CN1945169A - Semiconductor circulation heat pipe refrigerator - Google Patents
Semiconductor circulation heat pipe refrigerator Download PDFInfo
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- CN1945169A CN1945169A CN 200510105913 CN200510105913A CN1945169A CN 1945169 A CN1945169 A CN 1945169A CN 200510105913 CN200510105913 CN 200510105913 CN 200510105913 A CN200510105913 A CN 200510105913A CN 1945169 A CN1945169 A CN 1945169A
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Abstract
The semiconductor circulation heat pipe refrigerator refrigerating with semiconductor thermoelectric device features the circulating heat pipe technology, no any mechanical motion and no noise. Radiating fin and circulating heat pipe radiator are constituted into various types of radiating fin-circulating heat pipe and/or casing-circulating heat pipe temperature difference complex, and the connecting skeleton of the temperature difference complex is assembled to the temperature difference interface of heat insulated container to constitute the main body of semiconductor circulation heat pipe refrigerator. The present invention solves the problems of heat dissipation and heat insulation in semiconductor refrigerating, and obtains high refrigerating performance. The semiconductor circulation heat pipe refrigerator may be used to reach temperature as low as 5deg.C, at the environment temperature of 32deg.C, and may be used widely.
Description
Affiliated technical field
The present invention relates to the utensil that a kind of family expenses or similar family expenses carry out refrigeration by consumed power, especially adopt semiconductor cooler and fin, circulation heat pipe radiator as the design of core low-temperature receiver, called after semiconductor circulation heat pipe refrigerator thus.
Background technology
At present, conventional semiconductor refrigerating box one class is for adopting snakelike heat-pipe radiator of wire grid formula and fin heat pipe radiator, the former area of dissipation is not enough, refrigeratory capacity is little, must be by fan refrigeration in case, the latter must be dispelled the heat by fan outside case, they all have to exist the structure of working medium box or heat-conducting block, have to heat radiation is divided into two processes of afterwards loosing that pass earlier, can not satisfy the heat radiation requirement of semiconductor cooler, remove fan, refrigeration output can not be up to standard, another kind of for adopting the gilled radiator of extrusion molding or shaping by stock removal, its defective can not combine with heat pipe, can not satisfy the required radiating rate of semiconductor cooler, simultaneously at radiator, the semiconductor temperature difference device, heat-conducting block, heat dump interconnects, must form heat insulation structural between radiator and the heat dump, but the conventional semiconductor refrigerating box is exactly so, between radiator and the heat-conducting block, being connected between heat dump and the heat-conducting block, only depend on the thick plastic mattress of 1-2mm heat insulation, certainly lead to a certain degree heat bridge and cold bridge, also influence the performance of conductor refrigeration performance, the result is under 32 ℃ of environment, the ice chest that this two classes radiator is made, the best cooling effect of the temperature inside the box is 15 ℃, only be 17 ℃ with the difference of environment temperature, all can not be referred to as refrigerator, if will be referred to as refrigerator, must reach both at home and abroad relevant refrigerator storage temperature (tm) and be 5 ℃ standard, but no matter above-mentioned which kind of, if will improve refrigeration output all be unable to do without radiator fan or cooling fan, promptly still have the mechanical movement participation, and produce noise thus, the while fan is worked fragile under high temperature or clammy condition, causes refrigeration performance and reliability more and more poor, makes it become short-life low grade products.
Summary of the invention
In order to overcome above-mentioned deficiency, the present invention catches existing semiconductor refrigeration box not reach fundamental problem's problem of practical function on refrigeration performance, a kind of fin that can design according to practical needs is provided, circulation heat pipe radiator, can satisfy the requirement of semiconductor temperature difference electrical part heat radiation fully, solve no any cold and hot bridge construction simultaneously, fundamentally solve the heat radiation and the temperature difference heat-insulating problem that hinder conductor refrigeration performance performance, increase substantially freezing capacity, it no matter is heat radiation or refrigeration all can be removed fan in case outside case, under 32 ℃ of environment, storage temperature in the case (tm) can reach 5 ℃, make the conductor refrigeration ability really reach the standard that is referred to as refrigerator both at home and abroad, simultaneously because no any mechanical movement, also just not wearing and tearing, do not have noise, make semiconductor freezer become the high-grade durable product of a kind of environmental protection and energy saving.
The technical solution adopted for the present invention to solve the technical problems is: a kind of semiconductor circulation heat pipe refrigerator that is made of main body temperature difference complex and heat-insulated container two parts, temperature difference complex part is by radiator, the semiconductor temperature difference device, the heat conduction ware, connecting skeleton constitutes, radiator adopts fin, circulation heat pipe radiator, its heat-sinking capability is that the actual needs according to semiconductor circulation heat pipe refrigerator designs, fin can independently fold or be folded to form continuously all size pattern, when the folding parallel at certain intervals distribution of fin of some independences, promptly one or some heat pipes part volt are in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of fin, complications couple together and near first end by a working medium return duct UNICOM, constitute the sealing circulation line, be after the heat pipe head end is accepted semiconductor temperature difference device heat, the interior working medium of heat pipe is heated rising and is utilized the evaporation pressure handle heat that increases rapidly at first to be delivered among the fin group of radiator than far-end, dispel the heat gradually by fin, the working medium condensation, reduce and be back to end after evaporation is pressed, constitute various fin cycling hot casts thus, or with fin continuously folding beautify into certain pattern and arrange be combined to form best area of dissipation, heat pipe part volt is in the heat pipe passage of fin folded bottom, part heat pipe extension is also pasted row on the shell of tabular of being made by good heat conducting material or fin shape refrigerator, or run in the guide in the assembling circular hole of fin of the some parallel distributions of shell peripheral space, be after the heat pipe head end is accepted semiconductor temperature difference device heat, working medium is heated in the heat pipe, and evaporation pressure handle heat rising and that utilization increases rapidly at first transmits shell or the shell peripheral space has bigger surface area to dispel the heat, the working medium condensation, reduce and be back to end after evaporation is pressed, two parts heat pipe circles the circulating heat pipe structure that connects and composes sealing at the first and last end, constitute various shell cycling hot casts thus, or with various fin cycling hot casts combine with various shell cycling hot casts constitute various in conjunction with the cycling hot cast, the power of circulating heat pipe is exactly to accept the heat that the semiconductor temperature difference device is distributed, can utilize gravity to accelerate circulation rate, first end installation at circulating heat pipe is saved through supercharging by pyrocondensation, makes working medium form unidirectional circulation.The heat conduction ware of composite semiconductor thermoelectric device and cuboid or truncated cone shape on the motherboard of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton and the motherboard of heat insulation window frame shape again, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation temperature difference complex of sealing, is determined the type of temperature difference complex by the type of radiator.The heat-insulated container part is by heat insulation case lid or door, heat insulating box, temperature difference interface constitutes, heat insulation case lid and casing constitute top-opening type, heat insulation chamber door and casing constitute vertical type, generally temperature difference complex is installed at the back side at casing in vertical type, the backboard that is casing is a machine core board, shift out the evaporation airway on machine core board top to the case inboard, shift out the condensation airway in the machine core board bottom to the case inboard, and the condensation airway shifted out to the inside again the power supply airway that holds power board, owing to move in the machine core board of bottom, just can utilize corresponding outstanding position, the interior bottom of casing to form the draining step of row's condensed water, machine core board middle part is moved in not, remain on the casing tool back plane, and form protruding formula temperature difference interface thereon, connection skeleton on the various temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, make the two-part main body that constitutes refrigerator that combines, such structure can make on the one hand that each fin can both touch natural convection air to greatest extent on the radiator of heating status, be beneficial to heat exchange, can form best heat insulation structural on the other hand, in heat insulating box, again heat dump and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, also temperature difference complex can be installed on chamber door, be that chamber door is a machine core board, or temperature difference complexs are installed in other sides of case lid or casing, other side plates that are case lid or casing are machine core board, temperature difference interface is arranged on the machine core board, move in around the temperature difference interface and form the sunken platform that matches with motherboard size thickness, form recessed formula interface, connection skeleton on the various temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, motherboard is embedded in and falls in the platform, makes the two-part main body that constitutes refrigerator that combines.In heat insulating box, again heat dump and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, one case one core also can one case multicore, form fin type thus, can type, the semiconductor circulation heat pipe refrigerator of mating type various types, can be under 32 ℃ of conditions of environment temperature, with rated power energising refrigeration, can reach in the case 5 ℃ storage temperature (tm) rapidly, make semiconductor freezer reach both at home and abroad standard, because stronger refrigeration output is arranged, utilize the linear character of thermoelectric cooling, just can break away from additional power source and mechanical carrier equipment, utilize rechargeable battery insulation self-contained in the battery compartment, temperature difference movement is furnished with common set controller in addition, but General Motors, train, aircraft, power supply on the steamer, owing to can get rid of cold and hot bridge, stress and distortion, simultaneously because no any mechanical movement does not have wearing and tearing, noiseless, make semiconductor circulation heat pipe refrigerator become durable expensive goods, really can be reached for and improve the quality of living and the purpose of extensive use.
The invention has the beneficial effects as follows, because cooling effect is good, noiselessness, environmental protection and energy saving, high-grade reliability and durability, moderate cost can be used at indoor or outdoors, and fixedly use also can be moved use in the vehicles, both can put use and also can hang use, play an important role to improving the quality of living, replace the big absorption refrigerator of power consumption that costs an arm and a leg, all have important function aspect making rational use of resources in environmental protection and energy saving.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
The exploded pictorial that Fig. 1 and Fig. 2 constitute for main body of the present invention.
Fig. 3 is the signal of first embodiment of the invention section.
Fig. 4 is the three-dimensional signal of second embodiment of the invention.
Fig. 5 is the signal of the three-dimensional partly cut-away of third embodiment of the invention.
Fig. 6 is the signal of the three-dimensional partly cut-away of four embodiment of the invention.
Fig. 7 is the signal of fifth embodiment of the invention section.
Fig. 8 is the signal of the three-dimensional partly cut-away of sixth embodiment of the invention.
Among the figure: 1. fin, 2. heat pipe, 3. folded bottom, 4. heat pipe passage, 5. assembling circular hole, 6. return duct, 7. semiconductor temperature difference device, 8. shell, 9. motherboard, 10. heat conduction ware, 11. the connection skeleton, 12. case lids or door, 13. casings, 14. temperature difference interfaces, 15. machine core board, 16. evaporation airways, 17. condensation airways, 18. power supply airways, 19. the draining step, 20. heat dumps, 21. fall into platforms, the 22. undergauge supercharging joints that are heated, 23. drainpipe, 24. battery compartment, 25. are total to set controller, 26. drainpipes.
In Fig. 1 and main body of the present invention shown in Figure 2: the main body of semiconductor circulation heat pipe refrigerator is made of temperature difference complex and heat-insulated container two parts, temperature difference complex part is by radiator, the semiconductor temperature difference device, the heat conduction ware, connecting skeleton constitutes, radiator adopts fin (1), circulating heat pipe (2) radiator, its heat-sinking capability is that the actual needs according to semiconductor circulation heat pipe refrigerator designs, fin can independently fold or be folded to form continuously all size pattern, when the folding parallel at certain intervals distribution of fin of some independences, promptly one or some heat pipes part volt are in the heat pipe passage (4) of fin folded bottom (3), a part runs in the guide in the assembling circular hole (5) of fin, complications couple together and near first end by a working medium return duct (6) UNICOM, constitute the sealing circulation line, be after the heat pipe head end is accepted semiconductor temperature difference device (7) heat, the interior working medium of heat pipe is heated rising and is utilized the evaporation pressure handle heat that increases rapidly at first to be delivered among the fin group of radiator than far-end, dispel the heat gradually by fin, the working medium condensation, reduce and be back to end after evaporation is pressed, constitute various fin cycling hot casts thus, or with fin continuously folding beautify into certain pattern and arrange be combined to form best area of dissipation, heat pipe part volt is in the heat pipe passage of fin folded bottom, part heat pipe extension and walking is attached on the shell (8) of the tabular of being made by good heat conducting material or fin shape refrigerator, or run in the guide in the assembling circular hole (5) of fin (1) of the some parallel distributions of shell peripheral space, be after the heat pipe head end is accepted semiconductor temperature difference device heat, working medium is heated in the heat pipe, and evaporation pressure handle heat rising and that utilization increases rapidly at first transmits shell or the shell peripheral space has bigger surface area to dispel the heat, the working medium condensation, reduce and be back to end after evaporation is pressed, two parts heat pipe circles the circulating heat pipe structure that connects and composes sealing at the first and last end, constitute various shell cycling hot casts thus, or with various fin cycling hot casts combine with various shell cycling hot casts constitute various in conjunction with the cycling hot cast, the power of circulating heat pipe is exactly to accept the heat that the semiconductor temperature difference device is distributed, can utilize gravity to accelerate circulation rate, first end installation at circulating heat pipe is subjected to pyrocondensation through supercharging joint (22), makes working medium form unidirectional circulation.Go up the heat conduction ware (10) of composite semiconductor thermoelectric device and cuboid or truncated cone shape at the motherboard (9) of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton (11) of heat insulation window frame shape again with motherboard, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation temperature difference complex of sealing, is determined the type of temperature difference complex by the type of radiator.The heat-insulated container part is by heat insulation case lid or door (12), heat insulating box (13), temperature difference interface (14) constitutes, heat insulation case lid and casing constitute top-opening type, heat insulation chamber door and casing constitute vertical type, generally temperature difference complex is installed at the back side at casing in vertical type, the backboard that is casing is a machine core board, shift out evaporation airway (16) on machine core board top to the case inboard, shift out condensation airway (17) in the machine core board bottom to the case inboard, and the condensation airway shifted out to the inside again the power supply airway (18) that holds power board, owing to move in the machine core board of bottom, just can utilize corresponding outstanding position, the interior bottom of casing to form the draining step of row's condensed water, machine core board middle part is moved in not, remain on the casing tool back plane, and form protruding formula temperature difference interface thereon, connection skeleton on the various temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, make the two-part main body that constitutes refrigerator that combines, such structure can make on the one hand that each fin can both touch natural convection air to greatest extent on the radiator of heating status, be beneficial to heat exchange, can form best heat insulation structural on the other hand, in heat insulating box, again heat dump and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, also temperature difference complex can be installed on chamber door, be that chamber door is a machine core board, or temperature difference complexs are installed in other sides of case lid or casing, other side plates that are case lid or casing are machine core board, temperature difference interface is arranged on the machine core board, move in around the temperature difference interface and form the sunken platform (21) that matches with motherboard size thickness, form recessed formula interface, connection skeleton on the various temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, motherboard is embedded in and falls in the platform, makes the two-part main body that constitutes refrigerator that combines.Heat dump and heat conduction ware are coupled together in heat insulating box again and just constitute the semiconductor temperature difference movement, one case one core also can one case multicore, forms the semiconductor circulation heat pipe refrigerator of fin type, can type, mating type various types thus.
Figure 3 shows that first embodiment of the invention, fin in the compound body of the temperature difference, circulation heat pipe radiator is a fin cycling hot cast, when the folding parallel at certain intervals distribution of fin (1) of some independences, promptly one or some heat pipes (2) part volt is in the heat pipe passage (4) of fin folded bottom (3), a part runs in the guide in the assembling circular hole (5) of fin, complications couple together and near first end by a working medium return duct (6) UNICOM, constitute the sealing circulation line, be after the heat pipe head end is accepted semiconductor temperature difference device (7) heat, the interior working medium of heat pipe is heated rising and is utilized the evaporation pressure handle heat that increases rapidly at first to be delivered among the fin group of radiator than far-end, dispel the heat gradually by fin, the working medium condensation, reduce and be back to end after evaporation is pressed, constitute fin cycling hot cast thus, go up the heat conduction ware (10) of composite semiconductor thermoelectric device (7) and cuboid or truncated cone shape at the motherboard (9) of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton (11) of heat insulation window frame shape again with motherboard, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation temperature difference complex of sealing, the heat-insulated container part is by heat insulation chamber door (12), heat insulating box (13), temperature difference interface (14) constitutes, generally temperature difference complex is installed at the back side of casing, the backboard that is casing is machine core board (15), shift out evaporation airway (16) on machine core board top to the case inboard, shift out condensation airway (17) in the machine core board bottom to the case inboard, and the condensation airway shifted out to the inside again the power supply airway (18) that holds power board, owing to move in the machine core board of bottom, just can utilize corresponding outstanding position, the interior bottom of casing to form the draining step (19) of row's condensed water, machine core board middle part is moved in not, remain on the casing tool back plane, and form protruding formula temperature difference interface (14) thereon, connection skeleton on the temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, make the two-part main body that constitutes refrigerator that combines, in heat insulating box, again heat dump (20) and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, constitute the semiconductor circulation heat pipe refrigerator of fin cycling hot cast thus.
Second embodiment of the invention shown in Figure 4, fin in the compound body of the temperature difference, circulation heat pipe radiator is a fin cycling hot cast, when some independences fold the parallel at certain intervals distribution of inverted U-shaped fin (1), promptly one or some heat pipes (2) part volt is in the heat pipe passage (4) of fin folded bottom (3), a part runs in the guide in the assembling circular hole (5) of fin, complications couple together and near first end by a working medium return duct (6) UNICOM, constitute the sealing circulation line, the heat conduction ware of composite semiconductor thermoelectric device and cuboid or truncated cone shape on the motherboard of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton and the motherboard of heat insulation window frame shape again, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation temperature difference complex of sealing, the heat-insulated container part is by heat insulation chamber door (12), heat insulating box (13), temperature difference interface constitutes, temperature difference complex is installed on chamber door, be that chamber door is a machine core board, connection skeleton on the temperature difference complex is assemblied in the temperature difference interface on the heat insulation chamber door and passes inner bag in case, make the two-part main body that constitutes refrigerator that combines, heat insulation chamber door beautified and within it heat dump and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, constitute the semiconductor circulation heat pipe refrigerator of the fin cycling hot cast of door portion refrigeration thus.
Third embodiment of the invention shown in Figure 5, fin in the compound body of the temperature difference, circulation heat pipe radiator is a shell cycling hot cast, continuous the folding of fin (1) beautified into certain pattern and arranged the area of dissipation that is combined to form the best, and as the part of refrigerator both sides shell, heat pipe (2) part volt is in the heat pipe passage (4) of fin folded bottom, part heat pipe extension is also pasted row on the shell (8) of the fin shape refrigerator of being made by good heat conducting material, be after the heat pipe head end is accepted semiconductor temperature difference device (7) heat, the interior working medium of heat pipe is heated rising and is utilized the evaporation pressure handle heat that increases rapidly at first to transmit on the shell of other both sides of casing, utilize shell to have bigger surface area to dispel the heat, the working medium condensation, reduce and be back to end after evaporation is pressed, two parts heat pipe circles the circulating heat pipe structure that connects and composes sealing at the first and last end, constitute shell cycling hot cast thus, go up the heat conduction ware (10) of composite semiconductor thermoelectric device (7) and cuboid or truncated cone shape at the motherboard (9) of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton (11) of heat insulation window frame shape again with motherboard, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation temperature difference complex of sealing, the heat-insulated container part is by heat insulation case lid (12), heat insulating box (13), temperature difference interface (14) constitutes, biside plate is a machine core board, temperature difference interface is arranged on the machine core board, move in around the temperature difference interface and form the sunken platform that matches with motherboard size thickness, form recessed formula interface, connection skeleton on the various temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, motherboard is embedded in and falls in the platform, makes the two-part main body that constitutes refrigerator that combines.In heat insulating box, again heat dump (20) and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, one case two core top-opening type, with the part of its radiator that beautifies as casing both sides shell, with casing both sides shell auxiliary heat dissipation in addition, constitute the semiconductor circulation heat pipe refrigerator of shell cycling hot cast thus simultaneously.
Four embodiment of the invention shown in Figure 6, fin in the compound body of the temperature difference, circulation heat pipe radiator is the cycling hot cast that fin combines with shell, on case lid, fin (1) is beautified into certain pattern and arranges the area of dissipation that is combined to form the best, it is the parallel at certain intervals distribution of fin, heat pipe (2) all lies prostrate in the heat pipe passage (4) of fin folded bottom, after the heat pipe head end is accepted semiconductor temperature difference device (7) heat, the interior working medium of heat pipe is heated rising and is utilized the evaporation pressure handle heat that increases rapidly at first to be delivered among the fin group of radiator than far-end, dispel the heat gradually by fin, the working medium condensation, reduce and be back to end after evaporation is pressed, the tortuous distribution between heat pipe, the first and last end connects and composes the circulating heat pipe structure of sealing, on the casing both sides, heat pipe (2) part volt is in the heat pipe passage (4) of fin (1) folded bottom (3), another part heat pipe extension is walked and is attached on the tabular outcase of refrigerator of being made by good heat conducting material (8), after the heat pipe head end is accepted semiconductor temperature difference device (7) heat, the interior working medium of heat pipe is heated rising and is utilized the evaporation pressure handle heat that increases rapidly at first to transmit on the shell of other both sides of casing, utilize shell to have bigger surface area to dispel the heat, the working medium condensation, reduce and be back to end after evaporation is pressed, between heat pipe around distribution, the first and last end connects and composes the circulating heat pipe structure of sealing, go up the heat conduction ware (10) of composite semiconductor thermoelectric device and cuboid or truncated cone shape at the motherboard (9) of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton (11) of heat insulation window frame shape again with motherboard, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid cold and hot bridge de-stress deformed configurations side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation shell auxiliary heat dissipation type temperature difference complex of sealing, the heat-insulated container part is by heat insulation case lid (12), heat insulating box (13), temperature difference interface (14) constitutes, heat insulation case lid and casing constitute top-opening type, on case lid and casing both sides, temperature difference interface is arranged, can form best heat-proof quality, the temperature difference complex of two kinds of types is assemblied in respectively in the temperature difference interface of heat-insulated container and makes the two-part main body that constitutes refrigerator that combines, in heat insulating box, again heat dump (20) and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, one case three core, with the part of its radiator that beautifies as case lid shell and casing both sides shell, with casing both sides shell auxiliary heat dissipation in addition, constitute the semiconductor circulation heat pipe refrigerator of mating type thus simultaneously.
Figure 7 shows that fifth embodiment of the invention, fin in the compound body of the temperature difference, circulation heat pipe radiator is the cycling hot cast that fin combines with shell, when the folding parallel at certain intervals distribution of fin (1) of some independences, promptly one or some heat pipes (2) part volt is in the heat pipe passage (4) of fin folded bottom, a part runs in the guide in the assembling circular hole (5) of fin with walking and is attached on the shell of being made by good heat conducting material, its volt row heat pipe and horizontal plane form the elevation angle, heat pipe of walking and horizontal plane form the angle of depression, circle between heat pipe couple together and near first end by working medium return duct UNICOM, constitute the sealing circulation line, go up the heat conduction ware (10) of composite semiconductor thermoelectric device (7) and cuboid or truncated cone shape at the motherboard (9) of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton (11) of heat insulation window frame shape again with motherboard, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting thus the semiconductor temperature difference device is the temperature difference complex of the heat insulation fin cycling hot cast of sealing.The heat-insulated container part is by heat insulation case lid (12); heat insulating box (13); temperature difference interface (14) constitutes; heat insulation case lid and casing constitute top-opening type; temperature difference complex is installed in front at casing; the front panel that is casing is machine core board (15); form recessed formula interface; move in promptly around temperature difference interface and form the sunken platform (21) that matches with motherboard size thickness; connection skeleton on the fin cycling hot cast temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case; motherboard is embedded in and falls in the platform; make the two-part main body that constitutes refrigerator that combines; in heat insulating box, again heat dump (20) and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement; one case one core; dress fan auxiliary heat dissipation; dress outer cover protection fin cycling hot cast radiator; cover the battery compartment (24) of laying rechargeable battery at hot box; is furnished with waterproof cover on the lattice; utilize rechargeable battery insulation self-contained in the battery compartment; temperature difference movement is furnished with common set controller (25) in addition; but General Motors; train; aircraft; power supply on the steamer constitutes the semiconductor circulation heat pipe refrigerator of mating type thus.
Figure 8 shows that sixth embodiment of the invention, fin in the compound body of the temperature difference, circulation heat pipe radiator is the cycling hot cast that fin combines with shell, continuous the folding of fin (1) beautified into certain pattern and arranged the area of dissipation that is combined to form the best, heat pipe (2) part volt is in the heat pipe passage (4) of fin folded bottom, part heat pipe extension also runs in the guide in the assembling circular hole (5) of fin of the some parallel distributions of top casing (8) peripheral space, be after the heat pipe head end is accepted semiconductor temperature difference device heat, the interior working medium of heat pipe is heated rising and is utilized the evaporation pressure handle heat that increases rapidly at first to transmit the shell peripheral space has the bigger surface area that has of more fin formation to dispel the heat, the working medium condensation, reduce and be back to end after evaporation is pressed, two parts heat pipe circles the circulating heat pipe structure that connects and composes sealing at the first and last end, can utilize gravity to accelerate circulation rate.Go up the heat conduction ware (10) of composite semiconductor temperature difference device (7) and cuboid or truncated cone shape at the motherboard (9) of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton (11) of heat insulation window frame shape again with motherboard, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation temperature difference complex of sealing.The heat-insulated container part is by heat insulation chamber door (12), heat insulating box (13), temperature difference interface (14) constitutes, two-door pair of chamber, temperature difference complex is installed in two sides at casing, the biside plate that is casing is machine core board, temperature difference interface is arranged on the machine core board, move in around the temperature difference interface and form the sunken platform (21) that matches with motherboard size thickness, connection skeleton on the shell cycling hot cast temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, motherboard is embedded in and falls in the platform, make the two-part main body that constitutes refrigerator that combines, in heat insulating box, again heat dump (20) and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, one case two core, be contained in both sides, top casing peripheral space fin is strengthened heat radiation, can hang on the wall, lowest part has drainpipe (26) in the heat insulating box, constitutes the semiconductor circulation heat pipe refrigerator of mating type thus.
Claims (7)
1, a kind of semiconductor circulation heat pipe refrigerator that adopts semiconductor cooler and circulation heat pipe radiator to design as the core low-temperature receiver, it is characterized in that: the main body that constitutes semiconductor circulation heat pipe refrigerator by temperature difference complex and heat-insulated container two parts, temperature difference complex part is by radiator, the semiconductor temperature difference device, the heat conduction ware, connecting skeleton constitutes, radiator adopts fin, circulation heat pipe radiator, its heat-sinking capability is that the actual needs according to semiconductor circulation heat pipe refrigerator designs, fin can independently fold or be folded to form continuously all size pattern, when the folding parallel at certain intervals distribution of fin of some independences, promptly one or some heat pipes part volt are in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of fin, complications couple together and near first end by a working medium return duct UNICOM, constitute the sealing circulation line, be after the heat pipe head end is accepted semiconductor temperature difference device heat, the interior working medium of heat pipe is heated rising and is utilized the evaporation pressure handle heat that increases rapidly at first to be delivered among the fin group of radiator than far-end, dispel the heat gradually by fin, the working medium condensation, reduce and be back to end after evaporation is pressed, constitute various fin cycling hot casts thus, or with fin continuously folding beautify into certain pattern and arrange be combined to form best area of dissipation, heat pipe part volt is in the heat pipe passage of fin folded bottom, part heat pipe extension and walking is attached on the shell of the tabular of being made by good heat conducting material or fin shape refrigerator, or run in the guide in the assembling circular hole of fin of the some parallel distributions of shell peripheral space, be after the heat pipe head end is accepted semiconductor temperature difference device heat, working medium is heated in the heat pipe, and evaporation pressure handle heat rising and that utilization increases rapidly at first transmits shell or the shell peripheral space has bigger surface area to dispel the heat, the working medium condensation, reduce and be back to end after evaporation is pressed, two parts heat pipe circles the circulating heat pipe structure that connects and composes sealing at the first and last end, constitute various shell cycling hot casts thus, or with various fin cycling hot casts combine with various shell cycling hot casts constitute various in conjunction with the cycling hot cast, the power of circulating heat pipe is exactly to accept the heat that the semiconductor temperature difference device is distributed, can utilize gravity to accelerate circulation rate, first end installation at circulating heat pipe is saved through supercharging by pyrocondensation, makes working medium form unidirectional circulation.The heat conduction ware of composite semiconductor thermoelectric device and cuboid or truncated cone shape on the motherboard of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton and the motherboard of heat insulation window frame shape again, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation temperature difference complex of sealing, is determined the type of temperature difference complex by the type of radiator.The heat-insulated container part is by heat insulation case lid or door, heat insulating box, temperature difference interface constitutes, heat insulation case lid and casing constitute top-opening type, heat insulation chamber door and casing constitute vertical type, generally temperature difference complex is installed at the back side at casing in vertical type, the backboard that is casing is a machine core board, shift out the evaporation airway on machine core board top to the case inboard, shift out the condensation airway in the machine core board bottom to the case inboard, and the condensation airway shifted out to the inside again the power supply airway that holds power board, owing to move in the machine core board of bottom, just can utilize corresponding outstanding position, the interior bottom of casing to form the draining step of row's condensed water, machine core board middle part is moved in not, remain on the casing tool back plane, and form protruding formula temperature difference interface thereon, connection skeleton on the various temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, make the two-part main body that constitutes refrigerator that combines, such structure can make on the one hand that each fin can both touch natural convection air to greatest extent on the radiator of heating status, be beneficial to heat exchange, can form best heat insulation structural on the other hand, in heat insulating box, again heat dump and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, also temperature difference complex can be installed on chamber door, be that chamber door is a machine core board, or temperature difference complexs are installed in other sides of case lid or casing, other side plates that are case lid or casing are machine core board, temperature difference interface is arranged on the machine core board, move in around the temperature difference interface and form the sunken platform that matches with motherboard size thickness, form recessed formula interface, connection skeleton on the various temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, motherboard is embedded in and falls in the platform, makes the two-part main body that constitutes refrigerator that combines.In heat insulating box, again heat dump and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, one case one core also can one case multicore, because tm can reach standard, utilize the linear character of thermoelectric cooling, just can break away from additional power source and mechanical carrier equipment, utilize rechargeable battery insulation self-contained in the battery compartment, temperature difference movement is furnished with common set controller in addition, but power supply on General Motors, train, aircraft, the steamer forms the semiconductor circulation heat pipe refrigerator of fin type, can type, mating type various types thus.
2, semiconductor circulation heat pipe refrigerator according to claim 1, it is characterized in that: the fin in the temperature difference complex part, circulation heat pipe radiator is a fin cycling hot cast, the parallel at certain intervals distribution of fin that some independences are folding, its volt row heat pipe and horizontal plane form the elevation angle, heat pipe of walking and horizontal plane form the angle of depression, promptly one or some heat pipes part volt are in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of fin, utilize the fin heat radiation, between heat pipe complications couple together and near first end by a working medium return duct UNICOM, constitute the sealing circulation line, temperature difference complex is installed at the back side at casing, the backboard that is casing is a machine core board, shift out the evaporation airway on machine core board top to the case inboard, shift out the condensation airway in the machine core board bottom to the case inboard, and the condensation airway shifted out to the inside again the power supply airway that holds power board, owing to move in the machine core board of bottom, just can utilize corresponding outstanding position, the interior bottom of casing to form the draining step of row's condensed water, machine core board middle part is moved in not, remain on the casing tool back plane, and form protruding formula temperature difference interface thereon, form fin cycling hot cast temperature difference complex thus, vertical type, one case one core, connection skeleton on the temperature difference complex is assemblied in the temperature difference interface of back machine core board and passes inner bag in case, make the two-part main body that constitutes refrigerator that combines, form the semiconductor circulation heat pipe refrigerator of fin type thus.
3, semiconductor circulation heat pipe refrigerator according to claim 1, it is characterized in that: the fin in the temperature difference complex part, circulation heat pipe radiator is a fin cycling hot cast, somely independently be folded into the parallel at certain intervals distribution of inverted U-shaped fin, its volt row heat pipe and horizontal plane form the elevation angle, heat pipe of walking and horizontal plane form the angle of depression, promptly one or some heat pipes part volt are in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of fin, utilize the fin heat radiation, between heat pipe complications couple together and near first end by a working medium return duct UNICOM, constitute the sealing circulation line, temperature difference complex is installed on chamber door, be that chamber door is a machine core board, connection skeleton on the temperature difference complex is assemblied in the temperature difference interface on the heat insulation chamber door and passes inner bag in case, make the two-part main body that constitutes refrigerator that combines, heat insulation chamber door beautified and within it heat dump and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, be formed in the semiconductor circulation heat pipe refrigerator of the fin type of a last refrigeration thus.
4, semiconductor circulation heat pipe refrigerator according to claim 1, it is characterized in that: the fin in the temperature difference complex part, circulation heat pipe radiator is a shell cycling hot cast, continuous the folding of fin beautified into certain pattern and arranged the area of dissipation that is combined to form the best, and as the part of refrigerator both sides shell, heat pipe part volt is in the heat pipe passage of fin folded bottom, part heat pipe extension and walking is attached on the shell of the fin shape refrigerator that other both sides make by good heat conducting material, utilize the shell heat radiation, two parts heat pipe circles the circulating heat pipe structure that connects and composes sealing at the first and last end, the heat-insulated container part is by heat insulation case lid, heat insulating box constitutes top-opening type, biside plate is a machine core board, temperature difference interface is arranged on the machine core board, move in around the temperature difference interface and form the sunken platform that matches with motherboard size thickness, form recessed formula interface, connection skeleton on the various temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, motherboard is embedded in and falls in the platform, make two-part one case two core of main body that constitutes refrigerator that combines, with the part of its radiator that beautifies as casing both sides shell, with casing both sides shell auxiliary heat dissipation in addition, constitute the semiconductor circulation heat pipe refrigerator of can type thus simultaneously.
5, semiconductor circulation heat pipe refrigerator according to claim 1, it is characterized in that: the fin in the compound body of the temperature difference, circulation heat pipe radiator is the cycling hot cast that fin combines with shell, on case lid, fin is beautified into certain pattern and arranges the area of dissipation that is combined to form the best, it is the parallel at certain intervals distribution of fin, heat pipe all lies prostrate in the heat pipe passage of fin folded bottom, utilize the fin heat radiation, the tortuous distribution between heat pipe, the first and last end connects and composes the circulating heat pipe structure of sealing, on the casing both sides, heat pipe part volt is in the heat pipe passage of fin folded bottom, another part heat pipe extension is walked and is attached on the tabular outcase of refrigerator of being made by good heat conducting material, utilize the shell heat radiation, between heat pipe around distribution, the first and last end connects and composes the circulating heat pipe structure of sealing, the heat-insulated container part is by heat insulation case lid, heat insulating box constitutes top-opening type, on case lid and casing both sides, temperature difference interface is arranged, the temperature difference complex of two kinds of types is assemblied in respectively in the temperature difference interface of heat-insulated container and makes the two-part main body that constitutes refrigerator that combines, one case three core, with the part of its radiator that beautifies as case lid shell and casing both sides shell, with casing both sides shell auxiliary heat dissipation in addition, constitute the semiconductor circulation heat pipe refrigerator of mating type thus simultaneously.
6; semiconductor circulation heat pipe refrigerator according to claim 1; it is characterized in that: the fin in the compound body of the temperature difference; circulation heat pipe radiator is the cycling hot cast that fin combines with shell; when the folding parallel at certain intervals distribution of fin of some independences; promptly one or some heat pipes part volt are in the heat pipe passage of fin folded bottom; a part runs in the guide in the assembling circular hole of fin with walking and is attached on the shell of being made by good heat conducting material; utilize fin and shell to dispel the heat; circle between heat pipe couple together and at its first and last end by working medium return duct UNICOM; constitute the sealing circulation line; the heat-insulated container part constitutes top-opening type by heat insulation case lid and casing; temperature difference complex is installed in front at casing; the front panel that is casing is a machine core board; form recessed formula interface; one case one core; dress fan auxiliary heat dissipation; dress outer cover protection fin cycling hot cast radiator; cover the battery compartment of laying rechargeable battery at hot box; is furnished with waterproof cover on the lattice; temperature difference movement is furnished with common set controller in addition, constitutes the semiconductor circulation heat pipe refrigerator of mating type thus.
7, semiconductor circulation heat pipe refrigerator according to claim 1, it is characterized in that: the fin in the compound body of the temperature difference, circulation heat pipe radiator is the cycling hot cast that fin combines with shell, continuous the folding of fin beautified into certain pattern and arranged the area of dissipation that is combined to form the best, heat pipe part volt is in the heat pipe passage of fin folded bottom, part heat pipe extension also runs in the guide in the assembling circular hole of fin of the some parallel distributions of top casing peripheral space, utilize shell and peripheral space to have more fin to dispel the heat, two parts heat pipe circles the circulating heat pipe structure that connects and composes sealing at the first and last end, the heat-insulated container part is made of heat insulation chamber door and heat insulating box, two-door pair of chamber, temperature difference complex is installed in two sides at casing, connection skeleton on the shell cycling hot cast temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, motherboard is embedded in and falls in the platform, make the two-part main body that constitutes refrigerator that combines, one case two core, top casing peripheral space fin is strengthened heat radiation, can hang on the wall, lowest part has drainpipe in the heat insulating box, constitutes the semiconductor circulation heat pipe refrigerator of mating type thus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510105913 CN1945169A (en) | 2005-10-08 | 2005-10-08 | Semiconductor circulation heat pipe refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510105913 CN1945169A (en) | 2005-10-08 | 2005-10-08 | Semiconductor circulation heat pipe refrigerator |
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| Publication Number | Publication Date |
|---|---|
| CN1945169A true CN1945169A (en) | 2007-04-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510105913 Pending CN1945169A (en) | 2005-10-08 | 2005-10-08 | Semiconductor circulation heat pipe refrigerator |
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| CN (1) | CN1945169A (en) |
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| CN104329871A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semi-conductor refrigeration refrigerator and cold end heat exchanging device thereof |
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