CN203474703U - Cooling coating and cooling fin - Google Patents
Cooling coating and cooling fin Download PDFInfo
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- CN203474703U CN203474703U CN201320124099.7U CN201320124099U CN203474703U CN 203474703 U CN203474703 U CN 203474703U CN 201320124099 U CN201320124099 U CN 201320124099U CN 203474703 U CN203474703 U CN 203474703U
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- heat
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- heating device
- carrier layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0269—Non-uniform distribution or concentration of particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model is applicable to the technical field of cooling, and discloses a cooling coating and a cooling fin which are used for directly or indirectly contacting to disperse heat of an electric heating device. The cooling coating comprises a carrier layer arranged at the outer surface of the electric heating device, wherein a heat transfer layer for transferring the heat into an infrared ray is evenly arranged on the carrier layer. The cooling coating directly contacts with the electric heating device or contacts the electric heating device through a carrier in use; the heat energy is transferred into the infrared ray by the heat transfer layer, so that the heat is dispersed, and the cooling efficiency is high. Compared with the prior art, the cooling efficiency in active cooling can be considered, meanwhile, an electric product with smaller volume in passive cooling is obtained; the cooling efficiency of the electronic product is improved; the temperature of the work environment is reduced. Therefore, the cooling coating and the cooling fin can be widely applicable to various electronic, mechanical and electrical products.
Description
Technical field
The utility model relates to cooling electronic component technical field, relates in particular at heating element heat radiation coating and radiator element.
Background technology
Electronic devices and components are when work, and part electric energy conversion is heat, makes electronic devices and components be operated in higher temperature environment, and the heat that electronic devices and components need to be produced scatters in time, otherwise affect work-ing life and the task performance of electronic devices and components.
Existing electronic devices and components and electronic product mainly contain two kinds of radiating modes, a kind of is to adopt active heat removal, by heat radiation power set is set, as electric fan, although active heat removal efficiency is better, but it takes up room and makes more greatly the electronic product volume cannot miniaturization, and active heat removal also can increase the power consumption of electronic product simultaneously.Two kinds is to adopt passive heat radiation, although can reduce small product size, because passive radiating efficiency is lower, for the electronic product of dense distribution electronic devices and components, the working temperature of electronic product is higher, affects electronic product and electronic devices and components work-ing life and task performance.
Utility model content
The technical problem that the utility model mainly solves is to provide a kind of heat radiation coating and radiator element, radiating efficiency when this heat radiation coating and radiator element can be taken into account active heat removal, obtain the smaller and more exquisite volume of electronic product while adopting passive heat radiation simultaneously, improve electronic product radiating efficiency, reduce operating ambient temperature.
In order to solve the problems of the technologies described above, the utility model provides a kind of heat radiation coating, this coating of dispelling the heat, for the heat that directly or indirectly contact produces electric heating device, scatter, it comprises the carrier layer of being located at electric heating device outside surface, is evenly provided with and transfers heat to ultrared heat conversion layer in this carrier layer.
Say further the thickness 10 μ m-100 μ m of described carrier layer.
The utility model also provides a kind of radiator element, this radiator element scatters for the heat that directly or indirectly contact produces electric heating device, this radiator element comprises heat-radiating substrate, at this heat-radiating substrate, be at least simultaneously provided with carrier layer, in this carrier layer, be evenly distributed with and transfer heat to ultrared heat conversion layer.
Say further the thickness 10 μ m-100 μ m of described carrier layer.
Say further, described heat-radiating substrate, for heat radiation material, comprises aluminium, copper, magnesium.
Say further, described heat-radiating substrate and heat generating components contact surface are provided with bonding coat.
The utility model discloses a kind of for directly or indirectly contacting heat radiation coating and the radiator element that electric heating device heat is scattered.This heat radiation coating comprises the carrier layer of being located at electric heating device outside surface, is evenly provided with and transfers heat to ultrared heat conversion layer in this carrier layer.During use, this heat radiation coating directly or indirectly being contacted with electric heating device by carrier, is infrared rays by heat conversion layer by thermal power transfer, and then heat is scattered, and radiating efficiency is high.Compared with prior art, the radiating efficiency in the time of can taking into account active heat removal obtains the smaller and more exquisite volume of electronic product while adopting passive heat radiation simultaneously, improves electronic product radiating efficiency, reduces operating ambient temperature, can be widely used in the dynamo-electric product that waits of all kinds of electronics.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, below by time embodiment or description of the Prior Art in the accompanying drawing of required use be briefly described, apparently, and accompanying drawing in describing is embodiment more of the present utility model, to those skilled in the art, do not paying under the prerequisite of creative work, can also obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is the utility model heat radiation coating embodiment cross-sectional view.
Fig. 2 is the utility model radiator element embodiment cross-sectional view.
Below in conjunction with embodiment, and with reference to accompanying drawing, the realization of the utility model object, functional characteristics and advantage are described further.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, the every other embodiment that those of ordinary skills obtain under the prerequisite of not making creative work, belongs to the scope that the utility model is protected.
As shown in Figure 1, the utility model provides a kind of heat radiation coating embodiment.
It is a kind of for the heat radiation coating that directly or indirectly electric heating device heat is scattered in contact that the utility model provides, and it comprises the carrier layer 2 of being located at electric heating device outside surface, in this carrier layer 2, is evenly provided with and transfers heat to ultrared heat conversion layer 1.
Specifically, at the surface uniform of carrier layer 2, be provided with and transfer heat to ultrared heat conversion layer 1, this heat conversion layer 1 at least comprises the carbon of nanometer or Subnano-class, silicon carbide, boron nitride, aluminium nitride, aluminum oxide, titanium dioxide or the carbon granule that can also comprise as required nanometer or Subnano-class wherein one or more.
Described carrier layer 2 is for heat conversion layer 1 is fixed on to electric heating device 3, and this carrier layer 2 can comprise polyurethane series (PU), epoxy resin (EPOXY), urethane resin system (HYHRID), polyester (POLYESTER) or fluoroolefin-vinyl ether (ester) copolymer coating (FEVE) etc.When described heat conversion layer is mainly comprised of carbon, silicon carbide, boron nitride, aluminium nitride, aluminum oxide, titanium dioxide and the carbon granule of nanometer or Subnano-class, the carbon of nanometer or Subnano-class, silicon carbide, boron nitride, aluminium nitride, aluminum oxide and titanium dioxide weight ratio are respectively 5-30%, 10-20%, 10-20%, 10-20%, 5-10% and 5-30%.The thickness 10 μ m-100 μ m of described carrier layer 2, this carrier layer is unsuitable thick, and due to this carrier layer 2, normally heat transfer efficiencies is not too high, therefore the thickness of carrier layer is unsuitable excessive, otherwise affect heat, conduct to heat conversion layer, and then affect the excitation energy of heat conversion layer, affect radiating efficiency.The density of described carrier layer 2 is greater than the density of each material that forms heat conversion layer, can be conveniently by hot melt characteristic, will more evenly be located at carrier layer 2 surfaces by nanometer or sub-nano-sized carbon or the lighter material of silicon carbide isodensity.
During use, this heat radiation coating directly or indirectly being contacted with electric heating device by carrier, is infrared rays by heat conversion layer by thermal power transfer, and then heat is scattered, and radiating efficiency is high.The higher efficiency of heat radiation in the time of can taking into account active heat removal, while making to adopt passive heat radiation, electronic product has smaller and more exquisite volume simultaneously, reduces operating ambient temperature, can be widely used in the dynamo-electric product that waits of all kinds of electronics.
For the radiating effect of better explanation the utility model heat radiation coating, choose a kind of brand mobile phone, adopt two kinds of heat sink conceptions: scheme one arranges heat radiation coating on PCBA; Scheme two is that heat radiation coating is set respectively on PCBA and mobile phone battery cover.The data that test obtains are at normal temperatures as shown in the table.
| Specification | Do not post radiator element | Scheme one | Scheme two |
| Envrionment temperature | 20.3℃ | 21.4℃ | 21.5℃ |
| Fore shell temperature | 46℃ | 45.5℃ | 44.5℃ |
| Back cover temperature | 39.8℃ | 33.4℃ | 31.7℃ |
| Fore shell ascending temperature | 25.7℃ | 24.1℃ | 23℃ |
| Back cover ascending temperature | 19.5℃ | 12℃ | 10.2℃ |
| Fore shell cooling extent | ---- | 1.6℃ | 2.7℃ |
| Back cover cooling extent | ---- | 7.5℃ | 9.3℃ |
Data Comparison from upper table can be found out, use heat radiation coating can effectively reduce mobile phone temp, and usable floor area is larger, and radiating efficiency is higher.
As shown in Figure 2, it is a kind of for directly or indirectly contacting the radiator element that electric heating device heat is scattered that the utility model also provides, this radiator element comprises heat-radiating substrate 4, at this heat-radiating substrate 4, be at least simultaneously provided with carrier layer 2, on this section of body layer 2, be evenly distributed with and transfer heat to ultrared heat conversion layer 1.
Specifically, at the surface uniform of carrier layer 2, be provided with and transfer heat to ultrared heat conversion layer 1, this heat conversion layer 1 at least comprises the carbon of nanometer or Subnano-class, silicon carbide, boron nitride, aluminium nitride, aluminum oxide, titanium dioxide or the carbon granule that can also comprise as required nanometer or Subnano-class wherein one or more.
Described carrier layer 2 is for heat conversion layer 1 is fixed on to electric heating device 3, and this carrier layer 2 can comprise polyurethane series (PU), epoxy resin (EPOXY), urethane resin system (HYHRID), polyester (POLYESTER) or fluoroolefin-vinyl ether (ester) copolymer coating (FEVE) etc.When main carbon, silicon carbide, boron nitride, aluminium nitride, aluminum oxide, titanium dioxide and the carbon granule by nanometer or Subnano-class of heat conversion layer 1 forms, its nano-sized carbon that is 5-30% containing weight ratio, weight ratio is the silicon carbide of 10-20%, weight ratio is the boron nitride of 10-20%, weight ratio is the aluminium nitride of 10-20%, the titanium dioxide that the aluminum oxide that weight ratio is 5-10% and weight ratio are 5-30%.The thickness 10 μ m-100 μ m of described carrier layer 2, this carrier layer is unsuitable thick, and due to this carrier layer 2, normally heat transfer efficiencies is not too high, therefore the thickness of carrier layer is unsuitable excessive, otherwise affect heat, conduct to heat conversion layer, and then affect the excitation energy of heat conversion layer, affect radiating efficiency.The density of described carrier layer 2 is greater than the density of each material that forms heat conversion layer, can be conveniently by hot melt characteristic, will more evenly be located at carrier layer 2 surfaces by nanometer or sub-nano-sized carbon or the lighter material of silicon carbide isodensity.
During use, this radiator element is directly or indirectly contacted with electric heating device, as shown in Figure 2, can be by being located at viscose glue on heat-radiating substrate 4 directly or indirectly and thermoelectric heating device is fixed.Because heat conversion layer is by adopting the mode of hot melt to form uniform texture, therefore heat conversion layer is located on heat-radiating substrate 4, facilitate better user directly to use.Simultaneously in reflow process, have certain temperature requirement, therefore for curved surface or concerning temperature has responsive electronic devices and components the direct producing heat conversion layer thereon of discomfort, can be suitable for various electronics or the electron devices that need heat radiation.
Use is infrared rays by thermal power transfer, can rapidly heat be scattered.The higher efficiency of heat radiation when this radiator element can be taken into account active heat removal, while making to adopt passive heat radiation, electronic product has smaller and more exquisite volume simultaneously, and better convenient use can be widely used in the dynamo-electric product that waits of all kinds of electronics.
Described heat-radiating substrate 4, for heat radiation material, comprises on heat-radiating substrate 4, being provided with aluminium, copper, magnesium and alloy thereof etc. and being provided with bonding coat 5 with heat generating components 3 contact surfaces, fixing, easy for installation with heat generating components 3 by bonding coat 5 during use.
Radiating effect for better explanation radiator element of the present invention, choose television rod, with thermal imager, find out and determine the hottest three points in television rod surface, be respectively T1, T2, T3 and IC chip surface temperature and test, on circuit card, use radiator element and do not use in radiator element situation test to obtain temperature data as shown in the table.
| Specification | Do not post radiator element | Post radiator element |
| Envrionment temperature | 25.6℃ | 27.5℃ |
| T1 temperature | 63.7℃ | 50.3℃ |
| T2 temperature | 61.8℃ | 50.9℃ |
| T3 temperature | 57.8℃ | 50.3℃ |
| IC chip temperature | 114℃ | 69.8℃ |
| T1 ascending temperature | 38.1℃ | 22.8℃ |
| T2 ascending temperature | 36.2℃ | 23.4℃ |
| T3 ascending temperature | 32.2℃ | 22.8℃ |
| IC chip ascending temperature | 88.3℃ | 41.3℃ |
| T1 cooling extent | -- | 15.3℃ |
| T2 cooling extent | -- | 12.8℃ |
| T3 cooling extent | -- | 9.4℃ |
| IC chip cooling extent | -- | 47℃ |
Data Comparison from upper table can be found out, uses the television rod of radiator element, and chip temperature has more obviously reduction, illustrates that the radiating efficiency of this radiator element is higher, can effectively the heat of chip be left fast, reduces the temperature of chip and the temperature of product.
Above embodiment only, in order to the technical solution of the utility model to be described, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement, and these modifications or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (6)
1. a heat radiation coating, scatters for the heat that directly or indirectly contact produces electric heating device, it is characterized in that:
It comprises the carrier layer of being located at electric heating device outside surface, is evenly provided with and transfers heat to ultrared heat conversion layer in this carrier layer.
2. heat radiation coating according to claim 1, is characterized in that:
The thickness 10 μ m-100 μ m of described carrier layer.
3. a radiator element, directly or indirectly contacts the heat that electric heating device is produced and scatters, and this radiator element comprises heat-radiating substrate, it is characterized in that:
At this heat-radiating substrate, be at least simultaneously provided with carrier layer, on this section of body layer, be evenly distributed with and transfer heat to ultrared heat conversion layer.
4. radiator element according to claim 3, is characterized in that:
The thickness 10 μ m-100 μ m of described carrier layer.
5. radiator element according to claim 3, is characterized in that:
Described heat-radiating substrate, for heat radiation material, comprises aluminium, copper, magnesium.
6. according to the radiator element described in claim 3 or 5, it is characterized in that:
Described heat-radiating substrate and heat generating components contact surface are provided with bonding coat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320124099.7U CN203474703U (en) | 2012-04-13 | 2013-03-05 | Cooling coating and cooling fin |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210108801.0 | 2012-04-13 | ||
| CN201210108801 | 2012-04-13 | ||
| CN201320124099.7U CN203474703U (en) | 2012-04-13 | 2013-03-05 | Cooling coating and cooling fin |
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| Publication Number | Publication Date |
|---|---|
| CN203474703U true CN203474703U (en) | 2014-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320124099.7U Expired - Lifetime CN203474703U (en) | 2012-04-13 | 2013-03-05 | Cooling coating and cooling fin |
| CN201310083816.0A Active CN103436066B (en) | 2012-04-13 | 2013-03-05 | Heat dissipation coating, heat dissipation fin and manufacturing method |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310083816.0A Active CN103436066B (en) | 2012-04-13 | 2013-03-05 | Heat dissipation coating, heat dissipation fin and manufacturing method |
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| CN (2) | CN203474703U (en) |
| WO (1) | WO2013152623A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104710912A (en) * | 2015-03-31 | 2015-06-17 | 东莞市闻誉实业有限公司 | Cooling fin |
| WO2017055599A1 (en) * | 2015-10-01 | 2017-04-06 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Electronic component carrier for carrying and cooling a heat generating electronic component |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014107909A1 (en) * | 2014-06-05 | 2015-12-17 | Infineon Technologies Ag | Printed circuit boards and process for their manufacture |
| CN104876553A (en) * | 2015-04-29 | 2015-09-02 | 江门市华材新材料科技实业有限公司 | Nano ceramic electric heating element and manufacturing method thereof |
| CN104861831A (en) * | 2015-06-10 | 2015-08-26 | 普罗旺斯科技（深圳）有限公司 | Graphene coating, graphene cooling fin and manufacturing methods of graphene coating and graphene cooling fin |
| CN104896452A (en) * | 2015-06-11 | 2015-09-09 | 固态照明张家口有限公司 | Heat dissipation material, LED spot light radiator based on same, and LED spot light |
| CN105038374A (en) * | 2015-09-02 | 2015-11-11 | 普罗旺斯科技（深圳）有限公司 | Cooling coating, cooling fin and manufacturing method |
| CN105371254A (en) * | 2015-11-27 | 2016-03-02 | 海信集团有限公司 | Wavelength conversion device, preparation method thereof and laser light source device |
| CN107529540A (en) * | 2017-10-16 | 2018-01-02 | 普罗旺斯科技（深圳）有限公司 | A kind of thermal dispersant coatings and preparation method thereof |
| CN109233368A (en) * | 2018-08-03 | 2019-01-18 | 四川省思硕教育科技有限公司 | Case radiation device efficient heat-resisting thermal dispersant coatings |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6288899B1 (en) * | 2000-02-09 | 2001-09-11 | Unisys Corporation | Method and apparatus for heat dissipation in a multi-processor module |
| AT412265B (en) * | 2002-11-12 | 2004-12-27 | Electrovac | HEAT EXTRACTION COMPONENT |
| DE10336747A1 (en) * | 2003-08-11 | 2005-03-17 | Infineon Technologies Ag | Semiconductor component used as a power transistor comprises a layer structure with a semiconductor chip, a support for the chip and an electrically insulating layer made from nano-particles of an electrically insulating material |
| DE102005062181A1 (en) * | 2005-12-23 | 2007-07-05 | Electrovac Ag | Composite material, preferably multi-layered material, useful e.g. as printed circuit board, comprises two components, which are adjacent to each other and connected to a surface by an adhesive compound, which is a nano-fiber material |
| CN101003701B (en) * | 2006-12-31 | 2010-07-28 | 大连理工大学 | Method for modifying functional coat of gradient dispersed stuffing grains |
| JP5098507B2 (en) * | 2007-08-10 | 2012-12-12 | 東京エレクトロン株式会社 | Semiconductor device manufacturing method, semiconductor manufacturing apparatus, and storage medium |
| US20100043871A1 (en) * | 2008-04-14 | 2010-02-25 | Bp Corporation North America Inc. | Thermal Conducting Materials for Solar Panel Components |
| TWI455822B (en) * | 2008-09-08 | 2014-10-11 | Nippon Steel & Sumikin Chem Co | High thermal conductivity polyimide film, high thermal conductivity metal-clad laminate and method for producing same |
| CN104962037A (en) * | 2009-02-25 | 2015-10-07 | 松下电器产业株式会社 | Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition |
| KR101035011B1 (en) * | 2010-01-19 | 2011-05-17 | 한국전기연구원 | Heat-radiant coatings and heat-radiant plate thereby |
| CN102143646B (en) * | 2010-01-28 | 2013-03-06 | 昆山雅森电子材料科技有限公司 | Stiffening plate for printed circuit board |
-
2013
- 2013-03-05 CN CN201320124099.7U patent/CN203474703U/en not_active Expired - Lifetime
- 2013-03-05 CN CN201310083816.0A patent/CN103436066B/en active Active
- 2013-04-11 WO PCT/CN2013/000413 patent/WO2013152623A1/en active Application Filing
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104710912A (en) * | 2015-03-31 | 2015-06-17 | 东莞市闻誉实业有限公司 | Cooling fin |
| CN104710912B (en) * | 2015-03-31 | 2017-09-22 | 东莞市闻誉实业有限公司 | Fin |
| WO2017055599A1 (en) * | 2015-10-01 | 2017-04-06 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Electronic component carrier for carrying and cooling a heat generating electronic component |
| CN108293295A (en) * | 2015-10-01 | 2018-07-17 | 奥特斯奥地利科技与系统技术有限公司 | The electronic component carrier of carrying and heat dissipation for heat-generating electronic part |
| US10390421B2 (en) | 2015-10-01 | 2019-08-20 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Electronic component carrier for carrying and cooling a heat generating electronic component |
| CN108293295B (en) * | 2015-10-01 | 2020-09-04 | 奥特斯奥地利科技与系统技术有限公司 | Electronic component carrier for carrying and dissipating heat of heat-generating electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103436066B (en) | 2017-02-15 |
| CN103436066A (en) | 2013-12-11 |
| WO2013152623A1 (en) | 2013-10-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Liu Jingsong Inventor after: Chen Yingfei Inventor after: Liang Yifan Inventor before: Liang Yifan |
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| COR | Change of bibliographic data | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140312 |