JP2005155983A - Panel cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a panel cooling device which is not bedewed in operation. <P>SOLUTION: This panel cooling device 10 uses a Peltier element 15. Since the surface temperature of a heat absorbing side heat sink 22 of the Peltier element 15 is controlled so that the surface temperature always exceeds the dew point temperature of the ambient air, dew condensation can surely be prevented in the heat sink 22, and it is not necessary to perform discharge processing or the like of condensed water. Since it is not necessary to provide a processing unit or the like of the condensed water accompanied with that, the cost of the cooling device can be reduced, and the installation location of a switchboard, a communication device and a server or the like is not limited. Also, the panel cooling device 10 is provided with an in-panel temperature detector 2 for detecting the temperature in a panel 1. When the temperature in the panel 1 detected by the in-panel temperature detector 2 is 35°C or less, power to the Peltier element 15 is stopped. Thereby, the dew condensation can be prevented and efficient cooling can be performed without reducing the temperature in the panel 1 beyond necessity. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a panel cooling device used for a panel incorporating an electric / electronic device or the like, and more particularly to a panel cooling device using a Peltier element.

2. Description of the Related Art Conventionally, a cooling device using a Peltier element has been used as a means for releasing heat generated from electrical and electronic equipment arranged inside a box such as a switchboard, a communication device, or a server to the outside of the box. In such a cooling device, an endothermic fin is disposed inside the box body, and a radiating fin is disposed outside the box body, and the heat generating surface of the electronic cooling element using the Peltier effect is joined to the radiating fin, and the endothermic fin is The endothermic surface of the electronic cooling element using the Peltier effect is joined. Here, when cooling is performed by a cooling device using a Peltier element, when the air around the heat absorption side heat sink that is the cooling side of the Peltier element is cooled to the dew point temperature or less during heat exchange, dew condensation water is generated. It is necessary to discharge the condensed water. As such a condensed water discharge device, for example, in Patent Document 1, a water receiving portion that receives condensed water, a water guiding portion that guides water in the water receiving portion, an evaporating dish that stores and evaporates the water, and absorbs water A water-absorbing evaporator and a water outlet that drains water outside the heat exchanger when water exceeds the storage limit of the evaporating dish are disclosed. In the drainage device according to Patent Document 1, since the drainage structure is very simplified, it is easy to attach and remove, and it is possible to obtain an effect that drainage can be performed at a low cost with good absorption efficiency of condensed water.
JP-A-9-112947

  However, in the conventional technology as described above, the condensation is not eliminated and the condensed water adhering to the surface of the heat sink must be drained. Therefore, a drainage device for that purpose must be installed, and the cost of the drainage device is reduced. At the same time, there is a problem that the installation environment of the switchboard, the communication device, the server and the like is limited.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a panel cooling device that does not cause condensation during operation.

  In order to achieve the above object, the panel cooling device according to claim 1 uses a Peltier element so that the surface temperature of the heat sink on the heat absorption side of the Peltier element is always equal to or higher than the dew point temperature of the surrounding air. It is controlled.

  In addition to the configuration of the panel cooling device according to claim 1, the panel cooling device according to claim 2 includes a panel temperature detection unit that detects the temperature in the panel, and detects the temperature in the panel. The power supply to the Peltier element is stopped when the temperature in the panel detected by the unit is equal to or lower than a certain temperature.

  In addition to the configuration of the panel cooling device according to claim 1 or 2, the panel cooling device according to claim 3 includes a panel temperature detection unit that detects the temperature in the panel, A power supply control unit for controlling the operation of the panel cooling device based on the temperature in the panel detected by the temperature detection unit is provided.

  In addition to the configuration of the panel cooling device according to any one of claims 1 to 3, the panel cooling device according to claim 4 is a temperature detector that detects the surface temperature of the heat absorption side heat sink of the Peltier element. And a drive voltage to the Peltier element is controlled based on the surface temperature of the heat absorption side heat sink detected by the temperature detection unit.

  In the panel cooling device according to the present invention, the surface temperature of the heat sink on the heat absorption side of the Peltier element is controlled so as to always be equal to or higher than the dew point temperature of the surrounding air, so that dew condensation on the heat sink is ensured. Therefore, it is not necessary to perform a condensate discharge process. In addition, it is not necessary to provide a condensate treatment device and the like, so the cost of the cooling device can be reduced, and the installation location of the switchboard, communication device, server, etc. is not limited. Also, a panel temperature detector for detecting the temperature in the panel is provided, and the supply of power to the Peltier element is stopped when the temperature in the panel detected by the panel temperature detector is below a certain temperature. I made it. As a result, condensation can be prevented and efficient cooling can be performed without lowering the temperature in the panel more than necessary.

  In addition, the cooling device can be operated more efficiently by providing a power supply control unit that controls the operation of the panel cooling device based on the temperature in the panel detected by the panel temperature detection unit. Furthermore, by providing a temperature detector that detects the surface temperature of the heat sink on the heat absorption side of the Peltier element, it is possible to accurately grasp the temperature of the heat sink where condensation may occur, and this temperature detector detects the temperature. The driving voltage to the Peltier element can be controlled based on the surface temperature of the heat absorption side heat sink.

  Hereinafter, a board cooling device according to a first embodiment of the present invention will be described with reference to the drawings. First, with reference to FIG. 1, the apparatus structure of the board 1 to which the board cooling device according to the present invention is attached will be briefly described. The panel 1 accommodates electrical and electronic equipment such as a switchboard, a distribution panel, and a communication panel inside, and a cooling device 10 for cooling the inside of the panel 1 is provided on a side surface thereof. Inside the panel 1, a panel temperature detector 2 for detecting the temperature in the panel is provided, and this panel temperature detector 2 is connected via a power control unit 220 provided in the cooling device 10. It is connected to a DC power source 120 of the Peltier unit 20 described later.

  Next, the cooling device 10 will be described in detail with reference to FIG. Here, FIG. 2 is a block diagram schematically showing the cooling device 10. As shown in FIG. 2, the cooling device 10 is configured by arranging a Peltier unit 20, a heat radiating radiator 30, a heat absorbing radiator 31, and the like in a cooling device housing 11. The Peltier unit 20 provided in the cooling device casing 11 is configured in a state in which the Peltier element 15 is sandwiched between the heat radiation side heat sink 21 and the heat absorption side heat sink 22. The heat dissipation side heat sink 22 is connected to the heat absorption radiator 31 via the reserve tank 26 and the circulation pump P. The heat dissipation side heat sink 22 is connected to the heat dissipation radiator 30 via the tank 25 and the circulation pump P. Further, a heat radiating fan 130 is provided facing the back surface of the heat radiating radiator 30, and a heat absorbing fan 131 is provided facing the back surface of the heat absorbing radiator 31. Further, a DC power source 120 is connected to the Peltier unit 20, and a power source control unit 220 is connected to the DC power source 120, so that power supply to the Peltier unit 20 is controlled by the power source control unit 220. Yes. It should be noted that it is preferable to select an appropriate capability of the Peltier element 15 of the Peltier unit 20 according to the amount of heat generated by the devices in the panel 1.

  In this cooling device 10, the refrigerant cooled by the Peltier unit 20 flows through the heat absorption side heat sink 22, circulates through the heat absorption side path L 1 via the reserve tank 26 by the circulation pump P, and is provided on the back surface of the heat absorption radiator 31. The inside of the board 1 is cooled by sending cool air into the board 1 (refer to FIG. 1) by the heat absorbing fan 131. Further, the heat dissipation side heat sink 21 of the Peltier unit 20 is connected to the heat dissipation radiator 30 via the circulation pump P and the reserve tank 25, and the refrigerant circulates in the heat dissipation side path L2 so that the heat dissipation side of the Peltier unit 20 is reached. The heat generated by the heat is transferred to the heat dissipation radiator 30, and the heat is released by the heat dissipation fan 130 on the airflow to the outside.

  Here, when the Peltier unit 20 continues to operate, the surface temperature of the heat sink side heat sink 22 decreases and falls below the dew point temperature of the air around the heat sink. In order to prevent dew condensation, the temperature of the heat sink side heat sink 22 is prevented from dropping below the dew point temperature of the surrounding air. Specifically, in this embodiment, the temperature of the heat absorption side heat sink 22 is controlled to be about 27 ° C. with reference to 25 ° C., which is the dew point temperature of air under general humidity. Specifically, the temperature of the heat sink side heat sink 22 is adjusted to 27 ° C. by adjusting the capacity of the Peltier element 15, the drive current of the Peltier element 15 when the rated voltage is applied, the capacity of the heat sink fan 131, the flow rate of the refrigerant, and the like. I try to keep it at a certain level. Thereby, dew condensation on the heat absorption side heat sink 22 can be prevented, there is no need to provide a device for treating the dew condensation water, and the installation location of the cooling device housing is not limited.

  When the temperature detected by the in-panel temperature detector 2 provided in the panel 1 is 35 ° C. or lower regardless of the temperature of the heat sink 22 on the heat absorption side, the power controller 220 supplies power to the Peltier unit 20. The supply is stopped. In addition, it is good also as what can adjust this temperature suitably according to the kind of the electric and electronic equipment incorporated in a board, and it is preferable to set to about 35-40 degreeC in that case. As a result, efficient cooling can be realized without wastefully operating the Peltier unit 20.

  Next, a second embodiment of the panel cooling device according to the present invention will be described. In the present embodiment, the power supply control unit 220 provided in the cooling device 10 of the first embodiment controls the amount of power supplied to the Peltier unit 20. Specifically, the temperature detected by the in-panel temperature detector 2 provided in the panel 1 approaches 35 ° C., which is a temperature at which power supply to the Peltier unit 20 is stopped (hereinafter referred to as “in-panel set temperature”). Accordingly, the amount of power supplied to the Peltier unit 20 is controlled stepwise. Specifically, in this embodiment, the Peltier unit 20 is rated for operation until the temperature detected in the panel is 3 ° C. higher than the set temperature in the panel of 35 ° C. If the difference between the two becomes less than 3 ° C., 80% of the rated power is supplied to the Peltier element 15. Thereby, the Peltier unit 20 can be efficiently operated without waste.

  Also in the cooling device of the present embodiment, the Peltier element 15 drive current when the rated voltage is applied with the capability of the Peltier element 15 on the basis of 25 ° C., which is the dew point temperature of air under general humidity. The temperature of the heat absorption side heat sink 22 is controlled to about 27 ° C. by adjusting the capacity of the heat absorption fan 131 and the flow rate of the refrigerant. Therefore, it is possible to prevent dew condensation on the heat absorption side heat sink 22, it is not necessary to provide a device for treating the dew condensation water, and the installation place of the switchboard, communication device, server, etc. is not limited.

  Next, a third embodiment of the panel cooling apparatus according to the present invention will be described with reference to FIG. As shown in FIG. 3, in the cooling device 100 of the present embodiment, in addition to the configuration of the cooling device 10 described above, the temperature detection for detecting the surface temperature of the heat absorption side heat sink 22 is performed on the heat absorption side heat sink 22 of the Peltier unit 20. A vessel 122 is provided. The temperature detector 122 is connected to the DC power source 120 via the power supply control unit 320, and controls the drive voltage to the Peltier element 15 according to the temperature detected by the temperature detector 122. Specifically, the supply of power to the Peltier unit 20 is stopped when the detection temperature at the heat absorption side heat sink 22 reaches 27 ° C., and as the detection temperature at the heat absorption side heat sink 22 approaches 27 ° C., the Peltier unit 20 The amount of power supplied to the vehicle is controlled in stages.

  Specifically, in the present embodiment, the set temperature of the heat sink side heat sink 22 is set to 27 ° C., and the Peltier unit 20 is rated for operation until the detected temperature is 3 ° C. higher than the set temperature 27 ° C. When the difference between the detected temperature and the set temperature falls below 3 ° C., 80% of the rated power is supplied to the Peltier element 15. As a result, the temperature of the heat absorption side heat sink 22 can always be set to about 27 ° C., and it is possible to reliably prevent the occurrence of dew condensation on the heat sink, so it is necessary to provide a device or the like for treating the dew condensation water. In addition, the installation location of the switchboard, communication device, server, etc. is not limited.

  The present invention is not limited to the above embodiment, and various modifications can be made. For example, a dew condensation water detector that detects the occurrence of dew condensation water may be provided on the heat absorption side heat sink, and it may be provided in the event of a failure, whereby the reliability of the cooling device can be further improved. Further, the cooling device may be one that attaches a sword mountain-shaped heat radiation fin and a heat absorption fin directly to the Peltier element without using a radiator, and performs heat radiation and heat absorption by flowing air through each fin. Also, there are differences in the usage environment, humidity, etc. depending on the area where the cooling device is used, etc., and the temperature at which condensation occurs on the heat sink varies, so the set temperature, the drive current of the Peltier element, etc. A changeover switch to be changed may be provided. Further, in the above embodiment, when the supply of power to the Peltier unit 20 is stopped by the set temperature of the heat sink on the panel and the heat sink side, the amount of power supplied as the detected temperature in the panel and the heat sink on the heat sink side approaches the set temperature. If the detected temperature is 3 ° C higher than the set temperature, the Peltier unit 20 is rated and the difference between the detected temperature and the set temperature is less than 3 ° C. Although it is performed in accordance with the standard of supplying 80% of rated power to the Peltier element 15, the method for controlling the amount of power supply is not limited to this.

It is a figure which shows the apparatus structure of the panel 1 and the cooling device 10. FIG. 2 is a block diagram schematically showing the configuration of the cooling device 10. FIG. 2 is a block diagram schematically showing a configuration of a cooling device 100. FIG.

Explanation of symbols

1 panel 10 cooling device 15 Peltier element 20 Peltier unit 21 heat radiation side heat sink 22 heat absorption side heat sink 120 DC power supply 122 temperature detector 220 power control unit 320 power control unit

Claims (4)

  A panel cooling apparatus using a Peltier element, wherein the surface temperature of the heat absorption side heat sink of the Peltier element is controlled so as to be always equal to or higher than the dew point temperature of the surrounding air.   A panel temperature detector for detecting the temperature in the panel is provided, and the supply of power to the Peltier element is stopped when the temperature in the panel detected by the panel temperature detector is below a certain temperature. The panel cooling device according to claim 1.   A panel temperature detector for detecting the temperature in the panel is provided, and a power controller for controlling the operation of the panel cooling device is provided based on the panel temperature detected by the panel temperature detector. The panel cooling device according to claim 1, wherein the panel cooling device is characterized by the following.   A temperature detection unit for detecting a surface temperature of the heat absorption side heat sink of the Peltier element; and a drive voltage to the Peltier element is controlled based on the surface temperature of the heat absorption side heat sink detected by the temperature detection unit. The panel cooling device according to any one of claims 1 to 3, wherein

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