CN217508774U

CN217508774U - Optical time domain reflectometer suitable for various temperature environments

Info

Publication number: CN217508774U
Application number: CN202221464146.8U
Authority: CN
Inventors: 贺健波; 陈勇军
Original assignee: Shenhuo Jinggong Nanjing Communication Technology Co ltd
Current assignee: Shenhuo Jinggong Nanjing Communication Technology Co ltd
Priority date: 2022-06-13
Filing date: 2022-06-13
Publication date: 2022-09-27
Anticipated expiration: 2032-06-13

Abstract

The utility model discloses an optical time domain reflectometer suitable for multiple temperature environment. It includes interior casing, and the inside of interior casing is equipped with the mainboard and the temperature sensor who is connected with the mainboard, is equipped with a plurality of first heat transfer holes on the interior casing, and the outside of interior casing is fixed with the shell body, and the inboard middle part of shell body is equipped with the mounting panel, and the downside of casing including the mounting panel interval sets up inlays on the mounting panel and is equipped with a plurality of semiconductor refrigeration pieces, and the upper surface setting of semiconductor refrigeration piece is at the mounting panel upside, and its lower surface setting is equipped with second heat transfer hole and heat transfer fan at the downside of mounting panel on the shell body, heat transfer fan and semiconductor refrigeration piece respectively with mainboard connection. The utility model discloses a set up the semiconductor refrigeration piece on the mounting panel and come to carry out the heat transfer to the mainboard in the inner casing, no matter ambient temperature is too high or cross low excessively, all can guarantee that the temperature in the inner casing keeps in setting for the temperature range to be applicable to multiple temperature environment.

Description

Optical time domain reflectometer suitable for various temperature environments

Technical Field

The utility model relates to an optical time domain reflectometer technical field, concretely relates to optical time domain reflectometer suitable for multiple temperature environment.

Background

The optical time domain reflectometer is manufactured according to the backward scattering and Fresnel backward principle of light, obtains attenuation information by utilizing the backward scattering light generated when the light propagates in an optical fiber, can be used for measuring the attenuation of the optical fiber, the loss of a joint, the positioning of a fault point of the optical fiber, knowing the loss distribution condition of the optical fiber along the length and the like, and is an essential tool in the construction, maintenance and monitoring of the optical cable. Because the optical time domain reflectometer can produce certain heat when working, generally dispel the heat through setting up the louvre on the casing of current optical time domain reflectometer, when ambient temperature is higher, the optical time domain reflectometer can appear the high temperature and cause the precision to descend or overtemperature protection shut down to when ambient temperature is low excessively, the inside components and parts temperature of optical time domain reflectometer is low excessively, also can appear the precision and descend, is not convenient for use.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an optical time domain reflectometer suitable for multiple temperature environment to the not enough of prior art existence.

In order to realize the above-mentioned purpose, the utility model provides an optical time domain reflectometer suitable for multiple temperature environment, including interior casing, the inside of interior casing is equipped with the mainboard and with mainboard connection's temperature sensor, be equipped with a plurality of first heat transfer holes on the interior casing, the outside of interior casing is fixed with the shell body, the inboard middle part of shell body is equipped with the mounting panel, the downside of casing including the mounting panel interval sets up, inlay on the mounting panel and be equipped with a plurality of semiconductor refrigeration pieces, the upper surface setting of semiconductor refrigeration piece is at the mounting panel upside, and its lower surface setting is at the downside of mounting panel, be equipped with second heat transfer hole and heat transfer fan on the shell body, heat transfer fan and semiconductor refrigeration piece respectively with mainboard connection.

Furthermore, the upper end of the inner shell is fixedly connected with the upper end of the outer shell through a connecting seat.

Furthermore, the first heat exchange holes are formed in the periphery and the bottom of the inner shell, and the periphery of the inner shell and the inner side of the outer shell are arranged at intervals.

Further, the first heat exchange holes are strip-shaped holes.

Furthermore, the lower side of the semiconductor refrigeration piece is fixed with a heat radiation fin.

Furthermore, heat-conducting silicone grease is arranged between the radiating fins and the lower side of the semiconductor refrigerating sheet.

Further, the second heat exchange hole is formed in the opposite side of the heat exchange fan.

Further, the mounting panel is the heated board, the shell body is enclosed by the heated board and closes and form.

Furthermore, the heat preservation board comprises two metal plates arranged at intervals and a polystyrene foam board clamped between the two metal plates.

Has the advantages that: the utility model discloses a set up a plurality of first heat transfer holes on the inner casing, and the outside of inner casing sets up the shell body, the middle part of shell body is separated by the mounting panel, through set up the semiconductor refrigeration piece on the mounting panel and come to carry out the heat transfer to the mainboard in the inner casing, the semiconductor refrigeration piece passes through the switching of power polarity and can realize the switching of heating surface and refrigeration face, no matter ambient temperature is too high or low excessively, all can guarantee that the temperature in the inner casing keeps in setting for the temperature range, thereby be applicable to multiple temperature environment.

Drawings

FIG. 1 is a schematic perspective view of an optical time domain reflectometer suitable for use in various temperature environments;

FIG. 2 is a schematic cross-sectional view of an optical time domain reflectometer suitable for use in a variety of temperature environments;

FIG. 3 is a partial perspective view of an optical time domain reflectometer suitable for use in a variety of temperature environments.

Detailed Description

The present invention will be further clarified by the following embodiments with reference to the attached drawings, which are implemented on the premise of the technical solution of the present invention, and it should be understood that these embodiments are only used for illustrating the present invention and are not used for limiting the scope of the present invention.

As shown in fig. 1 to 3, the embodiment of the utility model provides an optical time domain reflectometer suitable for multiple temperature environment, including interior casing 1, the inside of interior casing 1 is equipped with mainboard and mainboard connection's temperature sensor, display screen 2, control button 3, the upper end of casing 1 including power source 4 and signal interface 5 etc. all set up, and display screen 2, control button 3, power source 4 and signal interface 5 etc. respectively with mainboard connection, be used for accomplishing optical time domain reflectometer's basic function, be prior art above, no longer describe repeatedly. Be equipped with a plurality of first heat transfer holes 6 on casing 1 including, casing 7 is fixed with in the outside of casing 1 including, the inboard middle part of casing 7 is equipped with mounting panel 8, casing 1's downside including 8 interval settings of mounting panel, it is equipped with a plurality of semiconductor refrigeration pieces 9 to inlay on mounting panel 8, it is preferably 4 to 6 to do semiconductor refrigeration pieces 9, the upper surface setting of semiconductor refrigeration piece 9 is at 8 upsides of mounting panel, and its lower surface sets up the downside at mounting panel 8, be equipped with second heat transfer hole 10 and heat transfer fan 11 on casing 1, heat transfer fan 11 and semiconductor refrigeration piece 9 respectively with mainboard connection, by mainboard control heat transfer fan 11 and the work of semiconductor refrigeration piece 9. Specifically, after the power-on starts to operate, the sensor starts to collect the temperature in the inner shell 1, and feeds back the temperature to the mainboard, then the mainboard control heat exchange fan 11 and the work of semiconductor refrigeration piece 9, if the temperature in the inner shell 1 is less than the temperature threshold value that sets for, the upper surface of mainboard control semiconductor refrigeration piece 9 is for heating, lower surface refrigeration. If the temperature in the inner housing 1 is higher than the set temperature threshold, the main board controls the upper surface of the semiconductor cooling sheet 9 to cool and the lower surface to heat, so that the temperature in the inner housing 1 is kept within the set temperature range, such as 22 ℃ to 25 ℃. The air introduced by the heat exchange fan 11 can exchange heat with the lower surface of the semiconductor refrigeration sheet 9.

In order to fix the inner housing 1 on the outer housing 7, a connecting seat 12 is fixed between the upper end of the inner housing 1 and the upper end of the outer housing 7. Specifically, the section of the connecting seat 12 is an inverted L-shape, one side of which can be fixed on the outer side of the inner casing 1 by a plurality of bolts, and the other side of which can be fixed on the upper end of the outer casing 7 by a plurality of bolts.

In order to ensure the heat exchange effect, the utility model discloses casing 1 reaches the bottom all around including first heat transfer hole 6 sets up to, casing 1 is interior all around with the inboard interval setting of shell body 7. The first heat exchanging holes 6 are preferably strip-shaped holes.

In order to improve the heat exchange effect of the lower surface of the semiconductor chilling plate 9, it is preferable that a heat dissipation fin 13 is fixed on the lower side of the semiconductor chilling plate 9, and the heat dissipation fin 13 can increase the contact area with the air, thereby improving the heat exchange effect. It is also preferable that the second heat exchanging hole 10 is preferably provided at the opposite side of the heat exchanging fan 11, and the direction of the heat radiating fins 13 is preferably provided along the direction from the second heat exchanging hole 10 to the heat exchanging fan 11. It is also preferable that a heat conductive silicone grease is provided between the heat radiating fins 13 and the lower side of the semiconductor chilling plate 9 to improve the heat conduction effect.

In order to reduce the temperature influence of the environment on the region between the outer shell 7 and the inner shell 1, the mounting plate 8 is preferably made of a heat insulation plate, and the outer shell 7 is preferably formed by enclosing the heat insulation plate. The preferred heated board includes two metal sheets that the interval set up and the polystyrene foam board of clamp setting between two metal sheets, and the metal sheet can adopt aluminum plate.

The above description is only a preferred embodiment of the present invention, and it should be noted that other parts not specifically described belong to the prior art or the common general knowledge to those skilled in the art. Without departing from the principle of the present invention, several improvements and decorations can be made, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims

1. The utility model provides an optical time domain reflectometer suitable for multiple temperature environment, a serial communication port, includes interior casing, the inside of interior casing is equipped with the mainboard and with mainboard connection's temperature sensor, be equipped with a plurality of first heat transfer holes on the interior casing, the outside of interior casing is fixed with the shell body, the inboard middle part of shell body is equipped with the mounting panel, the downside of casing including the mounting panel interval sets up, inlay on the mounting panel and be equipped with a plurality of semiconductor refrigeration pieces, the upper surface setting of semiconductor refrigeration piece is at the mounting panel upside, and its lower surface setting is at the downside of mounting panel, be equipped with second heat transfer hole and heat transfer fan on the shell body, heat transfer fan and semiconductor refrigeration piece respectively with mainboard connection.

2. The optical time domain reflectometer as in claim 1, wherein the upper end of the inner casing is fixedly connected to the upper end of the outer casing by a connecting base.

3. The optical time domain reflectometer as in claim 1, wherein the first heat exchanging holes are disposed around and at the bottom of the inner case, and the inner case is spaced from the inner side of the outer case.

4. The optical time domain reflectometer as in claim 1 wherein the first heat transfer aperture is a strip aperture.

5. The optical time domain reflector suitable for various temperature environments as claimed in claim 1, wherein a heat dissipation fin is fixed on the lower side of the semiconductor chilling plate.

6. The optical time domain reflector suitable for various temperature environments as claimed in claim 5, wherein a heat-conducting silicone grease is disposed between the heat dissipation fins and the lower side of the semiconductor chilling plate.

7. The optical time domain reflectometer as in claim 1 wherein the second heat exchanging hole is disposed on the opposite side of the heat exchanging fan.

8. An optical time domain reflectometer as in claim 1 wherein the mounting plate is a thermal insulation plate and the outer housing is enclosed by the thermal insulation plate.

9. An optical time domain reflectometer as in claim 8 wherein the thermal insulation plate comprises two metal plates spaced apart and a polystyrene foam plate sandwiched between the two metal plates.