CN104180576B - Cryogenic semiconductor refrigerator and the method providing linear voltage for its cooling piece - Google Patents
Cryogenic semiconductor refrigerator and the method providing linear voltage for its cooling piece Download PDFInfo
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- CN104180576B CN104180576B CN201410444396.9A CN201410444396A CN104180576B CN 104180576 B CN104180576 B CN 104180576B CN 201410444396 A CN201410444396 A CN 201410444396A CN 104180576 B CN104180576 B CN 104180576B
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- chilling plate
- semiconductor chilling
- refrigerator
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Abstract
The invention discloses a kind of cryogenic semiconductor refrigerator and the method providing linear voltage for its cooling piece, it includes refrigerator main body, described refrigerator main body is by shell, inner bag, door, framework forms, also include temperature control assembly, radiating subassembly, heat-insulation layer and semiconductor chilling plate composition, described temperature control assembly is mainly by pressure regulation DC/DC power supply, remote measurement working state monitoring unit, display and input control unit, signals collecting and DSP microprocessor composition, temperature control assembly provides 4V～12V linear work voltage for partly leading cooling piece, the cold end of described semiconductor chilling plate is joined directly together with inner bag, the hot junction of semiconductor chilling plate contacts with the hot junction of described radiating subassembly, described heat-insulation layer is made up of polyurethane foam and vacuum insulation panel.Compared with prior art, the present invention uses linear voltage regulation mode to be driven semiconductor chilling plate, improves refrigerator heat-insulating property, has possessed the functions such as startup self-detection, temperature setting and display, fault alarm and parameter remote measurement.
Description
Technical field
The present invention relates to a kind of refrigeration storage device, particularly relate to a kind of cryogenic semiconductor refrigerator and for its
Cooling piece provides the method for linear voltage.
Background technology
Semiconductor freezer seen in actual life is mainly as car refrigerator at present, or travlling refrigerator,
Wine cabinets etc., its temperature control scope, typically at 0 DEG C～15 DEG C, is used for carrying out beverage, food etc. the cold preservation of short time.
Semiconductor freezer is mainly made up of parts such as refrigerator body, cooling piece, blower fan and heat abstractors, and it is excellent
Point is that volume is little, life-span length, friction, shock resistance, the temperature difference is adjustable, also can heat, do not use cold-producing medium
Deng, it is the refrigeration plant of a kind of real environmental protection.But its shortcoming be refrigeration, radiating efficiency relatively low, insulation
Poor performance, is not suitable for requiring higher to refrigeration, particularly requires storage temperature below zero degrees celsius
Occasion.
Samsung Electronics's CN03277508.3 patent discloses a kind of semiconductor freezer,
This invention is mainly provided with apopore at refrigerator main body, and the exit of this apopore is provided with drip tray,
Being provided with heating element heater on drip tray, heating element heater is connected with computer heating control loop, at needs evaporative condenser
Heating circuit is connected during water.Hefei Media Rongshida Refrigerator Co., Ltd.'s CN20120305650.8 patent
Disclosing semiconductor freezer drive circuit, temperature control equipment and refrigerator, this invention relates to quasiconductor system
Cold piece driving circuit, this drive circuit has the double-direction control function to input cooling piece bipolar current, thus
This cooling piece is made to have heating and refrigerating function.But above-mentioned two inventions are primarily present problems with:
(1) do not possesses power-on self-test function, as product bug reason can not be accurately positioned failure cause；
(2) refrigerating efficiency, heat-insulating property are the highest, it is impossible to provide less than 0 DEG C low temperature storage environment, and refrigeration
Temperature is non-adjustable.
(3) can not be to essential electrical component operation monitoring state in refrigerator, such as cooling piece, the work of blower fan
Make the parameter such as voltage and electric current.
Summary of the invention
The purpose of the present invention is that offer one solves the problems referred to above, improves semiconductor freezer refrigerating efficiency
And heat-insulating property, possess power-on self-test, key parameter monitoring, the continuously adjustable cryogenic semiconductor of cavity temperature
Refrigerator and the method providing linear voltage for its cooling piece.
To achieve these goals, the technical solution used in the present invention is: a kind of cryogenic semiconductor refrigerator,
It includes that refrigerator main body, described refrigerator main body are made up of shell, inner bag, door, framework, also includes temperature control group
Part, radiating subassembly, heat-insulation layer and semiconductor chilling plate composition, described temperature control assembly is mainly by pressure regulation DC/DC
Power supply, remote measurement working state monitoring unit, show and input control unit, signals collecting and the micro-process of DSP
Device form, pressure regulation DC/DC power supply, remote measurement working state monitoring unit, show with input control unit, letter
Number gather and DSP microprocessor between electrically connect, temperature control assembly for partly lead cooling piece provide 4V～12V linear
Running voltage, the cold end of described semiconductor chilling plate is joined directly together with inner bag, the hot junction of semiconductor chilling plate with
The hot junction contact of described radiating subassembly, described heat-insulation layer is made up of polyurethane foam and vacuum insulation panel.
As preferably, described radiating subassembly is made up of heat pipe, radiating fin and blower fan, and described blower fan is positioned at scattered
The cold end of hot assembly, radiating fin is fixing with heat pipe to be connected.
As preferably, described heat-insulation layer is between shell and inner bag.
As preferably, described vacuum thermal insulation board heat conductivity coefficient is 0.005-0.01W/m K.
As preferably, the contact surface in the hot junction of semiconductor chilling plate with the hot junction of described radiating subassembly is smeared and is led
Hot silicone grease layer.
A kind of method that cryogenic semiconductor refrigerator provides linear voltage for its cooling piece, described quasiconductor system
Cold high efficiency drive linear voltage is to use DSP microprocessor to go out according to temperature control algorithm real-time resolving partly to lead
Running voltage needed for body cooling piece, and combine pressure regulation DC/DC output characteristic of power source and calculate DC/DC power supply institute
Linear quadratic control input voltage, described linear quadratic control input voltage is needed to be passed to by drive circuit in a digital manner
DA output module, DA output module passes to pressure-adjustable DC/DC mould after converting digital signals into voltage signal
The linear quadratic control input of block, pressure regulation DC/DC exports semiconductor chilling plate by scheduled voltage, thus realizes
Semiconductor chilling plate high efficiency drive.
Compared with prior art, it is an advantage of the current invention that:
(1) use linear voltage regulation mode that semiconductor chilling plate is driven, higher than traditional control method efficiency；
(2) use rigid polyurethane foams and vacuum insulation panel assembly insulation construction, substantially increase refrigerator and protect
Warm nature energy；
(3) the temperature control assembly with DSP as core processor so that refrigerator has possessed startup self-detection, temperature sets
The functions such as fixed and display, fault alarm and parameter remote measurement.
Accompanying drawing explanation
Fig. 1 is present configuration schematic diagram；
Fig. 2 is heat insulation layer structure schematic diagram of the present invention
Fig. 3 is semiconductor chilling plate linear voltage regulation control mode block diagram of the present invention
Fig. 4 is refrigerating capacity test result of the present invention.
In figure: 1. temperature control assembly；2. refrigerator main body；3. semiconductor chilling plate；4. heat-insulation layer；5. heat radiation group
Part；6. shell；7. vacuum insulation panel；8. inner bag；9. polyurethane foam.
Detailed description of the invention
The invention will be further described below.
Embodiment: see Fig. 1, Fig. 2, Fig. 3, a kind of cryogenic semiconductor refrigerator and carrying for its cooling piece
For the method for linear voltage, it includes refrigerator main body 2, described refrigerator main body 2 by shell 6, inner bag 8, door,
Framework forms, and also includes that temperature control assembly 1, radiating subassembly 5, heat-insulation layer 4 and semiconductor chilling plate 3 form,
The cold end of described semiconductor chilling plate 3 is joined directly together with inner bag 8, and the hot junction of semiconductor chilling plate 3 is with described
The hot junction contact of radiating subassembly 5, described radiating subassembly 5 is made up of heat pipe, radiating fin and blower fan, heat radiation
Fin is fixing with heat pipe to be connected, and the cold end of radiating subassembly 5 carries out forced convection heat radiation equipped with blower fan, at quasiconductor
The contact surface in the hot junction of the hot junction of cooling piece 3 and described radiating subassembly 5 smears thermal conductive silicon lipid layer, described insulation
Layer 4 is made up of polyurethane foam 9 layers and vacuum insulation panel 7, and described heat-insulation layer 4 is positioned at shell 6 and inner bag 8
Between, described vacuum insulation panel 7 heat conductivity is 0.005-0.01W/m K, as preferred the present embodiment
The heat conductivity 0.008W/m K of vacuum insulation panel 7.
Described heat-insulation layer 4 is made up of polyurethane foam 9 layers and vacuum insulation panel 7, and described heat-insulation layer 4 changes
The conventional vacuum form that is only thermally shielded with foam, selects polyurethane foam 9 and vacuum insulation panel 7 to combine,
First vacuum insulation panel 7 is fixed in the structure of refrigerator with bonding way, rear employing pressure expansion mode,
Making foam form one after solidifying with vacuum insulation panel 7, this heat preserving mode substantially increases the heat insulating ability of refrigerator
Energy.
Described temperature control assembly 1 mainly by pressure regulation DC/DC power supply, remote measurement working state monitoring unit, display with
Input control unit, signals collecting and DSP microprocessor composition, pressure regulation DC/DC power supply, remote measurement work shape
State monitoring means, show and input control unit, electrically connect between signals collecting and DSP microprocessor.
Temperature control assembly 1 provides 4V～12V linear work voltage for partly leading cooling piece.Described temperature control assembly 1 leads to
Excess temperature sensor obtains interior cavity temperature, calculates observed temperature and design temperature difference, according to self learning type people
Work intelligent fuzzy control technique algorithm calculates the control parameter that semiconductor chilling plate 3 works required, described control
Temperature algorithm is in temperature control by specialist system, artificial intelligence application, based on the more each control of temperature deviation amount
Temperature variation characteristic provide corresponding controlled quentity controlled variable before and after cycle processed, uses dsp processor to control to calculate according to temperature
Method real-time resolving goes out running voltage needed for semiconductor chilling plate 3, and combines pressure regulation DC/DC output characteristic of power source
Calculating linear quadratic control input voltage needed for DC/DC power supply, described pressure regulation DC/DC power supply can pass through two secondary controls
End processed input 0.4V～1.2V control signal, this pressure regulation DC/DC power supply the most exportable 4.0V～12.0V refrigeration is flat
Required supply voltage, described linear quadratic control input voltage passes to DA by drive circuit in a digital manner and exports
Module, DA output module passes to the two of pressure-adjustable DC/DC module after converting digital signals into voltage signal
Secondary control inputs, and pressure regulation DC/DC exports semiconductor chilling plate 3 by scheduled voltage so that semiconductor refrigerating
Sheet 3 is in efficient duty, thus realizes-20 DEG C～4 DEG C of continuously adjustable temperature controls.Bright refrigerating capacity
Test result is as shown in Figure 4.
Described temperature control assembly 1 the most first carries out DSP microprocessor self-inspection, temperature sensor duty
Detection, blower fan and the functional detection of semiconductor chilling plate 3, and by the display detection of front panel OLED display screen
As a result, described temperature control assembly 1 can monitor blower fan running voltage and electric current, semiconductor chilling plate 3 works electricity
The major parameters such as the temperature in pressure and electric current, intracavity and radiator hot junction.Refrigerator intracavity is made by temperature control assembly 1
Cryogenic temperature continuously adjustabe, can be by self-inspection information, temperature information and fault alarm information and pass through OLED after powering on
Display, can monitor essential electrical component operation state.Temperature control assembly 1 real current refrigerator startup self-detection, temperature
The functions such as degree setting and display, fault alarm, semiconductor chilling plate 3 high efficiency drive and key parameter monitoring.
The present invention is not disclosed technology and belongs to general knowledge as well known to those skilled in the art.
The cryogenic semiconductor refrigerator that invention is provided and the method for its cooling piece offer linear voltage are carried out
Exhaustive presentation, principle and the embodiment of the present invention are set forth by specific case used herein,
The explanation of above example is only intended to help to understand method and the core concept thereof of the present invention；Simultaneously for
One of ordinary skill in the art, according to the thought of the present invention, the most all
Will change, change and improvement to the present invention will be possible, without beyond accessory claim
The spirit and scope of defined, in sum, this specification content should not be construed as limitation of the present invention.
Claims (6)
1. a cryogenic semiconductor refrigerator, it includes refrigerator main body, described refrigerator main body by shell,
Inner bag, door, framework form, it is characterised in that: also include temperature control assembly, radiating subassembly, heat-insulation layer and half
Conductor cooling piece forms, and described temperature control assembly is mainly by pressure regulation DC/DC power supply, remote measurement working state monitoring list
Unit, show with input control unit, signals collecting and DSP microprocessor composition, pressure regulation DC/DC power supply,
Remote measurement working state monitoring unit, show and input between control unit, signals collecting and DSP microprocessor
Electrical connection, temperature control assembly provides 4V～12V linear work voltage, described semiconductor refrigerating for partly leading cooling piece
The cold end of sheet is joined directly together with inner bag, and the hot junction of semiconductor chilling plate contacts with the hot junction of described radiating subassembly,
For being gone out the work electricity needed for semiconductor chilling plate by DSP microprocessor according to temperature control algorithm real-time resolving
Pressure, and it is defeated to combine the linear quadratic control needed for pressure regulation DC/DC output characteristic of power source calculates pressure regulation DC/DC power supply
Enter voltage, as linear voltage, semiconductor chilling plate is driven；Described heat-insulation layer is by polyurethane foam
Form with vacuum insulation panel.
A kind of cryogenic semiconductor refrigerator, it is characterised in that: described scattered
Hot assembly is made up of heat pipe, radiating fin and blower fan, and described blower fan is positioned at the cold end of radiating subassembly, radiating fin
Sheet is fixing with heat pipe to be connected.
A kind of cryogenic semiconductor refrigerator, it is characterised in that: described guarantor
Temperature layer is between shell and inner bag.
A kind of cryogenic semiconductor refrigerator, it is characterised in that: described very
Empty thermal insulation board heat conductivity is 0.005-0.01W/m K.
A kind of cryogenic semiconductor refrigerator, it is characterised in that: partly leading
The contact surface in the hot junction of the hot junction of body cooling piece and described radiating subassembly smears thermal conductive silicon lipid layer.
6. the method that cryogenic semiconductor refrigerator provides linear voltage for semiconductor chilling plate, it is special
Levy and be: semiconductor chilling plate high efficiency drive linear voltage is to use DSP microprocessor to control to calculate according to temperature
Method real-time resolving goes out running voltage needed for semiconductor chilling plate, and combines pressure regulation DC/DC output characteristic of power source solution
Calculating linear quadratic control input voltage needed for pressure regulation DC/DC power supply, described linear quadratic control input voltage is with numeral side
Formula passes to DA output module by drive circuit, and DA output module converts digital signals into voltage signal
After pass to pressure regulation DC/DC power supply linear quadratic control input, pressure regulation DC/DC power supply press scheduled voltage export
To semiconductor chilling plate, thus realize semiconductor chilling plate high efficiency drive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410444396.9A CN104180576B (en) | 2014-09-03 | 2014-09-03 | Cryogenic semiconductor refrigerator and the method providing linear voltage for its cooling piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410444396.9A CN104180576B (en) | 2014-09-03 | 2014-09-03 | Cryogenic semiconductor refrigerator and the method providing linear voltage for its cooling piece |
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| CN104180576A CN104180576A (en) | 2014-12-03 |
| CN104180576B true CN104180576B (en) | 2016-08-17 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104613804B (en) * | 2014-12-15 | 2017-03-01 | 青岛海尔股份有限公司 | Bending pipe fitting and the semiconductor freezer with this bending pipe fitting |
| CN104534772B (en) * | 2015-01-06 | 2017-04-12 | 青岛海尔股份有限公司 | Semiconductor refrigerator |
| CN104654849B (en) * | 2015-02-03 | 2017-04-26 | 青岛海尔股份有限公司 | Heat exchange device and semiconductor cryogenic refrigerator with same |
| CN106300922B (en) * | 2015-06-04 | 2019-08-06 | 国网智能电网研究院 | A kind of high temperature driven protective device |
| DE102017124739B4 (en) * | 2017-10-23 | 2024-03-28 | Binder Gmbh | Method for operating a climate chamber and climate chamber |
| CN110613306B (en) * | 2018-06-20 | 2020-12-22 | 佛山市顺德区美的电热电器制造有限公司 | Cooking equipment and temperature control method and device thereof |
| CN113982877A (en) * | 2021-11-19 | 2022-01-28 | 天津市通洁高压泵制造有限公司 | High-pressure plunger pump for fatigue test of gas cylinder |
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| CN2528044Y (en) * | 2001-12-24 | 2002-12-25 | 苏州三星电子有限公司 | Power supply voltage control circuit for refrigerator by semiconductor refrigeration |
| CN201450457U (en) * | 2009-06-10 | 2010-05-05 | 佛山市南庄广昌电器塑料有限公司 | Bilinear buck-boost switching power supply |
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| CN1945169A (en) * | 2005-10-08 | 2007-04-11 | 深圳市益酷科技有限公司 | Semiconductor circulation heat pipe refrigerator |
| CN100504244C (en) * | 2007-08-28 | 2009-06-24 | 武汉凌云光电科技有限责任公司 | High power compact thermostatic device without liquid cooling |
| CN102155814B (en) * | 2011-01-19 | 2012-08-29 | 顺德职业技术学院 | Variable current semiconductor refrigerator |
| CN202413554U (en) * | 2012-01-19 | 2012-09-05 | 西安科技大学 | Vehicle-mounted semiconductor heat insulated box |
| CN103723379B (en) * | 2014-01-11 | 2015-12-30 | 苏州安特实业有限公司 | Medicines insulation refrigeration case |
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| CN2528044Y (en) * | 2001-12-24 | 2002-12-25 | 苏州三星电子有限公司 | Power supply voltage control circuit for refrigerator by semiconductor refrigeration |
| CN201450457U (en) * | 2009-06-10 | 2010-05-05 | 佛山市南庄广昌电器塑料有限公司 | Bilinear buck-boost switching power supply |
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