CN218677132U - Double-sided radiating half-bridge power module - Google Patents
Double-sided radiating half-bridge power module Download PDFInfo
- Publication number
- CN218677132U CN218677132U CN202221787951.4U CN202221787951U CN218677132U CN 218677132 U CN218677132 U CN 218677132U CN 202221787951 U CN202221787951 U CN 202221787951U CN 218677132 U CN218677132 U CN 218677132U
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- Prior art keywords
- heat
- heat dissipation
- shell
- power module
- main part
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 66
- 238000005057 refrigeration Methods 0.000 claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 239000010949 copper Substances 0.000 claims abstract description 37
- 239000004065 semiconductor Substances 0.000 claims abstract description 32
- 239000000919 ceramic Substances 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 claims abstract description 19
- 238000005253 cladding Methods 0.000 claims abstract description 4
- 238000009423 ventilation Methods 0.000 claims description 15
- 239000000110 cooling liquid Substances 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 abstract description 9
- 238000001816 cooling Methods 0.000 abstract description 4
- 239000002826 coolant Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model provides a double-sided radiating half-bridge power module, including module main part, connecting block and cladding at module main part surface and integrated into one piece's plastic envelope shell, a plurality of electrode terminals of top fixedly connected with of plastic envelope shell, the fixed surface of module main part is connected with the solder main part, the solder main part set up in the upper and lower both sides of module main part, the skin weld of solder main part has and is used for the module main part to carry out radiating heat dissipation mechanism. The utility model discloses in, the refrigeration end through the semiconductor refrigeration piece refrigerates, and rethread heat conduction copper billet carries out thermal transmission with superconducting heat pipe to cool down superconducting heat pipe, heat conduction copper billet and copper-clad ceramic substrate fast, finally reach the quick radiating purpose of messenger's heat dissipation shell and module main part, refrigerate through the semiconductor refrigeration piece and the radiating mode that the forced air cooling combined together, improved radiating efficiency, improved power module's life.
Description
Technical Field
The utility model relates to a power module technical field, in particular to double-sided radiating half-bridge power module.
Background
The power module is formed by combining and encapsulating power electronic devices into a module according to a certain function, the application of the power module is more and more extensive along with the development of the society, and the power module has higher density and higher power, so that the situation of overhigh temperature and heating of the module is easy to occur in the working and running process of the power module;
in view of the above circumstances, how to improve the heat dissipation performance of the power module is an important step, and the conventional power module mainly dissipates heat through a heat sink, and has a single heat dissipation mode, a simple heat dissipation mechanism, low heat dissipation efficiency and a long service life of the power module.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a half-bridge power module with double-sided heat dissipation to solve or alleviate the technical problems existing in the prior art, and at least provide a useful choice.
The utility model discloses technical scheme is so realized: a half-bridge power module with double-sided heat dissipation comprises a module main body, a connecting block and a plastic package shell which is coated on the surface of the module main body and is integrally formed, wherein the top of the plastic package shell is fixedly connected with a plurality of electrode terminals, the surface of the module main body is fixedly connected with a solder main body, the solder main body is arranged on the upper side and the lower side of the module main body, and a heat dissipation mechanism for dissipating heat of the module main body is welded on the surface of the solder main body;
the heat dissipation mechanism is arranged on the upper side and the lower side of the solder main body and comprises a heat dissipation shell and a semiconductor refrigeration piece.
Preferably, one side of the surface of the heat dissipation shell is welded with the surface of the solder main body, the heat dissipation mechanism further comprises a copper-clad ceramic substrate, the copper-clad ceramic substrate is arc-shaped, and the copper-clad ceramic substrate is uniformly distributed inside the heat dissipation shell.
Preferably, the surface of the connecting block is provided with ventilation holes, and the ventilation holes are uniformly distributed in the connecting block.
Preferably, the number of the semiconductor refrigeration pieces is two, and the two groups of semiconductor refrigeration pieces are symmetrically arranged on two sides in the heat dissipation shell respectively;
the surfaces of the refrigerating ends of the two groups of semiconductor refrigerating pieces are fixedly connected with heat-conducting copper blocks together, the inner surfaces of the heat-conducting copper blocks are circular, and concave parts convenient for air circulation are formed at the bottoms of the heat-conducting copper blocks.
Preferably, the inner surface of the heat conducting copper block is connected with a superconducting heat pipe in a sliding mode, the superconducting heat pipe is of a hollow structure, a cavity with a circular cross section area is formed inside the superconducting heat pipe, cooling liquid is filled inside the cavity, one end of the superconducting heat pipe is fixedly connected with a motor through a rotating shaft, the surface of the motor is fixedly connected with the inner wall of a heat dissipation shell, a circular sliding groove matched with the superconducting heat pipe is formed in the inner wall of the heat dissipation shell, and the other end of the surface of the superconducting heat pipe is connected with the heat dissipation shell in a sliding mode through the circular sliding groove.
Preferably, one side of the heat dissipation shell is fixedly connected with an air ventilation shell, an air inlet pipe is fixedly connected between the heat dissipation shell and the air ventilation shell, and one end of the air inlet pipe is fixedly connected with a miniature heat dissipation fan;
the other side of the heat dissipation shell is fixedly connected with a miniature air pump through a connecting pipe.
Preferably, a bottom plate is formed at the bottom of the plastic package shell, a threaded hole is formed in the surface of the bottom plate, and an internal thread for connecting a bolt in a threaded manner is formed in the inner wall of the threaded hole.
The embodiment of the utility model provides a owing to adopt above technical scheme, it has following advantage:
1. the utility model discloses in, open the semiconductor refrigeration piece, the refrigeration end through the semiconductor refrigeration piece refrigerates, and open the motor, make it drive superconducting heat pipe and rotate, the refrigeration end pair heat conduction copper billet of semiconductor refrigeration piece refrigerates, the rethread heat conduction copper billet carries out thermal transmission with superconducting heat pipe, through constantly rotating superconducting heat pipe, make thermal transmission more even, fast, and simultaneously, make its inside coolant liquid flow through rotating superconducting heat pipe, so that fast to superconducting heat pipe, heat conduction copper billet and covering copper ceramic substrate cool down, finally reach the quick radiating purpose of messenger's heat dissipation shell and module main part.
2. The utility model discloses in, when using the semiconductor refrigeration piece to carry out the radiating, open miniature aspiration pump and miniature radiator fan, take the inside high-temperature air of heat dissipation shell out through miniature aspiration pump, assist the heat dissipation, through miniature radiator fan, make the outside low-temperature air get into in the heat dissipation shell fast, and carry out the air convection through interior recess and the ventilation hole of heat conduction copper billet bottom, make air and superconducting heat pipe, heat conduction copper billet and copper-clad ceramic substrate carry out continuous contact, thereby carry out thermal exchange, finally further cool down the module main part, through the radiating mode that semiconductor refrigeration piece refrigeration and forced air cooling combined together, the radiating efficiency is improved, the service life of power module is prolonged.
The foregoing summary is provided for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will be readily apparent by reference to the drawings and following detailed description.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments or technical descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the three-dimensional structure of the present invention;
fig. 3 is a schematic perspective view of the module body according to the present invention;
fig. 4 is a schematic diagram of a three-dimensional structure of the module main body of the present invention;
fig. 5 is a schematic view of a partial three-dimensional structure of the heat dissipation shell of the present invention;
fig. 6 is a cross-sectional view of the ventilation housing and the intake pipe of the present invention.
Reference numerals: 1. a module body; 2. a solder body; 3. a heat dissipation housing; 4. a semiconductor refrigeration sheet; 5. a ventilation shell; 6. a micro heat dissipation fan; 7. a micro air pump; 8. a copper-clad ceramic substrate; 9. a superconducting heat pipe; 10. a motor; 11. a heat-conducting copper block; 12. connecting blocks; 13. a vent hole; 14. an air inlet pipe; 15. plastic packaging the shell; 16. a base plate.
Detailed Description
In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1-6, an embodiment of the present invention provides a half-bridge power module with double-sided heat dissipation, which includes a module main body 1, a connecting block 12, and a plastic package housing 15 that is coated on the surface of the module main body 1 and is integrally formed, wherein the top of the plastic package housing 15 is fixedly connected with a plurality of electrode terminals, the surface of the module main body 1 is fixedly connected with a solder main body 2, the solder main body 2 is disposed on the upper and lower sides of the module main body 1, and the surface of the solder main body 2 is welded with a heat dissipation mechanism for dissipating heat of the module main body 1;
the heat dissipation mechanism is arranged on the upper side and the lower side of the solder main body 2 and comprises a heat dissipation shell 3 and a semiconductor refrigeration piece 4;
when this power module begins to use, can produce a large amount of heats, through thermal transmission, these heats can gather in the inside copper-clad ceramic substrate 8 of heat dissipation shell 3, open semiconductor refrigeration piece 4, refrigerate through the refrigeration end of semiconductor refrigeration piece 4, and open motor 10, make it drive superconductive heat pipe 9 and rotate, the refrigeration end of semiconductor refrigeration piece 4 refrigerates heat conduction copper billet 11, the rethread heat conduction copper billet 11 carries out thermal transmission with superconductive heat pipe 9, through constantly rotating superconductive heat pipe 9, make thermal transmission more even, fast, simultaneously, make its inside coolant liquid flow through rotating superconductive heat pipe 9, so that cool down superconductive heat pipe 9 fast, heat conduction copper billet 11 and copper-clad ceramic substrate 8, finally reach the quick radiating purpose of messenger heat dissipation shell 3 and module main part 1.
In this embodiment, specifically: one side of the surface of the radiating shell 3 is welded with the surface of the solder main body 2, the radiating mechanism further comprises a copper-clad ceramic substrate 8, the copper-clad ceramic substrate 8 is arc-shaped, and the copper-clad ceramic substrate 8 is uniformly distributed inside the radiating shell 3;
the surface of the connecting block 12 is provided with vent holes 13, and the vent holes 13 are uniformly distributed in the connecting block 12;
the semiconductor refrigerating pieces 4 are divided into two groups, and the two groups of semiconductor refrigerating pieces 4 are respectively and symmetrically arranged at two sides in the radiating shell 3;
the surfaces of the refrigerating ends of the two groups of semiconductor refrigerating sheets 4 are fixedly connected with a heat-conducting copper block 11 together, the inner surface of the heat-conducting copper block 11 is circular, and an inward concave part convenient for air circulation is formed at the bottom of the heat-conducting copper block 11;
the inner surface of the heat conduction copper block 11 is connected with a superconducting heat pipe 9 in a sliding mode, the superconducting heat pipe 9 is of a hollow structure, a cavity with a circular cross section is formed inside the superconducting heat pipe 9, cooling liquid is filled inside the cavity, one end of the superconducting heat pipe 9 is fixedly connected with a motor 10 through a rotating shaft, the surface of the motor 10 is fixedly connected with the inner wall of the heat dissipation shell 3, a circular sliding groove matched with the superconducting heat pipe 9 is formed in the inner wall of the heat dissipation shell 3, and the other end of the surface of the superconducting heat pipe 9 is connected with the heat dissipation shell 3 in a sliding mode through the circular sliding groove;
open semiconductor refrigeration piece 4, refrigerate through the refrigeration end of semiconductor refrigeration piece 4, and open motor 10, make it drive superconductive heat pipe 9 and rotate, the refrigeration end of semiconductor refrigeration piece 4 refrigerates heat conduction copper billet 11, the thermal transmission is carried out with superconductive heat pipe 9 to rethread heat conduction copper billet 11, through constantly rotating superconductive heat pipe 9, make thermal transmission more even, fast, and simultaneously, make its inside coolant liquid flow through rotating superconductive heat pipe 9, so that fast to superconductive heat pipe 9, heat conduction copper billet 11 and copper cladding ceramic substrate 8 cool down, set up to the arc through covering copper ceramic substrate 8, increase its area of contact with superconductive heat pipe 9 and air, thereby be convenient for thermal transmission.
In this embodiment, specifically: one side of the heat dissipation shell 3 is fixedly connected with a ventilation shell 5, an air inlet pipe 14 is fixedly connected between the heat dissipation shell 3 and the ventilation shell 5, and one end of the air inlet pipe 14 is fixedly connected with a miniature heat dissipation fan 6;
the other side of the heat dissipation shell 3 is fixedly connected with a micro air pump 7 through a connecting pipe;
open miniature aspiration pump 7 and miniature radiator fan 6, take out the inside high-temperature air of heat dissipation shell 3 through miniature aspiration pump 7, assist the heat dissipation, through miniature radiator fan 6, make external low-temperature air get into in heat dissipation shell 3 fast, and carry out the air convection through interior recess and ventilation hole 13 of heat conduction copper billet 11 bottom, make air and superconductive heat pipe 9, heat conduction copper billet 11 and copper-clad ceramic substrate 8 carry out continuous contact, thereby carry out thermal exchange, finally further cool down module main part 1, through the radiating mode that semiconductor refrigeration piece 4 refrigeration and air-cooling combined together, the radiating efficiency is improved, the service life of power module is prolonged.
In this embodiment, specifically: a bottom plate 16 is formed at the bottom of the plastic package shell 15, a threaded hole is formed in the surface of the bottom plate 16, and an internal thread for connecting a bolt in a threaded manner is formed in the inner wall of the threaded hole;
can fix and protect module main part 1 through setting up plastic envelope shell 15, through setting up the screw hole, be convenient for fix this power module, avoid it to take place to remove when using.
The utility model discloses at the during operation: s1, when the power module is used, a large amount of heat can be generated, the heat can be gathered in a copper-clad ceramic substrate 8 inside a heat dissipation shell 3 through heat transfer, a semiconductor refrigeration piece 4 is opened, refrigeration is carried out through a refrigeration end of the semiconductor refrigeration piece 4, a motor 10 is opened to drive a superconducting heat pipe 9 to rotate, the refrigeration end of the semiconductor refrigeration piece 4 refrigerates a heat conduction copper block 11, heat transfer is carried out through the heat conduction copper block 11 and the superconducting heat pipe 9, heat transfer is more uniform and rapid through continuous rotation of the superconducting heat pipe 9, meanwhile, cooling liquid inside the superconducting heat pipe 9 flows through rotation of the superconducting heat pipe 9, so that the superconducting heat pipe 9, the heat conduction copper block 11 and the copper-clad ceramic substrate 8 can be cooled rapidly, and finally the purpose of rapid heat dissipation of the heat dissipation shell 3 and the module main body 1 is achieved.
S2, when using semiconductor refrigeration piece 4 to dispel the heat, open miniature aspiration pump 7 and miniature radiator fan 6, take out the inside high-temperature air of heat dissipation shell 3 through miniature aspiration pump 7, assist the heat dissipation, through miniature radiator fan 6, make the outside low-temperature air get into in the heat dissipation shell 3 fast, and carry out the air convection through interior concave part and ventilation hole 13 of heat conduction copper billet 11 bottom, make air and superconductive heat pipe 9, heat conduction copper billet 11 and copper cladding ceramic substrate 8 constantly contact, thereby carry out thermal exchange, finally further cool down module main part 1, through the heat dissipation mode that semiconductor refrigeration piece 4 refrigeration and air-cooling combined together, the radiating efficiency is improved, the service life of power module is prolonged.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various changes or substitutions within the technical scope of the present invention, which should be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. The utility model provides a two-sided radiating half-bridge power module, includes module main part (1), connecting block (12) and cladding at module main part (1) surface and integrated into one piece's plastic envelope (15), its characterized in that: the top of the plastic package shell (15) is fixedly connected with a plurality of electrode terminals, the surface of the module main body (1) is fixedly connected with a solder main body (2), the solder main body (2) is arranged on the upper side and the lower side of the module main body (1), and a heat dissipation mechanism for dissipating heat of the module main body (1) is welded on the surface of the solder main body (2);
the heat dissipation mechanism is arranged on the upper side and the lower side of the solder main body (2) and comprises a heat dissipation shell (3) and a semiconductor refrigeration piece (4).
2. The double-sided heat-dissipating half-bridge power module of claim 1, wherein: one side of the surface of the heat dissipation shell (3) is welded with the surface of the solder main body (2), and the heat dissipation mechanism further comprises a copper-clad ceramic substrate (8).
3. The double-sided heat-dissipating half-bridge power module of claim 2, wherein: the copper-clad ceramic substrate (8) is arc-shaped, and the copper-clad ceramic substrate (8) is uniformly distributed inside the heat dissipation shell (3).
4. The double-sided heat dissipating half-bridge power module of claim 1, wherein: ventilation hole (13) have been seted up on the surface of connecting block (12), ventilation hole (13) evenly distributed is in the inside of connecting block (12).
5. The double-sided heat-dissipating half-bridge power module of claim 1, wherein: the semiconductor refrigerating pieces (4) are divided into two groups, and the two groups of semiconductor refrigerating pieces (4) are respectively and symmetrically arranged on two sides inside the heat dissipation shell (3);
the surface of the refrigerating end of the two groups of semiconductor refrigerating pieces (4) is fixedly connected with a heat-conducting copper block (11) together, the inner surface of the heat-conducting copper block (11) is circular, and an inward concave part convenient for air circulation is formed at the bottom of the heat-conducting copper block (11).
6. The double-sided heat-dissipating half-bridge power module according to claim 5, wherein: the inner surface of the heat conduction copper block (11) is connected with a superconducting heat pipe (9) in a sliding mode, the superconducting heat pipe (9) is of a hollow structure, a cavity with a circular cross section is formed inside the superconducting heat pipe (9), and cooling liquid is filled inside the cavity.
7. The double-sided heat-dissipating half-bridge power module of claim 6, wherein: the one end of superconductive heat pipe (9) is through pivot fixedly connected with motor (10), the surface of motor (10) with heat dissipation shell (3) inner wall looks fixed connection, the cooperation has been seted up to heat dissipation shell (3) inner wall the circular spout of superconductive heat pipe (9), the other end on superconductive heat pipe (9) surface pass through circular spout with heat dissipation shell (3) looks sliding connection.
8. The double-sided heat-dissipating half-bridge power module of claim 7, wherein: one side of the heat dissipation shell (3) is fixedly connected with a ventilation shell (5), an air inlet pipe (14) is fixedly connected between the heat dissipation shell (3) and the ventilation shell (5), and one end of the air inlet pipe (14) is fixedly connected with a miniature heat dissipation fan (6);
the other side of the heat dissipation shell (3) is fixedly connected with a miniature air pump (7) through a connecting pipe.
9. The double-sided heat dissipating half-bridge power module of claim 1, wherein: a bottom plate (16) is formed at the bottom of the plastic package shell (15), a threaded hole is formed in the surface of the bottom plate (16), and an internal thread for connecting a bolt in a threaded manner is formed in the inner wall of the threaded hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221787951.4U CN218677132U (en) | 2022-07-12 | 2022-07-12 | Double-sided radiating half-bridge power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221787951.4U CN218677132U (en) | 2022-07-12 | 2022-07-12 | Double-sided radiating half-bridge power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218677132U true CN218677132U (en) | 2023-03-21 |
Family
ID=85553684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221787951.4U Expired - Fee Related CN218677132U (en) | 2022-07-12 | 2022-07-12 | Double-sided radiating half-bridge power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218677132U (en) |
-
2022
- 2022-07-12 CN CN202221787951.4U patent/CN218677132U/en not_active Expired - Fee Related
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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Granted publication date: 20230321 |