CN218899885U

CN218899885U - Semiconductor low-temperature pain relieving probe

Info

Publication number: CN218899885U
Application number: CN202222362545.XU
Authority: CN
Inventors: 吴国宪
Original assignee: Guangzhou Sande Medical Technology Co ltd
Current assignee: Guangzhou Sande Medical Technology Co ltd
Priority date: 2022-09-05
Filing date: 2022-09-05
Publication date: 2023-04-25
Anticipated expiration: 2032-09-05

Abstract

The utility model discloses a semiconductor low-temperature pain relieving probe, which comprises: the handle shell is internally provided with a containing cavity, the front side of the upper end of the handle shell is provided with a mounting hole, the rear side of the upper end of the handle shell is provided with a radiating hole, the cold compress probe is arranged at the position of the mounting hole, the refrigerating assembly, the radiating assembly and the control circuit board are arranged in the handle shell, the heat absorbing end of the refrigerating assembly is contacted with the cold compress probe, the radiating assembly is arranged at the rear side of the refrigerating assembly and corresponds to the radiating hole, the handle shell is provided with a plurality of air inlet holes corresponding to the radiating assembly, and the refrigerating assembly and the radiating assembly are electrically connected with the control circuit board; the semiconductor low-temperature pain relieving probe can realize continuous refrigeration, so that the cold compress probe is kept in a low-temperature state, and when the semiconductor low-temperature pain relieving probe is used, the cold compress probe is applied to a lesion part, so that long-time stable cold compress can be realized, blood exudation is reduced, nerve endings are stimulated by the cold compress, paralysis is generated, and the cold compress pain relieving and treatment effects are good.

Description

Semiconductor low-temperature pain relieving probe

Technical Field

The utility model relates to the technical field related to cold compress devices, in particular to a semiconductor low-temperature pain relieving probe.

Background

Cold compress is one of the treatment methods, namely, cold compress is applied to the forehead, the back of the neck or the skin of a lesion part by using an ice bag or a cold wet towel. Is applied to the affected part to promote local vasoconstriction, control bleeding of small blood vessels and relieve pain of lump with large tension, and achieve the effects of detumescence and pain relief.

When acute sprain, scald or scratch occurs, ice cubes or ice bags are generally used for cold compress, the ice cubes are fused along with the increase of the cold compress time, the cold compress effect is deteriorated, and how to design a device which can replace the ice bags or ice cubes for cold compress and can keep stable cold compress effect for a long time becomes a problem to be solved.

Disclosure of Invention

In order to overcome the defects in the prior art, the utility model aims to provide a semiconductor low-temperature pain relieving probe for solving the technical problems.

The technical scheme adopted for solving the technical problems is as follows:

according to one aspect of the present utility model, a semiconductor cryoprobe is designed comprising: handle shell, cold compress probe, refrigeration subassembly, radiator unit, control circuit board, the inside chamber that holds that has of handle shell, handle shell upper end front side are equipped with the mounting hole, and the upper end rear side is equipped with the louvre, cold compress probe install in the mounting hole position, refrigeration subassembly, radiator unit, control circuit board locate in the handle shell to refrigeration subassembly's heat absorption end with cold compress probe contact, radiator unit locate refrigeration subassembly rear side and with the louvre corresponds, be equipped with a plurality of air inlet holes that correspond with radiator unit on the handle shell, refrigeration subassembly, radiator unit all with the control circuit board electricity is connected.

In order to better solve the technical defects, the utility model also has a better technical scheme:

in some embodiments, the refrigeration assembly includes a semiconductor refrigeration sheet having a heat absorbing end in contact with the cold compress probe.

In some embodiments, the refrigeration assembly further comprises a low temperature sensing piece, the low temperature sensing piece is adhered to the radiating end of the semiconductor refrigeration piece, and the other end of the low temperature sensing piece is in contact with a radiator on the radiating assembly.

In some embodiments, the heat dissipation assembly comprises a heat radiator and a heat dissipation fan, wherein the heat radiator is arranged on the heat dissipation fan, the heat dissipation fan is fixedly connected with the handle shell and corresponds to the heat dissipation hole, and the air inlet hole corresponds to the heat radiator.

In some embodiments, a power socket is connected to the handle housing, and the power socket is electrically connected to the control circuit board.

In some embodiments, the handle shell comprises a handle front shell and a handle rear shell, and the handle front shell and the handle rear shell are connected through a clamping buckle and a clamping groove or through a screw.

In some embodiments, a rechargeable battery electrically connected to the control circuit board is disposed within the handle housing, and the power supply socket is electrically connected to the rechargeable battery.

In some embodiments, the cold compress probe is a sheet metal and the side facing the outside is in the shape of a circular arc-shaped bulge.

In some embodiments, a switch button and a function button electrically connected with the control circuit board are arranged on the front handle shell.

In some embodiments, the handle housing is internally provided with a vibration-resistant layer.

Compared with the prior art, the utility model has the beneficial effects that:

according to the semiconductor low-temperature pain relieving probe, the control circuit board is used for controlling the refrigeration assembly to start refrigeration and the heat radiating assembly to start to radiate heat, the heat absorbing end of the semiconductor refrigeration piece absorbs heat on the cold compress probe to cool the cold compress probe, the heat radiating end of the semiconductor refrigeration piece conducts the absorbed heat to the low-temperature sensing piece and the radiator, when the cooling fan rotates, external air enters the handle shell from the air inlet hole and passes through the radiator, and then is discharged from the heat radiating hole, so that internal heat is discharged, continuous refrigeration of the semiconductor refrigeration piece is realized, the cold compress probe is kept in a low-temperature state, and when the semiconductor low-temperature pain relieving probe is used, stable cold compress for a long time can be realized, blood exudation is reduced, nerve endings are stimulated by cold compress, paralysis is generated, and the cold compress pain relieving and treatment effects are good; in addition, the semiconductor low-temperature pain-relieving probe of the design has the advantages of small volume, low energy consumption, simple structure, low cost, high portability and good practicability.

Drawings

FIG. 1 is a schematic diagram showing the front view structure of a semiconductor cryoprobe according to an embodiment of the present utility model;

FIG. 2 is a schematic rear view of a semiconductor cryoprobe;

FIG. 3 is a schematic view of an expanded structure of a semiconductor cryoprobe;

reference numerals:

1. a handle housing; 11. a handle front case; 12. a handle rear housing; 13. a mounting hole; 14. a heat radiation hole; 15. a power supply socket; 16. a switch button; 17. a function button; 2. a cold compress probe; 3. a refrigeration assembly; 31. a semiconductor refrigeration sheet; 32. a low temperature sensor chip; 4. a heat dissipation assembly; 41. a heat sink; 42. a heat radiation fan; 5. and a control circuit board.

Detailed Description

The objects, technical solutions and advantages of the present utility model will become more apparent by the following detailed description of the present utility model with reference to the accompanying drawings. It should be understood that the description is only illustrative and is not intended to limit the scope of the utility model. In addition, in the following description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the present utility model.

Referring to fig. 1 to 3, the present utility model provides a semiconductor low temperature pain relieving probe, comprising: handle shell 1, cold compress probe 2, refrigeration subassembly 3, radiator unit 4, control circuit board 5.

The handle shell 1 is internally provided with a containing cavity, the handle shell 1 comprises a handle front shell 11 and a handle rear shell 12, a buckle is arranged between the handle front shell 11 and the handle rear shell 12 through one of the handle front shell and the handle rear shell, a clamping groove is arranged on the other handle front shell and the handle rear shell, and the handle front shell and the handle rear shell are connected through the buckle and the clamping groove in a clamping mode or are connected through screws, and a connecting mode is set according to requirements.

The front side of the upper end of the handle shell 1 is provided with a mounting hole 13, the rear side of the upper end is provided with a radiating hole 14, namely the front side of the handle front shell 11 is provided with the mounting hole 13, the rear side of the handle rear shell 12 is provided with the radiating hole 14, the radiating hole 14 comprises a circle of round holes and a circle of leaf-shaped holes, the cold compress probe 2 is mounted at the position of the mounting hole 13 through screws, the refrigerating component 3, the radiating component 4 and the control circuit board 5 are arranged in the handle shell 1, the heat absorbing end of the refrigerating component 3 is contacted with the cold compress probe 2, the radiating component 4 is arranged at the rear side of the refrigerating component 3 and corresponds to the radiating hole 14, the handle shell 1 is provided with a plurality of air inlet holes corresponding to the radiating component 4, the refrigerating component 3 and the radiating component 4 are electrically connected with the control circuit board 5, and the control circuit board 5 is fixedly connected with the handle shell 1 through screws.

The cold compress probe 2 is a metal sheet, and may be aluminum, stainless steel, aluminum alloy, etc., preferably stainless steel, and the side of the cold compress probe 2 facing the outside is in a circular arc convex shape.

The refrigeration assembly 3 comprises a semiconductor refrigeration piece 31 and a low-temperature sensing piece 32, the semiconductor refrigeration piece 31 is fixedly connected in a mounting groove in the front handle shell 11 through a screw, the semiconductor refrigeration piece 31 is electrically connected with the control circuit board 5, the heat absorption end of the semiconductor refrigeration piece 31 is in contact with the cold compress probe 2, the low-temperature sensing piece 32 is stuck to the heat dissipation end, namely the rear end, of the semiconductor refrigeration piece 31, and the low-temperature sensing piece 32 is made of metal materials, such as aluminum, stainless steel, aluminum alloy and the like.

The heat dissipation assembly 4 comprises a heat dissipation device 41 and a heat dissipation fan 42, wherein the heat dissipation device 41 comprises a heat dissipation bottom plate and a plurality of heat dissipation fins arranged on the heat dissipation bottom plate, the heat dissipation device 41 is arranged on the heat dissipation fan 42 through screws, the heat dissipation bottom plate on the heat dissipation device 41 is in contact with the low-temperature sensing fins 32, the heat dissipation fan 42 is fixedly connected in a mounting groove in the handle rear shell 12 through screws, an air outlet end of the heat dissipation fan 42 corresponds to the heat dissipation holes 14, the heat dissipation fan 42 is electrically connected with the control circuit board 5, and a plurality of air inlet holes respectively correspond to the front, the rear, the left and the right of the heat dissipation device 41.

The handle shell 1 is connected with a power supply socket 15, and the power supply socket 15 is electrically connected with the control circuit board 5.

The front handle shell 11 is provided with a switch button 16 and a function button 17 which are electrically connected with the control circuit board 5.

In some embodiments, the handle housing 1 is internally provided with a shock-resistant layer.

In other embodiments, a rechargeable battery electrically connected to the control circuit board 5 is provided in the handle housing 1, and the power supply socket 15 is electrically connected to the rechargeable battery.

The foregoing is merely illustrative of some embodiments of the utility model, and it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the inventive concept.

Claims

1. A semiconductor cryoprobe for analgesia, comprising: handle shell, cold compress probe, refrigeration subassembly, radiator unit, control circuit board, the inside chamber that holds that has of handle shell, handle shell upper end front side are equipped with the mounting hole, and the upper end rear side is equipped with the louvre, cold compress probe install in the mounting hole position, refrigeration subassembly, radiator unit, control circuit board locate in the handle shell to refrigeration subassembly's heat absorption end with cold compress probe contact, radiator unit locate refrigeration subassembly rear side and with the louvre corresponds, be equipped with a plurality of air inlet holes that correspond with radiator unit on the handle shell, refrigeration subassembly, radiator unit all with the control circuit board electricity is connected.

2. A semiconductor cryoprobe according to claim 1 wherein said refrigeration assembly comprises a semiconductor refrigeration sheet having a heat absorbing end in contact with said cold compress probe.

3. The semiconductor low-temperature pain-relieving probe according to claim 2, wherein the refrigerating assembly further comprises a low-temperature sensing piece, the low-temperature sensing piece is adhered to the radiating end of the semiconductor refrigerating piece, and the other end of the low-temperature sensing piece is in contact with a radiator on the radiating assembly.

4. A semiconductor low temperature pain relieving probe according to any one of claims 1 to 3, wherein the heat dissipating assembly comprises a heat sink and a heat dissipating fan, the heat sink is mounted on the heat dissipating fan, the heat dissipating fan is fixedly connected with the handle case and corresponds to the heat dissipating hole, and the air inlet hole corresponds to the heat sink.

5. A semiconductor low temperature pain relieving probe as defined in claim 1, wherein a power socket is connected to said handle housing, said power socket being electrically connected to said control circuit board.

6. The semiconductor low-temperature pain-relieving probe according to claim 1, wherein the handle shell comprises a handle front shell and a handle rear shell, and the handle front shell and the handle rear shell are connected through clamping grooves and clamping buckles or screws.

7. The semiconductor low temperature pain relieving probe of claim 5, wherein a rechargeable battery is disposed within the handle housing and electrically connected to the control circuit board, and the power supply socket is electrically connected to the rechargeable battery.

8. A semiconductor cryoprobe according to claim 1 wherein said cold compress probe is a metal sheet and has a convex shape of a circular arc on the side facing the outside.

9. The semiconductor low temperature pain relieving probe according to claim 6, wherein a switch button and a function button electrically connected with the control circuit board are provided on the front case of the handle.

10. A semiconductor low temperature pain relieving probe as claimed in claim 1, wherein a vibration-proof layer is provided inside the handle housing.