CN1945171A - Semiconductor refrigerator for sleeping room - Google Patents
Semiconductor refrigerator for sleeping room Download PDFInfo
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- CN1945171A CN1945171A CN 200510105915 CN200510105915A CN1945171A CN 1945171 A CN1945171 A CN 1945171A CN 200510105915 CN200510105915 CN 200510105915 CN 200510105915 A CN200510105915 A CN 200510105915A CN 1945171 A CN1945171 A CN 1945171A
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Abstract
The semiconductor refrigerator for sleeping room refrigerating with semiconductor thermoelectric device features the circulating heat pipe technology, no any mechanical motion and no noise. Radiating fin and circulating heat pipe radiator are constituted into various types of radiating fin-circulating heat pipe and casing-circulating heat pipe temperature difference complex, and the connecting skeleton of the temperature difference complex is assembled to the temperature difference interface of heat insulated container to constitute the main body of semiconductor refrigerator for sleeping room. The present invention solves the problems of heat dissipation and heat insulation in semiconductor refrigerating, and obtains high refrigerating performance. The semiconductor refrigerator for sleeping room may be used to reach temperature as low as 5deg.C, and the environment temperature of 32deg.C and may be used conveniently in sleeping room.
Description
Affiliated technical field
The present invention relates to a kind of family expenses or similar family expenses carry out refrigeration by consumed power utensil, especially adopt semiconductor cooler as the noiseless unidirectional circulating heat pipe design of core low-temperature receiver and no any mechanical movement, be fit to be placed on the refrigerator in bedroom, hotel and the household bedroom, thus the called after semiconductor refrigerator for sleeping room.
Background technology
At present, with growth in the living standard, in the bedroom, also need place refrigerator, be used to store medicine, drink, cosmetics, so that use, require noiseless and on refrigeration output, reach the standard level of refrigerating box, but conventional semiconductor refrigerator one class is for adopting the snakelike heat-pipe radiator of iron wire grid formula, its major defect is to satisfy the required area of dissipation of semiconductor cooler reality of work, cause the cooling effect of semiconductor cooler can't get out, refrigeration output can not be up to standard, another kind of for adopting extrusion molding or shaping by stock removal gilled radiator, its defective can not combine with heat pipe, also be can not satisfy the semiconductor cooler reality of work required radiating rate, simultaneously at radiator, the semiconductor temperature difference device, heat-conducting block, heat dump interconnects, must form heat insulation structural between radiator and the heat dump, but conventional semiconductor refrigeration movement is exactly so, between radiator and the heat-conducting block, being connected between heat dump and the heat-conducting block, only depend on the thick plastic mattress of 1-2mm heat insulation, certainly lead to a certain degree heat bridge and cold bridge, also influence the performance of conductor refrigeration performance, the result is under 32 ℃ of environment, the refrigerator that this two classes radiator is made, the best cooling effect of the temperature inside the box is 15 ℃, only be 17 ℃ with the difference of environment temperature, all can not reach degree with practical value, can not reach both at home and abroad relevant refrigerator storage temperature and be 5 ℃ standard, thereby only be suitable for making the both cooling and heating case that uses on the automobile below 18 liters, generally only as insulation, it or not genuine semiconductor freezer, but no matter above-mentioned which kind of, all be unable to do without radiator fan or cooling fan if will improve refrigeration output, promptly still have mechanical movement to participate in, and produce noise thus, fan is worked fragile under high temperature or cold damp condition simultaneously, cause refrigeration performance and reliability more and more poor, make it become short-life low grade products, can not be placed in bedroom, hotel and the household bedroom.Compressor formula refrigeration has noise in addition, though the absorption refrigeration noiseless, the energy consumption height, the price height should not be promoted, and therefore can not be placed in bedroom, hotel and the household bedroom.
Summary of the invention
In order to overcome above-mentioned deficiency, the present invention catches existing semiconductor freezer not reach fundamental problem's problem of practical function on refrigeration performance, a kind of fin that can design according to practical needs is provided, circulation heat pipe radiator, can satisfy the requirement of semiconductor temperature difference electrical part heat radiation fully, solve no any cold and hot bridge construction simultaneously, fundamentally solve the heat radiation and the temperature difference heat-insulating problem that hinder conductor refrigeration performance performance, increase substantially freezing capacity, just can no matter be that fan is all removed in heat radiation or refrigeration promptly at the inside and outside of refrigerator, under 32 ℃ of environment, temperature can reach 5 ℃ in the case, with the difference of environment temperature be 27 ℃, make the conductor refrigeration ability really reach the level that possesses practical value, reach the standard of relevant refrigerator both at home and abroad, simultaneously because no any mechanical movement does not just have noise yet, not wearing and tearing make semiconductor freezer become a kind of suitable high-grade durable product of environmental protection and energy saving that is placed in the bedroom.
The technical solution adopted for the present invention to solve the technical problems is: a kind of semiconductor refrigerator for sleeping room that is made of main body temperature difference complex and heat-insulated container two parts, temperature difference complex part is by radiator, the semiconductor temperature difference device, the heat conduction ware, connecting skeleton constitutes, radiator adopts fin, circulation heat pipe radiator, its heat-sinking capability is that the actual needs according to semiconductor refrigerator for sleeping room designs, fin can independently fold or be folded to form continuously all size pattern, when the folding parallel at certain intervals distribution of fin of some independences, promptly one or some heat pipes part volt are in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of fin, complications couple together and at its first and last end by a working medium return duct UNICOM, constitute the sealing circulation line, be after the heat pipe head end is accepted semiconductor temperature difference device heat, the interior working medium of heat pipe is heated rising and is utilized the evaporation pressure handle heat that increases rapidly at first to be delivered among the fin group of radiator than far-end, dispel the heat gradually by fin, the working medium condensation, reduce and be back to end after evaporation is pressed, constitute various fin cycling hot casts thus, the next working medium return duct of motherboard forms normal throw, the upper working medium return duct of motherboard forms negative drop, heating undergauge supercharging joint then is installed on the working medium return duct, or with fin continuously folding beautify into certain pattern and arrange be combined to form best area of dissipation, heat pipe part volt is in the heat pipe passage of fin folded bottom, part heat pipe extension is also pasted row on the shell of tabular of being made by good heat conducting material or fin shape refrigerator, or run in the guide in the assembling circular hole of fin of the some parallel distributions of shell peripheral space, be after the heat pipe head end is accepted semiconductor temperature difference device heat, working medium is heated in the heat pipe, and evaporation pressure handle heat rising and that utilization increases rapidly at first transmits shell or the shell peripheral space has bigger surface area to dispel the heat, the working medium condensation, reduce and be back to end after evaporation is pressed, two parts heat pipe circles the circulating heat pipe structure that connects and composes sealing at the first and last end, constitute various shell cycling hot casts thus, can utilize gravity to accelerate circulation rate.The heat conduction ware of composite semiconductor thermoelectric device and cuboid or truncated cone shape on the motherboard of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton and the motherboard of heat insulation window frame shape again, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation temperature difference complex of sealing, is determined the type of temperature difference complex by the type of radiator.The heat-insulated container part is by heat insulation case lid or door, heat insulating box, temperature difference interface constitutes, heat insulation case lid and casing constitute top-opening type, heat insulation chamber door and casing constitute vertical type, generally temperature difference complex is installed at the back side at casing in vertical type, the backboard that is casing is a machine core board, shift out the evaporation airway on machine core board top to the case inboard, shift out the condensation airway in the machine core board bottom to the case inboard, and the condensation airway shifted out to the inside again the power supply airway that holds power board, owing to move in the machine core board of bottom, just can utilize corresponding outstanding position, the interior bottom of casing to form the draining step of row's condensed water, machine core board middle part is moved in not, remain on the casing tool back plane, and temperature difference interface arranged thereon, connection skeleton on the temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, make the two-part main body that constitutes refrigerator for sleeping room that combines, such structure can make on the one hand that each fin can both touch natural convection air to greatest extent on the radiator of heating status, be beneficial to heat exchange, can form best heat insulation structural on the other hand, in heat insulating box, again heat dump and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, can form one case chamber, it all is refrigerating chamber, also can form one case two chamber, refrigerating chamber of an ice-making compartment constitutes a conventional type and conventional two types thus.Also can temperature difference complex be installed in the side of casing, the side plate that is casing is a machine core board, temperature difference interface is arranged on the machine core board, move in around the temperature difference interface and form the step that matches with motherboard size thickness, connection skeleton on the shell cycling hot cast temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, motherboard is embedded in the step, make the two-part main body that constitutes refrigerator for sleeping room that combines, in heat insulating box, again heat dump and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, one case one core also can one case multicore, generally be contained in both sides, top casing or plane or fin shape or the auxiliary reinforcement heat radiation of shell peripheral space arrangement fin, can hang on the wall, constitute the type of suspension and two types of suspension, form the semiconductor refrigerator for sleeping room of various types thus.When this temperature difference movement is worked in the heat insulation refrigerator for sleeping room main body of sealing, can be under 32 ℃ of conditions of environment temperature, with rated power energising refrigeration, can reduce to refrigerated storage temperature rapidly, can get rid of the cold and hot bridge, stress and the distortion that are produced when forming the big temperature difference, refrigeration output does not decay, durable reliably and with long-term, simultaneously because no any mechanical movement, noiseless, do not have wearing and tearing, make semiconductor freezer become durable expensive goods, really can be reached for the purpose of improving the quality of living and in bedroom, hotel and household bedroom, laying refrigerator.
The invention has the beneficial effects as follows, because cooling effect is good, noiselessness, environmental protection and energy saving, reliably and with long-term, high-grade durable, moderate cost is suitable for extensively to be placed in the bedroom, just medicine, cosmetics, drink etc. can be placed in the refrigerator, both can be used as bedside cupboard and also can be placed on the platform in bedroom, perhaps hung on the wall, made things convenient for daily life, play an important role to improving the quality of living, can be assembled in addition in the bedroom, hotel, replace the big absorption refrigerator of power consumption that costs an arm and a leg, all have important function aspect making rational use of resources in environmental protection and energy saving.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
The exploded pictorial that Fig. 1 constitutes for main body of the present invention.
Fig. 2 is the conventional type profile signal of first embodiment of the invention.
Fig. 3 is the conventional type profile signal of second embodiment of the invention.
Fig. 4 cuts open signal for third embodiment of the invention hangs the three-dimensional office of a type.
Fig. 5 cuts open signal for four embodiment of the invention hangs the three-dimensional office of two types.
Among the figure: 1. fin, 2. heat pipe, 3. folded bottom, 4. heat pipe passage, 5. assembling circular hole, 6. return duct, 7. semiconductor temperature difference device, 8. shell, 9. motherboard, 10. heat conduction ware, 11. connect skeletons, 12. case lids or door, 13. casing, 14. temperature difference interfaces, 15. machine core boards, 16. evaporation airways, 17. the condensation airway, 18. power supply airways, 19. draining steps, 20. heat dumps, 21. fall into platform, 22. heating undergauge supercharging joints, 23. drainpipes.
The specific embodiment
In main body of the present invention shown in Figure 1: the main body of semiconductor refrigerator for sleeping room is made of temperature difference complex and heat-insulated container two parts, temperature difference complex part is by radiator, the semiconductor temperature difference device, the heat conduction ware, connecting skeleton constitutes, radiator adopts fin (1), circulating heat pipe (2) radiator, its heat-sinking capability is that the actual needs according to semiconductor refrigerator for sleeping room designs, fin can independently fold or be folded to form continuously all size pattern, when the folding parallel at certain intervals distribution of fin of some independences, promptly one or some heat pipes part volt are in the heat pipe passage (4) of fin folded bottom (3), a part runs in the guide in the assembling circular hole (5) of fin, complications couple together and at its first and last end by a working medium return duct (6) UNICOM, constitute the sealing circulation line, be after the heat pipe head end is accepted semiconductor temperature difference device (7) heat, the interior working medium of heat pipe is heated rising and is utilized the evaporation pressure handle heat that increases rapidly at first to be delivered among the fin group of radiator than far-end, dispel the heat gradually by fin, the working medium condensation, reduce and be back to end after evaporation is pressed, constitute various fin cycling hot casts thus, the next working medium return duct of motherboard forms normal throw, the upper working medium return duct of motherboard forms negative drop, heating undergauge supercharging joint then is installed on the working medium return duct, or with fin continuously folding beautify into certain pattern and arrange be combined to form best area of dissipation, heat pipe part volt is in the heat pipe passage of fin folded bottom, part heat pipe extension is also pasted row on the shell (8) of tabular of being made by good heat conducting material or fin shape refrigerator, or run in the guide in the assembling circular hole of fin of the some parallel distributions of shell peripheral space, be after the heat pipe head end is accepted semiconductor temperature difference device heat, working medium is heated in the heat pipe, and evaporation pressure handle heat rising and that utilization increases rapidly at first transmits shell or the shell peripheral space has bigger surface area to dispel the heat, the working medium condensation, reduce and be back to end after evaporation is pressed, two parts heat pipe circles the circulating heat pipe structure that connects and composes sealing at the first and last end, constitute various shell cycling hot casts thus, can utilize gravity to accelerate circulation rate.Go up the heat conduction ware (10) of composite semiconductor thermoelectric device and cuboid or truncated cone shape at the motherboard (9) of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton (11) of heat insulation window frame shape again with motherboard, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation temperature difference complex of sealing, the type of the type decision temperature difference complex of radiator.The heat-insulated container part is by heat insulation case lid or door (12), heat insulating box (13), temperature difference interface (14) constitutes, heat insulation case lid and casing constitute top-opening type, heat insulation chamber door and casing constitute vertical type, generally temperature difference complex is installed at the back side of casing, the backboard that is casing is a machine core board, shift out evaporation airway (16) on machine core board top to the case inboard, shift out condensation airway (17) in the machine core board bottom to the case inboard, and the condensation airway shifted out to the inside again the power supply airway (18) that holds power board, owing to move in the machine core board of bottom, just can utilize corresponding outstanding position, the interior bottom of casing to form the draining step of row's condensed water, machine core board middle part is moved in not, remain on the casing tool back plane, and temperature difference interface (14) arranged thereon, connection skeleton on the temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, make the two-part main body that constitutes refrigerator for sleeping room that combines, such structure can make on the one hand that each fin can both touch natural convection air to greatest extent on the radiator of heating status, be beneficial to heat exchange, can form best heat insulation structural on the other hand, in heat insulating box, again heat dump and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, can form one case chamber, it all is refrigerating chamber, also can form one case two chamber, refrigerating chamber of an ice-making compartment constitutes a conventional type and conventional two types thus.Also can temperature difference complex be installed in the side of casing, the side plate that is casing is a machine core board, temperature difference interface is arranged on the machine core board, move in around the temperature difference interface and form the sunken platform (21) that matches with motherboard size thickness, connection skeleton on the shell cycling hot cast temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, motherboard is embedded in and falls in the platform, make the two-part main body that constitutes refrigerator for sleeping room that combines, in heat insulating box, again heat dump and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, one case one core, also can one case multicore, generally be contained in the side, top casing or plane or fin shape auxiliary heat dissipation or shell peripheral space are arranged fin and are strengthened heat radiation, can hang on the wall, constitute the type of suspension and two types of suspension, form the semiconductor refrigerator for sleeping room of various types thus.
Figure 2 shows that first embodiment of the invention, fin (1) in the compound body of the temperature difference, circulating heat pipe (2) radiator is a next fin angle cycling hot cast of motherboard, its volt row heat pipe and horizontal plane form the elevation angle, heat pipe of walking and horizontal plane form the angle of depression, promptly one or some heat pipes part volt are in the heat pipe passage (4) of fin folded bottom (3), a part runs in the guide in the assembling circular hole (5) of fin, complications couple together and at its first and last end by a working medium return duct (6) UNICOM, constitute the sealing circulation line, go up the heat conduction ware (10) of composite semiconductor thermoelectric device (7) and cuboid or truncated cone shape at the motherboard (9) of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton (11) of heat insulation window frame shape again with motherboard, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation temperature difference complex of sealing, the heat-insulated container part is by heat insulation chamber door (12), heat insulating box (13), temperature difference interface (14) constitutes, generally temperature difference complex is installed at the back side of casing, the backboard that is casing is machine core board (15), shift out evaporation airway (16) on machine core board top to the case inboard, shift out condensation airway (17) in the machine core board bottom to the case inboard, and the condensation airway shifted out to the inside again the power supply airway (18) that holds power board, owing to move in the machine core board of bottom, just can utilize corresponding outstanding position, the interior bottom of casing to form the draining step (19) of row's condensed water, machine core board middle part is moved in not, remain on the casing tool back plane, and temperature difference interface (14) arranged thereon, connection skeleton on the temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, make the two-part main body that constitutes refrigerator for sleeping room that combines, in heat insulating box, again heat dump (20) and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, one case one movement, motherboard is the next to be suitable for one case chamber, only be refrigerating chamber, constitute the semiconductor refrigerator for sleeping room of a conventional type thus.
Figure 3 shows that second embodiment of the invention, fin (1) in the compound body of the temperature difference, circulating heat pipe (2) radiator is the upper fin angle of a motherboard cycling hot cast, its volt row heat pipe and horizontal plane form the elevation angle, the heat pipe of walking or the formation angle of depression parallel with horizontal plane, promptly one or some heat pipes part volt are in the heat pipe passage (4) of fin folded bottom (3), a part runs in the guide in the assembling circular hole (5) of fin, complications couple together and at its first and last end by a working medium return duct (6) UNICOM, constitute the sealing circulation line, the working medium return duct is lower than the first and last end, one heating undergauge supercharging joint (22) is installed on it, go up the heat conduction ware (10) of composite semiconductor thermoelectric device (7) and cuboid or truncated cone shape at the motherboard (9) of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton (11) of heat insulation window frame shape again with motherboard, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation temperature difference complex of sealing, the heat-insulated container part is by heat insulation chamber door (12), heat insulating box (13), temperature difference interface (14) constitutes, generally temperature difference complex is installed at the back side of casing, the backboard that is casing is machine core board (15), shift out evaporation airway (16) on machine core board top to the case inboard, shift out condensation airway (17) in the machine core board bottom to the case inboard, and the condensation airway shifted out to the inside again the power supply airway (18) that holds power board, owing to move in the machine core board of bottom, just can utilize corresponding outstanding position, the interior bottom of casing to form the draining step (19) of row's condensed water, machine core board middle part is moved in not, remain on the casing tool back plane, and temperature difference interface (14) arranged thereon, connection skeleton on the temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, make the two-part main body that constitutes refrigerator for sleeping room that combines, in heat insulating box, again L shape heat dump (20) and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, one case one movement, motherboard is upper to be suitable for one case two chamber, refrigerating chamber of an ice-making compartment constitutes the semiconductor refrigerator for sleeping room of conventional two types thus.
Figure 4 shows that third embodiment of the invention, fin (1) in the compound body of the temperature difference, circulating heat pipe (2) radiator is a shell cycling hot cast, continuous the folding of fin beautified into certain pattern and arranged the area of dissipation that is combined to form the best, heat pipe part volt is in the heat pipe passage (4) of fin folded bottom, part heat pipe extension is also pasted row on the flat outcase of refrigerator of being made by good heat conducting material (8), be after the heat pipe head end is accepted semiconductor temperature difference device heat, working medium is heated rising and is utilized the evaporation pressure handle heat that increases rapidly at first to transmit shell in the heat pipe has bigger surface area to dispel the heat, the working medium condensation, reduce and be back to end after evaporation is pressed, two parts heat pipe circles the circulating heat pipe structure that connects and composes sealing at the first and last end, can utilize gravity to accelerate circulation rate.Go up the heat conduction ware (10) of composite semiconductor temperature difference device (7) and cuboid or truncated cone shape at the motherboard (9) of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton (11) of heat insulation window frame shape again with motherboard, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation temperature difference complex of sealing.The heat-insulated container part is by heat insulation chamber door (12), heat insulating box (13), temperature difference interface (14) constitutes, the simple gate single chamber, temperature difference complex is installed in side at casing, the side plate that is casing is a machine core board, temperature difference interface is arranged on the machine core board, move in around the temperature difference interface and form the sunken platform (21) that matches with motherboard size thickness, connection skeleton on the shell cycling hot cast temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, motherboard is embedded in and falls in the platform, make the two-part main body that constitutes refrigerator for sleeping room that combines, in heat insulating box, again heat dump (20) and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, one case one core, be contained in a side, top casing or plane or fin shape auxiliary heat dissipation, can hang on the wall, lowest part has drainpipe (23) in the heat insulating box, constitutes the semiconductor refrigerator for sleeping room of the type of suspension thus.
Figure 5 shows that four embodiment of the invention, fin (1) in the compound body of the temperature difference, circulating heat pipe (2) radiator is for strengthening shell cycling hot cast, continuous the folding of fin beautified into certain pattern and arranged the area of dissipation that is combined to form the best, heat pipe part volt is in the heat pipe passage (4) of fin folded bottom, part heat pipe extension also runs in the guide in the assembling circular hole (5) of fin of the some parallel distributions of top casing (8) peripheral space, be after the heat pipe head end is accepted semiconductor temperature difference device heat, the interior working medium of heat pipe is heated rising and is utilized the evaporation pressure handle heat that increases rapidly at first to transmit the shell peripheral space has the bigger surface area that has of more fin formation to dispel the heat, the working medium condensation, reduce and be back to end after evaporation is pressed, two parts heat pipe circles the circulating heat pipe structure that connects and composes sealing at the first and last end, can utilize gravity to accelerate circulation rate.Go up the heat conduction ware (10) of composite semiconductor temperature difference device (7) and cuboid or truncated cone shape at the motherboard (9) of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton (11) of heat insulation window frame shape again with motherboard, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation temperature difference complex of sealing.The heat-insulated container part is by heat insulation chamber door (12), heat insulating box (13), temperature difference interface (14) constitutes, two-door pair of chamber, temperature difference complex is installed in two sides at casing, the biside plate that is casing is machine core board, temperature difference interface is arranged on the machine core board, move in around the temperature difference interface and form the sunken platform (21) that matches with motherboard size thickness, connection skeleton on the shell cycling hot cast temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, motherboard is embedded in and falls in the platform, make the two-part main body that constitutes refrigerator for sleeping room that combines, in heat insulating box, again heat dump (20) and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, one case two core, be contained in both sides, the fin of top casing peripheral space can be strengthened heat radiation, can hang on the wall, lowest part has drainpipe (23) in the heat insulating box, constitutes the semiconductor refrigerator for sleeping room of two types of suspension thus.
Claims (5)
1, a kind of semiconductor refrigerator for sleeping room that carries out refrigeration by the semiconductor temperature difference electrical part, it is characterized in that: constitute main body by semiconductor temperature difference complex and thermally insulated container two parts, temperature difference complex part is by radiator, the semiconductor temperature difference device, the heat conduction ware, connecting skeleton constitutes, radiator adopts fin, circulation heat pipe radiator, its heat-sinking capability is that the actual needs according to semiconductor refrigerator for sleeping room designs, fin can independently fold or be folded to form continuously all size pattern, when the folding parallel at certain intervals distribution of fin of some independences, promptly one or some heat pipes part volt are in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of fin, complications couple together and at its first and last end by a working medium return duct UNICOM, constitute the sealing circulation line, be after the heat pipe head end is accepted semiconductor temperature difference device heat, the interior working medium of heat pipe is heated rising and is utilized the evaporation pressure handle heat that increases rapidly at first to be delivered among the fin group of radiator than far-end, dispel the heat gradually by fin, the working medium condensation, reduce and be back to end after evaporation is pressed, constitute various fin cycling hot casts thus, the next working medium return duct of motherboard forms normal throw, the upper working medium return duct of motherboard forms negative drop, heating undergauge supercharging joint then is installed on the working medium return duct, or with fin continuously folding beautify into certain pattern and arrange be combined to form best area of dissipation, heat pipe part volt is in the heat pipe passage of fin folded bottom, part heat pipe extension is also pasted row on the outcase of refrigerator of tabular of being made by good heat conducting material or fin shape, or run in the guide in the assembling circular hole of fin of the some parallel distributions of shell peripheral space, be after the heat pipe head end is accepted semiconductor temperature difference device heat, working medium is heated in the heat pipe, and evaporation pressure handle heat rising and that utilization increases rapidly at first transmits shell or the shell peripheral space has bigger surface area to dispel the heat, the working medium condensation, reduce and be back to end after evaporation is pressed, circle the circulating heat pipe structure that forms sealing, constitute various shell cycling hot casts thus, can utilize gravity to accelerate circulation rate.The heat conduction ware of composite semiconductor thermoelectric device and cuboid or truncated cone shape on the motherboard of radiator, carry out heat conduction and form required insulating thickness by the heat conduction ware, fastening by the connection skeleton and the motherboard of heat insulation window frame shape again, connecting the interior have living space of skeleton fills with heat-barrier material, form and avoid the cold and hot bridge structure of de-stress side by side fully, constituting the semiconductor temperature difference device thus is the heat insulation temperature difference complex of sealing, is determined the type of temperature difference complex by the type of radiator.The heat-insulated container part is by heat insulation case lid or door, heat insulating box, temperature difference interface constitutes, heat insulation case lid and casing constitute top-opening type, heat insulation chamber door and casing constitute vertical type, generally temperature difference complex is installed at the back side at casing in vertical type, the backboard that is casing is a machine core board, shift out the evaporation airway on machine core board top to the case inboard, shift out the condensation airway in the machine core board bottom to the case inboard, and the condensation airway shifted out to the inside again the power supply airway that holds power board, owing to move in the machine core board of bottom, just can utilize corresponding outstanding position, the interior bottom of casing to form the draining step of row's condensed water, machine core board middle part is moved in not, remain on the casing tool back plane, and temperature difference interface arranged thereon, connection skeleton on the temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, make the two-part main body that constitutes refrigerator for sleeping room that combines, such structure can make on the one hand that each fin can both touch natural convection air to greatest extent on the radiator of heating status, be beneficial to heat exchange, can form best heat insulation structural on the other hand, in heat insulating box, again heat dump and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, can form one case chamber, it all is refrigerating chamber, also can form one case two chamber, refrigerating chamber of an ice-making compartment constitutes a conventional type and conventional two types thus.Also can temperature difference complex be installed in the side of casing, the side plate that is casing is a machine core board, temperature difference interface is arranged on the machine core board, move in around the temperature difference interface and form the step that matches with motherboard size thickness, connection skeleton on the shell cycling hot cast temperature difference complex is assemblied in the temperature difference interface of heat-insulated container and passes inner bag in case, motherboard is embedded in the step, make the two-part main body that constitutes refrigerator for sleeping room that combines, in heat insulating box, again heat dump and heat conduction ware are coupled together and just constitute the semiconductor temperature difference movement, one case one core also can one case multicore, generally be contained in both sides, top casing or plane or fin shape or the auxiliary reinforcement heat radiation of shell peripheral space arrangement fin, can hang on the wall, constitute the type of suspension and two types of suspension, form the semiconductor refrigerator for sleeping room of various types thus.
2, semiconductor refrigerator for sleeping room according to claim 1, it is characterized in that: the fin in the temperature difference complex part, circulation heat pipe radiator is a fin cycling hot cast, the parallel at certain intervals distribution of fin that some independences are folding, its volt row heat pipe and horizontal plane form the elevation angle, heat pipe of walking and horizontal plane form the angle of depression, promptly one or some heat pipes part volt are in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of fin, complications couple together and at its first and last end by a working medium return duct UNICOM, constitute the sealing circulation line, and form fin cycling hot cast temperature difference complex thus, connection skeleton on the temperature difference complex is assemblied in the temperature difference interface of back machine core board and passes inner bag in case, make the two-part main body that constitutes refrigerator for sleeping room that combines, vertical type, one case one core, motherboard is the next, one case chamber only is a refrigerating chamber, constitutes the semiconductor refrigerator for sleeping room of a conventional type thus.
3, semiconductor refrigerator for sleeping room according to claim 1, it is characterized in that: the fin in the temperature difference complex part, circulation heat pipe radiator is a fin cycling hot cast, the parallel at certain intervals distribution of fin that some independences are folding, its volt row heat pipe and horizontal plane form the elevation angle, heat pipe of walking and horizontal plane form the angle of depression, promptly one or some heat pipes part volt are in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of fin, complications couple together and at its first and last end by a working medium return duct UNICOM, constitute the sealing circulation line, and form fin cycling hot cast temperature difference complex thus, connection skeleton on the temperature difference complex is assemblied in the temperature difference interface of back machine core board and passes inner bag in case, make the two-part main body that constitutes refrigerator for sleeping room that combines, vertical type, one case one core, motherboard is upper, heating undergauge supercharging joint is installed on the working medium return duct, one case two chamber, one ice-making compartment, one refrigerating chamber constitutes the semiconductor refrigerator for sleeping room of conventional two types thus.
4, semiconductor refrigerator for sleeping room according to claim 1, it is characterized in that: the fin in the temperature difference complex part, circulation heat pipe radiator is a shell cycling hot cast, continuous the folding of fin beautified into certain pattern and arranged the area of dissipation that is combined to form the best, heat pipe part volt is in the heat pipe passage of fin folded bottom, part heat pipe extension is also pasted row on the shell of tabular of being made by good heat conducting material or fin shape refrigerator, two parts heat pipe circles the circulating heat pipe structure that connects and composes sealing at the first and last end, and form shell cycling hot cast temperature difference complex thus, connection skeleton on the temperature difference complex is assemblied in the temperature difference interface of casing side machine core board and passes inner bag in case, motherboard is embedded in the step, make the two-part main body that constitutes refrigerator for sleeping room that combines, with the part of its radiator that beautifies as the casing side casings, with casing top casing auxiliary heat dissipation, constitute vertical type thus, one case one core or multicore constitute the semiconductor refrigerator for sleeping room of the type of suspension thus.
5, semiconductor refrigerator for sleeping room according to claim 1, it is characterized in that: the fin in the temperature difference complex part, circulation heat pipe radiator is a shell cycling hot cast, continuous the folding of fin beautified into certain pattern and arranged the area of dissipation that is combined to form the best, heat pipe part volt is in the heat pipe passage of fin folded bottom, a part runs in the guide in the assembling circular hole of fin of the some parallel distributions of shell peripheral space, two parts heat pipe circles the circulating heat pipe structure that connects and composes sealing at the first and last end, and form shell cycling hot cast temperature difference complex thus, connection skeleton on the temperature difference complex is assemblied in the temperature difference interface of casing side machine core board and passes inner bag in case, motherboard is embedded in the step, make the two-part main body that constitutes refrigerator for sleeping room that combines, two parts heat pipe circles the circulating heat pipe structure that connects and composes sealing at the first and last end, with the part of its radiator that beautifies as the casing side casings, fin with the some parallel distributions of casing top casing peripheral space is strengthened heat radiation, vertical type, one case one core or multicore constitute the semiconductor refrigerator for sleeping room of two types of suspension thus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510105915 CN1945171A (en) | 2005-10-08 | 2005-10-08 | Semiconductor refrigerator for sleeping room |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510105915 CN1945171A (en) | 2005-10-08 | 2005-10-08 | Semiconductor refrigerator for sleeping room |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1945171A true CN1945171A (en) | 2007-04-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510105915 Pending CN1945171A (en) | 2005-10-08 | 2005-10-08 | Semiconductor refrigerator for sleeping room |
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| Country | Link |
|---|---|
| CN (1) | CN1945171A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102113775A (en) * | 2011-01-08 | 2011-07-06 | 耿功业 | Multifunctional refrigeration and fresh-keeping bedside cabinet |
| CN104329849A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Method for mounting semiconductor refrigerator |
| CN111397268A (en) * | 2019-11-21 | 2020-07-10 | 杭州大和热磁电子有限公司 | Semiconductor refrigeration cabinet for cosmetics |
| CN111829277A (en) * | 2020-06-18 | 2020-10-27 | 广东格兰仕集团有限公司 | Air duct structure of ice maker |
| CN111829259A (en) * | 2020-06-18 | 2020-10-27 | 广东格兰仕集团有限公司 | Refrigerator refrigerating system |
| CN111928557A (en) * | 2020-06-18 | 2020-11-13 | 广东格兰仕集团有限公司 | Air duct system of refrigerator |
| CN114279154A (en) * | 2021-11-18 | 2022-04-05 | 合肥芳容智能科技有限公司 | Heat dissipation mechanism for cosmetic refrigerator |
-
2005
- 2005-10-08 CN CN 200510105915 patent/CN1945171A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102113775A (en) * | 2011-01-08 | 2011-07-06 | 耿功业 | Multifunctional refrigeration and fresh-keeping bedside cabinet |
| CN102113775B (en) * | 2011-01-08 | 2013-01-02 | 耿功业 | Multifunctional refrigeration and fresh-keeping bedside cabinet |
| CN104329849A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Method for mounting semiconductor refrigerator |
| CN104329849B (en) * | 2014-03-28 | 2016-06-08 | 海尔集团公司 | The installation method of a kind of semi-conductor refrigerator |
| CN111397268A (en) * | 2019-11-21 | 2020-07-10 | 杭州大和热磁电子有限公司 | Semiconductor refrigeration cabinet for cosmetics |
| CN111397268B (en) * | 2019-11-21 | 2022-01-11 | 杭州大和热磁电子有限公司 | Semiconductor refrigeration cabinet for cosmetics |
| CN111829277A (en) * | 2020-06-18 | 2020-10-27 | 广东格兰仕集团有限公司 | Air duct structure of ice maker |
| CN111829259A (en) * | 2020-06-18 | 2020-10-27 | 广东格兰仕集团有限公司 | Refrigerator refrigerating system |
| CN111928557A (en) * | 2020-06-18 | 2020-11-13 | 广东格兰仕集团有限公司 | Air duct system of refrigerator |
| CN114279154A (en) * | 2021-11-18 | 2022-04-05 | 合肥芳容智能科技有限公司 | Heat dissipation mechanism for cosmetic refrigerator |
| CN114279154B (en) * | 2021-11-18 | 2024-03-08 | 合肥芳容智能科技有限公司 | Heat dissipation mechanism for cosmetic refrigerator |
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