CN211045420U

CN211045420U - High-compatibility IGBT module device

Info

Publication number: CN211045420U
Application number: CN201922106225.6U
Authority: CN
Inventors: 金明星
Original assignee: Muling Beiyi Semiconductor Technology Co ltd
Current assignee: Muling Beiyi Semiconductor Technology Co ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2020-07-17
Anticipated expiration: 2029-11-29

Abstract

The utility model discloses a high compatibility IGBT module device, including IGBT, temperature sensor, heat-conducting layer, radiator fan, heat dissipation storehouse, pipeline, admission line, check valve, water-cooling storehouse and refrigeration piece of giving vent to anger, temperature sensor locates on the IGBT module, the heat dissipation storehouse is located under the IGBT module, the water-cooling storehouse is located on the heat dissipation storehouse side, the heat-conducting layer is located between heat dissipation storehouse and the IGBT module, radiator fan locates in the heat dissipation storehouse, pipeline one end of giving vent to anger is located heat dissipation storehouse side lower extreme, and water-cooling storehouse side lower extreme is located to the other end, the check valve is located pipeline and the contact department of water-cooling storehouse side of giving vent to anger, the refrigeration piece is located in the water-cooling storehouse, admission line one end is connected in heat dissipation storehouse side upper end, and water-cooling storehouse side upper end is. The utility model belongs to the power electronics field specifically indicates an utilize high compatibility IGBT module device that forced air cooling water-cooling heat dissipation combines.

Description

High-compatibility IGBT module device

Technical Field

The utility model belongs to the technical field of power electronics, specifically indicate a high compatibility IGBT module device.

Background

The IGBT and the insulated gate bipolar transistor are composite fully-controlled voltage-driven power semiconductor devices composed of BJTs (bipolar transistors) and MOS (insulated gate field effect transistors), and have the advantages of both high input impedance of the MOSFET and low conduction voltage drop of GTR. The GTR saturation voltage is reduced, the current carrying density is high, but the driving current is large; the MOSFET has small driving power, high switching speed, large conduction voltage drop and small current carrying density. The IGBT integrates the advantages of the two devices, the driving power is small, the saturation voltage is reduced, the frequency characteristic is between that of the MOSFET and the power transistor, the IGBT can normally work in a frequency range of dozens of kHz, the IGBT is more and more widely applied in modern power electronic technology, and the IGBT occupies a leading position in high-frequency and medium-power application, but at present, the IGBT still has various problems, such as the fact that the IGBTs of different manufacturers with the same voltage class cannot be completely adapted, the compatibility is not good enough, and the service life of the IGBT is seriously influenced by the heat dissipation problem.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides an utilize high compatibility IGBT module device of forced air cooling water-cooling heat dissipation combination.

In order to realize the above functions, the utility model discloses the technical scheme who takes as follows: the utility model provides a high compatibility IGBT module device, includes IGBT, temperature sensor, heat-conducting layer, radiator fan, heat dissipation storehouse, the pipeline of giving vent to anger, admission line, check valve, water-cooling storehouse and refrigeration piece, temperature sensor locates on the IGBT module, the heat dissipation storehouse is located under the IGBT module, the water-cooling storehouse is located on the heat dissipation storehouse side, the heat-conducting layer is located between heat dissipation storehouse and the IGBT module, radiator fan locates in the heat dissipation storehouse, pipeline one end of giving vent to anger is located heat dissipation storehouse side lower extreme, the pipeline other end of giving vent to anger is located water-cooling storehouse side lower extreme, the check valve is located the pipeline of giving vent to anger and is contacted department with water-cooling storehouse side, the refrigeration piece is located in the water-cooling storehouse, admission line one end is connected in heat dissipation storehouse side upper end, the admission line other end is located water-cooling storehouse side upper end, radiator fan, Support arm and driving motor, the radiator fan pivot is the cavity structure of lower extreme open-ended, total a plurality of on radiator fan pivot side is located along the circumferencial direction to the radiator fan flabellum, the motor storehouse runs through and locates in the radiator fan pivot, driving motor locates in the motor storehouse and under locating the heat-conducting layer, support arm one end is connected in motor storehouse inner wall, the support arm other end is connected in the driving motor axis of rotation.

Furthermore, a heat-conducting silicone grease layer is arranged on one surface of the heat-conducting plate, which is in contact with the IGBT module, so that the thermal contact resistance between the heat-conducting plate and the IGBT module is reduced.

Furthermore, gate driving resistors matched with different manufacturers are arranged on the IGBT module, so that better compatibility is achieved.

The utility model adopts the above structure to gain beneficial effect as follows: the utility model provides a pair of high compatibility IGBT module device easy operation, the mechanism is compact, and reasonable design, be equipped with the gate pole driving resistance that different producers matched on the IGBT module, make the IGBT module have higher compatibility, the repetitive design of avoiding, the cost is saved, the pin way of IGBT module has been widened, through scribbling heat conduction silicone grease on the face of heat-conducting layer and IGBT module contact, the thermal contact resistance has been reduced, the heat conductivity of heat-conducting layer has been increased, the fan blows in the cold water storehouse with the hot-blast that effluvium, through the cold water heat absorption, the circulation heat dissipation, radiating purpose has been reached, the addding of individual term valve, liquid gets into the heat dissipation storehouse in the cold water storehouse has been avoided.

Drawings

Fig. 1 is an overall structural diagram of a high-compatibility IGBT module device according to the present invention;

fig. 2 is the utility model relates to a high compatibility IGBT module device's whole structure chart of back vision.

The air cooling device comprises an IGBT module 1, an IGBT module 2, a temperature sensor 3, a heat conduction layer 4, a cooling fan 5, a cooling bin 6, an air outlet pipeline 7, an air inlet pipeline 8, a one-way valve 9, a water cooling bin 10, a refrigeration block 11, cooling fan blades 12, a cooling fan rotating shaft 13, a motor bin 14, a supporting arm 15 and a driving motor.

Detailed Description

The technical solution of the present invention will be described in further detail with reference to the following embodiments, and the technical features or the connection relations of the present invention, which are not described in detail, are the prior art adopted.

The present invention will be described in further detail with reference to the accompanying drawings.

As shown in FIGS. 1-2, the utility model relates to a high compatibility IGBT module device, which comprises an IGBT module 1, a temperature sensor 2, a heat conduction layer 3, a heat dissipation fan 4, a heat dissipation chamber 5, a gas outlet pipe 6, a gas inlet pipe 7, a check valve 8, a water cooling chamber 9 and a refrigeration block 10, wherein the temperature sensor 2 is arranged on the IGBT module 1, the heat dissipation chamber 5 is arranged under the IGBT module 1, the water cooling chamber 9 is arranged on the side surface of the heat dissipation chamber 5, the heat conduction layer 3 is arranged between the heat dissipation chamber 5 and the IGBT module 1, the heat dissipation fan 4 is arranged in the heat dissipation chamber 5, one end of the gas outlet pipe 6 is arranged at the lower end of the side surface of the heat dissipation chamber 5, the other end of the gas outlet pipe 6 is arranged at the lower end of the side surface of the water cooling chamber 9, the check valve 8 is arranged at the contact position of the side surface of the gas outlet pipe 6 and the

water cooling chamber

9, 9 side upper ends in water-cooling storehouse are located to the admission line 7 other end, radiator fan 4 includes radiator fan blade 11, radiator fan pivot 12, motor storehouse 13, support arm 14 and driving motor 15, the cavity structure of radiator fan 4 pivot for upper and lower end open-ended, radiator fan blade 11 is located total a plurality of on the 12 sides in radiator fan pivot along the circumferencial direction, motor storehouse 13 runs through and locates in radiator fan pivot 12, driving motor 15 locates in the motor storehouse 13 and locates under the heat-conducting

layer

3, 14 one end of support arm is connected in motor storehouse 13 inner wall, support arm 14 is connected in driving motor 15 axis of rotation.

And a heat-conducting silicone grease layer is arranged on one surface of the heat-conducting plate, which is in contact with the IGBT module 1.

And gate driving resistors matched with different manufacturers are arranged on the IGBT module 1.

During the specific use, temperature sensor 2 senses the high temperature, open radiator fan 4 and refrigeration piece 10, refrigeration piece 10 will preset the liquid temperature in water-cooling storehouse 9 and reduce, then radiator fan 4 sends high temperature air into water-cooling storehouse 9 from outlet duct 6, high temperature air gets into from water-cooling storehouse 9 lower extreme, through the heat absorption of cryogenic liquid, the high temperature gas temperature reduces, rethread inlet duct 7 gets into heat dissipation storehouse 5, realize water-cooling and air-cooled combination recycling, be equipped with check valve 8 in outlet duct 6 and water-cooling storehouse 9 contact department, liquid gets into heat dissipation storehouse 5 in cold water 9 storehouse has been avoided.

The present invention and the embodiments thereof have been described above, but the description is not limited thereto, and the embodiment shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should understand that they should not be limited to the embodiments described above, and that they can design the similar structure and embodiments without departing from the spirit of the invention.

Claims

1. A high compatibility IGBT module device which characterized in that: comprises an IGBT, a temperature sensor, a heat conduction layer, a heat radiation fan, a heat radiation bin, a gas outlet pipeline, a gas inlet pipeline, a one-way valve, a water cooling bin and a refrigeration block, wherein the temperature sensor is arranged on an IGBT module, the heat radiation bin is arranged under the IGBT module, the water cooling bin is arranged on the side surface of the heat radiation bin, the heat conduction layer is arranged between the heat radiation bin and the IGBT module, the heat radiation fan is arranged in the heat radiation bin, one end of the gas outlet pipeline is arranged at the lower end of the side surface of the heat radiation bin, the other end of the gas outlet pipeline is arranged at the lower end of the side surface of the water cooling bin, the one-way valve is arranged at the contact part of the gas outlet pipeline and the side surface of the water cooling bin, the refrigeration block is arranged in the water cooling bin, one end of the gas inlet pipeline is connected with the upper end of the side surface of the heat radiation bin, the other end of, radiating fan blade locates total a plurality of on the radiating fan pivot side along the circumferencial direction, the motor storehouse runs through and locates in the radiating fan pivot, driving motor locates in the motor storehouse and under locating the heat-conducting layer, support arm one end is connected in motor storehouse inner wall, the support arm other end is connected in the driving motor axis of rotation.

2. The high-compatibility IGBT module device according to claim 1, characterized in that: and a heat-conducting silicone grease layer is arranged on one surface of the heat-conducting layer, which is in contact with the IGBT module.

3. The high-compatibility IGBT module device according to claim 1, characterized in that: and a gate driving resistor is arranged on the IGBT module.