CN104329851B - Semiconductor refrigeration refrigerator and manufacturing method thereof - Google Patents

Semiconductor refrigeration refrigerator and manufacturing method thereof Download PDF

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Publication number
CN104329851B
CN104329851B CN201410437143.9A CN201410437143A CN104329851B CN 104329851 B CN104329851 B CN 104329851B CN 201410437143 A CN201410437143 A CN 201410437143A CN 104329851 B CN104329851 B CN 104329851B
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CN
China
Prior art keywords
hot
heat
shell
semiconductor
condensation segment
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CN201410437143.9A
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Chinese (zh)
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CN104329851A (en
Inventor
冷静
陶海波
王定远
李鹏
王晶
李春阳
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青岛海尔股份有限公司
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Priority to CN201410437143.9A priority Critical patent/CN104329851B/en
Publication of CN104329851A publication Critical patent/CN104329851A/en
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Publication of CN104329851B publication Critical patent/CN104329851B/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00Self-contained movable devices, e.g. domestic refrigerators
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infra-red detectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2201/00Insulation
    • F25D2201/10Insulation with respect to heat

Abstract

The invention relates to a semiconductor refrigeration refrigerator and a manufacturing method of the semiconductor refrigeration refrigerator. The semiconductor refrigeration refrigerator comprises an outer shell, a semiconductor module and at least one heat end heat pipe which transmits the heat of the semiconductor to the outer shell, the semiconductor refrigeration refrigerator particularly comprises at least one heat end fixed pressing board, each heat end fixed pressing board fixes at least one part of a condensing segment of each heat end heat pipe on the inner surface of the outer shell, so that the at least one part of the condensing segment of each heat end heat pipe is attached to the inner surface of the outer shell. The invention further provides the manufacturing method of the semiconductor refrigeration refrigerator. According to the semiconductor refrigeration refrigerator and the manufacturing method thereof, the heat end fixed pressing board attaches to the at least one part of the condensing segment of the corresponding heat end heat pipe on the inner surface of the outer shell, the surface of the outer shell can be fully used as a heat dissipating surface, a heat dissipating fan is not needed, and the semiconductor refrigeration refrigerator is energy-saving, environment-friendly, high in reliability, simple in structure, convenient to install and high in practicality.

Description

Semiconductor freezer and its manufacture method
Technical field
The present invention relates to refrigerator, more particularly to a kind of semiconductor freezer and its manufacture method.
Background technology
Conventional refrigerator is used freon as cold-producing medium, and using compressor as the power of refrigerator inside working medium circulation, deposits To pollution problems such as depletions of the ozone layer, do not meet the environmental requirement of country.Semiconductor refrigerating, be also called freezing by thermoelectric action, Thermoelectric cooling.Compared with traditional steam compression type refrigeration mode, semiconductor refrigerating is without compressor, cold-producing medium, cooling activation Rapidly, structure is simple, the advantages of noiselessness, is considered as therefore a kind of to contribute to solving the problems, such as the environmental-protection refrigeration side of ozone layer destroying Formula.Meanwhile, semiconductor refrigerating also has refrigerator small volume, and the advantages of mobile, easy for installation, its refrigerating capacity can in milliwatt extremely Change between multikilowatt, the refrigeration temperature difference can adjust in the range of 20~150 DEG C, therefore cools down in electronic devices and components, small-sized refrigerating Equipment, military, armarium, there are a lot of applications in the field such as scientific research, and what is more important semiconductor refrigerating opens refrigeration skill One Ge Xin branch of art, solves a refrigeration difficult problem for many occasions.Particularly carrying recently as our people's living standard Height, semiconductor refrigerating is promoted rapidly in the application of the domestic environments such as small refrigerator, water dispenser, dehumidifier.
At present, on market, most of semiconductor freezers adopt radiation aluminium groove or heat pipe set fin as radiating module, this Radiating mode is although ensure that the temperature in semiconductor cooling hot junction and the requirement of cold preservation indoor air temperature, but there is also one A little problems, the aerofoil fan such as realizing forced convertion needs to consume extra electric energy, the time simultaneously run with aerofoil fan Increase, its noise producing and fault rate are also increasing, the comfortableness of impact user.
Content of the invention
One purpose of first aspect present invention is intended to overcome at least one defect of refrigerator of the prior art, provides one Plant semiconductor freezer, it effectively hot side heat can be fixed on shell and be radiated to make full use of shell, and Extra electric energy need not be consumed, noise is low and fault rate is low.
One temperature that further objective is that case surface to be made of first aspect present invention is uniformly distributed.
Another of first aspect present invention further objective is that the efficiency that will as far as possible improve semiconductor freezer.
One purpose of second aspect present invention is to provide for a kind of system for any of the above-described kind of semiconductor freezer Make method.
According to the first aspect of the invention, the invention provides a kind of semiconductor freezer, including shell and quasiconductor Module and at least one hot side heat that the heat of described semiconductor module reaches described shell, wherein, also include:At least One hot junction fixation clip, at least part of condensation segment of every described hot side heat is fixed on by each described hot junction fixation clip The inner surface of described shell, so that at least part of condensation segment of every described hot side heat is posted by the inner surface of described shell.
Alternatively, each described hot junction fixation clip has:Protrusion, is formed with the fixation extending along its length Groove, to accommodate at least part of condensation segment of accordingly described hot side heat;Respectively from two length edges of described protrusion to Two being fixedly connected with described shell and abutting on the inner surface of the described shell fixing flanks that outside is extended.
Alternatively, each fixing flank of each described hot junction fixation clip is fixed on described shell by screw.
Alternatively, described shell reclines the shell wall having at least part of condensation segment of described hot side heat innermost layer be graphite Film layer.
Alternatively, the condensation segment of every described hot side heat includes the first cold of the evaporator section both sides positioned at this hot side heat Solidifying section and the second condensation segment;The quantity of at least one hot junction fixation clip described is at least two, so that every described hot junction heat It is outer with described that at least part of pipeline section of the first condensation segment of pipe and the second condensation segment is utilized respectively a corresponding hot junction fixation clip The inner surface thermally coupled of shell.
Alternatively, the first condensation segment of every described hot side heat and at least part of pipeline section of the second condensation segment are respectively along water Flat longitudinal direction is fixed on the inner surface of two opposing sidewalls of described shell using accordingly described hot junction fixation clip.
Alternatively, the quantity of a described at least hot side heat is at least two, every in a part of described hot side heat At least part of pipeline section of the first condensation segment of root hot side heat and the second condensation segment utilizes corresponding institute along horizontal longitudinal direction respectively State the inner surface that hot junction fixation clip is fixed on two opposing sidewalls of described shell, every in hot side heat described in remainder At least part of pipeline section of the first condensation segment of root hot side heat and the second condensation segment is all along horizontal longitudinal direction using accordingly described Hot junction fixation clip is fixed on the inner surface of the roof of described shell;Or, the quantity of a described at least hot side heat is at least Three, the first condensation segment of every hot side heat in a part of described hot side heat and at least part of pipeline section of the second condensation segment It is fixed on the interior table of two opposing sidewalls of described shell respectively along horizontal longitudinal direction using accordingly described hot junction fixation clip Face, the first condensation segment of every hot side heat in hot side heat described in another part and at least part of pipeline section of the second condensation segment All it is fixed on the inner surface of the roof of described shell, remainder using accordingly described hot junction fixation clip along horizontal longitudinal direction At least part of pipeline section of the first condensation segment of every hot side heat in described hot side heat and the second condensation segment is all indulged along level It is fixed on the inner surface of the diapire of described shell to direction using accordingly described hot junction fixation clip.
Alternatively, described semiconductor module includes:Semiconductor chilling plate;With hot junction heat transfer substrate, it is installed into makes it Front surface is contacted against with the hot junction of described semiconductor chilling plate, and described hot junction heat transfer substrate is formed with least one receiving Groove, each described holding tank is configured to accommodate at least part of evaporator section of a corresponding described hot side heat.
Alternatively, the rear surface of described hot junction heat transfer substrate and the inner surface of the rear wall of described shell contact against, described The innermost layer of the rear wall of shell is graphite film layer.
Alternatively, described semiconductor module further includes:Cool guiding block, surface and described semiconductor chilling plate is cold thereafter End in contact against;With the cold and hot end thermal insulation layer with central opening, described semiconductor chilling plate and described cool guiding block are arranged on institute State in central opening, the hot junction of described semiconductor chilling plate protrudes from or flushes in the trailing flank of described cold and hot end thermal insulation layer, institute The front surface stating cool guiding block protrudes from or flushes in the leading flank of described cold and hot end thermal insulation layer;And cold end heat transfer substrate, thereafter Surface is contacted against with the front surface of described cool guiding block.
Alternatively, the opening of each described holding tank is in the front surface of described hot junction heat transfer substrate, so that described in every The outer wall of at least part of evaporator section of hot side heat and the hot junction of described semiconductor chilling plate contact against.
Alternatively, at least part of condensation segment of every described hot side heat is flat tube.
Alternatively, described shell includes separate Part I and rear wall, and described Part I includes described shell Roof, diapire and two opposite side walls, each described hot junction fixation clip is by least part of condensation of every described hot side heat Section is fixed on the inner surface of described Part I, to be easy to described semiconductor module when manufacturing described semiconductor freezer Install.
According to the second aspect of the invention, the invention provides a kind of manufacture any of the above-described kind of semiconductor freezer system Make method it is characterised in that including:
Step A:At least part of condensation segment of every hot side heat of described semiconductor freezer is positioned over described half The pre-position of the inner surface of the shell of conductor refrigerator;
Step B:Each described hot junction fixation clip cover is buckled in accordingly at least part of condensation segment of described hot side heat;
Step C:Each described hot junction fixation clip is fixed on described shell.
Alternatively, by multiple screws, each fixing flank of each described hot junction fixation clip is fixed on outside described Shell, each described hot junction fixation clip is fixed on described shell.
Alternatively, also include step A1 before described step A:Recline on the housing and have described hot side heat at least Graphite spraying coating or stickup graphite film on the inner surface of the substrate layer of the shell wall of partial condensation section, to form graphite film layer; And/or, graphite spraying coating or stickup graphite film on the inner surface of the substrate layer of the rear wall of described shell.
Alternatively, also include step A2 before described step A:By pressure-riveting process by every described hot side heat extremely Small part evaporator section embeds in the corresponding holding tank of the hot junction heat transfer substrate of the semiconductor module of described semiconductor freezer.
Alternatively, also include step D after described step C:
The front surface of the cold end heat transfer substrate of described semiconductor module is resisted against the inner bag of described semiconductor freezer Rear surface;
The semiconductor chilling plate of described semiconductor module, cool guiding block are installed on first being formed after cold and hot section of thermal insulation layer pre- The front surface of arrangement is resisted against the rear surface of described cold end heat transfer substrate;
The front surface of the hot junction heat transfer substrate of described semiconductor module is resisted against the hot junction of described semiconductor chilling plate, and The Part I of described shell is made to be fixedly connected with described inner bag;
Multiple screws are sequentially passed through respectively respective through hole on the heat transfer substrate of described hot junction, on the thermal insulation layer of described cold and hot end Respective through hole and described cold end heat transfer substrate on respective through hole after screw in screw in the hole on described inner bag rear wall;
The rear wall of described shell is installed, and makes the inner surface of rear wall of described shell and the rear table of described hot junction heat transfer substrate Face contacts against.
Because using hot junction fixation clip by corresponding hot junction in the semiconductor freezer of the present invention and its manufacture method At least part of condensation segment of heat pipe is posted by the inner surface of shell, therefore, it is possible to securely hot side heat is fixed on shell, To make full use of case surface as radiating surface, then do not need radiator fan so that this semiconductor freezer noise low, section Energy environmental protection, reliability height, and structure are simple, easy for installation, strong adaptability.
Further, due to the semiconductor freezer of the present invention and its spy of each hot junction fixation clip in manufacture method Different structure, significantly improves the transmission efficiency of the heat in hot side heat condensation segment.
Further, due to the semiconductor freezer of the present invention and its shell in manufacture method part shell wall interior Layer is graphite film layer, with the horizontal high thermal conductivity using graphite film, is dissipated into shell the even heat that hot side heat is spread out of Surface.
Further, due to the semiconductor freezer of the present invention and its special knot of hot side heat in manufacture method Structure, substantially increases the efficiency passing cold efficiency and refrigerator.
Further, due in the semiconductor freezer of the present invention and its manufacture method hot junction heat transfer substrate connect with shell Touch against significantly increasing area of dissipation.
Further, due in the semiconductor freezer and preparation method thereof of the present invention inside the shell there is no radiator fan, Moving component can be avoided because of the probability breaking down situations such as abrasion, collision, improve semiconductor freezer operation Reliability and life-span.
According to the detailed description to the specific embodiment of the invention below in conjunction with accompanying drawing, those skilled in the art will be brighter The above-mentioned and other purposes of the present invention, advantages and features.
Brief description
Describe some specific embodiments of the present invention hereinafter with reference to the accompanying drawings by way of example, and not by way of limitation in detail. In accompanying drawing, identical reference denotes same or similar part or part.It should be appreciated by those skilled in the art that these Accompanying drawing is not necessarily drawn to scale.In accompanying drawing:
Fig. 1 is the schematic explosive view of semiconductor freezer according to an embodiment of the invention;
Fig. 2 is the schematic local structural graph of semiconductor freezer according to an embodiment of the invention;
Fig. 3 is the schematic structure of hot junction fixation clip in semiconductor freezer according to an embodiment of the invention Figure;
Fig. 4 is the schematic cross sectional views of semiconductor freezer according to an embodiment of the invention;
Fig. 5 is the schematic partial enlarged view at A in Fig. 4;
Fig. 6 is the schematic local structural graph of semiconductor freezer according to an embodiment of the invention;
Fig. 7 is the schematic local structural graph of the inner bag of the semiconductor freezer with one embodiment of the invention;
Fig. 8 is the indicative flowchart of the manufacture method of semiconductor freezer according to an embodiment of the invention.
Specific embodiment
Fig. 1 is the schematic explosive view of semiconductor freezer according to an embodiment of the invention.As shown in figure 1, simultaneously With reference to Fig. 2, embodiments provide a kind of semiconductor freezer, it includes shell 50 and semiconductor module 20 and incites somebody to action The heat of semiconductor module 20 reaches at least one hot side heat 60 of shell 50.Especially, partly leading in the embodiment of the present invention System cold refrigerator also includes at least one hot junction fixation clip 70.Each hot junction fixation clip 70 is by every hot side heat 60 extremely Small part condensation segment is fixed on the inner surface of shell 50, so that at least part of condensation segment of every hot side heat 60 is posted by shell 50 inner surface.Each hot junction fixation clip 70 can securely corresponding hot side heat 60 be fixed on shell 50, every heat , with shell 50 directly against leaning on, thermal contact resistance is little at least part of condensation segment of end heat pipe 60, to make full use of case surface as scattered Hot face, and do not need radiator fan, so that this semiconductor freezer energy-conserving and environment-protective, reliability are high, and structure is simple, install Convenient, strong adaptability, also can achieve " zero noise " of semiconductor freezer radiating.
In order to improve heat exchange efficiency further, at least part of condensation segment of every hot side heat 60 is flat tube, that is, abut in The cross section of the part hot side heat pipeline section on shell 50 is squarish or square is circular.Every hot side heat 60 with shell 50 Also heat conductive silica gel can be smeared, to improve heat transfer efficiency on inner surface directly against at least part of condensation segment leaning on.For the ease of half The installation of conductor refrigerator, shell 50 may include separate Part I and rear wall.The Part I of shell 50 includes The roof of shell 50, diapire and two opposite side walls, each hot junction fixation clip 70 is at least partly cold by every hot side heat 60 Solidifying section is fixed on the inner surface of Part I, to be easy to the installation of semiconductor module 20 when manufacturing semiconductor freezer.
Fig. 3 is the schematic structure of hot junction fixation clip in semiconductor freezer according to an embodiment of the invention Figure.Each hot junction fixation clip 70 has protrusion 71 and two fixing flanks 72.Side along its length is formed with protrusion 71 To the fixing groove extending, to accommodate at least part of condensation segment of corresponding hot side heat 60.Two fixing flanks 72 are respectively from protuberance Two length edges in portion 71 extend laterally, for being fixedly connected and abutting in the inner surface of shell 50 with shell 50, Reach the interior table of shell 50 with the heat that at least part of condensation segment of corresponding hot side heat 60 is passed to hot junction fixation clip 70 Face.On each fixing flank 72, there is spaced multiple screw hole along its length, so that each hot junction fixation clip The fixing flank 72 of each of 70 is fixed on shell 50 by screw.
Fig. 4 is the schematic cross sectional views of semiconductor freezer according to an embodiment of the invention.As shown in figure 4, simultaneously With reference to Fig. 5, the innermost layer of the shell wall having at least part of condensation segment of hot side heat 60 that shell 50 reclines is graphite film layer, that is, Saying reclines thereon have one or more hot side heat 60 the shell shell wall of at least part of condensation segment innermost layer be graphite film layer, It is dissipated into the substrate layer surface of the shell wall with graphite film layer with the even heat spreading out of hot side heat 60.In the present invention one In specific embodiment, recline on the inner surface of two opposing sidewalls of shell 60 hot side heat 60, then the two of shell 50 The innermost layer of relative shell wall is graphite film layer.The semiconductor freezer of the embodiment of the present invention makes full use of graphite film layer 51 Laterally high thermal conductivity (alternatively referred to as uniform temperature), the even heat that hot side heat 60 is spread out of is dissipated into the shell with graphite film layer The substrate layer surface of wall, so that the substrate layer with the shell wall of graphite film layer equably distributes the air to outside shell 50 for the heat In.In the other embodiment of the present invention, the outermost layer of the substrate layer of all shell walls of shell 50 can be all graphite film layer 51.
Those skilled in the art, generally, it is considered that metal substrate layer just has thermal conduction characteristic, can transfer heat to outer In the air outside shell, and do not need samming, but it was found by the inventors of the present invention that directly by the condensation segment of every hot side heat When heat reaches inner surface of outer cover, the temperature in the region of the condensation segment of close hot side heat on shell will be significantly larger than away from heat The region of the condensation segment of end heat pipe, makes the heat that various pieces on the surface of shell distribute inconsistent, reduces semiconductor refrigerating The radiating of refrigerator.Graphite spraying coating or the graphite film layer pasting graphite film formation at least part of inner surface of substrate layer Each place radiating that shell can be made is than more uniform.
In view of the particularity of the structure of outcase of refrigerator, in the embodiment of the present invention, every hot side heat is designed as " similar U The structure of type ".Specifically, the condensation segment of every hot side heat 60 includes the first cold of the evaporator section both sides positioned at this hot side heat Solidifying section and the second condensation segment, the first condensation segment of every hot side heat 60 and at least part of pipeline section of the second condensation segment are respectively perpendicular At least part of evaporator section in corresponding hot side heat 60.In embodiments of the present invention, the evaporator section of every hot side heat 60 is phase Answer the middle pipeline section part of hot side heat, be mainly used in absorbing the heat that semiconductor module 20 produces, for example, every hot side heat 60 evaporator section can at least include the portion in the hot junction heat transfer substrate 25 being embedded in semiconductor module 20 of corresponding hot side heat It is in charge of section.The quantity of at least one hot junction fixation clip 70 is at least two, so that the first condensation segment of every hot side heat 60 It is utilized respectively a corresponding hot junction fixation clip 70 with least part of pipeline section of the second condensation segment to connect with the inner surface heat of shell 50 Connect.As shown in fig. 6, the quantity of an at least hot side heat 60 can be at least three, every hot junction in a part of hot side heat At least part of pipeline section of the first condensation segment of heat pipe 60 and the second condensation segment utilizes corresponding hot junction solid along horizontal longitudinal direction respectively Fixed pressuring plate 70 is fixed on the inner surface of two opposing sidewalls of shell, the every hot side heat 60 in another part hot side heat At least part of pipeline section of the first condensation segment and the second condensation segment all utilizes corresponding hot junction fixation clip 70 solid along horizontal longitudinal direction First condensation segment and second of the every hot side heat 60 in the inner surface of the roof of shell 50, remainder hot side heat At least part of pipeline section of condensation segment is all fixed on the diapire of shell 50 along horizontal longitudinal direction using corresponding hot junction fixation clip 70 Inner surface.
The quantity of an at least hot side heat 60 of the present invention can (refrigerating capacity etc.) appropriate design according to the actual needs, often The position of the first condensation segment of root hot side heat 60 and the second condensation segment resets also dependent on being actually needed.For example in radiating When amount is within 100W, by arranging, the heat of semiconductor module is conducted to the both sides of shell 50 by 4 " U-shaped like " heat pipes Face, roof and diapire.When heat dissipation capacity is 100~125W, by 5 " U-shaped like " heat pipes of arranging by the heat of semiconductor module Amount is conducted to the two sides of shell 50, roof and diapire.When heat dissipation capacity is 125~150W, by 6 " U-shaped like " of arranging The heat of semiconductor module is conducted to the two sides of shell 50, roof and diapire by heat pipe.In general, hot junction heat often increases 25W, then need to increase a hot side heat 60.
In some alternate embodiment of the present invention, the first condensation segment of every hot side heat 60 and the second condensation segment At least partly pipeline section is fixed on respective side walls of shell respectively along horizontal longitudinal direction using corresponding hot junction fixation clip 70 Inner surface and roof inner surface.For example, the quantity of an at least hot side heat 60 can be 2, a hot side heat 60 At least part of pipeline section of the first condensation segment is fixed on the one of shell 50 along horizontal longitudinal direction using corresponding hot junction fixation clip 70 The inner surface of individual respective side walls, at least part of pipeline section of the second condensation segment utilizes corresponding hot junction fixation clip along horizontal longitudinal direction The inner surface of 70 roofs being fixed on shell 50;At least part of pipeline section of the first condensation segment of an other hot side heat 60 is along water Flat longitudinal direction is fixed on the inner surface of respective side walls of shell 50, the second condensation segment using corresponding hot junction fixation clip 70 At least part of pipeline section be fixed on along horizontal longitudinal direction using corresponding hot junction fixation clip 70 shell 50 roof inner surface.
In other alternate embodiments of the present invention, the quantity alternatively at least two of an at least hot side heat 60 At least part of pipeline section of root, the first condensation segment of the every hot side heat 60 in a part of hot side heat and the second condensation segment is respectively It is fixed on the inner surface of two opposing sidewalls of shell 50, its remaining part along horizontal longitudinal direction using corresponding hot junction fixation clip 70 The first condensation segment of every hot side heat 60 in hot side heat and at least part of pipeline section of the second condensation segment is divided all to indulge along level It is fixed on the inner surface of the roof of shell 50 to direction using corresponding hot junction fixation clip 70.Other substituting in the present invention In embodiment, the first condensation segment of every hot side heat 60 and at least part of pipeline section of the second condensation segment are respectively along level longitudinal direction side Inner surface to two opposing sidewalls being fixed on shell using corresponding hot junction fixation clip 70.
In a preferred embodiment of the invention, semiconductor module 20 may include semiconductor chilling plate 21, cold end passes Hot substrate 22, hot junction heat transfer substrate 25 and cool guiding block 23 and the cold and hot end thermal insulation layer 24 with central opening.Semiconductor refrigerating The quantity of piece 21 can be one or more.In embodiments of the present invention, the quantity of semiconductor chilling plate 21 is one piece.Cool guiding block 23 Rear surface contact against with the cold end of semiconductor chilling plate 21, the rear table of the front surface of cool guiding block 23 and cold end heat transfer substrate 22 Face contacts against, and the cold of semiconductor chilling plate 21 is reached cold end heat transfer substrate 22.Semiconductor chilling plate 21 and cool guiding block In 23 central openings being arranged on cold and hot end thermal insulation layer 24, the hot junction of semiconductor chilling plate 21 protrude from or flush in cold and hot end every The trailing flank of thermosphere 24, the front surface of cool guiding block 23 protrudes from or flushes in the leading flank of cold and hot end thermal insulation layer 24, cold to prevent Carry out cold and hot exchange between end heat transfer substrate 22 and hot junction heat transfer substrate 25.Hot junction heat transfer substrate 25 is installed into makes its front surface Contact against with the hot junction of semiconductor chilling plate 21, by the heat transfer of semiconductor chilling plate 21 to shell 50, dissipated Heat.At least one holding tank is formed with hot junction heat transfer substrate 25, each holding tank is configured to accommodate a corresponding hot side heat 60 at least part of evaporator section.Semiconductor chilling plate 21, cold end heat transfer substrate 22, hot junction heat transfer substrate 25 and cool guiding block 23 are mutual Between contact surface heat-conducting silicone grease all to be smeared, to reduce contact surface thermal resistance.
In a preferred embodiment of the invention, the rear surface of hot junction heat transfer substrate 25 and the rear wall of shell 50 is interior Surface contacts against, and the innermost layer of the rear wall of shell 60 is graphite film layer 51, so that hot junction heat transfer substrate 25 and graphite film layer 51 contacts, significantly increase area of dissipation.In some other embodiments of the present invention, each appearance of hot junction heat transfer substrate 25 The opening of groove received is in the front surface of hot junction heat transfer substrate 25, so that the part of at least part of evaporator section of every hot side heat 60 Outer wall is contacted against with the hot junction of semiconductor chilling plate, so that the interior table of the evaporator section of every hot side heat 60 and shell 50 rear wall There is between face certain spacing, can prevent the evaporator section of every hot side heat 60 from absorbing the heat on shell 50 inner surface, fall Low heat emission effect.
Fig. 7 is the schematic local structural graph of the inner bag of the semiconductor freezer with one embodiment of the invention.This The semiconductor freezer of inventive embodiments may also include and reaches the cold of semiconductor module 20 in semiconductor freezer At least one cool side heat pipes 30 of gallbladder 10 and at least one cold end fixation clip 40.Each cold end fixation clip 40 is by every cold end At least part of evaporator section of heat pipe 30 is fixed on the outer surface of inner bag 10, so that at least part of evaporator section of every cool side heat pipes 30 It is posted by the outer surface of inner bag 10, so that semiconductor freezer is using outer surface of liner as cold scattering face, simplified processing process, Cost-effective.Each cold end fixation clip 40 is consistent with the structure of the hot junction fixation clip 70 for fixing hot side heat 60.? In some alternate embodiment of the present invention, at least part of evaporator section of every cool side heat pipes 30 is welded in the appearance of inner bag 10 Face, and adopt the welding manner for soldering, that is, cool side heat pipes 30 can carry out soldering with the inner bag 10 processing through plating nickel on surface Connect, to reduce thermal contact resistance.
At least part of pipeline section of the first evaporator section of every cool side heat pipes 30 and the second evaporator section is respectively along level longitudinal direction side Outer surface to two opposing sidewalls being fixed on inner bag 10.Or, the quantity of at least cool side heat pipes 30 is at least three, with Two parts or three parts can be divided into.Every cool side heat pipes 30 when being separated into two parts, in a part of cool side heat pipes The first evaporator section and at least part of pipeline section of the second evaporator section be fixed on two phases of inner bag 10 respectively along horizontal longitudinal direction The outer surface of offside wall, the first evaporator section of the every cool side heat pipes 30 in remainder cool side heat pipes and the second evaporator section are extremely Small part pipeline section is all fixed on the outer surface of the roof of inner bag 10 along horizontal longitudinal direction.When being separated into three parts, one At least part of pipeline section of the first evaporator section of every cool side heat pipes 30 in point cool side heat pipes and the second evaporator section is respectively along level Longitudinal direction is fixed on the outer surface of two opposing sidewalls of inner bag 10, the every cool side heat pipes 30 in another part cool side heat pipes The first evaporator section and the second evaporator section at least part of pipeline section be all fixed on along horizontal longitudinal direction inner bag 10 roof outer Surface, the first evaporator section of the every cool side heat pipes 30 in remainder cool side heat pipes and at least part of pipeline section of the second evaporator section All it is fixed on the outer surface of the diapire of inner bag 10 along horizontal longitudinal direction.
At least one holding tank is also formed with cold end heat transfer substrate 22, each holding tank be configured to accommodate one accordingly cold At least part of condensation segment of end heat pipe 30.The opening of each holding tank is in the rear surface of cold end heat transfer substrate 22, so that every The outer wall of at least part of condensation segment of cool side heat pipes 30 and the front surface of cool guiding block 23 contact against.Cold end heat transfer substrate 22 Front surface contact against with the outer surface of the rear wall of inner bag 10.At least part of outermost layer of inner bag 10 is alternatively the stone of inner bag 10 Ink film layer 12, to improve refrigerating efficiency.Specifically, the outermost layer of at least part of gallbladder wall of inner bag 10 is graphite film layer, and thereon The outermost layer of the gallbladder wall of at least part of evaporator section of one or more cool side heat pipes 30 that recline is necessary for graphite film layer, will be cold The cold that end heat pipe 30 spreads out of uniformly is dissipated into substrate layer 11 surface of the gallbladder wall with graphite film layer.Every cool side heat pipes 30 At least partly evaporator section is flat tube.
In one embodiment of the invention, the substrate layer of inner bag 10, cold end heat transfer substrate 22 and hot junction heat transfer substrate 25 And the substrate layer of shell 50 is integrally formed all using aluminium alloy 6061 and using aluminium section bar cold extruding formation process, and it is entered Row plating nickel on surface is processed, and carries out argon arc welding to its gap, is holed in relevant position using drilling machine.Additionally, shell 50 outer surface can Cover ABS hard material.The material of cool guiding block 23 can be using the higher copper product of heat transfer efficiency.The substrate layer of inner bag 10, cold end The substrate layer of heat transfer substrate 22, cool guiding block 23 and hot junction heat transfer substrate 25 and shell 50 may also be employed other metal materials.
Cool side heat pipes 30 and hot side heat 60 mainly use copper product, the working medium in cool side heat pipes 30 can for ethanol or Methanol, the working medium in hot side heat 60 can be deionized water.In order to ensure the temperature at cold and hot end and the temperature of semiconductor chilling plate 21 Difference, single cool side heat pipes 30 and hot side heat 60 its temperature difference under the conditions of the power test of 25W are necessarily less than 5 DEG C.Cool side heat pipes 30 and hot side heat 60 technique after oversintering, fluid injection, evacuation, degasification and sealing after be initially formed round directly-heated pipe, then utilize Circle directly-heated pipe is struck out required form, such as flat tube shape by punch press and pressing mold, also needs to carry out finishing processing to its surface after flattening, To ensure flatness.Larger in use environment humidity, also need to carry out chemical nickel plating to cool side heat pipes 30 and hot side heat 60 surface, And carry out Salt frog test, to avoid cool side heat pipes to be corroded.
The cold and hot end thermal insulation layer 24 of semiconductor module 20 adopts polyurethane foam material, foaming-formed by mould, Then is holed in its relevant position, and semiconductor chilling plate 21 and cool guiding block 23 interference fit are positioned in central opening.
Fig. 8 is the indicative flowchart of the manufacture method of semiconductor freezer according to an embodiment of the invention.This Inventive embodiments additionally provide a kind of manufacture method manufacturing any of the above-described kind of semiconductor freezer, and it includes:
Step A:At least part of condensation segment of every hot side heat of semiconductor freezer is positioned over semiconductor refrigerating The pre-position of the inner surface of the shell of refrigerator.
Step B:Each hot junction fixation clip cover is buckled at least part of condensation segment of corresponding hot side heat.
Step C:Each hot junction fixation clip is fixed on shell.Specifically, can be solid by each hot junction by multiple screws The fixing flank of each of fixed pressuring plate is fixed on shell, and each hot junction fixation clip is fixed on shell.
In one embodiment of the invention, also include step A1 before step A:Reclining on shell has hot side heat At least partly graphite spraying coating or stickup graphite film on the inner surface of the substrate layer of shell wall of condensation segment, to form graphite film Layer;And/or on the inner surface of the substrate layer of the rear wall of shell graphite spraying coating or paste graphite film.In this, also can be Graphite spraying coating or paste graphite film that is to say, that step A1 on the inner surface of the substrate layer of other shell walls of shell Can be regarded as:Graphite spraying coating or stickup graphite film on the inner surface of the substrate layer of the predetermined shell wall of shell, To form graphite film layer, the predetermined shell wall of shell at least includes reclining thereon has one or more hot side heat at least The shell wall of partial condensation section and/or rear wall.
For example, in one specific embodiment of the present invention, recline on the inner surface of two opposing sidewalls of shell heat End heat pipe.It will be appreciated by persons skilled in the art that can be only on the inner surface of the substrate layer of two opposing sidewalls of shell Graphite spraying coating or paste graphite film, the even heat of semiconductor module is disseminated to two opposite sides of shell Wall, so that enclosure is caught a cold uniformly;Also can only on the inner surface of the substrate layer of the rear wall of shell graphite spraying coating or Person pastes graphite film, and the heat on the hot junction heat transfer substrate of semiconductor module is transferred directly to housing back wall;Also can be outside Graphite spraying coating or stickup graphite film on the inner surface of substrate layer of two opposing sidewalls of shell and rear wall;Also can be in shell The inner surface of whole substrate layers on graphite spraying coating or paste graphite film.Above-mentioned four kinds of situations, can be according to quasiconductor system The work requirements of cold refrigerator are selected.
In another embodiment of the invention, may also comprise step A2 before step A:By pressure-riveting process by every heat At least part of evaporator section of end heat pipe embeds the corresponding receiving of the hot junction heat transfer substrate of semiconductor module of semiconductor freezer In groove.
Also include step D after step c:The front surface of the cold end heat transfer substrate of semiconductor module is resisted against quasiconductor The rear surface of the inner bag of refrigerator;
The semiconductor chilling plate of semiconductor module, cool guiding block are installed on the first prepackage group being formed after the thermal insulation layer of cold and hot end The front surface of part is resisted against the rear surface of cold end heat transfer substrate;
The front surface of the hot junction heat transfer substrate of semiconductor module is resisted against the hot junction of semiconductor chilling plate, and makes shell Part I is fixedly connected with inner bag;
Multiple screws are sequentially passed through respectively the respective through hole on the heat transfer substrate of hot junction, accordingly leading on the thermal insulation layer of cold and hot end The screw in the hole on inner bag rear wall is screwed in after respective through hole on hole and cold end heat transfer substrate;
The rear wall of shell is installed, and so that the inner surface of rear wall of shell is contacted against with the rear surface of hot junction heat transfer substrate.
The front surface of the cold end heat transfer substrate by semiconductor module in step D is resisted against in semiconductor freezer The rear surface of gallbladder includes:At least part of condensation segment of every cool side heat pipes is embedded by semiconductor freezer by pressure-riveting process In the corresponding holding tank of the cold end heat transfer substrate of semiconductor module;At least portion by every cool side heat pipes of semiconductor freezer On the outer surface of inner bag that point evaporator section is fixed on semiconductor freezer, to form the second pre- arrangement.
The front surface of the hot junction heat transfer substrate of semiconductor module is resisted against the hot junction of semiconductor chilling plate, that is, will be outer The Part I of shell and hot junction heat transfer substrate are arranged on the second pre- arrangement.
Step E is also included after step D:Filled polyurethane foaming layer between inner bag and shell, to completely cut off between storing Indoor cold is revealed.
Step F is also included after step E:In the contact position of the Qianmen of semiconductor freezer and shell, magnetic is installed close Strip of paper used for sealing, hinge is passed through together with housing hinge in Qianmen.
It should be noted that above-mentioned steps have been able to make semiconductor freezer be operated, but in order to attractive in appearance or its It requires in addition it is also necessary to install part of some ornamental member, protectiveness etc..
So far, although those skilled in the art will appreciate that detailed herein illustrate and describe the multiple of the present invention and show Example property embodiment, but, without departing from the spirit and scope of the present invention, still can be direct according to present disclosure Determine or derive other variations or modifications of many meeting the principle of the invention.Therefore, the scope of the present invention is it is understood that and recognize It is set to and cover other variations or modifications all these.

Claims (16)

1. a kind of semiconductor freezer, reaches institute including shell and semiconductor module and by the heat of described semiconductor module At least one hot side heat stating shell is it is characterised in that also include:
At least one hot junction fixation clip, each described hot junction fixation clip is by least part of condensation of every described hot side heat Section is fixed on the inner surface of described shell, so that at least part of condensation segment of every described hot side heat is posted by described shell Inner surface;And
Described semiconductor module includes:
Semiconductor chilling plate;With
Hot junction heat transfer substrate, it is installed into makes its front surface and the hot junction of described semiconductor chilling plate contact against, described heat It is formed with least one holding tank, each described holding tank is configured to accommodate an accordingly described hot side heat on the heat transfer substrate of end At least part of evaporator section;
The opening of each described holding tank is in the front surface of described hot junction heat transfer substrate, so that every described hot side heat is extremely The outer wall of small part evaporator section is contacted against with the hot junction of described semiconductor chilling plate.
2. semiconductor freezer according to claim 1 is it is characterised in that each described hot junction fixation clip has:
Protrusion, is formed with the fixing groove extending along its length, to accommodate at least partly cold of corresponding described hot side heat Solidifying section;With
That the edge extending from two of the described protrusion length directions along described protrusion respectively extends laterally and institute State two fixing flanks that shell is fixedly connected and abuts on the inner surface of described shell.
3. semiconductor freezer according to claim 2 it is characterised in that
The fixing flank of each of each described hot junction fixation clip is fixed on described shell by screw.
4. semiconductor freezer according to claim 1 it is characterised in that
Recline on described shell the shell wall having at least part of condensation segment of described hot side heat innermost layer be graphite film layer.
5. semiconductor freezer according to claim 1 it is characterised in that
The condensation segment of every described hot side heat includes first condensation segment and second of the evaporator section both sides positioned at this hot side heat Condensation segment;
The quantity of at least one hot junction fixation clip described is at least two, so that the first condensation segment of every described hot side heat It is utilized respectively a corresponding hot junction fixation clip with least part of pipeline section of the second condensation segment to connect with the inner surface heat of described shell Connect.
6. semiconductor freezer according to claim 5 it is characterised in that
At least part of pipeline section of the first condensation segment of every described hot side heat and the second condensation segment is respectively along horizontal longitudinal direction It is fixed on the inner surface of two opposing sidewalls of described shell using accordingly described hot junction fixation clip.
7. semiconductor freezer according to claim 5 it is characterised in that
The quantity of a described at least hot side heat is at least two, every hot side heat in a part of described hot side heat At least part of pipeline section of the first condensation segment and the second condensation segment is pressed along horizontal longitudinal direction using accordingly described hot junction is fixing respectively Plate is fixed on the inner surface of two opposing sidewalls of described shell, every hot side heat in hot side heat described in remainder At least part of pipeline section of the first condensation segment and the second condensation segment is all along horizontal longitudinal direction using accordingly described hot junction fixation clip It is fixed on the inner surface of the roof of described shell;Or
The quantity of a described at least hot side heat is at least three, every hot side heat in a part of described hot side heat At least part of pipeline section of the first condensation segment and the second condensation segment is pressed along horizontal longitudinal direction using accordingly described hot junction is fixing respectively Plate is fixed on the inner surface of two opposing sidewalls of described shell, every hot side heat in hot side heat described in another part At least part of pipeline section of the first condensation segment and the second condensation segment is all along horizontal longitudinal direction using accordingly described hot junction fixation clip It is fixed on the inner surface of the roof of described shell, the first condensation segment of every hot side heat in hot side heat described in remainder With at least part of pipeline section of the second condensation segment be all fixed on along horizontal longitudinal direction using accordingly described hot junction fixation clip described The inner surface of the diapire of shell.
8. semiconductor freezer according to claim 1 it is characterised in that
The rear surface of described hot junction heat transfer substrate and the inner surface of the rear wall of described shell contact against, the rear wall of described shell Innermost layer is graphite film layer.
9. semiconductor freezer according to claim 1 is it is characterised in that described semiconductor module further includes:
Cool guiding block, surface and the cold end of described semiconductor chilling plate contact against thereafter;With
There is the cold and hot end thermal insulation layer of central opening, described semiconductor chilling plate and described cool guiding block are arranged on described central opening In, the hot junction of described semiconductor chilling plate protrudes from or flushes in the trailing flank of described cold and hot end thermal insulation layer, described cool guiding block Front surface protrudes from or flushes in the leading flank of described cold and hot end thermal insulation layer;And
Cold end heat transfer substrate, surface and the front surface of described cool guiding block contact against thereafter.
10. semiconductor freezer according to claim 1 it is characterised in that
At least part of condensation segment of every described hot side heat is flat tube.
11. semiconductor freezers according to claim 1 it is characterised in that
Described shell includes separate Part I and rear wall, and described Part I includes the roof of described shell, diapire And two opposite side walls, at least part of condensation segment of every described hot side heat is fixed on described by each described hot junction fixation clip The inner surface of Part I, to be easy to the installation of described semiconductor module when manufacturing described semiconductor freezer.
The manufacture method of semiconductor freezer any one of a kind of 12. claim 1 to 11 is it is characterised in that include:
Step A:At least part of condensation segment of every hot side heat of described semiconductor freezer is positioned over described quasiconductor The pre-position of the inner surface of the shell of refrigerator;
Step B:Each described hot junction fixation clip cover is buckled in accordingly at least part of condensation segment of described hot side heat;
Step C:Each described hot junction fixation clip is fixed on described shell.
13. manufacture methods according to claim 12 it is characterised in that
By multiple screws, each fixing flank of each described hot junction fixation clip is fixed on described shell, by each institute State hot junction fixation clip and be fixed on described shell.
14. manufacture methods according to claim 12 are it is characterised in that also included step A1 before described step A:
Recline on the housing and spray on the inner surface of the substrate layer of shell wall have at least part of condensation segment of described hot side heat Graphite paint or stickup graphite film, to form graphite film layer;And/or
Graphite spraying coating or stickup graphite film on the inner surface of the substrate layer of the rear wall of described shell.
15. manufacture methods according to claim 12 are it is characterised in that also included step A2 before described step A:
By pressure-riveting process, at least part of evaporator section of every described hot side heat is embedded the half of described semiconductor freezer In the corresponding holding tank of the hot junction heat transfer substrate of conductor module.
16. manufacture methods according to claim 15 are it is characterised in that also include step D after described step C:
The front surface of the cold end heat transfer substrate of described semiconductor module is resisted against after the inner bag of described semiconductor freezer Surface;
The semiconductor chilling plate of described semiconductor module, cool guiding block are installed on the first prepackage group being formed after the thermal insulation layer of cold and hot end The front surface of part is resisted against the rear surface of described cold end heat transfer substrate;
The front surface of the hot junction heat transfer substrate of described semiconductor module is resisted against the hot junction of described semiconductor chilling plate, and makes institute The Part I stating shell is fixedly connected with described inner bag;
Multiple screws are sequentially passed through respectively the respective through hole on the heat transfer substrate of described hot junction, the phase on the thermal insulation layer of described cold and hot end The screw in the hole on described inner bag rear wall is screwed in after answering the respective through hole on through hole and described cold end heat transfer substrate;
The rear wall of described shell is installed, and so that the inner surface of rear wall of described shell and the rear surface of described hot junction heat transfer substrate is connect Touch against.
CN201410437143.9A 2014-08-29 2014-08-29 Semiconductor refrigeration refrigerator and manufacturing method thereof CN104329851B (en)

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CN201111626Y (en) * 2007-05-17 2008-09-10 黄钟 Hot pipe heat conduction heat radiator
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