CN213178892U - Monitoring equipment's heat radiation structure - Google Patents

Abstract

The utility model discloses a heat dissipation structure of monitoring equipment, which comprises a shell and a heat dissipation device, four corners on a second cover plate on the left side of the shell are all fixedly connected with bolts A, four corners on a first cover plate on the right side of the shell are all fixedly connected with bolts C, a high-conduction cold aluminum sheet is arranged in the shell, the shell is divided into a first inner cavity and a second inner cavity which are not communicated by the high-conduction cold aluminum sheet, the first inner cavity is used for accommodating a monitoring controller, the monitoring controller is connected on one side of the high-conduction cold aluminum sheet through close fitting, the second inner cavity is used for accommodating a heat dissipation device and a heat dissipation fan, the heat dissipation device is connected on the other side of the high-conduction cold aluminum sheet through close fitting of a bolt B, the heat dissipation fan is detachably connected on the left side wall through the bolt A, the power input end of the heat dissipation fan is electrically, is suitable for wide popularization and application.

Description

Monitoring equipment's heat radiation structure

Technical Field

The utility model relates to a security protection supervisory equipment technical field, in particular to supervisory equipment's heat radiation structure.

Background

The security monitoring device is a device for real-time monitoring by using a camera device. The video recorder can reflect the monitored object in real time, vividly and truly and record the object through the video recorder, thereby greatly prolonging the observation distance of human eyes, expanding the functions of the human eyes, replacing manpower to carry out long-time monitoring in severe environment and enabling people to see all the actual conditions of the monitored site. The positioning structure for installing the security monitoring equipment is a structure for installing the monitoring camera device.

Patent CN201910509097.1 discloses a supervisory equipment's heat radiation structure relates to security protection supervisory equipment installation technical field, including fixing base, location installation piece and buffering locating component, the top fixedly connected with mounting panel of fixing base, and the top both sides of mounting panel are fixed with the side shield, the dust blocking subassembly is installed to the top of side shield, the integration of location installation piece sets up in the top middle part of mounting panel, and the top of location installation piece installs the surveillance camera head, angle adjusting component is installed to the both sides below of surveillance camera head. The invention has the beneficial effects that: the device's connecting rod and gyro wheel can be to the rear atress of surveillance camera head, and angle adjusting component's dead lever and rotation axis can be to the both sides atress of surveillance camera head to buffer spring and sliding plate can be to the below atress of surveillance camera head, and the structure setting of trilateral atress makes the installation location structure of surveillance camera head more stable.

The prior art and the above disadvantages: 1. because the temperature of the working environment in the shell is raised along with the generation of heat in the running process of the equipment, although the equipment is provided with the heat dissipation device, the normal work of electronic components is still influenced and the electronic components can be burnt if the equipment is only provided with the heat dissipation fan; 2. the existing heat dissipation device main chip and the radiator are arranged in the shell, the radiator is fixed on the surface of the main chip with larger heat productivity to dissipate heat, and when the radiator needs to be maintained or replaced, the shell structure needs to be disassembled and assembled, which can affect the IP protection grade of the product.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a heat dissipation structure for monitoring equipment, which can effectively solve the problems of poor heat dissipation of the equipment and maintenance and replacement of the heat dissipation device in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a supervisory equipment's heat radiation structure, includes casing and heat abstractor, its characterized in that: the utility model discloses a cooling fan, including casing, first inner chamber, second inner chamber, radiator fan, cooling fan power input end and motor power output end electric connection, four equal fixedly connected with bolts in angle on the left side wall of casing, four equal fixedly connected with bolts in angle on the right side wall of casing the inside of casing is equipped with high cold aluminum sheet of leading, high cold aluminum sheet of leading divide into first inner chamber and the second inner chamber that each other does not communicate with the casing, first inner chamber is used for holding supervisory control ware, supervisory control ware connects on high cold aluminum sheet one side of leading through the laminating closely, the second inner chamber is used for holding heat abstractor and radiator fan, heat abstractor connects on high cold aluminum sheet opposite side of leading through the bolt laminating closely, radiator fan passes through the bolt and can dismantle the connection.

Further, heat abstractor includes cooling fin, refrigeration chip, semiconductor refrigeration piece and heat conduction aluminum sheet, cooling fin is installed at the top in the heat abstractor, cooling fin closely laminates on high heat conduction aluminum sheet, cooling fin below closely laminates on the semiconductor refrigeration piece, the installation of closely laminating in semiconductor refrigeration piece below is on the refrigeration chip, the installation of closely laminating in refrigeration chip below is on the heat conduction aluminum sheet.

Furthermore, the shell is provided with heat dissipation units with fin structures on two side walls of the second inner cavity.

Furthermore, the heat dissipation device, the monitoring controller and the motor input end are electrically connected with an external power supply.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. the heat dissipation device used for the equipment is a semiconductor heat radiator which is composed of cooling fins, a heat conduction aluminum sheet, a semiconductor refrigeration sheet and a refrigeration chip, and can continuously work without any refrigerant, a pollution source and a rotating part are avoided, a rotation effect is avoided, a sliding part is not provided, the heat dissipation device is a solid sheet, vibration and noise are avoided during work, the service life is long, and the installation is easy; the semiconductor refrigerating sheet is a current transduction type sheet, can realize high-precision temperature control by controlling input current, and is easy to realize remote control, program control and computer control by adding temperature detection and control means, so that an automatic control system is convenient to form and is safe to use, the thermal inertia of the semiconductor refrigerating sheet is very small, the refrigerating and heating time is fast, and the refrigerating sheet can reach the maximum temperature difference by electrifying for less than one minute under the condition that the heat dissipation of a hot end is good and a cold end is in no load; the reverse use of the semiconductor refrigeration piece is temperature difference power generation, the semiconductor refrigeration piece is generally suitable for power generation in medium and low temperature regions, and the problem of damaging a computer is solved; meanwhile, the heat dissipation units arranged on the two sides of the shell are heat dissipation units with fin structures, the fin structures increase the contact area with air, and the heat dissipation efficiency is improved.

2. Be equipped with high cold aluminum sheet of leading through the inside of casing, high cold aluminum sheet of leading divide into first inner chamber and the second inner chamber that each other does not communicate with the casing, be used for holding supervisory control ware in first inner chamber, supervisory control ware connects on high cold aluminum sheet one side of leading through closely laminating, and be used for holding heat abstractor and radiator fan in the second inner chamber, heat abstractor connects on high cold aluminum sheet opposite side of leading through bolt closely laminating, radiator fan passes through the structure setting of bolt detachable connection on the left side wall, the device is in the maintenance process, only need open first inner chamber can, needn't carry out the dismouting to the second inner chamber, also can not cause the influence to the IP protection level of product.

Drawings

Fig. 1 is the utility model discloses a whole planar structure schematic diagram of supervisory equipment's heat radiation structure.

Fig. 2 is a schematic view of a plane structure of a heat dissipation structure of a monitoring device of the present invention.

Fig. 3 is the utility model relates to a supervisory equipment's heat radiation structure heat dissipation unit planar structure sketch map.

In the figure: 1. a housing; 2. a first lumen; 3. a second lumen; 31. a heat dissipation unit; 4. A heat radiation fan; 5. a motor; 6. a bolt A; 7. a bolt B; 8. a heat sink; 81. A heat conducting aluminum sheet; 82. cooling the fins; 83. a refrigeration chip; 84. a semiconductor refrigeration sheet; 9. a bolt C; 10. a monitoring controller; 11. high conductivity cold aluminum sheet; 12. a first cover plate; 13. and a second cover plate.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

As shown in fig. 1-3, a heat dissipation structure of a monitoring device includes a housing 1 and a heat dissipation device 8, four corners of a second cover plate 13 on the left side of the housing 1 are fixedly connected with bolts a6, four corners of a first cover plate 12 on the right side of the housing 1 are fixedly connected with bolts C9, a high-conduction cold aluminum sheet 11 is disposed inside the housing 1, the high-conduction cold aluminum sheet 11 divides the housing 1 into a first inner cavity 2 and a second inner cavity 3 which are not communicated with each other, the first inner cavity 2 is used for accommodating a monitoring controller 10, the monitoring controller 10 is connected to one side of the high-conduction cold aluminum sheet 11 through close fitting, the second inner cavity 3 is used for accommodating the heat dissipation device 8 and the heat dissipation fan 4, the heat dissipation device 8 is connected to the other side of the high-conduction cold aluminum sheet 11 through close fitting of a bolt B7, the heat dissipation fan 4 is detachably connected to the left side wall through a bolt a, and the power input end of the cooling fan 4 is electrically connected with the power output end of the motor 5.

In this embodiment (as shown in fig. 2), the heat dissipation device 8 includes cooling fins 82, a refrigeration chip 83, a semiconductor refrigeration piece 84 and a heat-conducting aluminum sheet 81, the cooling fins 82 are installed at the top in the heat dissipation device 8, the cooling fins 82 are closely attached to the high-conductivity cooling aluminum sheet 11, the cooling fins 82 are closely attached to the semiconductor refrigeration piece 84 below, the semiconductor refrigeration piece 84 is closely attached to the refrigeration chip 83 below, and the refrigeration chip 83 is closely attached to the heat-conducting aluminum sheet 81 below.

The heat dissipation device 8 used for the equipment is a semiconductor heat radiator which is composed of cooling fins 82, a heat conduction aluminum sheet 81, a semiconductor refrigeration sheet 84 and a refrigeration chip 83, and the semiconductor heat radiator can continuously work without any refrigerant, has no pollution source, no rotating part and no rotary effect, has no sliding part which is a solid piece, has no vibration and noise during work, long service life and easy installation; the semiconductor refrigerating sheet 84 is a current transduction type sheet, high-precision temperature control can be realized through control of input current, remote control, program control and computer control are easily realized through temperature detection and control means, an automatic control system is convenient to form, the use is safe, the thermal inertia of the semiconductor refrigerating sheet 84 is very small, the refrigerating and heating time is fast, and the refrigerating sheet can reach the maximum temperature difference when being electrified for less than one minute under the condition that a hot end has good heat dissipation and a cold end has no load.

In this embodiment (as shown in fig. 3), the heat dissipation units 31 with fin structures are disposed on both side walls of the housing 1 located in the second inner cavity 3.

The heat dissipation units 31 arranged on the two sides of the housing 1 are the heat dissipation units 31 with fin structures, the fin structures increase the contact area with air, and the heat dissipation efficiency is improved.

In this embodiment (as shown in fig. 1 and 2), the heat dissipation device 8, the monitoring controller 10, and the input end of the motor 5 are electrically connected to an external power source.

Wherein, the heat sink 8, the monitoring controller 10 and the input end of the motor 5 are electrically connected with an external power supply to provide stable power.

It should be noted that in operation, the utility model is started by being connected with an external power supply, a high-conductivity cold aluminum sheet 11 is arranged in the shell 1, the high-conductivity cold aluminum sheet 11 divides the shell 1 into a first inner cavity 2 and a second inner cavity 3 which are not communicated with each other, the monitoring controller 10 is accommodated in the first inner cavity 2, the monitoring controller 10 is connected to one side of the high-conductivity cold aluminum sheet 11 by close fitting, the second inner cavity 3 is used for accommodating a heat dissipation device 8 and a heat dissipation fan 4, the heat dissipation device 8 is connected to the other side of the high-conductivity cold aluminum sheet 11 by close fitting through a bolt B7, the heat dissipation fan 4 is detachably connected to the second cover plate 13 through a bolt A6, so as to realize heat dissipation of the monitoring controller 10, the heat dissipation units 31 arranged at two sides of the shell 1 are heat dissipation units 31 with fin structures, the fin structures increase the contact area with air, the heat dissipation efficiency is improved, wherein the semiconductor radiator is composed of cooling fins 82, heat-conducting aluminum sheets 81, semiconductor refrigerating sheets 84 and refrigerating chips 83, the semiconductor radiator does not need any refrigerant, can continuously work, has no pollution source, no rotating part and no rotation effect, has no sliding part, is a solid sheet, has no vibration and noise during work, has long service life and is easy to install; the semiconductor refrigerating sheet 84 is a current transduction type sheet, high-precision temperature control can be realized through control of input current, remote control, program control and computer control are easily realized through temperature detection and control means, an automatic control system is convenient to form, the use is safe, the thermal inertia of the semiconductor refrigerating sheet 84 is very small, the refrigerating and heating time is fast, and the refrigerating sheet can reach the maximum temperature difference when being electrified for less than one minute under the condition that a hot end has good heat dissipation and a cold end has no load.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (4)

1. A monitoring device's heat radiation structure, includes casing (1) and heat abstractor (8), its characterized in that: the utility model discloses a solar energy heat dissipation device, including casing (1), the equal fixedly connected with bolt A (6) in four angles on the left side second apron (13) of casing (1), the equal fixedly connected with bolt C (9) in four angles on the right side first apron (12) of casing (1) the inside of casing (1) is equipped with high cold aluminum sheet (11) of leading, high cold aluminum sheet (11) of leading divide into first inner chamber (2) and the second inner chamber (3) that do not communicate each other with casing (1), first inner chamber (2) are used for holding supervisory control ware (10), supervisory control ware (10) are connected on one side of high cold aluminum sheet (11) of leading through closely laminating, second inner chamber (3) are used for holding heat abstractor (8) and radiator fan (4), heat abstractor (8) are connected on high cold aluminum sheet (11) opposite side through closely laminating through bolt B (7), radiator fan (4) can dismantle through bolt A (6) and connect on the left side wall, and the power input end of the cooling fan (4) is electrically connected with the power output end of the motor (5).

2. The heat dissipation structure of a monitoring device according to claim 1, wherein: heat abstractor (8) are including cooling fin (82), refrigeration chip (83), semiconductor refrigeration piece (84) and heat conduction aluminum sheet (81), cooling fin (82) are installed at heat abstractor (8) interior top, cooling fin (82) closely laminate on high lead cold aluminum sheet (11), closely laminate in cooling fin (82) below is on semiconductor refrigeration piece (84), closely laminate in semiconductor refrigeration piece (84) below is installed on refrigeration chip (83), closely laminate in refrigeration chip (83) below is installed on heat conduction aluminum sheet (81).

3. The heat dissipation structure of a monitoring device according to claim 1, wherein: and heat dissipation units (31) with fin structures are arranged on two side walls of the shell (1) positioned in the second inner cavity (3).

4. The heat dissipation structure of a monitoring device according to claim 1, wherein: the heat dissipation device (8), the monitoring controller (10) and the input end of the motor (5) are electrically connected with an external power supply.

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