CN211934497U - Forehead fever reducing instrument - Google Patents

Forehead fever reducing instrument Download PDF

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Publication number
CN211934497U
CN211934497U CN202020271934.XU CN202020271934U CN211934497U CN 211934497 U CN211934497 U CN 211934497U CN 202020271934 U CN202020271934 U CN 202020271934U CN 211934497 U CN211934497 U CN 211934497U
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China
Prior art keywords
probe
forehead
sheet
heat dissipation
fever
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Expired - Fee Related
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CN202020271934.XU
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Chinese (zh)
Inventor
段文军
刘勇
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Individual
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Individual
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Priority to CN202020271934.XU priority Critical patent/CN211934497U/en
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Publication of CN211934497U publication Critical patent/CN211934497U/en
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Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a forehead appearance of bringing down a fever, include: the body, the cold guide plate and the semiconductor refrigeration plate; the hot end of the semiconductor refrigerating sheet is connected with a heat dissipation assembly, and heat is dissipated outwards through the heat dissipation assembly; this internal circuit board and battery of being provided with, the body back is provided with the display screen, semiconductor refrigeration piece, radiator unit and the equal electric connection of display screen in circuit board. The utility model cools through the semiconductor refrigeration piece, the cold conduction piece transmits the temperature to the human body, the physical cooling can be realized, and the effect is better than the traditional disposable cooling paste through the electronic equipment cooling, and the cold conduction piece can be repeatedly used and is a necessary product for families; the operation of intelligent control semiconductor refrigeration piece can be realized to the appearance of bringing down a fever, realizes intelligent cooling, and the effect is better, and the cooling effect is faster, and is higher quality than conventional physics appearance of bringing down a fever, and it has controllability, surveillance nature, thereby intelligence reaches ideal effect.

Description

Forehead fever reducing instrument
Technical Field
The utility model relates to a domestic medical equipment technical field, more specifically the utility model relates to a forehead appearance of bringing down a fever that says so.
Background
Fever is the most common manifestation of many diseases and, in severe cases, can directly damage human brain cells.
Fever generally comprises two fever reducing modes in clinic, wherein one mode is medicinal fever reducing, and the other mode is physical cooling.
Fever is a common disease, especially fever of children, and if the fever is relieved by medicines, the side effect is large, so physical cooling is often used.
The fever reducing patch sold in the market is also used by sticking the fever reducing patch on the forehead in a physical cooling mode. However, the fever reducing patch is a disposable product, and the fever reducing patch has short ice compress time, needs to be frequently replaced and is inconvenient to use. Moreover, after the cooling paste is used for a period of time, the temperature rises, and the significance of ice compress is lost.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a forehead appearance of bringing down a fever.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a forehead fever reduction instrument comprising: the refrigerator comprises a body, a cold guide sheet arranged on the front surface of the body and contacted with the forehead of a human body, and a semiconductor refrigerating sheet arranged on the body and contacted with the cold guide sheet; the hot end of the semiconductor refrigerating sheet is connected with a heat dissipation assembly, and heat is dissipated outwards through the heat dissipation assembly; this internal circuit board and battery of being provided with, the body back is provided with the display screen, semiconductor refrigeration piece, radiator unit and the equal electric connection of display screen in circuit board.
In the preferred technical scheme, the front side of the body is arc-shaped, and the back side of the body is provided with a containing cavity for assembling the heat dissipation assembly and the storage battery.
In a preferred technical solution, the heat dissipation assembly includes: the heat dissipation aluminum sheet is arranged between the semiconductor refrigeration sheet and the direct current fan.
In the preferred technical scheme, an installation opening is formed in the inner wall of the containing cavity, and the semiconductor refrigeration sheet is installed in the installation opening and exposed from the front surface of the body to be in contact with the cold guide sheet.
In the preferred technical scheme, the heat dissipation aluminum sheet is contacted with the semiconductor refrigerating sheet, and the direct current fan blows out the heat of the heat dissipation aluminum sheet; the surface of the cold guide sheet is provided with an ice bag sheet.
In a preferred technical scheme, the body is provided with a first probe, a second probe and a third probe.
In a preferred technical scheme, the first probe is a room temperature probe; the second probe is an infrared non-contact probe; the third probe is a contact temperature measuring probe.
In the preferred technical scheme, the circuit board is provided with a control module, a loudspeaker and a charging interface.
In the preferred technical scheme, the control module receives signals of the first probe, the second probe and the third probe to drive the semiconductor chilling plate to operate; and signals of the first probe, the second probe and the third probe are converted into data through a control module of the circuit board and are displayed on a display screen.
In a preferred technical scheme, the body is connected with a binding band.
Known through foretell technical scheme, compare with prior art, the utility model discloses following beneficial effect has: the utility model cools through the semiconductor refrigeration piece arranged in the body, the cold conduction piece transfers the temperature to the human body, the physical cooling can be realized, and the effect is better than the traditional disposable cooling paste by cooling through the electronic equipment, and the cold conduction piece can be repeatedly used and is a necessary product for families; in addition, the fever reducing instrument is provided with a first probe, a second probe and a third probe, wherein the first probe is used for detecting the room temperature, the second probe is used for detecting the temperature of a human body, the third probe is used for detecting the temperature of an ice bag sheet, the intelligent control of the operation of the semiconductor refrigeration sheet can be realized, the intelligent temperature reduction is realized, the effect is better, the temperature reduction effect is faster, the fever reducing instrument is higher in quality than the conventional physical fever reducing instrument, and the fever reducing instrument has controllability, monitoring performance and intelligence so as to achieve an ideal effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of the exploded structure of the present invention.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
In the description of the present application, it is to be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity of description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the present application. In the description of the present application, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
A forehead fever reducing instrument, as shown in fig. 1-2, comprising: the cooling device comprises a body 100, a cooling fin 200 which is arranged on the front surface of the body 100 and is contacted with the forehead of a human body, and a semiconductor cooling fin 300 which is arranged on the body 100 and is contacted with the cooling fin 200.
Semiconductor refrigeration piece 300's one end is the cold junction, and the other end is the hot junction, and the one end of contacting with cold conduction piece 200 is the cold junction, can transmit cold temperature to cold conduction piece 200, can need to cool down to the human body.
The semiconductor chilling plate 300 is connected with a heat dissipation assembly 400.
The body 100 is further provided with a display screen 500, a circuit board 600 and a storage battery 700.
The back of body 100 be provided with the appearance chamber that is used for radiator unit 400 to assemble, body 100 has seted up the installing port in appearance intracavity portion, the installing port runs through in the front of body 100 for semiconductor refrigeration piece 300 is installed in the installing port, can contact with cold conduction piece 200 effectively, transmits the cold sensation to cold conduction piece 200.
Furthermore, the cold guide plate 200 is proved to be additionally connected with an ice bag plate 210, and after the ice bag plate 210 is added, the ice bag plate 210 is actually in direct contact with the forehead of the human body in use.
For wearing comfort, the front surface of the body 100 may be configured to be arc-shaped, and the body 100 is provided with a strap 110 for wearing the fever reducing device on the head.
The heat sink assembly 400 includes: a thermally conductive aluminum sheet 410 and a dc fan 420. The heat-conducting aluminum sheet 410 is arranged in the accommodating cavity, and the heat-conducting aluminum sheet 410 is contacted with the hot end of the semiconductor refrigerating sheet 300; the dc fan 420 is mounted in contact with the thermally conductive aluminum sheet 410.
When the heat-conducting aluminum sheet is used, the heat at the hot end of the semiconductor refrigeration sheet 300 is transferred to the heat-conducting aluminum sheet 410, and the heat of the heat-conducting aluminum sheet 410 is blown out by the direct current fan 420.
The semiconductor cooling plate 300, the heat dissipation assembly 400 and the display screen 500 are electrically connected to the circuit board 600.
The body 100 is provided with a first probe 101, a second probe 102 and a third probe 103; the first probe 101 is a room temperature probe and is used for detecting room temperature; the second probe 102 is an infrared non-contact probe and is used for detecting the temperature of a human body; the third probe 103 is a contact temperature probe for detecting the temperature of the ice bag sheet 210.
The circuit board 600 is provided with a control module, a loudspeaker 610 and a charging interface; the charging interface is used for charging the storage battery 700, and the horn is used for playing the current human body temperature or playing a warning role, for example, when continuous high burning is detected, an alarm can be given through the horn.
The product is provided with a power line 800 for connecting a charging interface for charging the storage battery 700.
The control module is used for controlling the operation of the semiconductor chilling plate 300 through the temperatures of the first probe 101, the second probe 102 and the third probe 103, so as to realize intelligent fever reduction.
Signals of the first probe 101, the second probe 102 and the third probe 103 are converted into data through a control module of the circuit board, and the data are displayed on the display screen 500;
monitoring the human body temperature, wherein the function is realized by monitoring the human body temperature by the second probe 102 when the second probe 102 scans the human body temperature, and when the second probe 102 detects that the human body temperature is reduced to a normal value of the human body for three consecutive times, the second probe 102 transmits an instruction to stop the machine and not reduce the temperature to the forehead any more; however, the second probe 102 is still monitoring the human body, when the second probe 102 detects that the human body rises and is not within the normal body temperature range, the second probe 102 transmits a finger instruction, and the semiconductor refrigeration piece 300 cools again, so that intelligent cooling is realized.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. The utility model provides a forehead appearance that defervesces which characterized in that: the method comprises the following steps: the refrigerator comprises a body, a cold guide sheet arranged on the front surface of the body and contacted with the forehead of a human body, and a semiconductor refrigerating sheet arranged on the body and contacted with the cold guide sheet; the hot end of the semiconductor refrigerating sheet is connected with a heat dissipation assembly, and heat is dissipated outwards through the heat dissipation assembly;
this internal circuit board and battery of being provided with, the body back is provided with the display screen, semiconductor refrigeration piece, radiator unit and the equal electric connection of display screen in circuit board.
2. A forehead fever reducing instrument according to claim 1, wherein: the front side of the body is arranged in an arc shape, and a containing cavity for assembling the heat dissipation assembly and the storage battery is formed in the back side of the body.
3. A forehead fever reducing instrument according to claim 1, wherein: the heat dissipation assembly comprises: the heat dissipation aluminum sheet is arranged between the semiconductor refrigeration sheet and the direct current fan.
4. A forehead fever reducing instrument according to claim 2, wherein: the inner wall of the containing cavity is provided with a mounting opening, and the semiconductor refrigeration sheet is mounted in the mounting opening and exposed from the front surface of the body to be contacted with the cold guide sheet; the surface of the cold guide sheet is provided with an ice bag sheet.
5. A forehead fever reducing instrument according to claim 3, wherein: the heat dissipation aluminum sheet is contacted with the semiconductor refrigerating sheet, and the direct current fan blows out the heat of the heat dissipation aluminum sheet.
6. A forehead fever reducing instrument according to claim 1, wherein: the body is provided with a first probe, a second probe and a third probe.
7. A forehead fever reducing instrument according to claim 6, wherein: the first probe is a room temperature probe; the second probe is an infrared non-contact probe; the third probe is a contact temperature measuring probe.
8. A forehead fever reducing instrument according to claim 7, wherein: the circuit board on be provided with control module, loudspeaker and the interface that charges.
9. A forehead fever reducing instrument according to claim 8, wherein: the control module receives signals of the first probe, the second probe and the third probe to drive the semiconductor chilling plate to operate;
and signals of the first probe, the second probe and the third probe are converted into data through a control module of the circuit board and are displayed on a display screen.
10. A forehead fever reducing instrument according to claim 1, wherein: the body is connected with a binding band.
CN202020271934.XU 2020-03-06 2020-03-06 Forehead fever reducing instrument Expired - Fee Related CN211934497U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020271934.XU CN211934497U (en) 2020-03-06 2020-03-06 Forehead fever reducing instrument

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020271934.XU CN211934497U (en) 2020-03-06 2020-03-06 Forehead fever reducing instrument

Publications (1)

Publication Number Publication Date
CN211934497U true CN211934497U (en) 2020-11-17

Family

ID=73193424

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020271934.XU Expired - Fee Related CN211934497U (en) 2020-03-06 2020-03-06 Forehead fever reducing instrument

Country Status (1)

Country Link
CN (1) CN211934497U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112402096A (en) * 2020-11-20 2021-02-26 李姗姗 A medical physics heat sink for paediatrics
CN112656577A (en) * 2020-12-18 2021-04-16 杭州真房网络科技有限公司 Human body cooling refrigerator
CN114366434A (en) * 2022-02-23 2022-04-19 温彪 Forehead semiconductor cooling device for adult fever

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112402096A (en) * 2020-11-20 2021-02-26 李姗姗 A medical physics heat sink for paediatrics
CN112656577A (en) * 2020-12-18 2021-04-16 杭州真房网络科技有限公司 Human body cooling refrigerator
CN114366434A (en) * 2022-02-23 2022-04-19 温彪 Forehead semiconductor cooling device for adult fever

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Granted publication date: 20201117