CN110836559A

CN110836559A - Method for controlling semiconductor refrigerating sheet

Info

Publication number: CN110836559A
Application number: CN201911380934.1A
Authority: CN
Inventors: 王博良
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-12-27
Filing date: 2019-12-27
Publication date: 2020-02-25

Abstract

A method for controlling a semiconductor refrigeration chip. Through the real-time monitoring of the temperature and the humidity of the two sides of the semiconductor refrigerating sheet, the power of the refrigerating sheet and the radiator is dynamically adjusted, so that the refrigerating efficiency is improved, the power consumption is saved, and the purpose of preventing condensed water is achieved. Can be used for the use of various semiconductor refrigerating sheets.

Description

Method for controlling semiconductor refrigerating sheet

Technical Field

The heat dissipation design method has the advantages that the heat dissipation design method can be used for manufacturing corresponding sizes according to requirements of various application fields, and is used for heat dissipation design of heating elements in electronic information technologies (integrated circuits, computer technologies, communication technologies and other technologies), advanced manufacturing and automation technologies (major equipment, automobile key parts, automatic control technologies and products, power transmission and transformation equipment and other technologies), safety production technologies, broadcast movie and television technologies, lighting technologies and household appliances.

Background

Current heat dissipation techniques all rely on the second law of thermodynamics, i.e., heat cannot be spontaneously transferred from a low temperature object to a high temperature object. Existing heat dissipation technologies use metal (heat pipe) or other heat conducting materials to passively conduct heat to a large area surface, or (directly) carry heat away from a heat generating device through convection or phase change of air flow or low-temperature liquid.

The Peltier effect means that when a current passes through a circuit composed of different conductors, heat absorption and heat release phenomena occur at joints of the different conductors along with the difference of current directions, in addition to irreversible joule heat generation. The semiconductor refrigerating plate made by using said effect is a heat pump with refrigerating surface and heat-transferring surface, and at the same time its volume is small, noise is low, and it has no vibration and is reliable. The existing semiconductor refrigerating sheet cannot meet the requirement of a computer for accurate temperature control, cannot balance energy consumption, can produce condensed water under certain conditions, not only influences the normal operation of the computer, but also influences the service life of the refrigerating sheet.

Disclosure of Invention

Through the real-time monitoring of the temperature and the humidity of the two sides of the semiconductor refrigerating sheet, the power of the refrigerating sheet and the radiator is dynamically adjusted, so that the refrigerating efficiency is improved, the power consumption is saved, and the purpose of preventing condensed water is achieved. As shown in figure 1.

Drawings

FIG. 1: patent control hardware structure diagram

FIG. 2 is a drawing: patent control hardware logic diagram

Detailed Description

The patent mainly comprises two parts: control hardware and control methods.

The control hardware mainly comprises a control board and one or more temperature sensors, and a humidity sensor can be optionally arranged. The control board is connected with an input power supply, an output semiconductor refrigerating sheet power supply, a radiator (optional) control signal and power supply and each sensor, and is provided with one or more data interfaces capable of communicating with the outside. The stability and reliability of the whole system can be ensured by installing a plurality of sets of control boards. The sensors are sequentially arranged on the refrigerating surface and the heat transfer surface of the refrigerating sheet according to the arrangement quantity and the principle of uniform distribution. The optional humidity sensor is only mounted on the refrigerated surface.

In the aspect of the control method, the control board monitors the returned data of the sensor at a certain frequency, and controls the refrigeration power of the semiconductor refrigeration piece in modes including but not limited to direct current voltage regulation, pulse width modulation and the like through a modifiable control strategy. Fig. 2 is a control strategy.

Claims

1. A method for controlling semiconductor refrigerating chip is composed of control hardware and control method.

2. The method of claim 1, wherein the refrigeration power is dynamically adjusted based on the heating value using one or more sensors and a control board.

3. Method according to claim 1, characterized in that the type (temperature, humidity, etc.), number of sensors can be flexibly configured.

4. The method of claim 1, wherein the external communication interface is configured to adjust the control strategy to work with an external device.

5. Method according to claim 1, characterized in that condensate water production is avoided by parameter adjustment of the control logic.

6. The method of claim 1, wherein the system stability and reliability are substantially ensured by deploying a plurality of controllers.

7. The method of claim 1, wherein the sensor is disposed on the semiconductor chilling plate in a manner including but not limited to edge attachment, surface attachment, and interior mounting of the semiconductor chilling plate.

8. The method of claim 1, characterized by the control logic of figure 2.

9. The method of claim 1, wherein the method is used in various situations where semiconductor chilling plates are used.