CN216215924U - Case for low-voltage distributed power supply regulation and control acquisition device - Google Patents
Case for low-voltage distributed power supply regulation and control acquisition device Download PDFInfo
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- CN216215924U CN216215924U CN202122483076.2U CN202122483076U CN216215924U CN 216215924 U CN216215924 U CN 216215924U CN 202122483076 U CN202122483076 U CN 202122483076U CN 216215924 U CN216215924 U CN 216215924U
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Abstract
本实用新型公开了一种用于低电压分布式电源调控采集装置机箱，包括机箱本体，所述机箱本体的外部壳体为长方体结构，所述机箱本体的顶部与底部均设有散热槽；显示屏，所述机箱本体的前侧开设有显示屏，用于对设备的运行状态进行显示；控制按键，所述机箱本体的前侧且远离显示屏的一端设有控制按键，所述控制按键用于对设备进行控制；连接端子，用于与线路进行连接；散热机构，所述机箱本体的顶部设有散热机构，所述散热机构用于对设备进行散热本实用新型所达到的有益效果是：本实用新型结构紧凑，实用性强，通过加设散热机构便于提高机箱本体的散热效率，防止设备温度过高，提高设备运行的性能，且间接提高了设备寿命。
The utility model discloses a case for a low-voltage distributed power source regulation and collection device, which comprises a case body, an outer casing of the case body is a rectangular parallelepiped structure, and heat dissipation slots are arranged on the top and the bottom of the case body; The front side of the chassis body is provided with a display screen, which is used to display the operating status of the equipment; control buttons, the front side of the chassis body and the end away from the display screen are provided with control buttons, and the control buttons are used for For controlling equipment; connecting terminals for connecting with lines; heat dissipation mechanism, the top of the chassis body is provided with a heat dissipation mechanism, and the heat dissipation mechanism is used for heat dissipation of the equipment The beneficial effects achieved by the utility model are: The utility model is compact in structure and strong in practicability. By adding a heat dissipation mechanism, it is convenient to improve the heat dissipation efficiency of the chassis body, prevent the equipment temperature from being too high, improve the operation performance of the equipment, and indirectly increase the service life of the equipment.
Description
Technical Field
The utility model relates to an acquisition device, in particular to a case for a low-voltage distributed power supply regulation acquisition device, and belongs to the technical field of acquisition devices.
Background
The power supply regulation and control acquisition device takes a kernel microprocessor as a core, integrates circuits such as sensor conditioning, acquisition and measurement, data storage, communication, a real-time clock and the like, and has the characteristics of strong anti-interference capability, good reliability, high intelligent integration degree, high measurement precision, low power consumption, convenience in installation, operation and maintenance and the like. However, in order to ensure waterproof and moistureproof properties, the equipment is usually close to a sealing design, so that the inside and outside air is not circulated, the heat dissipation property is poor, the operation performance of the equipment is reduced after the equipment is used at high temperature for a long time, and the service life of internal elements of the equipment is gradually reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art and provides a case for a low-voltage distributed power supply regulation and control acquisition device.
In order to solve the technical problems, the utility model provides the following technical scheme:
the utility model relates to a case for a low-voltage distributed power supply regulation and control acquisition device, which comprises:
the case comprises a case body, wherein an outer shell of the case body is of a cuboid structure, and the top and the bottom of the case body are provided with heat dissipation grooves;
the display screen is arranged on the front side of the case body and used for displaying the running state of the equipment;
the control key is arranged at the front side of the case body and at one end far away from the display screen and used for controlling equipment;
a connection terminal for connecting with a line;
the heat dissipation mechanism is arranged at the top of the case body and used for dissipating heat of equipment.
In the implementation process, the heat dissipation efficiency of the case body is improved conveniently by additionally arranging the heat dissipation mechanism, the overhigh temperature of the equipment is prevented, the running performance of the equipment is improved, and the service life of the equipment is indirectly prolonged.
As a preferred scheme of the present invention, the external casing of the chassis body is formed by splicing a top plate, a bottom plate, a panel and two side back plates of an L-shaped structure;
and the side back plate of the case body is in threaded connection with a clamping rail which is used for being in sliding connection with an external preset rail.
As a preferable aspect of the present invention, the heat dissipation mechanism includes:
the middle of the top of the case body is also provided with a heat dissipation plate;
the heat conduction pipes are arranged in the heat dissipation plate at equal intervals;
the bottom of the heat conduction pipe extends to the top of the inner wall of the case body and is fixedly connected with the semiconductor refrigeration piece, and the semiconductor refrigeration piece is used for refrigerating and cooling the inside of the case body;
the heat dissipation fan is mounted at the top of the case body, the heat dissipation fan is fixedly mounted at the top of the mounting plate, a heat dissipation port is formed in the middle of the mounting plate, and the heat dissipation fan is used for dissipating heat of the heat dissipation plate;
and the temperature sensor is arranged on one side of the inside of the case body and used for detecting the temperature in the case body.
As a preferred scheme of the present invention, a control chip is disposed above the interior of the chassis body, and the control chip is used for controlling the device;
and the refrigerating end of the semiconductor refrigerating chip is close to the control chip.
As a preferred scheme of the present invention, the heat dissipation fan, the heat dissipation port, and the heat dissipation plate are all located in the same vertical plane;
a gap is reserved between the top of the mounting plate and the top of the heat dissipation plate;
the input end of the heat radiation fan is attached to the heat radiation port.
As a preferred scheme of the present invention, the temperature sensor, the semiconductor refrigeration chip and the cooling fan are all electrically connected to the control chip.
The utility model has the following beneficial effects: the utility model has compact structure and strong practicability, is convenient to improve the heat dissipation efficiency of the case body by additionally arranging the heat dissipation mechanism, prevents the over-high temperature of the equipment, improves the running performance of the equipment and indirectly prolongs the service life of the equipment.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a front view of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
fig. 3 is a bottom view of the internal structure of the present invention.
In the figure: 1. a chassis body; 2. a display screen; 3. a control key; 4. a connection terminal; 5. a heat dissipation mechanism; 51. a heat dissipation plate; 52. a heat conducting pipe; 53. a semiconductor refrigeration sheet; 54. mounting a plate; 55. a heat radiation fan; 56. a heat dissipation port; 57. a temperature sensor; 6. and a control chip.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
Examples
As shown in fig. 1-3, the utility model provides a case for a low-voltage distributed power supply regulation and collection device, which comprises a case body 1, wherein an outer shell of the case body 1 is of a cuboid structure, and heat dissipation grooves are formed in the top and the bottom of the case body 1; the display screen 2 is arranged on the front side of the case body 1 and used for displaying the running state of the equipment; the control key 3 is arranged at one end of the front side of the case body 1, which is far away from the display screen 2, and the control key 3 is used for controlling equipment; a connection terminal 4 for connection with a line; the heat dissipation mechanism 5 is arranged on the top of the case body 1, and the heat dissipation mechanism 5 is used for dissipating heat of the equipment.
Further, the outer shell of the case body 1 is formed by splicing a top plate, a bottom plate, a panel and two side rear plates with L-shaped structures; and the side back plate of the chassis body 1 is in threaded connection with a clamping rail which is used for being in sliding connection with an external preset rail.
Further, a heat dissipation plate 51 is arranged at the middle of the top of the case body 1 and the heat dissipation plate 51 is arranged at the middle of the top of the case body 1; heat conduction pipes 52, the heat conduction pipes 52 being provided at equal intervals inside the heat dissipation plate 51; the semiconductor refrigeration piece 53 is characterized in that the heat conduction pipe 52 is of a U-shaped structure, the bottom of the heat conduction pipe 52 extends to the top of the inner wall of the case body 1 and is fixedly connected with the semiconductor refrigeration piece 53, and the semiconductor refrigeration piece 53 is used for refrigerating and cooling the interior of the case body 1; a heat dissipation fan 55, wherein a mounting plate 54 is mounted on the top of the chassis body 1, the heat dissipation fan 55 is fixedly mounted on the top of the mounting plate 54, a heat dissipation port 56 is formed in the middle of the mounting plate 54, and the heat dissipation fan 55 is used for dissipating heat of the heat dissipation plate 51; and a temperature sensor 57, wherein the temperature sensor 57 is installed at one side inside the case body 1 and is used for detecting the temperature inside the case body 1.
Understandably, when the temperature in the chassis body 1 rises, the temperature sensor 57 detects the temperature rise and then turns on the semiconductor cooling plate 53 and the heat dissipation fan 55 through the control chip 6, the semiconductor cooling plate 53 directly cools the interior of the chassis body 1, meanwhile, the heat pipe 52 absorbs the heat generated on the semiconductor cooling plate 53, the heat pipe 52 absorbs the heat and then conducts the heat to the heat dissipation plate 51, the heat is dissipated through the heat dissipation plate 51, and meanwhile, the heat dissipation fan 55 turns on to dissipate the heat of the heat dissipation plate 51.
Further, a control chip 6 is arranged above the inside of the case body 1, and the control chip 6 is used for controlling the equipment; the refrigerating end of the semiconductor refrigerating sheet 53 is close to the control chip 6, so that the interior of the equipment is directly refrigerated and smelled.
Further, the heat dissipation fan 55, the heat dissipation port 56 and the heat dissipation plate 51 are all located in the same vertical plane; a gap is left between the top of the mounting plate 54 and the top of the heat dissipation plate 51; the input end of the heat dissipation fan 55 is attached to the heat dissipation opening 56.
Furthermore, temperature sensor 57, semiconductor refrigeration piece 53 and radiator fan 55 all with control chip 6 electric connection, temperature sensor 57's model is DS18B20, and control chip 6's model is BF50x, be convenient for better control equipment.
Specifically, when using, temperature sensor 57 detects that the temperature in chassis body 1 is higher, and control chip 6 controls semiconductor refrigeration piece 53 and radiator fan 55 and opens this moment, and semiconductor refrigeration piece 53 directly cools down to chassis body 1's inside, and in the heat of semiconductor refrigeration piece 53 heating face led to radiator plate 51 through heat pipe 52, radiator fan 55 opened and dispelled the heat to heat pipe 52 and radiator plate 51 simultaneously.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122483076.2U CN216215924U (en) | 2021-10-15 | 2021-10-15 | Case for low-voltage distributed power supply regulation and control acquisition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122483076.2U CN216215924U (en) | 2021-10-15 | 2021-10-15 | Case for low-voltage distributed power supply regulation and control acquisition device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216215924U true CN216215924U (en) | 2022-04-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122483076.2U Active CN216215924U (en) | 2021-10-15 | 2021-10-15 | Case for low-voltage distributed power supply regulation and control acquisition device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216215924U (en) |
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2021
- 2021-10-15 CN CN202122483076.2U patent/CN216215924U/en active Active
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