CN217509286U

CN217509286U - Cooling device for being installed on equipment control box

Info

Publication number: CN217509286U
Application number: CN202220651384.3U
Authority: CN
Inventors: 李来升; 朱逸晨; 费仁俊; 刘世祺
Original assignee: Chang'an Yiyang Power Generation Co ltd
Current assignee: Chang'an Yiyang Power Generation Co ltd
Priority date: 2022-03-23
Filing date: 2022-03-23
Publication date: 2022-09-27
Anticipated expiration: 2032-03-23

Abstract

The utility model relates to a measurement control technical field provides a heat sink for installing on equipment control box, locates on the casing of equipment control box, include: the semiconductor refrigeration piece is arranged on the side wall of the shell, the inner cooling piece is arranged on the semiconductor refrigeration piece and is positioned in the shell, and the outer cooling piece is arranged on the semiconductor refrigeration piece and is positioned outside the shell; the inner radiating fin is provided with an inner fan; and an outer fan is arranged on the outer radiating fin. Through interior fin, interior fan, semiconductor refrigeration piece, outer fin and outer fan, utilize fin and semiconductor refrigeration piece to have the advantage that heat conduction efficiency is fast to and combine the fan further to improve cooling efficiency, can refrigerate in the equipment control box, guarantee the invariant of the interior temperature of equipment control box, have the advantage that the radiating effect is good.

Description

Cooling device for being installed on equipment control box

Technical Field

The application belongs to the technical field of measurement control, and more specifically relates to a heat sink for installing on equipment control box.

Background

At present, in the thermal power factory, many equipment of thermal power unit are located near high temperature heat source like equipment control box, lead to easily gathering a large amount of heats in the equipment control box, and can't distribute away in time. High temperature can cause equipment in the equipment control box to break down, and the safety of the equipment is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide a heat sink for installing on equipment control box to solve the technical problem that equipment control box radiating effect is not good among the prior art.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: the utility model provides a heat sink for installing on equipment control box, locate on equipment control box's casing, include: the semiconductor refrigeration piece is arranged on the side wall of the shell, the inner cooling piece is arranged on the semiconductor refrigeration piece and is positioned in the shell, and the outer cooling piece is arranged on the semiconductor refrigeration piece and is positioned outside the shell; the inner radiating fin is provided with an inner fan; and an outer fan is arranged on the outer radiating fin.

In one embodiment, the shell is provided with a wiring terminal and an electronic temperature control module, a temperature measuring probe is arranged in the shell, the inner fan, the outer fan, the semiconductor refrigeration piece, the electronic temperature control module and the temperature measuring probe are electrically connected with the wiring terminal, and the wiring terminal is electrically connected with an external power supply.

In one embodiment, a first heat-conducting silica gel is arranged between the inner radiating fin and the semiconductor refrigerating fin, and a second heat-conducting silica gel is arranged between the outer radiating fin and the semiconductor refrigerating fin.

In one embodiment, the temperature measuring probe is arranged in the shell in a hanging mode, or the temperature measuring probe is in contact with a heat source.

In one embodiment, the inner and outer fins are both aluminum pieces.

In one embodiment, the inner fan is fixed to the inner heat sink by a fastener, and the outer fan is fixed to the outer heat sink by a fastener.

In one embodiment, at least one inner heat sink, semiconductor chilling plate and outer heat sink are arranged on one side surface of the shell; at least one side of the shell is provided with an inner radiating fin, a semiconductor refrigerating fin and an outer radiating fin.

The application provides a heat sink for installing on equipment control box's beneficial effect lies in: through interior fin, interior fan, semiconductor refrigeration piece, outer fin and outer fan, utilize fin and semiconductor refrigeration piece to have the advantage that heat conduction efficiency is fast to and combine the fan further to improve cooling efficiency, can refrigerate in the equipment control box, guarantee the invariant of the interior temperature of equipment control box, have the advantage that the radiating effect is good.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic connection diagram of a cooling device for installation on an equipment control box according to an embodiment of the present disclosure;

fig. 2 is a schematic external plan view of a cooling device for installation on an equipment control box according to an embodiment of the present application after being installed on a housing.

Wherein, in the figures, the respective reference numerals:

1. an inner heat sink; 2. an outer heat-dissipating sheet; 3. a semiconductor refrigeration sheet; 4. an inner fan; 5. an external fan; 6. a wiring terminal; 7. an electronic temperature control module; 8. a temperature measuring probe; 9. an external power supply; 10. a housing.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1-2, a cooling device for installation on an equipment control box according to an embodiment of the present application will now be described. This a heat sink for installing on equipment control box locates on equipment control box's casing 10, this heat sink includes: the refrigerator comprises an inner radiating fin 1, an outer radiating fin 2 and a semiconductor refrigerating fin 3, wherein the semiconductor refrigerating fin 3 is arranged on the side wall of a shell 10, the inner radiating fin 1 is arranged on the semiconductor refrigerating fin 3 and is positioned inside the shell 10, and the outer radiating fin 2 is arranged on the semiconductor refrigerating fin 3 and is positioned outside the shell 10; the inner heat radiating fin 1 is provided with an inner fan 4; the outer heat dissipation plate 2 is provided with an outer fan 5. The inner heat sink 1, the semiconductor chilling plate 3 and the outer heat sink 2 may achieve heat transfer inside and outside the case 10, and the inner fan 4 and the outer fan 5 may improve heat dissipation efficiency. The inner heat sink 1 is fixed to the inside of the housing 10 by screws, and the outer heat sink 2 is fixed to the outside of the housing 10 by screws.

In this embodiment, through interior fin 1, interior fan 4, semiconductor refrigeration piece 3, outer fin 2 and outer fan 5, utilize fin and semiconductor refrigeration piece 3 to have the advantage that heat conduction efficiency is fast to and combine the fan further to improve cooling efficiency, can refrigerate in the equipment control box, guarantee the invariant of the interior temperature of equipment control box, have the advantage that the radiating effect is good.

In this embodiment, the housing 10 is provided with a connection terminal 6 and an electronic temperature control module 7, the housing 10 is provided with a temperature probe 8 therein, the inner fan 4, the outer fan 5, the electronic temperature control module 7, the semiconductor refrigeration piece 3 and the temperature probe 8 are all electrically connected to the connection terminal 6, and the connection terminal 6 is electrically connected to an external power supply 9. The external power supply is a 24VDC power supply. The temperature measuring probe 8 is used for measuring the temperature in the shell 10, and the electronic temperature control module 7 is used for controlling the opening and closing of the inner fan 4 and the outer fan 5 according to the temperature measured by the temperature measuring probe 8. When the temperature in the shell 10 is lower than the set value, the refrigeration stops, and the inner fan 4, the outer fan 5 and the semiconductor refrigeration sheet 3 stop working in sequence. When the temperature is higher than the set value, the inner fan 4, the outer fan 5 and the semiconductor chilling plate 3 are electrified again in sequence to start chilling. The electronic temperature control module 7 is an embedded electronic temperature controller and is installed on the side wall of the shell 10, so that the temperature setting and operation of workers are facilitated. The electronic temperature control module 7 and the outer heat dissipation plate 2 are disposed on the same side of the housing 10, and the connection terminal 6 may be disposed on the same side or on the other side.

In this embodiment, a first heat-conducting silica gel is disposed between the inner heat sink 1 and the semiconductor refrigerating plate 3, and a second heat-conducting silica gel is disposed between the outer heat sink 2 and the semiconductor refrigerating plate 3. The first heat-conducting silica gel and the second heat-conducting silica gel have the function of ensuring good heat conduction between the radiating fin and the semiconductor refrigerating fin 3.

In an implementation manner of this embodiment, the temperature measuring probe 8 is suspended in the housing 10, so that the temperature measuring probe 8 is used for measuring the ambient temperature in the housing 10, and the overall ambient temperature in the housing 10 is guaranteed to be stable. In another embodiment of this embodiment, the temperature probe 8 is in contact with a heat source, which is a heating element within the housing 10, and is configured to be separately cooled to ensure that the heating element is operating properly.

In the present embodiment, the inner fin 1 and the outer fin 2 are made of aluminum, preferably 6063 type aluminum.

In the present embodiment, the inner fan 4 is fixed to the inner heat sink 1 by a fastener, and the outer fan 5 is fixed to the outer heat sink 2 by a fastener, which is a screw.

In the embodiment, at least one inner heat sink 1, semiconductor chilling plate 3 and outer heat sink 2 are arranged on one side surface of the shell 10; at least one side of the shell 10 is provided with an inner radiating fin 1, a semiconductor refrigerating fin 3 and an outer radiating fin 2. In this embodiment, the quantity of interior fin 1, semiconductor refrigeration piece 3 and outer fin 2 can increase according to the volume size of equipment control box to the assurance can carry out good heat dissipation to the equipment control box and be the standard.

The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A heat sink for installing on equipment control box locates on equipment control box's casing (10), its characterized in that includes: the cooling structure comprises an inner radiating fin (1), an outer radiating fin (2) and a semiconductor refrigerating fin (3), wherein the semiconductor refrigerating fin (3) is arranged on the side wall of a shell (10), the inner radiating fin (1) is arranged on the semiconductor refrigerating fin (3) and is positioned inside the shell (10), and the outer radiating fin (2) is arranged on the semiconductor refrigerating fin (3) and is positioned outside the shell (10); the inner radiating fins (1) are provided with inner fans (4); an outer fan (5) is arranged on the outer radiating fin (2).

2. The cooling device for mounting on an equipment control box of claim 1, wherein: be equipped with binding post (6) and electron temperature control module (7) on casing (10), be equipped with temperature probe (8) in casing (10), interior fan (4) outer fan (5) semiconductor refrigeration piece (3) electron temperature control module (7) with temperature probe (8) all with binding post (6) electricity is connected, binding post (6) are connected with external power source (9) electricity.

3. A cooling device for mounting on an equipment control box according to claim 2, wherein: interior fin (1) with be equipped with first heat conduction silica gel between semiconductor refrigeration piece (3), outer fin (2) with be equipped with second heat conduction silica gel between semiconductor refrigeration piece (3).

4. A cooling device for mounting on an equipment control box according to claim 3, wherein: the temperature measuring probe (8) is arranged in the shell (10) in a suspended mode, or the temperature measuring probe (8) is in contact with a heat source.

5. The cooling device for mounting on an equipment control box of claim 4, wherein: the inner radiating fins (1) and the outer radiating fins (2) are all made of aluminum.

6. The cooling device for mounting on an equipment control box of claim 5, wherein: the inner fan (4) is fixed on the inner radiating fin (1) through a fastener, and the outer fan (5) is fixed on the outer radiating fin (2) through a fastener.

7. The cooling device for mounting on an equipment control box of claim 6, wherein: at least one inner radiating fin (1), a semiconductor refrigerating fin (3) and an outer radiating fin (2) are arranged on one side surface of the shell (10); at least one side surface of the shell (10) is provided with an inner radiating fin (1), a semiconductor refrigerating fin (3) and an outer radiating fin (2).