CN214155157U - Cooling device for electronic component packaging - Google Patents
Cooling device for electronic component packaging Download PDFInfo
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- CN214155157U CN214155157U CN202022231819.2U CN202022231819U CN214155157U CN 214155157 U CN214155157 U CN 214155157U CN 202022231819 U CN202022231819 U CN 202022231819U CN 214155157 U CN214155157 U CN 214155157U
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- heat dissipation
- cooling device
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Abstract
The utility model discloses a cooling device of electronic components encapsulation, including cooling device body, heat dissipation mechanism and cooling body, the cooling device body is one end open-ended cavity setting, the open end of cooling device body is equipped with the fixed block, the open end both sides of cooling device body are located to the fixed block symmetry, cooling device body middle part is equipped with the backup pad, the backup pad middle part is equipped with the heat dissipation through-hole, one side of backup pad is equipped with the cooling chamber, this internal one side that is close to the open end of cooling device is located to the cooling chamber, the cooling chamber is one end open-ended cavity setting, the opposite side of backup pad is equipped with the heat dissipation chamber. The utility model belongs to the technical field of cooling device, specifically provide a cooling device and electronic components encapsulation joint are convenient, and the heat-conducting plate is convenient for electronic components encapsulation heat conduction, and the heat dissipation fin is convenient for dispel the heat capacity, the cooling device of the electronic components encapsulation of the multiple cooling that forced air cooling and water-cooling combined together.
Description
Technical Field
The utility model belongs to the technical field of cooling device, specifically indicate a cooling device of electronic components encapsulation.
Background
Electronic components is electronic component and miniature machine of electricity, the component of instrument, it often comprises a plurality of parts itself, electronic components encapsulation is used for saving electronic components's usefulness, present electronic components encapsulation is mostly closed shell structure, electronic component can produce some heats when the operation, in case electronic components takes place to damage because of overheating and need maintain, just need carry out the tweezers through appurtenance and get, however electronic components welds the precision, will have the tweezers and get inconvenient problem when the tweezers get, the damage of an electronic components's overheating very has the damage maintenance operation that can need carry out large tracts of land, make the work degree of difficulty greatly increased. Therefore, how to timely cool down the electronic component package is an urgent problem to be solved, and is more important especially in high-temperature occasions such as power plants, heating furnaces and the like. The cooling device for packaging the electronic components at present has a limited cooling range; the cooling effect is also not good; the installation and use are inconvenient, so a novel cooling device for packaging the electronic components is urgently needed to solve the problems.
SUMMERY OF THE UTILITY MODEL
In order to solve the existing problem, the utility model provides a cooling device is convenient with electronic components encapsulation joint, and the heat-conducting plate is convenient for electronic components encapsulation heat conduction, and the heat dissipation fin is convenient for dispel the heat capacity, the cooling device of the electronic components encapsulation of the multiple cooling that forced air cooling and water-cooling combined together.
The utility model adopts the following technical scheme: the utility model relates to a cooling device of electronic components encapsulation, including cooling device body, heat dissipation mechanism and cooling body, the cooling device body is one end open-ended cavity setting, the open end of cooling device body is equipped with the fixed block, the open end both sides of cooling device body are located to the fixed block symmetry, cooling device body middle part is equipped with the backup pad, the backup pad middle part is equipped with the heat dissipation through-hole, one side of backup pad is equipped with the cooling chamber, this internal one side that is close to the open end of cooling device is located to the cooling chamber, the cooling chamber is one end open-ended cavity setting, the opposite side of backup pad is equipped with the heat dissipation chamber, the cooling device is located to the heat dissipation chamber originally internally, the heat dissipation chamber is cavity setting, cooling chamber and heat dissipation intracavity are located to heat dissipation mechanism, heat dissipation mechanism includes heat-conducting plate, Hold spring, radiator fin and radiator fan tightly, the heat-conducting plate is located backup pad one side, the heat-conducting plate is located the radiating cavity, hold the spring tightly and locate between backup pad and the heat-conducting plate, the radiator fin link up and locates in the radiating through-hole, the radiator fin locates in the radiating cavity, the radiator fin links to each other with the heat-conducting plate, the radiator fan locates the radiating cavity inside wall, the radiator fan locates radiator fin one side, hold the spring tightly and make the heat-conducting plate and electronic components encapsulation in close contact with, the heat on the electronic components encapsulation is transmitted to the heat-conducting plate, the heat-conducting plate transmits the heat to the radiator fin, the radiator fan starts to accelerate the air flow around the radiator fin, reach the effect of cooling and heat dissipation, the cooling body is located in the cooling device body, the cooling body includes cooling water tank, condenser tube and cooling fan, the cooling water tank locates cooling device body one side, the cooling water pipe is located that cooling device is originally internal, cooling water pipe links to each other with coolant tank, heat dissipation through-hole lateral wall is located to cooling water pipe, cooling water pipe locates the heat dissipation fin lateral wall, cooling fan symmetry locates cooling device body inside wall, and coolant tank passes through the cooling water pipe circulation with refrigerated low temperature water, and cooling water pipe and heat dissipation fin contact transmit the heat-conducting plate through the heat dissipation fin with the temperature of cooling water, transmit the encapsulation for electronic components by the heat-conducting plate again to this reaches the water-cooling to electronic components encapsulation, and cooling fan starts direct effectual to electronic components encapsulation air-cooled cooling.
Further, the side wall of the cooling device body is provided with the filter screen, the filter screen is symmetrically arranged at two ends of the fixing block, the filter screen is convenient for ventilation inside the cooling device body, and external impurities are convenient to filter.
Further, cooling water tank's lateral wall is equipped with the water filling port, and the water filling port is convenient for add clean water toward cooling water tank in, conveniently to electronic components encapsulation water-cooling.
Further, the heat-conducting plate is provided with a temperature sensor, and the temperature sensor is convenient for measuring the temperature of the packaging surface of the electronic component contacted with the heat-conducting plate.
Further, a controller is arranged in the cooling device body, and the controller is electrically connected with the temperature sensor, the cooling fan and the cooling water tank respectively.
Furthermore, the heat conducting plate, the radiating fins and the cooling water pipe are made of metal aluminum materials, and the aluminum product has good heat conducting performance and low price.
Adopt above-mentioned structure the utility model discloses the beneficial effect who gains as follows: this scheme electronic components encapsulation's cooling device holds spring tightly and makes heat-conducting plate and electronic components encapsulation in close contact with, heat transfer on the electronic components encapsulation is to the heat-conducting plate, the heat-conducting plate is with heat transfer to the heat dissipation fin on, radiator fan starts the air flow of accelerating around the heat dissipation fin, reach the radiating effect of cooling down, coolant tank passes through condenser tube circulation with refrigerated low temperature water, condenser tube and heat dissipation fin contact, transmit the heat-conducting plate with the temperature of cooling water through the heat dissipation fin, transmit the electronic components encapsulation by the heat-conducting plate again, reach the water-cooling to the electronic components encapsulation with this, radiator fan starts direct effectual air-cooled cooling to the electronic components encapsulation.
Drawings
Fig. 1 is a schematic side view of a cooling device for electronic component packaging according to the present invention;
fig. 2 is a schematic view of a front view structure of a cooling device for electronic component packaging according to the present invention.
The cooling device comprises a cooling device body 1, a cooling device body 2, a heat dissipation mechanism 3, a cooling mechanism 4, a fixing block 5, a supporting plate 6, a heat dissipation through hole 7, a cooling cavity 8, a heat dissipation cavity 9, a heat conduction plate 10, a holding spring 11, a heat dissipation fin 12, a heat dissipation fan 13, a cooling water tank 14, a cooling water pipe 15, a cooling fan 16, a filter screen 17, a water filling port 18, a temperature sensor 19 and a controller.
Detailed Description
The technical solution of the present invention will be described in further detail with reference to specific embodiments, and all the parts of the present invention not described in detail in the technical features or the connection relation are the prior art.
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in figures 1 and 2, the cooling device for packaging electronic components of the present invention comprises a cooling device body 1, a heat dissipation mechanism 2 and a cooling mechanism 3, wherein the cooling device body 1 is a hollow cavity with an open end, the open end of the cooling device body 1 is provided with a fixing block 4, the fixing block 4 is symmetrically arranged at two sides of the open end of the cooling device body 1, the middle part of the cooling device body 1 is provided with a supporting plate 5, the middle part of the supporting plate 5 is provided with a heat dissipation through hole 6, one side of the supporting plate 5 is provided with a cooling cavity 7, the cooling cavity 7 is arranged at one side close to the open end in the cooling device body 1, the cooling cavity 7 is a hollow cavity with an open end, the other side of the supporting plate 5 is provided with a heat dissipation cavity 8, the heat dissipation cavity 8 is arranged in the cooling device body 1, and the heat dissipation cavity 8 is a hollow cavity, the heat dissipation mechanism 2 is arranged in the cooling cavity 7 and the heat dissipation cavity 8, the heat dissipation mechanism 2 comprises a heat conduction plate 9, a holding spring 10, a heat dissipation fin 11 and a heat dissipation fan 12, the heat conduction plate 9 is arranged on one side of the support plate 5, the heat conduction plate 9 is arranged in the heat dissipation cavity 8, the holding spring 10 is arranged between the heat conduction plate 9 and the support plate 5, the heat dissipation fin 11 is arranged in the heat dissipation through hole 6 in a penetrating way, the heat dissipation fin 11 is arranged in the heat dissipation cavity 8, the heat dissipation fin 11 is connected with the heat conduction plate 9, the heat dissipation fan 12 is arranged on the inner side wall of the heat dissipation cavity 8, the heat dissipation fan 12 is arranged on one side of the heat dissipation fin 11, the cooling mechanism 3 is arranged in the cooling device body 1, the cooling mechanism 3 comprises a cooling water tank 13, a cooling water pipe 14 and a cooling fan 15, the cooling water tank 13 is arranged on one side of the cooling device body 1, the cooling water pipe 14 is arranged in the cooling device body 1, the cooling water pipe 14 is connected with the cooling water tank 13, the cooling water pipe 14 is arranged on the side wall of the heat dissipation through hole 6, the cooling water pipe 14 is arranged on the side wall of the heat dissipation fin 11, and the cooling fans 15 are symmetrically arranged on the inner side wall of the cooling device body 1.
Wherein, 1 lateral wall of cooling device body is equipped with filter screen 16, 4 both ends of fixed block are located to the filter screen 16 symmetry, cooling water tank 13's lateral wall is equipped with water filling port 17, heat-conducting plate 9 is equipped with temperature sensor 18, this internal controller 19 that is equipped with of cooling device, controller 19 links to each other with temperature sensor 18, radiator fan 12, cooling fan 15, cooling water tank 13 electrical property respectively, heat-conducting plate 9, radiator fin 11 and condenser tube 14 adopt the metal aluminium material to make.
When the cooling device is used, the cooling device body 1 is fixed on a welding plate of an electronic component package to be cooled through the fixing block 4, the heat conducting plate 9 is tightly contacted with the electronic component package by the spring 10, clean water is added into the cooling water tank 13 through the water filling port 17, the cooling device is started, the controller 19 controls the temperature sensor 18 to measure the temperature of the electronic component package surface contacted with the heat conducting plate 9 in real time, when the temperature sensor 18 detects that the temperature of the electronic component package surface is higher than the lowest value of a set temperature range, the controller 19 controls the cooling fan 12 to be started, the heat on the electronic component package is transmitted to the cooling fins 11 through the heat conducting plate 9, the cooling fan 12 is started to accelerate the air flow around the cooling fins 11, the effect of cooling and heat dissipation is achieved, when the temperature sensor 18 detects that the temperature of the electronic component package surface is higher than the set highest value, the controller 19 controls the cooling water tank 13 to start, the cooling water tank 13 starts to cool clean water in the cooling water tank 13, then the cooling water circulates through the cooling water pipe 14, the cooling water pipe 14 is in contact with the radiating fins 11, the temperature of the cooling water is transmitted to the heat conducting plate 9 through the radiating fins 11, and then the temperature of the cooling water is transmitted to the electronic component package through the heat conducting plate 9, so that the water-cooling of the electronic component package is achieved, meanwhile, the controller 19 controls the cooling fan 15 to start, the cooling fan 15 directly and effectively carries out air-cooling on the electronic component package, and when the temperature sensor 18 detects that the surface temperature of the electronic component package is lower than a set maximum value, the controller 19 controls the cooling water tank 13 and the cooling fan 15 to stop working.
The present invention and the embodiments thereof have been described above, but the description is not limited thereto, and the embodiment shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should understand that they should not be limited to the embodiments described above, and that they can design the similar structure and embodiments without departing from the spirit of the invention.
Claims (7)
1. A cooling device for electronic component packaging is characterized in that: the cooling device comprises a cooling device body, a heat dissipation mechanism and a cooling mechanism, wherein the cooling device body is a hollow cavity with an opening at one end, the opening end of the cooling device body is provided with fixed blocks, the fixed blocks are symmetrically arranged at two sides of the opening end of the cooling device body, the middle part of the cooling device body is provided with a supporting plate, the middle part of the supporting plate is provided with a heat dissipation through hole, one side of the supporting plate is provided with a cooling cavity, the cooling cavity is arranged at one side close to the opening end in the cooling device body, the cooling cavity is a hollow cavity with an opening at one end, the other side of the supporting plate is provided with a heat dissipation cavity, the heat dissipation cavity is arranged in the cooling device body, the heat dissipation mechanism is arranged in the cooling cavity and the heat dissipation cavity and comprises a heat conduction plate, a clasping spring, a heat dissipation fin and a heat dissipation fan, the heat conduction plate is arranged at one side of the supporting plate, the heat-dissipating intracavity is located to the heat-conducting plate, hold the spring tightly and locate between heat-conducting plate and the backup pad, the heat dissipation fin link up and locates in the heat dissipation through-hole, the heat dissipation intracavity is located to the heat dissipation fin, the heat dissipation fin links to each other with the heat-conducting plate, radiator fan locates heat dissipation intracavity lateral wall, radiator fan locates heat dissipation fin one side, cooling body locates this internally to cool off the mechanism, cooling body includes coolant tank, condenser tube and cooling fan, coolant tank locates cooling device body one side, it is originally internal that coolant tube locates the cooling device, condenser tube links to each other with coolant tank, the heat dissipation through-hole lateral wall is located to condenser tube, condenser tube locates the heat dissipation fin lateral wall, the cooling fan symmetry locates the cooling device body inside wall.
2. A cooling apparatus for an electronic component package according to claim 1, wherein: the cooling device body lateral wall is equipped with the filter screen, the filter screen symmetry is located the fixed block both ends.
3. A cooling apparatus for an electronic component package according to claim 1, wherein: and a water filling port is formed in the side wall of the cooling water tank.
4. A cooling apparatus for an electronic component package according to claim 1, wherein: the heat-conducting plate is provided with a temperature sensor.
5. A cooling apparatus for an electronic component package according to claim 1, wherein: the cooling device body is internally provided with a controller.
6. A cooling apparatus for an electronic component package according to claim 5, wherein: the controller is respectively electrically connected with the temperature sensor, the cooling fan and the cooling water tank.
7. A cooling apparatus for an electronic component package according to claim 1, wherein: the heat conducting plate, the radiating fins and the cooling water pipe are made of metal aluminum materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022231819.2U CN214155157U (en) | 2020-10-09 | 2020-10-09 | Cooling device for electronic component packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022231819.2U CN214155157U (en) | 2020-10-09 | 2020-10-09 | Cooling device for electronic component packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214155157U true CN214155157U (en) | 2021-09-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022231819.2U Active CN214155157U (en) | 2020-10-09 | 2020-10-09 | Cooling device for electronic component packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214155157U (en) |
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2020
- 2020-10-09 CN CN202022231819.2U patent/CN214155157U/en active Active
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