CN219896083U - Handheld semiconductor ice compress device - Google Patents

Abstract

The utility model relates to the technical field of ice compress devices. The utility model relates to a handheld semiconductor ice compress device, which comprises a shell, a semiconductor refrigerating piece, a radiator and an axial flow fan, wherein the semiconductor refrigerating piece, the radiator and the axial flow fan are all positioned in the shell; the bottom surface of the shell is an ice compress surface, the cold surface of the semiconductor refrigeration piece is attached to the bottom of the inner wall of the shell, and the upper part of the shell is a handheld part; the radiator is attached to the hot surface of the semiconductor refrigerating sheet, and the axial flow fan is arranged at the top of the radiator; the top end of the shell is provided with a first ventilation opening which is positioned above the axial flow fan; the side wall of the lower part of the shell is provided with a second air vent, and the second air vent corresponds to the radiator in position. The handheld semiconductor ice compress device has excellent ventilation and heat dissipation effects, effectively improves the refrigeration efficiency of the semiconductor refrigeration piece, and has the advantages of flexible ice compress part, allergy prevention, easy control of ice compress temperature and convenient and fast use.

Description

Handheld semiconductor ice compress device

Technical Field

The utility model relates to the technical field of ice compress devices, in particular to a handheld semiconductor ice compress device.

Background

The cold compress can relieve pain, swelling, inflammatory reaction and hematoma, and reduce energy consumption of the organism, such as sport sprain red swelling, illness and heat, high temperature scald, etc., and needs to carry out ice compress. At present, the ice compress mode has the following problems that ice is compressed by adopting ice cubes, crushed ice cubes are filled into an ice bag, the ice bag is placed at a position needing ice compress, and the ice bag has the defects of troublesome manufacture, heavy weight, incapability of continuously changing the temperature frequently, easy frostbite and the like; the second mode adopts a chemical ice bag mode, the chemical ice bag needs to be stored in a refrigerator, the temperature is uncontrollable during use, the ice bag is supercooled in the initial stage of use, frostbite can occur, the later stage of low temperature is gradually lost, the cold compress effect is not ideal, and the chemical ice bag is easy to cause anaphylaxis when contacting the skin; the third is a semiconductor refrigerated ice pack.

In the prior art, most of semiconductor refrigeration ice compress is in a binding type, and the ice compress part is limited. The semiconductor refrigerating sheet can generate heat during refrigeration, if the heat is not timely emitted, the refrigeration efficiency is affected, and the hand-held ice patch using the semiconductor refrigerating sheet as a cold source has the problem of poor heat dissipation effect due to poor ventilation effect.

Disclosure of Invention

The utility model aims to provide a handheld semiconductor ice compress device which has the characteristics of compact structure and good heat dissipation effect.

To achieve the purpose, the utility model adopts the following technical scheme:

the handheld semiconductor ice compress device comprises a shell, a semiconductor refrigeration piece, a radiator and an axial flow fan, wherein the semiconductor refrigeration piece, the radiator and the axial flow fan are all positioned in the shell;

the bottom surface of the shell is an ice compress surface, the cold surface of the semiconductor refrigeration piece is attached to the bottom of the inner wall of the shell, and the upper part of the shell is a handheld part; the radiator is attached to the hot surface of the semiconductor refrigerating sheet, and the axial flow fan is arranged at the top of the radiator;

the top end of the shell is provided with a first ventilation opening, and the first ventilation opening is positioned above the axial flow fan; the side wall of the lower part of the shell is provided with a second air vent, and the second air vent corresponds to the radiator in position.

Further, the cold surface of the semiconductor refrigeration piece is bonded with the bottom of the inner wall of the shell through heat-conducting glue;

the semiconductor refrigerating sheet, the radiator and the side wall of the axial flow fan are all attached to or closely adjacent to the inner wall of the shell.

Further, the radiator is a copper fin radiator;

the two opposite side surfaces of the shell are respectively provided with the second air inlets, and two ends of the fins of the fin radiator respectively correspond to the two second air inlets.

Further, the heat sink includes a heat transfer plate and a folded fin connected to the heat transfer plate;

the bottom of the axial flow fan is connected with the folding fins through a screw rod or a positioning rod.

Further, the thickness of the bottom of the shell is smaller than the thickness of the side wall of the shell.

Further, the outer peripheral surface of the shell gradually contracts from bottom to top, so that a handheld part is formed at the upper part of the shell; and the outer peripheral surface of the shell gradually contracts from bottom to top to enable the top of the shell to form the first ventilation opening.

Further, the shell is made of silica gel, and the shell is an integrated forming mechanism.

Further, the handheld semiconductor ice compress device further comprises a rechargeable battery, wherein the rechargeable battery is positioned in the shell;

the semiconductor refrigerating sheet and the axial flow fan are electrically connected with the rechargeable battery;

the lower part of the shell is provided with a charging port connected with the rechargeable battery.

Further, the handheld semiconductor ice compress device further comprises an electric control plate and a temperature probe, wherein the temperature probe, the semiconductor refrigerating sheet and the axial flow fan are electrically connected with the electric control plate;

the inductive head of the temperature probe is positioned on the bottom surface of the shell.

Further, the electric control board is provided with a temperature setting button, and the shell is provided with an operation position corresponding to the temperature setting button.

The technical scheme provided by the utility model can comprise the following beneficial effects:

according to the handheld semiconductor ice compress device, the radiator is directly attached to the hot surface of the semiconductor refrigerating sheet and the axial flow fan is directly arranged at the top of the radiator, and heat generated by the operation of the semiconductor refrigerating sheet can be timely taken away; and based on the setting of first vent and second vent, the flow of air current is more smooth and easy in the shell, more is favorable to axial fan to start the air current that produces to cool down the radiator, therefore, this handheld semiconductor ice compress device has outstanding ventilation radiating effect, effectively improves the refrigeration efficiency of semiconductor refrigeration piece. The handheld semiconductor ice compress device has the advantages of flexible ice compress position, effective prevention of anaphylaxis of the ice compress position to the handheld semiconductor ice compress device, easy control of ice compress temperature and convenient and fast use.

Drawings

Fig. 1 is a schematic structural view of a hand-held semiconductor ice compress device according to an embodiment of the present utility model;

FIG. 2 is a schematic view of the handheld semiconductor ice application device of FIG. 1 from another perspective;

FIG. 3 is a schematic illustration of the handheld semiconductor ice compress device of FIG. 1 with the housing removed;

FIG. 4 is a schematic diagram of a semiconductor refrigeration fin, heat sink and axial flow fan combination;

wherein, shell 1, ice compress face 11, handheld portion 12, first vent 13, second vent 14, charge mouth 15, operation position 16, semiconductor refrigeration piece 2, radiator 3, heat transfer plate 31, folding fin 32, axial fan 4, locating lever 41, automatically controlled board 5, temperature probe 6.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In the description of the present utility model, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the utility model. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly, for distinguishing between the descriptive features, and not sequentially, and not lightly.

In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

A hand-held semiconductor ice compress device according to an embodiment of the present utility model is described below with reference to fig. 1 to 4.

The utility model provides a handheld semiconductor ice compress device, which comprises a shell 1, a semiconductor refrigeration piece 2, a radiator 3 and an axial flow fan 4, wherein the semiconductor refrigeration piece 2, the radiator 3 and the axial flow fan 4 are all positioned in the shell 1;

the bottom surface of the shell 1 is an ice compress surface 11, the cold surface of the semiconductor refrigeration piece 2 is attached to the bottom of the inner wall of the shell 1, and the upper part of the shell 1 is a hand-held part 12; the radiator 3 is attached to the hot surface of the semiconductor refrigerating sheet 2, and the axial flow fan 4 is arranged at the top of the radiator;

the top end of the shell 1 is provided with a first ventilation opening 13, and the first ventilation opening 13 is positioned above the axial flow fan 4; the side wall of the lower part of the shell 1 is provided with a second air vent 14, and the second air vent 14 corresponds to the radiator 3.

Based on the problem that in the prior art, binding type semiconductor refrigeration ice is limited at an ice compress part, and the handheld type ice compress with the semiconductor refrigeration sheet 2 as a cold source has a heat dissipation effect, the utility model provides the handheld type semiconductor ice compress device, so that a radiator 3 is directly attached to the hot surface of the semiconductor refrigeration sheet 2 and an axial flow fan 4 is directly arranged at the top of the radiator 3, and heat generated by the operation of the semiconductor refrigeration sheet 2 can be timely taken away; and based on the setting of first vent 13 and second vent 14, the flow of air current is more smooth and easy in the shell 1, more is favorable to axial fan 4 to start the air current that produces to cool down to radiator 3, therefore, this handheld semiconductor ice compress device has outstanding ventilation radiating effect, effectively improves the refrigeration efficiency of semiconductor refrigeration piece 2. Meanwhile, the bottom surface of the shell 1 is an ice compress surface 11, the upper part of the shell is a handheld part 12, a user can use the ice compress device by holding the upper part of the shell 1, and the ice compress position is flexible.

In addition, based on the arrangement of the shell 1, when the handheld semiconductor ice compress device is used, the shell 1 directly contacts with the ice compress part, so that the shell 1 is made of a material which is not easy to be allergic, and the allergic phenomenon of the ice compress part to the handheld semiconductor ice compress device can be effectively prevented; the refrigeration temperature based on the semiconductor refrigeration chip is easy to control, the ice compress temperature of the handheld semiconductor ice compress device is easy to control, the problems of frostbite caused by low temperature and unsatisfactory ice compress effect caused by high temperature are avoided, after the semiconductor refrigeration chip is communicated or turned on, the semiconductor refrigeration chip begins to refrigerate, and then the handheld semiconductor ice compress device can be used for ice compress, so that the handheld semiconductor ice compress device is convenient and quick to use.

Specifically, when the handheld semiconductor ice compress device works, the cold energy of the cold face of the semiconductor refrigeration piece 2 is transferred to the ice compress part from the bottom of the shell 1, the cold energy of the hot face of the semiconductor refrigeration piece 2 is transferred to the radiator 3, the power generated by the axial flow fan 4 enables gas to enter the shell 1 from the first ventilation opening 13, then the gas is blown to the radiator 3 through the axial flow fan 4 to perform heat exchange to form hot air, and the hot air is discharged from the second ventilation opening 14. The air flow flows smoothly in the shell 1, and based on the fact that the axial flow fan 4 is directly arranged at the top of the radiator 3, almost all the air entering the shell 1 exchanges heat with the radiator 3, and a good radiating effect is achieved.

In some embodiments, the ice-applying surface 11 of the ice-applying device is a plane, and when the ice-applying device is used for applying ice to a relatively flat part, the ice-applying device can be directly placed on the ice-applying position, so that hands are released.

Further, in some embodiments of the present utility model, the cold surface of the semiconductor refrigeration piece 2 is adhered to the bottom of the inner wall of the housing 1 by heat-conducting glue, and the side walls of the semiconductor refrigeration piece 2, the radiator 3 and the axial flow fan 4 are all adhered to or close to the inner wall of the housing 1. The heat-conducting glue not only plays a role in transferring cold energy of the cold face of the semiconductor refrigeration piece 2 to the shell 1, but also is used for fixing the semiconductor refrigeration piece 2 on the inner wall of the shell 1, and based on the assembly relation of the semiconductor refrigeration piece 2, the radiator 3 and the axial flow fan 4, the semiconductor refrigeration piece 2, the radiator 3 and the axial flow fan 4 can be simultaneously installed in the shell 1 through the heat-conducting glue, so that the assembly step of the handheld semiconductor ice compress device is more convenient. The semiconductor refrigerating sheet 2, the radiator 3 and the axial flow fan 4 are assembled to be cuboid or square, the lower part of the shell 1 is square, the lower part of the shell 1 can accommodate the assembled semiconductor refrigerating sheet 2, radiator 3 and axial flow fan 4, the inner wall of the lower part of the shell 1 is closely adjacent to the semiconductor refrigerating sheet 2, radiator 3 and axial flow fan 4, and the handheld semiconductor ice compress device has the advantages of compact structure and simplicity and convenience in assembly. The close proximity of the inner wall of the lower part of the shell with the outer walls of the semiconductor refrigerating sheet 2, the radiator 3 and the axial flow fan 4 means that the distance between the side walls of the three and the inner wall of the shell 1 is very small, the shell 1 plays a limiting role on the three, and the three cannot shake in the shell 1. It can be understood that the semiconductor refrigeration piece 2 can be connected with the bottom of the inner wall of the shell 1 by a screw, a rivet or a clamping piece, but the bonding mode by the heat-conducting glue is more convenient.

Further, in some embodiments of the present utility model, the heat sink 3 is a copper fin heat sink 3; two opposite side surfaces of the shell 1 are respectively provided with second air inlets, and two ends of the fins of the fin radiator 3 respectively correspond to the two second air inlets. The copper fin radiator 3 has better heat transfer effect, the structure based on the handheld semiconductor ice compress device is compact, and the heat dissipation effect can be effectively improved by adopting the copper fin radiator 3. And make the both ends of fin radiator 3 correspond two second ventilation openings respectively, then, after the heat dissipation air current that axial fan 4 produced lies in radiator 3 and carries out the heat exchange, hot-blast can be discharged from two second ventilation openings, is favorable to axial fan 4 can produce bigger heat dissipation air current, further improves the heat dispersion of radiator 3.

Preferably, the heat sink 3 includes a heat transfer plate 31 and a folded fin 32, the folded fin 32 being connected to the heat transfer plate 31; the bottom of the axial flow fan 4 is connected to the folded fins 32 by screws or positioning rods 41. The heat transfer plate 31 transfers heat of the semiconductor refrigerator hot face to the folded fins 32, and the folded fins 32 exchange heat with the heat radiation air flow, thereby discharging the heat out of the casing 1. The folded fin 32 has a better heat dissipation effect and is easier to produce than a conventional heat dissipation fin. Screw holes are formed in two adjacent fins of the folding fins 32, namely, the opposite positions of the two adjacent fins are concave and provided with screw threads so as to facilitate screwing in a screw; or, the diameter of the positioning rod 41 is made to be larger than the distance between two adjacent fins, and the tail end of the positioning rod 41 is clamped between the two adjacent fins, so that the axial flow fan 4 can be mounted on the radiator 3.

To increase the conduction speed of the cold, further, the thickness of the bottom of the housing 1 is smaller than the thickness of the side walls of the housing 1, so that the cold passes through the housing 1 more rapidly and in a larger amount. Alternatively, in other embodiments of the present utility model, a metal sheet is attached to the inner wall of the bottom of the casing 1 to improve the conduction efficiency of the cold energy, or a metal sheet is embedded in the inner wall of the bottom of the casing 1 to improve the conduction efficiency of the cold energy.

Further, the outer peripheral surface of the housing 1 gradually contracts from bottom to top, so that the upper part of the housing 1 forms a holding part 12; and the outer peripheral surface of the housing 1 gradually contracts from bottom to top so that the top thereof forms a first ventilation opening 13. Therefore, based on the gradual shrinkage of the outer peripheral surface of the shell 1 from bottom to top, the inner wall of the shell 1 is an inclined surface, the resistance of the heat dissipation air flow received in the shell 1 is smaller, the improvement of the air supply quantity of the axial flow fan 4 is better facilitated, the turbulence in the air flow shell 1 can be prevented by the smooth inner wall, and the heat dissipation capacity of the air flow is improved. It should be noted that, the first ventilation opening 13 is located at the top of the casing 1, so that the outer peripheral surface of the casing 1 gradually contracts from bottom to top to form the first ventilation opening 13, and the first ventilation opening 13 may have a larger diameter, which is further beneficial to improving the air intake of the axial flow fan 4.

Further, the shell 1 is made of silica gel, and the shell 1 is an integral forming mechanism. The silica gel has good heat transfer performance and good skin-friendly performance, and the use effect of the handheld semiconductor ice compress device is more comfortable. Meanwhile, the silica gel has good elasticity, when the handheld semiconductor ice compress device is assembled, the semiconductor refrigeration piece 2, the radiator 3 and the axial flow fan 4 are assembled into a whole, and then the semiconductor refrigeration piece 2, the radiator 3 and the axial flow fan 4 are plugged into the shell 1 which is integrally formed from the first ventilation opening 13, so that the operation is extremely convenient. It will be appreciated that in other embodiments, when the housing 1 is made of plastic material without elasticity, the housing 1 is assembled from a plurality of plates, so as to facilitate the installation of the semiconductor cooling fin 2, the radiator 3 and the axial flow fan 4 in the housing 1.

To facilitate the use of the handheld semiconductor ice application device, further, the handheld semiconductor ice application device further comprises a rechargeable battery (not shown in the figure) located within the housing 1; the semiconductor refrigerating sheet 2 and the axial flow fan 4 are electrically connected with a rechargeable battery; the lower part of the housing 1 is provided with a charging port 15 connected with a rechargeable battery. The hand-held semiconductor ice compress device does not need to be connected with a power supply through a power line when in use, and can charge the rechargeable battery through the charging port 15 when in idle, so that the use is convenient. Illustratively, the charging port 15 is a USB port. It is understood that the rechargeable battery is mounted at the sides of the semiconductor cooling fin 2, the heat sink 3 and the axial flow fan 4, and avoids the second ventilation opening 14.

Further, the handheld semiconductor ice compress device further comprises an electric control board 5 and a temperature probe 6, and the temperature probe 6, the semiconductor refrigerating piece 2 and the axial flow fan 4 are electrically connected with the electric control board 5; the induction head of the temperature probe 6 is positioned on the bottom surface of the shell 1. The temperature probe 6, i.e., a temperature sensor, senses the temperature of the cold face of the casing 1. The temperature probe 6 sends the detected temperature signal to the electric control board 5, and the electric control board 5 is used for adjusting the refrigerating capacity of the semiconductor refrigerating sheet 2 according to the temperature signal so as to enable the cold compress surface to keep constant cold compress temperature. Specifically, the induction head of the temperature probe 6 is in contact with the bottom surface of the housing 1. Preferably, in some embodiments, the inner wall of the housing 1 has a recess into which the sensing head of the probe extends.

Further, the electric control board 5 is provided with a temperature setting button, and the housing 1 is provided with an operation position 16 corresponding to the temperature setting button. When it is necessary to adjust the ice temperature, the temperature setting button can be operated by pressing the operation position 16. Preferably, the temperature setting button also has both power on and power off functions, for example, a long press of greater than 3 seconds on the operation position 16 is used to power on or power off. Preferably, the electric control board 5 is also provided with a display screen, the display screen is closely adjacent to the temperature setting buttons, and the operation position 16 of the shell 1 is a light transmission part, so that a user can observe temperature information displayed by the display screen.

Other constructions, etc., and operation of a hand-held semiconductor ice compress device according to embodiments of the present utility model are known to those of ordinary skill in the art and will not be described in detail herein.

In the description herein, reference to the term "embodiment," "example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. The handheld semiconductor ice compress device is characterized by comprising a shell, a semiconductor refrigerating piece, a radiator and an axial flow fan, wherein the semiconductor refrigerating piece, the radiator and the axial flow fan are all positioned in the shell;

the bottom surface of the shell is an ice compress surface, the cold surface of the semiconductor refrigeration piece is attached to the bottom of the inner wall of the shell, and the upper part of the shell is a handheld part; the radiator is attached to the hot surface of the semiconductor refrigerating sheet, and the axial flow fan is arranged at the top of the radiator;

the top end of the shell is provided with a first ventilation opening, and the first ventilation opening is positioned above the axial flow fan; the side wall of the lower part of the shell is provided with a second air vent, and the second air vent corresponds to the radiator in position.

2. The hand-held semiconductor ice compress device of claim 1, wherein the cold face of the semiconductor refrigeration piece is bonded with the bottom of the inner wall of the shell through heat-conducting glue;

the semiconductor refrigerating sheet, the radiator and the side wall of the axial flow fan are all attached to or closely adjacent to the inner wall of the shell.

3. The handheld semiconductor ice compress device of claim 2, wherein the heat sink is a copper fin heat sink;

the two opposite side surfaces of the shell are respectively provided with the second air inlets, and two ends of the fins of the fin radiator respectively correspond to the two second air inlets.

4. A hand held semiconductor ice application device according to claim 3, wherein said heat sink comprises a heat transfer plate and a folded fin, said folded fin being connected to said heat transfer plate;

the bottom of the axial flow fan is connected with the folding fins through a screw rod or a positioning rod.

5. The handheld semiconductor ice compress device of claim 1, wherein the thickness of the housing bottom is less than the thickness of the housing side walls.

6. The handheld semiconductor ice compress device according to claim 1, wherein an outer peripheral surface of the housing gradually contracts from bottom to top, such that an upper portion of the housing forms a handheld portion;

and the outer peripheral surface of the shell gradually contracts from bottom to top to enable the top of the shell to form the first ventilation opening.

7. The device of claim 1, 5 or 6, wherein the housing is a silicone material and the housing is an integral molding mechanism.

8. The handheld semiconductor ice compress device of claim 1, further comprising a rechargeable battery located within the housing;

the semiconductor refrigerating sheet and the axial flow fan are electrically connected with the rechargeable battery;

the lower part of the shell is provided with a charging port connected with the rechargeable battery.

9. The handheld semiconductor ice compress device of claim 1, further comprising an electrical control board and a temperature probe, wherein the temperature probe, the semiconductor refrigeration piece and the axial flow fan are all electrically connected with the electrical control board;

the inductive head of the temperature probe is positioned on the bottom surface of the shell.

10. The hand-held semiconductor ice compress device of claim 9, wherein the electronic control board is provided with a temperature setting button, and the housing is provided with an operating position corresponding to the temperature setting button.