piece, so that the semiconductor refrigeration piece is cooled and protected; the baffle and the guide plate are arranged oppositely to form a circulation channel of the electrophoresis liquid, and the electrophoresis liquid can flow circularly through the circulation flow guide pipe, so that heat exchange is accelerated, and the cooling efficiency is improved.
Optionally, the areas of the flow guide plate and the partition plate are 2/5-6/7 of the wall of the electrophoresis tank with the smallest area to be placed in the electrophoresis liquid cooling device; the heat dissipation assembly comprises a heat dissipation plate connected to the semiconductor refrigeration sheet and a fan used for accelerating heat dissipation.
By adopting the technical scheme, the flow guide effect is better due to the larger areas of the flow guide plate and the partition plate, and the heat exchange rate is improved; the heat is transferred to the air far away from the semiconductor refrigerating sheet through the heat dissipation plate and the fan, so that the semiconductor refrigerating sheet is cooled and protected.
Optionally, the heat conducting assembly includes a heat pipe with two closed ends and filled with a phase change material, the upper portion of the heat pipe directly or indirectly contacts the semiconductor chilling plate, and the lower portion of the heat pipe may be placed in the electrophoretic liquid.
By adopting the technical scheme, when the electrophoretic liquid flows through the position near the liquid inlet part of the heat pipe, heat is absorbed by the phase-change material in the heat pipe and is transferred to the heat absorbing surface of the semiconductor refrigerating sheet, so that the heat is finally taken away by the semiconductor refrigerating sheet and the heat dissipation assembly, and the purpose of cooling the electrophoretic liquid is achieved.
Optionally, the heat pipe is connected with a first pressing block and a second pressing block, the first pressing block and the second pressing block are both made of metal materials, the first pressing block is connected with the semiconductor refrigerating sheet, and the second pressing block can be placed in the electrophoretic fluid.
Through adopting above-mentioned technical scheme, the first briquetting and the second briquetting that metal material made are high in heat conductivity, and the heat transfer that the second briquetting can absorb the electrophoresis liquid high-efficiently transmits for the heat pipe, and first briquetting transmits the heat that the heat pipe absorbed for the semiconductor refrigeration piece high-efficiently to first briquetting and second briquetting have increased heat transfer area, have improved cooling device's refrigeration efficiency.
Optionally, the electrophoresis apparatus further comprises a submerged pump and a thermometer for measuring the temperature of the electrophoresis liquid, a water outlet of the submerged pump is communicated with the circulation flow guide pipe, and an opening of the circulation flow guide pipe faces the second pressing block.
By adopting the technical scheme, the electrophoretic fluid is pumped out from the opening of the circulating flow guide pipe after being sucked by the submerged pump, the electrophoretic fluid is conveyed to the vicinity of the second pressing block and the heat pipe, and the heat pipe is utilized to absorb and transfer redundant heat; the temperature of the electrophoresis liquid can be monitored and recorded in real time by using the thermometer, so that the cooling condition of the electrophoresis liquid can be conveniently known and experimental parameters can be recorded.
Optionally, the partition plate is arranged on one side of the second pressing block, a first protrusion is arranged on one side of the partition plate close to the second pressing block, and the partition plate is connected with the second pressing block through the first protrusion; and reinforcing ribs are arranged on the partition board.
By adopting the technical scheme, the baffle plate can reduce the disturbance of the electrophoretic liquid flow pumped by the submerged pump to the electrophoresis and film transfer processes, and the first bulge ensures that a certain gap is formed between the baffle plate and the second pressing block, so that a flowing space is provided for the heated electrophoretic liquid, and the heat transfer and absorption are facilitated; the strengthening rib can increase the mechanical strength of baffle for the baffle is not fragile, and can play better guard action to the heat pipe.
Optionally, the guide plate is arranged on one side of the second pressing block, which is far away from the partition plate, and an extension part which is lengthened relative to the partition plate is arranged on one side of the guide plate, which is far away from the submerged pump; a second bulge is arranged on one side, close to the second pressing block, of the guide plate, and the guide plate is connected with the second pressing block through the second bulge; and a flow guide part is arranged on the second pressing block, and the opening of the circulating flow guide pipe faces to the flow guide part.
By adopting the technical scheme, the flow guide part can prevent the liquid flow pumped by the submerged pump from being rebounded by the second pressing block and guide the heated electrophoretic liquid to the vicinity of the heat pipe 21; the extension part on the guide plate guides the electrophoretic fluid cooled by the heat pipe to flow to one side of the partition plate, so that the temperature of the electrophoretic fluid at the electrophoretic part is reduced, and the influence of overhigh temperature on the experimental effect is reduced; the second bulge makes a certain gap between the guide plate and the second pressing block, provides a flowing space for the heated electrophoretic liquid, and is favorable for heat transfer and absorption.
Optionally, the heat conducting assembly includes a circulation pipe filled with a cooling liquid and a circulation pump communicated with the circulation pipe, and the circulation pipe passes through the electrophoresis liquid and is in direct or indirect contact with the semiconductor chilling plate.
By adopting the technical scheme, when the electrophoresis liquid flows through the part near the liquid inlet part of the circulating pipe, heat is absorbed and stored by the cooling liquid in the circulating pipe, the circulating pump conveys the cooling liquid absorbing heat in the circulating pipe to the position near the heat absorbing surface of the semiconductor refrigerating sheet, and the heat is finally taken away by the semiconductor refrigerating sheet and the heat dissipation assembly, so that the aim of cooling the electrophoresis liquid is fulfilled.
Optionally, heat-conducting component include the suction pump, communicate in the inlet tube of suction pump with communicate in the outlet pipe of suction pump, the water inlet of inlet tube is located the electrophoresis liquid, the inlet tube and/or the outlet pipe with semiconductor refrigeration piece direct or indirect contact, the outlet pipe can make the electrophoresis liquid after the cooling flow back to the electrophoresis tank.
By adopting the technical scheme, the electrophoresis liquid is pumped into the water inlet pipe by the water suction pump and is conveyed to the position near the heat absorption surface of the semiconductor refrigeration sheet, heat is taken away by the semiconductor refrigeration sheet and the heat dissipation assembly, the electrophoresis liquid flows back to the electrophoresis tank through the water outlet pipe after being cooled, and the electrophoresis liquid in the electrophoresis tank is cooled by circulation.
An electrophoresis tank cover comprises the electrophoresis liquid cooling device.
By adopting the technical scheme, the electrophoresis tank cover with the electrophoresis liquid cooling device is provided, the electrophoresis liquid can be efficiently cooled, the influence on an experimental result is reduced, and the electrophoresis tank cover is simple and convenient to operate, economical and practical; the separation of refrigeration equipment and electrophoresis liquid with high voltage is realized, and the safety performance is high.
In summary, compared with the related art, the invention has the following beneficial effects:
1. the semiconductor refrigerating sheet is provided with the heat absorbing surface and the heat releasing surface after being electrified, the heat of the electrophoretic liquid is transferred to the heat absorbing surface through the heat conducting assembly to be absorbed, the efficient cooling of the electrophoretic liquid is realized, and the ice box does not need to be frozen in advance; in addition, the heat dissipation assembly is arranged to be in contact with the heat release surface of the semiconductor refrigeration piece, and heat is transferred to air far away from the semiconductor refrigeration piece through the heat dissipation plate and the fan, so that cooling and protection of the semiconductor refrigeration piece are achieved.
2. The invention provides three specific heat conducting components, which can be flexibly selected and improved according to the comprehensive consideration of various factors such as refrigeration efficiency, installation difficulty, equipment cost and the like in actual work, and have strong applicability.
3. The invention pumps the electrophoretic fluid out of the water outlet after the submerged pump sucks the electrophoretic fluid, and then the electrophoretic fluid is conveyed to the vicinity of the heat pipe, and the heat pipe is used for absorbing redundant heat.
4. The invention provides an electrophoretic liquid cooling device which can run after being electrified, can efficiently cool an electrophoretic liquid, improves the electrophoresis and film transferring effects, and is simple and convenient to operate, economical and practical; the separation of the refrigeration equipment and the electrophoresis liquid with high voltage is realized, and the safety performance is high; the electrophoresis liquid cooling device can be arranged on the electrophoresis tank cover, the whole structure is compact, the occupied working space is small, and the miniaturization development of electrophoresis equipment is facilitated.
Drawings
FIG. 1 is a schematic view of the overall structure of an embodiment 1 of an electrophoretic fluid cooling apparatus;
FIG. 2 is an exploded view of the electrophoretic fluid cooling device in accordance with embodiment 1 of the present invention;
FIG. 3 is a partial exploded view of FIG. 1;
FIG. 4 is a schematic side view of the electrophoretic fluid cooling apparatus of example 1;
FIG. 5 is a schematic rear view of the electrophoretic fluid cooling apparatus according to example 1;
FIG. 6 is a schematic front view of the electrophoretic fluid cooling apparatus of example 2;
FIG. 7 is a schematic front view of the electrophoretic fluid cooling apparatus according to example 3;
FIG. 8 is a schematic view showing the overall structure of an electrophoresis tank cover having an electrophoresis liquid cooling apparatus;
FIG. 9(a) is a Western Blot of H1299 cell protein obtained by cooling in example 1 using an electrophoretic fluid cooling apparatus, wherein the amount of sample No. 1 is 40. mu.g and the amount of sample No. 2 is 20. mu.g;
FIG. 9(b) is a Western Blot of H1299 cell proteins obtained by placing the electrophoresis chamber in crushed ice and refrigerating, in which the amount of sample No. 5 is 40. mu.g and the amount of sample No. 6 is 20. mu.g.
Description of reference numerals: 1. a semiconductor refrigeration sheet; 2. a heat conducting component; 3. a heat dissipating component; 4. a submerged pump; 5. a partition plate; 6. a baffle; 7. reinforcing ribs; 8. a thermometer; 9. an electrophoresis tank cover; 10. a circulating flow guide pipe; 21. a heat pipe; 22. a first pressing block; 23. a second pressing block; 24. a circulation pipe; 25. a circulation pump; 26. a water inlet pipe; 27. a water outlet pipe; 28. a water pump; 31. a heat dissipation plate; 32. a fan; 51. a first protrusion; 61. a second protrusion; 62. an extension portion; 231. a flow guide part; 311. a vertical plate; 312. and a fin.
Detailed Description
The present application is described in further detail below with reference to figures 1-9.
The embodiment of the application discloses electrophoresis liquid cooling device.
Example 1
Referring to fig. 1 and 2, the electrophoresis liquid cooling device comprises a semiconductor refrigeration sheet 1, a heat conduction assembly 2, a heat dissipation assembly 3, a circulating flow guide assembly, a submerged pump 4, a reinforcing rib 7 and a thermometer 8.
Referring to fig. 1 and 2, the semiconductor cooling plate 1 is a cooling element of the device, has a heat absorbing surface and a heat releasing surface after being electrified, and can be installed above the electrophoresis tank cover. The heat conducting assembly 2 is connected with the heat absorbing surface of the semiconductor refrigerating sheet 1 and used for transferring the heat of the electrophoretic liquid to the semiconductor refrigerating sheet 1. The heat dissipation assembly 3 is connected with the heat release surface of the semiconductor refrigeration piece 1 and used for transferring heat released by the semiconductor refrigeration piece 1 to air far away from the semiconductor refrigeration piece 1, accelerating refrigeration and protecting the semiconductor refrigeration piece 1. The circulating flow guide assembly is connected with the heat conduction assembly 2 and used for accelerating the circulating flow of the electrophoresis liquid. The submerged pump 4 is installed in the electrophoresis tank and used for enabling the electrophoresis liquid temperature at each position in the electrophoresis tank to be evenly distributed. The reinforcing ribs 7 are used for reinforcing the mechanical strength of the circulating guide assembly. The thermometer 8 is used to monitor the temperature of the electrophoretic fluid.
Referring to fig. 2, the heat conductive assembly 2 includes a heat pipe 21, a first compact 22, and a second compact 23. The heat pipe 21 is a metal pipe with two closed ends and filled with a phase change material, and is internally pumped to a low pressure during manufacturing. First and second compacts 22 and 23 are made of a metal material, and in this embodiment, made of an aluminum alloy, are low in cost and have good heat conductivity and mechanical properties, and in other embodiments, other metal materials having good heat conductivity may be used. The upper part of the heat pipe 21 is pressed into a first pressing block 22, the lower part of the heat pipe 21 is pressed into a second pressing block 23, the first pressing block 22 is connected with the heat absorption surface of the semiconductor refrigerating sheet 1, and heat is transferred to the semiconductor refrigerating sheet 1; when the electrophoresis apparatus works, the second pressing block 23 is placed in the electrophoresis liquid to absorb the heat of the electrophoresis liquid.
Referring to fig. 2, after the heat pipe 21 starts to operate, the phase change material filled inside the heat pipe 21 changes phase to absorb and store latent heat at the lower part of the heat pipe 21; the heat pipe 21 has a high thermal conductivity coefficient, the phase change material releases latent heat and changes phase to an original state at the upper part of the heat pipe 21, the heat pipe 21 rapidly transfers heat to the first pressing block 22, and then the first pressing block 22 transfers the heat to the heat absorption surface of the semiconductor refrigeration piece 1. In this embodiment, the phase change material may be water, methanol, or refrigerant. In this embodiment, the heat pipe 21 is preferably a copper pipe with a high thermal conductivity, and the inner surface thereof is rough, which is beneficial for the phase change material to absorb and release heat to generate phase change.
Referring to fig. 3, a flow guiding part 231 having an inclined surface is disposed on the second pressing block 23 near the water outlet of the submerged pump 4, and the flow guiding part 231 can prevent the liquid flow pumped by the submerged pump 4 from being rebounded by the second pressing block 23 and guide the heated electrophoretic liquid to the vicinity of the heat pipe 21, thereby improving the cooling efficiency.
Referring to fig. 2, the heat radiating assembly 3 includes a heat radiating plate 31 and a fan 32. The heat dissipation plate 31 is connected with the heat dissipation surface of the semiconductor cooling plate 1, and the fan 32 is positioned on one side of the heat dissipation plate 31 far away from the semiconductor cooling plate 1. The heat dissipation plate 31 includes a vertical plate 311 and a plurality of fins 312, the vertical plate 311 is connected with the heat dissipation surface of the semiconductor cooling plate 1, the plurality of fins 312 are perpendicular to the vertical plate 311 and are integrally formed, and the fins 312 are parallel to each other, so that the heat dissipation area is greatly increased. The fan 32 is located on one side of the fin 312 far away from the riser 311, and is used for increasing the heat dissipation speed.
Referring to fig. 1 and 3, the circulation leading assembly includes a partition 5, a guide plate 6, and a circulation leading pipe 10. The partition 5 is arranged on one side of the second pressing block 23 and is used for reducing the disturbance of the electrophoresis and film transferring process caused by the electrophoresis liquid flow pumped by the submerged pump 4.
Referring to fig. 4, a first protrusion 51 is disposed on one side of the partition board 5 close to the second pressing block 23, and the partition board 5 and the second pressing block 23 are fixedly connected through the first protrusion 51, so as to provide a flowing space for the heated electrophoretic fluid, and facilitate heat transfer and absorption.
Referring to fig. 4, the flow guide plate 6 is disposed on one side of the second pressing block 23 away from the partition plate 5, and is opposite to the partition plate 5, and a channel for electrophoresis liquid to flow is formed between the flow guide plate 6 and the partition plate 5, so that the heat exchange efficiency is increased. One side of the guide plate 6 close to the second pressing block 23 is provided with a second protrusion 61, and the guide plate 6 and the second pressing block 23 are fixedly connected through the second protrusion 61, so that a flowing space is provided for the heated electrophoretic liquid, and heat transfer and absorption are facilitated.
Referring to fig. 5, the baffle 6 is provided with an extension 62 which is lengthened relative to the partition 5 on the side far away from the submerged pump 4, and the extension 62 is provided with a streamline edge for guiding the electrophoresis liquid to flow to the side of the partition 5 and reducing the temperature of the electrophoresis liquid at the electrophoresis place as soon as possible.
Referring to fig. 1 and 3, the submerged pump 4 is fixed on the partition plate 5, and can disturb the electrophoretic liquid, so that the temperature of the electrophoretic liquid is uniform, and the refrigeration efficiency of the cooling device is improved, so that the cooling device does not need to be additionally provided with a magnetic stirrer and a magnetic stirring rod for stirring to avoid local overheating, the volume of the device is reduced, and meanwhile, the device is also beneficial to preventing overturning accidents.
And the circulating guide pipe 10 is communicated with the water outlet of the submerged pump 4, so that the electrophoresis liquid can flow circularly, the heat exchange is accelerated, and the cooling efficiency is improved.
Referring to fig. 1, the heat pipe 21 is located between the partition board 5 and the guide plate 6 and does not extend out from the lower end, the partition board 5 and the guide plate 6 can protect the heat pipe 21 from being bent, and the partition board 5 and the guide plate 6 are provided with the reinforcing ribs 7 for reinforcing the mechanical strength of the partition board 5 and the guide plate 6 without integrally thickening the partition board 5 and the guide plate 6, so that the material and the cost are saved. In this embodiment, the areas of the diversion plate 6 and the partition plate 5 are 2/5-6/7 of the wall with the smallest area of the electrophoresis tank to be placed in the electrophoresis liquid cooling device, which can provide better diversion effect and protection effect.
Referring to fig. 1 and 4, a thermometer 8 is disposed on the partition board 5 for monitoring and recording the temperature of the electrophoretic fluid in real time, so as to facilitate understanding of the cooling condition of the electrophoretic fluid and recording experimental parameters. In the present embodiment, the thermometer 8 is a common mercury thermometer, and in other embodiments, a temperature probe and a temperature measuring instrument can be selected for temperature monitoring. In actual operation, the thermometer 8 may be disposed on the electrophoresis tank cover so that the temperature sensing part of the thermometer 8 is located in the electrophoresis solution.
The implementation principle of the embodiment 1 of the application is as follows: when the electrophoretic liquid flows through the vicinity of the liquid inlet part of the heat pipe 21, heat is absorbed and stored by the second pressing block 23 and the phase-change material in the heat pipe 21, the heat of the electrophoretic liquid absorbed by the second pressing block 23 is transferred to the heat pipe 21, the heat is transferred to the first pressing block 22 by the heat pipe 21, and the heat is transferred to the heat absorbing surface of the semiconductor refrigerating sheet 1 by the first pressing block 22, so that the heat is finally taken away by the semiconductor refrigerating sheet 1 and the heat dissipation assembly 3, thereby achieving the purpose of cooling the electrophoretic liquid. The submerged pump 4 can disturb the electrophoretic fluid, so that the temperature of the electrophoretic fluid is uniform, and the refrigeration efficiency is improved; the baffle 5 and the guide plate 6 form a channel for the electrophoresis liquid to flow, which is beneficial to the transfer and absorption of heat; the thermometer 8 can monitor and record the temperature of the electrophoretic fluid in real time.
Example 2
Referring to fig. 6, the present embodiment is different from embodiment 1 in that the heat conductive member 2 includes a circulation pipe 24 filled with a cooling liquid therein and a circulation pump 25 communicated with the circulation pipe 24, the circulation pipe 24 passing through the electrophoretic liquid and contacting the semiconductor chilling plate 1. In this embodiment, the cooling liquid may be cooling water, or may be a salt solution or heat transfer oil, or may be other liquids in other embodiments.
The implementation principle of embodiment 2 of the present application is as follows: when the electrophoresis liquid flows through the vicinity of the liquid inlet part of the circulating pipe 24, heat is absorbed and stored by the cooling liquid in the circulating pipe 24, the circulating pump 25 conveys the cooling liquid absorbing heat in the circulating pipe 24 to the vicinity of the heat absorbing surface of the semiconductor chilling plate 1, and the heat is finally taken away by the semiconductor chilling plate 1 and the heat dissipation assembly 3, so that the purpose of cooling the electrophoresis liquid is achieved.
Example 3
Referring to fig. 7, the present embodiment is different from embodiments 1 and 2 in that the heat conducting assembly 2 includes a water pump 28, a water inlet pipe 26 communicated with the water pump 28, and a water outlet pipe 27 communicated with the water pump 28; the water inlet of inlet tube 26 is arranged in the electrophoresis liquid, and inlet tube 26 is pumped into with the electrophoresis liquid to suction pump 28, and the electrophoresis liquid flows into outlet pipe 27 through suction pump 28, and outlet pipe 27 passes through semiconductor refrigeration piece 1 and laminates with semiconductor refrigeration piece 1, and outlet pipe 27 can make the electrophoresis liquid after the cooling return to the electrophoresis tank.
The implementation principle of embodiment 3 of the application is as follows: the electrophoresis liquid is pumped into the water inlet pipe 26 by the water pump 28 and is conveyed to the position near the heat absorbing surface of the semiconductor refrigerating sheet 1, heat is taken away by the semiconductor refrigerating sheet 1 and the heat dissipation assembly 3, the electrophoresis liquid flows back to the electrophoresis tank through the water outlet pipe 27 after being cooled, and the electrophoresis liquid in the electrophoresis tank is cooled by circulation.
Referring to fig. 8, the electrophoresis tank cover 9 with the electrophoresis liquid cooling device has a compact structure, occupies a small working space, and is beneficial to the miniaturization development of electrophoresis equipment.
Referring to FIGS. 9(a) and 9(b), comparing experiment No. 1 and experiment No. 5, it can be seen that the electrophoresis and film transfer effect of experiment No. 1 using the electrophoresis liquid cooling apparatus of example 1 is better when the sample amount is 40 μ g; comparing experiment No. 2 with experiment No. 6, when can finding that the sample volume is 20 mug, use refrigerated electrophoresis No. 2 of electrophoresis liquid cooling device embodiment 1 and change the membrane effect and have obvious promotion. In conclusion, the electrophoresis liquid cooling device has a good refrigeration effect, so that the electrophoresis and film transferring effects of the Western Blot experiment are good, and the electrophoresis liquid cooling device has remarkable progress compared with the related technology.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (10)
1. An electrophoresis liquid cooling device, its characterized in that: the electrophoresis device comprises a semiconductor refrigeration piece (1) and a heat conduction assembly (2) used for transferring heat of electrophoresis liquid to the semiconductor refrigeration piece (1), wherein the heat conduction assembly (2) is connected with one surface of the semiconductor refrigeration piece (1); the other side of the semiconductor refrigerating sheet (1) is connected with a heat dissipation assembly (3); a circulating flow guide assembly is arranged at one end, far away from the semiconductor refrigeration sheet (1), of the heat conduction assembly (2), and comprises a partition plate (5), a flow guide plate (6) and a circulating flow guide pipe (10) which are oppositely arranged, and the lower part of the heat conduction assembly (2) is arranged between the partition plate (5) and the flow guide plate (6); the opening of the circulation draft tube (10) is arranged between the partition plate (5) and the guide plate (6) and faces the lower part of the heat conduction assembly (2).
2. The electrophoretic fluid cooling apparatus as claimed in claim 1, wherein: the areas of the guide plate (6) and the partition plate (5) are 2/5-6/7 of the wall of the electrophoresis tank with the smallest area to be placed in the electrophoresis liquid cooling device; the heat dissipation assembly (3) comprises a heat dissipation plate (31) connected to the semiconductor refrigeration sheet (1) and a fan (32) used for accelerating heat dissipation.
3. The electrophoretic fluid cooling apparatus as claimed in claim 1, wherein: the heat conduction assembly (2) comprises a heat pipe (21) with two closed ends and filled with a phase change material, the upper part of the heat pipe (21) is directly or indirectly contacted with the semiconductor refrigeration sheet (1), and the lower part of the heat pipe (21) can be placed in the electrophoretic liquid.
4. An electrophoretic fluid cooling device as claimed in claim 3, wherein: the heat pipe (21) is connected with a first pressing block (22) and a second pressing block (23), the first pressing block (22) and the second pressing block (23) are both made of metal materials, the first pressing block (22) is connected with the semiconductor refrigerating sheet (1), and the second pressing block (23) can be placed in the electrophoretic fluid.
5. An electrophoretic fluid cooling device as claimed in claim 4, wherein: still include immersible pump (4) and be used for measuring temperature of electrophoresis liquid thermometer (8), the delivery port of immersible pump (4) with circulation honeycomb duct intercommunication, the opening orientation of circulation honeycomb duct (10) second briquetting (23).
6. An electrophoretic fluid cooling device as claimed in claim 5, wherein: the partition plate (5) is arranged on one side of the second pressing block (23), a first bulge (51) is arranged on one side, close to the second pressing block (23), of the partition plate (5), and the partition plate (5) is connected with the second pressing block (23) through the first bulge (51); and the partition plate (5) is provided with a reinforcing rib (7).
7. An electrophoretic fluid cooling device as claimed in claim 6, wherein: the guide plate (6) is arranged on one side, away from the partition plate (5), of the second pressing block (23), and an extension part (62) which is lengthened relative to the partition plate (5) is arranged on one side, away from the submerged pump (4), of the guide plate (6); a second bulge (61) is arranged on one side, close to the second pressing block (23), of the guide plate (6), and the guide plate (6) is connected with the second pressing block (23) through the second bulge (61); and a flow guide part (231) is arranged on the second pressing block (23), and the opening of the circulating flow guide pipe (10) faces to the flow guide part (231).
8. The electrophoretic fluid cooling apparatus as claimed in claim 1, wherein: the heat conduction assembly (2) comprises a circulating pipe (24) filled with cooling liquid and a circulating pump (25) communicated with the circulating pipe (24), and the circulating pipe (24) passes through the electrophoresis liquid and is in direct or indirect contact with the semiconductor refrigeration sheet (1).
9. The electrophoretic fluid cooling apparatus as claimed in claim 1, wherein: heat-conducting component (2) include suction pump (28), communicate in inlet tube (26) of suction pump (28) with communicate in outlet pipe (27) of suction pump (28), the water inlet of inlet tube (26) is arranged in the electrophoresis liquid, inlet tube (26) and/or outlet pipe (27) with semiconductor refrigeration piece (1) direct or indirect contact, outlet pipe (27) can make the electrophoresis liquid after the cooling flow back to the electrophoresis tank.
10. Electrophoresis tank cover (9), characterized in that: an electrophoretic fluid cooling device comprising an electrophoretic fluid as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110783439.6A CN113416996A (en) | 2021-07-12 | 2021-07-12 | Electrophoresis liquid cooling device and have its electrophoresis capping |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110783439.6A CN113416996A (en) | 2021-07-12 | 2021-07-12 | Electrophoresis liquid cooling device and have its electrophoresis capping |
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| CN113416996A true CN113416996A (en) | 2021-09-21 |
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| CN202110783439.6A Pending CN113416996A (en) | 2021-07-12 | 2021-07-12 | Electrophoresis liquid cooling device and have its electrophoresis capping |
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Application publication date: 20210921 |
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