CN220833288U - Electronic cooling instrument - Google Patents
Electronic cooling instrument Download PDFInfo
- Publication number
- CN220833288U CN220833288U CN202322118380.6U CN202322118380U CN220833288U CN 220833288 U CN220833288 U CN 220833288U CN 202322118380 U CN202322118380 U CN 202322118380U CN 220833288 U CN220833288 U CN 220833288U
- Authority
- CN
- China
- Prior art keywords
- semiconductor refrigeration
- hole
- condensation plate
- semiconductor
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 24
- 239000004065 semiconductor Substances 0.000 claims abstract description 76
- 238000005057 refrigeration Methods 0.000 claims abstract description 53
- 230000005494 condensation Effects 0.000 claims abstract description 37
- 238000009833 condensation Methods 0.000 claims abstract description 37
- 239000000523 sample Substances 0.000 claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims description 11
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052744 lithium Inorganic materials 0.000 claims description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 210000001061 forehead Anatomy 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to an electronic cooling instrument, which comprises a semiconductor refrigeration component, a power supply, a main shell, a temperature sensor and a PCB control panel, wherein the semiconductor refrigeration component comprises a semiconductor refrigeration sheet, a condensation plate, a radiator and a fan, the cold end of the semiconductor refrigeration sheet is contacted with the condensation plate, the hot end of the semiconductor refrigeration sheet is contacted with the radiator, the fan is fixed on one side of the radiator far away from the semiconductor refrigeration sheet, the semiconductor refrigeration component is fixedly arranged in the main shell, the bottom of the main shell is provided with a first through hole, one end of the condensation plate far away from the semiconductor refrigeration sheet is arranged on the first through hole, the end face of the condensation plate is contacted with a human body, a probe of the temperature sensor is contacted and connected with the condensation plate, and the PCB control panel is respectively electrically connected with the temperature sensor, the semiconductor refrigeration sheet and the power supply. The temperature sensor can detect the temperature of the condensing plate, and when the temperature of the condensing plate is detected to reach a preset value, the semiconductor refrigerating sheet automatically stops working without manual operation and shutdown.
Description
Technical Field
The utility model relates to the technical field of electronic products, in particular to an electronic cooling instrument.
Background
In daily life, when child or adult generate heat, under the condition that temperature is not especially high, can adopt physical cooling, if use electron cooling appearance, convenient to use can wear on the forehead, opens switch, can carry out physical cooling.
The utility model discloses a portable head-mounted semiconductor electronic temperature-reducing instrument, which specifically comprises an outer cover shell and an inner cover shell, wherein an air outlet groove is formed in the front surface of the outer cover shell, a micro radiator is fixed in the center of the inner part of the outer cover shell through a screw, a semiconductor refrigerating sheet is glued on the outer side of the micro radiator, a power wire is fixed at one end of the outer cover shell through a clamping groove, the power wire is electrically connected with the micro radiator and the semiconductor refrigerating sheet, a connecting plug is integrally formed at the end part of the power wire, an air inlet groove is formed in the upper surface of the outer cover shell, and the inner cover shell is fixed on the rear side of the outer cover shell through a screw. The temperature reducing instrument refrigerated by the semiconductor refrigerating sheet has good refrigerating effect, high heat conduction silica gel is directly stuck to the cold surface of the semiconductor refrigerating sheet to conduct cold efficiently, the loss is small, the speed is high, the contact skin is soft and comfortable, but the temperature reducing instrument can not automatically control the semiconductor refrigerating sheet to stop working.
Accordingly, the prior art has yet to be improved and developed in view of the above-mentioned drawbacks.
Disclosure of utility model
The utility model aims to overcome the defects and shortcomings of the prior art, and provides an electronic cooling instrument which is reasonable in structure and convenient to use and can automatically stop refrigeration after reaching the temperature.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
The utility model provides an electronic cooling instrument which comprises a semiconductor refrigeration assembly, a power supply, a main shell, a temperature sensor and a PCB control panel, wherein the semiconductor refrigeration assembly comprises a semiconductor refrigeration sheet, a condensation plate, a radiator and a fan, the cold end of the semiconductor refrigeration sheet is in contact connection with the condensation plate, the hot end of the semiconductor refrigeration sheet is in contact connection with the radiator, the fan is fixed on one side, far away from the semiconductor refrigeration sheet, of the radiator, the semiconductor refrigeration assembly is fixedly arranged in the main shell, a first through hole is formed in the bottom of the main shell, one end, far away from the semiconductor refrigeration sheet, of the condensation plate is arranged on the first through hole, the end face of the condensation plate is in contact with a human body, a probe of the temperature sensor is in contact connection with the condensation plate, and the PCB control panel is respectively and electrically connected with the temperature sensor, the semiconductor refrigeration sheet and the power supply.
According to the scheme, the condensing plate is provided with the groove, and the temperature probe of the temperature sensor is arranged in the groove and is in close contact with the inner side wall of the groove.
According to the scheme, the main shell comprises a surface shell and a bottom shell, the surface shell is fixedly connected with the bottom shell, the semiconductor refrigeration assembly, the PCB control panel and the power supply are fixedly installed inside the surface shell, and the bottom shell is provided with the first through hole.
According to the scheme, the semiconductor refrigerating device further comprises a fixing frame, a limiting hole matched with the semiconductor refrigerating sheet is formed in the fixing frame, the semiconductor refrigerating sheet is arranged in the limiting hole, one side of the radiator is fixedly connected with the fixing frame, the other side of the radiator is fixedly connected with the inner side of the face shell, and the side face, in contact with the semiconductor refrigerating sheet, of the condensing plate is close to the fixing frame.
According to the scheme, the first through hole is set to be the shoulder hole, the condensation plate edge is set to be the ladder structure, the condensation plate is arranged in the shoulder hole, condensation plate one side and human body contact, the opposite side with the cold junction of semiconductor refrigeration piece offsets.
According to the scheme, the contact surface of the semiconductor refrigerating sheet and the radiator is provided with heat conduction oil, and the contact surface of the semiconductor refrigerating sheet and the condensing plate is provided with heat conduction oil.
According to the scheme, the radiator comprises a radiating patch and radiating fins, one side of the radiating patch is in contact with the hot end of the semiconductor refrigerating sheet, the radiating fins and the fan are fixedly arranged on the other side of the radiating patch, and the radiating fins are arranged around the fan.
According to the scheme, the display device further comprises a transparent window and a power button, a second through hole and a third through hole are formed in the face shell, the transparent window is fixed on the inner side of the face shell and corresponds to the second through hole, the power button is fixed in the third through hole, a display and a power switch are electrically connected to the PCB control panel, the display corresponds to the transparent window, and the power switch corresponds to the power button.
According to the scheme, the power supply is a lithium battery, the PCB control panel is provided with a TYPE-C charging port, the face shell is provided with a fourth through hole, and the TYPE-C charging port corresponds to the fourth through hole.
According to the scheme, the utility model also comprises an elastic band, and two ends of the elastic belt are fixedly connected with two ends of the face shell respectively.
The utility model has the beneficial effects that:
According to the utility model, through the structure, the PCB control panel can control the semiconductor refrigeration sheet to refrigerate or stop refrigerating according to the set temperature and the temperature sensor in contact connection with the condensation plate, and manual operation is not needed to be stopped.
Drawings
FIG. 1 is a schematic view of an exploded construction of the present utility model;
FIG. 2 is a schematic cross-sectional view of the present utility model;
FIG. 3 is a schematic cross-sectional view of the condensing plate;
fig. 4 is a schematic view of the external structure of the present utility model.
In the figure: 1. a semiconductor refrigeration sheet; 2. a condensing plate; 3. a heat sink; 4. a fan; 5. a temperature sensor; 6. a PCB control panel; 7. a face shell; 8. a bottom case; 9. a fixing frame; 10. a transparent window; 11. a power button; 12. a lithium battery; 13. an elastic band; 31. a heat-dissipating patch; 32. a heat radiation fin; 61. a display; 62. a power switch; 63. a TYPE-C charging port; 71. a second through hole; 72. a third through hole; 73. a fourth through hole; 81. a first through hole; 91. and a limiting hole.
Detailed Description
The technical scheme of the utility model is described below with reference to the accompanying drawings and examples.
Example 1
As shown in fig. 1-4, the utility model provides an electronic cooling apparatus, which comprises a semiconductor refrigeration assembly, a power supply, a main housing, a temperature sensor 5 and a PCB control panel 6, wherein the semiconductor refrigeration assembly comprises a semiconductor refrigeration sheet 1, a condensation plate 2, a radiator 3 and a fan 4, the cold end of the semiconductor refrigeration sheet 1 is in contact connection with the condensation plate 2, the hot end of the semiconductor refrigeration sheet 1 is in contact connection with the radiator 3, the fan 4 is fixed on one side of the radiator 3 away from the semiconductor refrigeration sheet 1, the semiconductor refrigeration assembly is fixedly arranged in the main housing, an air inlet and an air outlet are required to be arranged on the main housing, so that the radiator 3 and the fan 4 work, a first through hole 81 is arranged at the bottom of the main housing, one end of the condensation plate 2 away from the semiconductor refrigeration sheet 1 is arranged on the first through hole 81, the end face of the condensation plate contacts with a human body, a certain radian can be arranged on one face of the condensation plate 2, which contacts with the human body, and the temperature sensor 5 is required to be connected with the semiconductor refrigeration sheet 1, the PCB control panel 6 and the temperature sensor 5 are respectively. Through the above structure, the PCB control panel 6 can control the semiconductor refrigeration sheet 1 to refrigerate and stop refrigerate according to the set temperature and the temperature sensor 5 in contact connection with the condensation plate 2, without manual operation.
Further, a groove 21 is formed in the condensation plate 2, and the temperature probe of the temperature sensor 5 is disposed in the groove 21 and is in close contact with the inner side wall of the groove 21. Through the above structure setting, the convenience temperature sensor 5 installs, can make simultaneously temperature sensor 5 detects the temperature of condensate plate 2 is more accurate, and the signal that conveys for PCB control panel 6 is more accurate.
Further, the main housing includes a face housing 7 and a bottom housing 8, the face housing 7 and the bottom housing 8 are fixedly connected by means of a buckle, the semiconductor refrigeration assembly, the PCB control panel 6 and the power supply are fixedly mounted in the face housing 7, and the bottom housing 8 is provided with the first through hole 81. Through the structure arrangement, the installation of the components such as the semiconductor refrigeration assembly, the PCB control panel 6 and the power supply is facilitated.
Further, the refrigerator further comprises a fixing frame 9, a limiting hole 91 matched with the semiconductor refrigerating sheet 1 is formed in the fixing frame 9, the semiconductor refrigerating sheet 1 is arranged in the limiting hole 91, one side of the radiator 3 is fixedly connected with the fixing frame 9, the other side of the radiator is fixedly connected with the inner side of the face shell 7, and the side, in contact with the semiconductor refrigerating sheet 1, of the condensing plate 2 is close to the fixing frame. Through the above structure arrangement, the semiconductor refrigerating sheet 1 is limited in the limiting hole 91, the cold end of the semiconductor refrigerating sheet 1 is contacted with the condensation plate 2, the hot end is contacted with the radiator 3, and the structure is compact, thereby being beneficial to reducing the miniaturization arrangement of the electronic cooling instrument.
Further, the first through hole 81 is a stepped hole, the edge of the condensation plate 2 is a stepped structure, the condensation plate 2 is disposed in the stepped hole, one side of the condensation plate 2 contacts with a human body, and the other side of the condensation plate 2 abuts against the cold end of the semiconductor refrigeration sheet 1. Through the above structure setting, the ladder structure of condensing plate 2 with the shoulder hole phase-match is favorable to the fixed and the quick installation of condensing plate 2.
Further, heat conduction oil is disposed on the contact surface of the semiconductor refrigeration sheet 1 and the radiator 3, and heat conduction oil is disposed on the contact surface of the semiconductor refrigeration sheet 1 and the condensation plate 2. Through the structure, the heat conduction effect of the semiconductor refrigeration piece 1 is enhanced.
Further, the heat sink 3 includes a heat dissipation patch 31 and heat dissipation fins 32, one side of the heat dissipation patch 31 contacts with the hot end of the semiconductor refrigeration sheet 1, the other side is fixedly provided with the heat dissipation fins 32 and the fan 4, and the heat dissipation fins 32 are arranged around the fan 4. Through the structure, the fan 4 has good heat dissipation function, and the structure of the utility model is more compact and reasonable, thereby being beneficial to miniaturization.
Further, the solar panel further comprises a transparent window 10 and a power button 11, the face shell 7 is provided with a second through hole 71 and a third through hole 72, the transparent window 10 is fixed on the inner side of the face shell 7 and corresponds to the second through hole 71, the power button 11 is fixed in the third through hole 72, the PCB control panel 6 is electrically connected with a display 61 and a power switch 62, the display 61 corresponds to the transparent window 10, the power switch 62 corresponds to the power button 11, and the display 61 is used for displaying the temperature of the condensing plate 2. Through the structure setting, the user of being convenient for opens the electron cooling appearance and knows its operating temperature.
Further, the power supply is a lithium battery 12, the PCB control panel 6 is provided with a TYPE-C charging port 63, the surface shell 7 is provided with a fourth through hole 73, and the TYPE-C charging port 63 corresponds to the fourth through hole 73. With the above configuration, when the lithium battery 12 is not charged, charging can be performed through the TYPE-C charging port 63.
Further, the novel face-piece cover also comprises an elastic band 13, and two ends of the elastic band 13 are fixedly connected with two ends of the face-piece 7 respectively. Through the structure setting, the user can wear on the forehead conveniently.
The foregoing description is only of the preferred embodiments of the utility model, and all changes and modifications that come within the meaning and range of equivalency of the structures, features and principles of the utility model are therefore intended to be embraced therein.
Claims (10)
1. An electronic cooling instrument comprises a semiconductor refrigeration component, a power supply and a main shell,
The semiconductor refrigeration assembly comprises a semiconductor refrigeration sheet (1), a condensation plate (2), a radiator (3) and a fan (4), wherein the cold end of the semiconductor refrigeration sheet (1) is in contact connection with the condensation plate (2), the hot end of the semiconductor refrigeration sheet (1) is in contact connection with the radiator (3), the fan (4) is fixed on the radiator (3) and away from one side of the semiconductor refrigeration sheet (1), the semiconductor refrigeration assembly is fixedly mounted in a main shell, a first through hole (81) is formed in the bottom of the main shell, one end of the condensation plate (2) away from the semiconductor refrigeration sheet (1) is mounted on the first through hole (81) and the end face of the condensation plate is in contact with a human body, and the semiconductor refrigeration assembly is characterized by further comprising a temperature sensor (5) and a PCB control panel (6), a probe of the temperature sensor (5) is in contact connection with the condensation plate (2), and the PCB control panel (6) is respectively in contact connection with the temperature sensor (5) and the semiconductor refrigeration sheet (1) and the PCB.
2. The electronic cooling instrument according to claim 1, wherein the condensation plate (2) is provided with a groove (21), and the temperature probe of the temperature sensor (5) is arranged in the groove (21) and is in close contact with the inner side wall of the groove (21).
3. The electronic cooling instrument according to claim 1, wherein the main housing comprises a face housing (7) and a bottom housing (8), the face housing (7) and the bottom housing (8) are fixedly connected, the semiconductor refrigeration assembly, the PCB control panel (6) and the power supply are fixedly installed inside the face housing (7), and the bottom housing (8) is provided with the first through hole (81).
4. The electronic cooling instrument according to claim 3, further comprising a fixing frame (9), wherein a limiting hole (91) matched with the semiconductor refrigerating sheet (1) is formed in the fixing frame (9), the semiconductor refrigerating sheet (1) is arranged in the limiting hole (91), one side of the radiator (3) is fixedly connected with the fixing frame (9), the other side of the radiator is fixedly connected with the inner side of the face shell (7), and the side surface, contacted with the semiconductor refrigerating sheet (1), of the condensing plate (2) is close to the fixing frame.
5. The electronic cooling instrument according to claim 4, wherein the first through hole (81) is a stepped hole, the edge of the condensation plate (2) is a stepped structure, the condensation plate (2) is arranged in the stepped hole, one side of the condensation plate (2) is in contact with a human body, and the other side of the condensation plate is propped against the cold end of the semiconductor refrigeration piece (1).
6. The electronic cooling instrument according to claim 1, wherein heat conduction oil is arranged on the contact surface of the semiconductor cooling plate (1) and the radiator (3), and heat conduction oil is arranged on the contact surface of the semiconductor cooling plate (1) and the condensing plate (2).
7. The electronic cooling instrument according to claim 1, wherein the heat sink (3) comprises a heat dissipation patch (31) and heat dissipation fins (32), one side of the heat dissipation patch (31) is in contact with the hot end of the semiconductor refrigeration sheet (1), the heat dissipation fins (32) and the fan (4) are fixedly arranged on the other side, and the heat dissipation fins (32) are arranged around the fan (4).
8. The electronic cooling instrument according to claim 3, further comprising a transparent window (10) and a power button (11), wherein a second through hole (71) and a third through hole (72) are formed in the surface shell (7), the transparent window (10) is fixed on the inner side of the surface shell (7) and corresponds to the second through hole (71), the power button (11) is fixed in the third through hole (72), a display (61) and a power switch (62) are electrically connected to the PCB control panel (6), the display (61) corresponds to the transparent window (10), and the power switch (62) corresponds to the power button (11).
9. An electronic cooling instrument according to claim 3, wherein the power supply is a lithium battery (12), a TYPE-C charging port (63) is arranged on the PCB control panel (6), a fourth through hole (73) is arranged on the face shell (7), and the TYPE-C charging port (63) corresponds to the fourth through hole (73).
10. An electronic cooling instrument according to claim 3, further comprising an elastic band (13), wherein two ends of the elastic band (13) are fixedly connected with two ends of the face shell (7), respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322118380.6U CN220833288U (en) | 2023-08-08 | 2023-08-08 | Electronic cooling instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322118380.6U CN220833288U (en) | 2023-08-08 | 2023-08-08 | Electronic cooling instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220833288U true CN220833288U (en) | 2024-04-26 |
Family
ID=90743530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322118380.6U Active CN220833288U (en) | 2023-08-08 | 2023-08-08 | Electronic cooling instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220833288U (en) |
-
2023
- 2023-08-08 CN CN202322118380.6U patent/CN220833288U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |