CN216215924U - Case for low-voltage distributed power supply regulation and control acquisition device - Google Patents

Case for low-voltage distributed power supply regulation and control acquisition device Download PDF

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Publication number
CN216215924U
CN216215924U CN202122483076.2U CN202122483076U CN216215924U CN 216215924 U CN216215924 U CN 216215924U CN 202122483076 U CN202122483076 U CN 202122483076U CN 216215924 U CN216215924 U CN 216215924U
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China
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heat dissipation
case body
plate
heat
equipment
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CN202122483076.2U
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周治伊
杨勇
赫如海
王永年
冯文韬
刘巍
龙杰
周昭
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STATE GRID GASU ELECTRIC POWER RESEARCH INSTITUTE
State Grid Gansu Electric Power Co Ltd
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STATE GRID GASU ELECTRIC POWER RESEARCH INSTITUTE
State Grid Gansu Electric Power Co Ltd
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Priority to CN202122483076.2U priority Critical patent/CN216215924U/en
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Abstract

The utility model discloses a case for a low-voltage distributed power supply regulation and collection device, which comprises a case body, wherein an outer shell of the case body is of a cuboid structure, and the top and the bottom of the case body are provided with heat dissipation grooves; the display screen is arranged on the front side of the case body and used for displaying the running state of the equipment; the control key is arranged at the front side of the case body and at one end far away from the display screen and used for controlling equipment; a connection terminal for connecting with a line; the heat dissipation mechanism is arranged at the top of the case body and used for dissipating heat of equipment, and the heat dissipation mechanism has the following beneficial effects that: the utility model has compact structure and strong practicability, is convenient to improve the heat dissipation efficiency of the case body by additionally arranging the heat dissipation mechanism, prevents the over-high temperature of the equipment, improves the running performance of the equipment and indirectly prolongs the service life of the equipment.

Description

Case for low-voltage distributed power supply regulation and control acquisition device
Technical Field
The utility model relates to an acquisition device, in particular to a case for a low-voltage distributed power supply regulation acquisition device, and belongs to the technical field of acquisition devices.
Background
The power supply regulation and control acquisition device takes a kernel microprocessor as a core, integrates circuits such as sensor conditioning, acquisition and measurement, data storage, communication, a real-time clock and the like, and has the characteristics of strong anti-interference capability, good reliability, high intelligent integration degree, high measurement precision, low power consumption, convenience in installation, operation and maintenance and the like. However, in order to ensure waterproof and moistureproof properties, the equipment is usually close to a sealing design, so that the inside and outside air is not circulated, the heat dissipation property is poor, the operation performance of the equipment is reduced after the equipment is used at high temperature for a long time, and the service life of internal elements of the equipment is gradually reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art and provides a case for a low-voltage distributed power supply regulation and control acquisition device.
In order to solve the technical problems, the utility model provides the following technical scheme:
the utility model relates to a case for a low-voltage distributed power supply regulation and control acquisition device, which comprises:
the case comprises a case body, wherein an outer shell of the case body is of a cuboid structure, and the top and the bottom of the case body are provided with heat dissipation grooves;
the display screen is arranged on the front side of the case body and used for displaying the running state of the equipment;
the control key is arranged at the front side of the case body and at one end far away from the display screen and used for controlling equipment;
a connection terminal for connecting with a line;
the heat dissipation mechanism is arranged at the top of the case body and used for dissipating heat of equipment.
In the implementation process, the heat dissipation efficiency of the case body is improved conveniently by additionally arranging the heat dissipation mechanism, the overhigh temperature of the equipment is prevented, the running performance of the equipment is improved, and the service life of the equipment is indirectly prolonged.
As a preferred scheme of the present invention, the external casing of the chassis body is formed by splicing a top plate, a bottom plate, a panel and two side back plates of an L-shaped structure;
and the side back plate of the case body is in threaded connection with a clamping rail which is used for being in sliding connection with an external preset rail.
As a preferable aspect of the present invention, the heat dissipation mechanism includes:
the middle of the top of the case body is also provided with a heat dissipation plate;
the heat conduction pipes are arranged in the heat dissipation plate at equal intervals;
the bottom of the heat conduction pipe extends to the top of the inner wall of the case body and is fixedly connected with the semiconductor refrigeration piece, and the semiconductor refrigeration piece is used for refrigerating and cooling the inside of the case body;
the heat dissipation fan is mounted at the top of the case body, the heat dissipation fan is fixedly mounted at the top of the mounting plate, a heat dissipation port is formed in the middle of the mounting plate, and the heat dissipation fan is used for dissipating heat of the heat dissipation plate;
and the temperature sensor is arranged on one side of the inside of the case body and used for detecting the temperature in the case body.
As a preferred scheme of the present invention, a control chip is disposed above the interior of the chassis body, and the control chip is used for controlling the device;
and the refrigerating end of the semiconductor refrigerating chip is close to the control chip.
As a preferred scheme of the present invention, the heat dissipation fan, the heat dissipation port, and the heat dissipation plate are all located in the same vertical plane;
a gap is reserved between the top of the mounting plate and the top of the heat dissipation plate;
the input end of the heat radiation fan is attached to the heat radiation port.
As a preferred scheme of the present invention, the temperature sensor, the semiconductor refrigeration chip and the cooling fan are all electrically connected to the control chip.
The utility model has the following beneficial effects: the utility model has compact structure and strong practicability, is convenient to improve the heat dissipation efficiency of the case body by additionally arranging the heat dissipation mechanism, prevents the over-high temperature of the equipment, improves the running performance of the equipment and indirectly prolongs the service life of the equipment.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a front view of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
fig. 3 is a bottom view of the internal structure of the present invention.
In the figure: 1. a chassis body; 2. a display screen; 3. a control key; 4. a connection terminal; 5. a heat dissipation mechanism; 51. a heat dissipation plate; 52. a heat conducting pipe; 53. a semiconductor refrigeration sheet; 54. mounting a plate; 55. a heat radiation fan; 56. a heat dissipation port; 57. a temperature sensor; 6. and a control chip.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Examples
As shown in fig. 1-3, the utility model provides a case for a low-voltage distributed power supply regulation and collection device, which comprises a case body 1, wherein an outer shell of the case body 1 is of a cuboid structure, and heat dissipation grooves are formed in the top and the bottom of the case body 1; the display screen 2 is arranged on the front side of the case body 1 and used for displaying the running state of the equipment; the control key 3 is arranged at one end of the front side of the case body 1, which is far away from the display screen 2, and the control key 3 is used for controlling equipment; a connection terminal 4 for connection with a line; the heat dissipation mechanism 5 is arranged on the top of the case body 1, and the heat dissipation mechanism 5 is used for dissipating heat of the equipment.
Further, the outer shell of the case body 1 is formed by splicing a top plate, a bottom plate, a panel and two side rear plates with L-shaped structures; and the side back plate of the chassis body 1 is in threaded connection with a clamping rail which is used for being in sliding connection with an external preset rail.
Further, a heat dissipation plate 51 is arranged at the middle of the top of the case body 1 and the heat dissipation plate 51 is arranged at the middle of the top of the case body 1; heat conduction pipes 52, the heat conduction pipes 52 being provided at equal intervals inside the heat dissipation plate 51; the semiconductor refrigeration piece 53 is characterized in that the heat conduction pipe 52 is of a U-shaped structure, the bottom of the heat conduction pipe 52 extends to the top of the inner wall of the case body 1 and is fixedly connected with the semiconductor refrigeration piece 53, and the semiconductor refrigeration piece 53 is used for refrigerating and cooling the interior of the case body 1; a heat dissipation fan 55, wherein a mounting plate 54 is mounted on the top of the chassis body 1, the heat dissipation fan 55 is fixedly mounted on the top of the mounting plate 54, a heat dissipation port 56 is formed in the middle of the mounting plate 54, and the heat dissipation fan 55 is used for dissipating heat of the heat dissipation plate 51; and a temperature sensor 57, wherein the temperature sensor 57 is installed at one side inside the case body 1 and is used for detecting the temperature inside the case body 1.
Understandably, when the temperature in the chassis body 1 rises, the temperature sensor 57 detects the temperature rise and then turns on the semiconductor cooling plate 53 and the heat dissipation fan 55 through the control chip 6, the semiconductor cooling plate 53 directly cools the interior of the chassis body 1, meanwhile, the heat pipe 52 absorbs the heat generated on the semiconductor cooling plate 53, the heat pipe 52 absorbs the heat and then conducts the heat to the heat dissipation plate 51, the heat is dissipated through the heat dissipation plate 51, and meanwhile, the heat dissipation fan 55 turns on to dissipate the heat of the heat dissipation plate 51.
Further, a control chip 6 is arranged above the inside of the case body 1, and the control chip 6 is used for controlling the equipment; the refrigerating end of the semiconductor refrigerating sheet 53 is close to the control chip 6, so that the interior of the equipment is directly refrigerated and smelled.
Further, the heat dissipation fan 55, the heat dissipation port 56 and the heat dissipation plate 51 are all located in the same vertical plane; a gap is left between the top of the mounting plate 54 and the top of the heat dissipation plate 51; the input end of the heat dissipation fan 55 is attached to the heat dissipation opening 56.
Furthermore, temperature sensor 57, semiconductor refrigeration piece 53 and radiator fan 55 all with control chip 6 electric connection, temperature sensor 57's model is DS18B20, and control chip 6's model is BF50x, be convenient for better control equipment.
Specifically, when using, temperature sensor 57 detects that the temperature in chassis body 1 is higher, and control chip 6 controls semiconductor refrigeration piece 53 and radiator fan 55 and opens this moment, and semiconductor refrigeration piece 53 directly cools down to chassis body 1's inside, and in the heat of semiconductor refrigeration piece 53 heating face led to radiator plate 51 through heat pipe 52, radiator fan 55 opened and dispelled the heat to heat pipe 52 and radiator plate 51 simultaneously.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. The utility model provides a be used for low voltage distributed power source regulation and control collection system machine case which characterized in that includes:
the case comprises a case body (1), wherein an outer shell of the case body (1) is of a cuboid structure, and heat dissipation grooves are formed in the top and the bottom of the case body (1);
the display screen (2) is arranged on the front side of the case body (1) and used for displaying the running state of the equipment;
the control key (3) is arranged at one end of the front side of the case body (1) and far away from the display screen (2), and the control key (3) is used for controlling equipment;
a connection terminal (4) for connection to a line;
the heat dissipation mechanism (5), the top of chassis body (1) is equipped with heat dissipation mechanism (5), heat dissipation mechanism (5) are used for dispelling the heat to equipment.
2. The cabinet for the low-voltage distributed power supply regulation and collection device of claim 1, wherein the outer shell of the cabinet body (1) is formed by splicing a top plate, a bottom plate, a panel and two side back plates with L-shaped structures;
and the side back plate of the case body (1) is in threaded connection with a clamping rail which is used for being in sliding connection with an external preset rail.
3. The case for a low voltage distributed power supply regulation acquisition device of claim 1, wherein the heat dissipation mechanism (5) comprises:
the heat dissipation plate (51) is further arranged in the middle of the top of the case body (1);
heat conduction pipes (52), wherein the heat conduction pipes (52) are equidistantly arranged in the heat dissipation plate (51);
the heat conduction pipe (52) is of a U-shaped structure, the bottom of the heat conduction pipe (52) extends to the top of the inner wall of the case body (1) and is fixedly connected with the semiconductor refrigeration piece (53), and the semiconductor refrigeration piece (53) is used for refrigerating and cooling the interior of the case body (1);
the heat dissipation device comprises a heat dissipation fan (55), wherein a mounting plate (54) is mounted at the top of the case body (1), the heat dissipation fan (55) is fixedly mounted at the top of the mounting plate (54), a heat dissipation port (56) is formed in the middle of the mounting plate (54), and the heat dissipation fan (55) is used for dissipating heat of a heat dissipation plate (51);
the temperature sensor (57) is installed on one side of the interior of the case body (1) and used for detecting the temperature in the case body (1).
4. The chassis for the low-voltage distributed power supply regulation and collection device of claim 3, characterized in that a control chip (6) is arranged above the inside of the chassis body (1), and the control chip (6) is used for controlling equipment;
the refrigerating end of the semiconductor refrigerating sheet (53) is close to the control chip (6).
5. The chassis for the low-voltage distributed power supply regulation and collection device of claim 3, wherein the cooling fan (55), the cooling port (56) and the cooling plate (51) are all located in the same vertical plane;
a gap is reserved between the top of the mounting plate (54) and the top of the heat dissipation plate (51);
the input end of the heat radiation fan (55) is attached to the heat radiation port (56).
6. The chassis for the low-voltage distributed power supply regulation and collection device of claim 3, wherein the temperature sensor (57), the semiconductor chilling plate (53) and the cooling fan (55) are electrically connected with the control chip (6).
CN202122483076.2U 2021-10-15 2021-10-15 Case for low-voltage distributed power supply regulation and control acquisition device Active CN216215924U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122483076.2U CN216215924U (en) 2021-10-15 2021-10-15 Case for low-voltage distributed power supply regulation and control acquisition device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122483076.2U CN216215924U (en) 2021-10-15 2021-10-15 Case for low-voltage distributed power supply regulation and control acquisition device

Publications (1)

Publication Number Publication Date
CN216215924U true CN216215924U (en) 2022-04-05

Family

ID=80866770

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122483076.2U Active CN216215924U (en) 2021-10-15 2021-10-15 Case for low-voltage distributed power supply regulation and control acquisition device

Country Status (1)

Country Link
CN (1) CN216215924U (en)

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