WO2013152623A1

WO2013152623A1 - Heat dissipating coating, sheets and methods for manufacturing same

Info

Publication number: WO2013152623A1
Application number: PCT/CN2013/000413
Authority: WO
Inventors: 梁一帆
Original assignee: 普罗旺斯科技（深圳）有限公司
Priority date: 2012-04-13
Filing date: 2013-04-11
Publication date: 2013-10-17
Also published as: CN103436066A; CN103436066B; CN203474703U

Abstract

Disclosed are a heat dissipating coating, sheets and methods for manufacturing same using for contacting directly or indirectly the electric heating component to diffuse the heat generated from the component. The heat dissipating coating comprises a carrier layer mounted on the external surface of the electric heating component, and a heat conversion layer for transforming heat into infrared ray which is mounted uniformly on the carrier layer. The density of the carrier layer is higher than that of various materials composing the heat conversion layer.

Description

Heat dissipation coating, heat sink and manufacturing method

The invention relates to the technical field of heat dissipation of electronic components, in particular to a heat dissipation coating, a heat sink and a manufacturing method of the heat generating component. Background technique

When the electronic components are in operation, part of the electrical energy is converted into heat, so that the electronic components work in a relatively high temperature environment, and the heat generated by the electronic components needs to be dispersed in time, otherwise the service life and working efficiency of the electronic components are affected.

The existing electronic components and electronic products mainly have two kinds of heat dissipation methods, one is to adopt active heat dissipation, and by setting a heat dissipation power device, such as an electric fan, although the active heat dissipation efficiency is good, the occupied space is large, so that the volume of the electronic product is large. It cannot be miniaturized, and active heat dissipation also increases the power consumption of electronic products. The two are passive heat dissipation. Although the product volume can be reduced, the passive heat dissipation efficiency is low. For electronic products with densely distributed electronic components, the operating temperature of electronic products is high, affecting the use of electronic products and electronic components. Life and work efficiency. Summary of the invention

The technical problem to be solved by the present invention is to provide a heat-dissipating coating and a manufacturing method thereof, which can simultaneously achieve heat dissipation efficiency during active heat dissipation, and at the same time obtain a smaller volume of electronic products when passive heat dissipation is used, and improve electronic products. Cooling efficiency, lower working temperature.

In order to solve the above technical problems, the present invention provides a heat dissipating coating for directly or indirectly contacting heat generated by an electric heating device, which comprises a carrier layer provided on an outer surface of the electric heating device, A heat transfer layer for converting heat into infrared rays is disposed on the carrier layer.

Further, the heat transfer layer includes at least nano or sub-nanometer carbon particles. Further, the heat transfer layer further comprises one or more of nano or sub-nanometer grade silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide or carbon particles.

Further, the carrier layer is a polyurethane resin, an epoxy resin system, a polyurethane resin system, a polyester, a fluoroolefin-ethyl decyl ether or a fluoroolefin-vinyl ester copolymer.

Further, the heat transfer layer further includes nano or sub-nanometer grade silicon carbide, boron nitride, aluminum nitride, aluminum oxide, and titanium dioxide.

Further, the weight ratio of the nano or sub-nanometer carbon, silicon carbide, boron nitride, aluminum nitride, aluminum oxide and titanium dioxide is 5-30%, 10-20%, 10-20%, 10- 20%, 5-10% and 5-30%.

Further, the carrier layer has a thickness of 10 um - 100 um.

Further, the density of the carrier layer is greater than the density of each substance constituting the heat conversion layer. The present invention also provides a heat sink for directly or indirectly contacting the heat generated by the electric heating device, the heat sink including a heat dissipation substrate, and at least one side of the heat dissipation substrate is provided with a carrier layer on the carrier layer There is a heat transfer layer that converts heat into infrared rays.

Further, the heat transfer layer includes at least nano or sub-nanometer carbon particles.

Further, the heat transfer layer further comprises one or more of nano or sub-nanometer grade silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide or carbon particles.

Further, the carrier layer is a polyurethane-based, epoxy-based, urethane-resin, polyester, fluoroolefin-vinyl ether or fluoroolefin-vinyl ester copolymer.

Further, the carrier layer has a thickness of 10 um - 100 um. Further, the density of the carrier layer is greater than the density of each substance constituting the heat conversion layer. Further, the heat dissipation substrate is a heat dissipation material, including aluminum, copper, magnesium, and alloys thereof. Further, an adhesive layer is provided on a surface of the heat dissipation substrate that is in contact with the heat generating component. The present invention also provides a method for manufacturing a heat-dissipating coating for uniformly arranging a heat-converting layer for converting heat into infrared rays on an outer surface of an electric heating device or a heat-dissipating substrate, the manufacturing method comprising:

Preparing carrier particles carrying the same amount of nano or sub-nanoparticles on the surface;

The carrier particles carrying the nano or sub-nano particles are solidified on the surface of the heat source, and the nano or sub-nano particles carried by the layer are layered with the carrier to form a heat conversion layer composed of nano or sub-nano particles and a carrier layer of the fixed heat conversion layer. .

Further, the step of preparing the carrier particles carrying the same amount of nano or sub-nanoparticles on the surface comprises:

Preparing a first carrier solution having a larger concentration of nanoparticles;

Preparing a second carrier solution having a smaller concentration of nanoparticles;

The second carrier solution having a smaller concentration of the nanoparticles is solidified and pulverized into the first fine carrier particles; the first fine carrier particles are added to the first carrier solution having a larger concentration of the nanoparticles, stirred, solidified, and pulverized into the second fine carrier particles. When the number of nanoparticles carried on the surface of the second fine carrier particle does not meet the requirements, the second fine carrier particle is placed in the first carrier solution having a larger concentration, stirred, solidified and pulverized until it meets the requirements.

Further, the step of melt-solidifying the carrier particles carrying the nano or sub-nano particles on the surface of the heat source comprises:

The carrier particles uniformly carrying the nanoparticles on the surface are uniformly distributed on the surface of the heat source;

The heat source provided with the carrier particles on the surface is placed by melt solidification.

Further, the post-cure pulverization produces fine particles of 5 um to 50 um. Further, the melt curing temperature is 100 to 200 ° C, and the curing time is 1 to 20 minutes. Further, the nanoparticles comprise at least nano or sub-nano carbon. Further, the nanoparticles further include one or more of nano or sub-nanous silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide or carbon particles. Further, the carrier layer is a polyurethane-based, epoxy-based, urethane-based, polyester, fluoroolefin-vinyl ether or fluoroolefin-vinyl ester copolymer. Further, the heat transfer layer further includes nano or sub-nanometer grade silicon carbide, boron nitride, aluminum nitride, aluminum oxide, and titanium dioxide.

Further, the density of the carrier is greater than the density of the nano or sub-nanoparticle material.

The present invention also provides a method for manufacturing a heat-dissipating coating for setting a heat-converting layer for converting heat into infrared rays on an outer surface of an electric heating device or a heat-dissipating substrate, the manufacturing method comprising:

The present invention also provides a method for manufacturing a heat-dissipating coating for uniformly disposing a heat-converting layer for converting heat into infrared rays on an outer surface of an electric heating device or a heat-dissipating substrate, the manufacturing method comprising:

Preparing a liquid heat-dissipating paint containing nanoparticles uniformly distributed, mixing the nanoparticles into a liquid carrier, and adding a suspending agent and a dispersing agent to form a uniform liquid heat-dissipating coating during stirring;

Preparing a liquid heat-dissipating paint for attaching the nanoparticles to the bubbles, and applying the liquid heat-dissipating paint to the liquid heat-dissipating paint to inject nano-scale bubbles to adhere the bubbles to each of the nanoparticles;

The liquid heat-dissipating paint of the bubble-attached nanoparticles is applied to the surface of the heat-dissipating substrate and solidified, and the nanoparticles and the carrier are layered to form a heat-dissipating layer composed of nanoparticles and a carrier layer formed by the carrier.

Further, the bubbles are inert bubbles.

Further, the nanoparticles include nano or sub-nanometer carbon, and further include one or more of nano or sub-nanous silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide or carbon particles, when the heat conversion layer Mainly composed of silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide and carbon In the mixture, the weight ratio of nano or sub-nanometer carbon, silicon carbide, boron nitride, aluminum nitride, aluminum oxide and titanium dioxide is 5-30%, 10-20%, 10-20%, 10-20%, respectively. 5-10% and 5-30%.

Further, the carrier is a polyurethane system, an epoxy resin system, a polyurethane resin system, a polyester, a fluoroolefin-vinyl ether or a fluoroolefin-vinyl ester copolymer.

Further, the dispersing agent is a surfactant composed of a lipophilic group and a hydrophilic group, and includes a long chain fatty acid, cetyltrimethylammonium bromide.

Further, the dispersing agent is a small molecular weight inorganic electrolyte or inorganic polymer, including sodium silicate or sodium hexametaphosphate.

Further, the dispersant is a large molecular weight polymer and a polyelectrolyte, including gelatin, carboxymethyl cellulose, polydecyl acrylate or polyethyleneimine.

Further, the dispersant is contained in an amount of 5 to 10% by mass of the heat-dissipating paint. The present invention discloses a heat dissipation coating, a heat sink and a manufacturing method for directly or indirectly contacting heat of an electric heating device. The heat dissipating coating layer comprises a carrier layer disposed on an outer surface of the electric heating device, and a heat conversion layer for converting heat into infrared rays is disposed on the carrier layer. In use, the heat-dissipating coating layer is brought into contact with the electric heating device directly or through the carrier, and the heat conversion layer converts the thermal energy into infrared rays, thereby dissipating the heat, and the heat dissipation efficiency is high. Compared with the prior art, the heat dissipation efficiency during active heat dissipation can be taken into consideration, and the smaller size of the electronic product when passive heat dissipation is obtained, the heat dissipation efficiency of the electronic product is improved, and the working environment temperature is lowered, which can be widely applied to various electronic electromechanical products and the like. .

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be described below. Obviously, the drawings in the description are Some of the embodiments of the present invention may be obtained by those of ordinary skill in the art from the drawings without departing from the scope of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS 2 is a schematic cross-sectional structural view of an embodiment of a heat sink of the present invention.

3 is a schematic flow chart of a method for manufacturing a heat-dissipating coating of the present invention.

Figure 4 is a schematic illustration of the process flow for preparing carrier particles carrying the same amount of nano or sub-nanoparticles on the surface.

Fig. 5 is a schematic view showing the process of melting and solidifying a carrier particle carrying a nano or sub-nanoparticle on a surface of a heat source.

6 is a schematic flow chart of another method for manufacturing a heat-dissipating coating. The implementation, functional features and advantages of the objects of the present invention will be further described below in conjunction with the embodiments and with reference to the accompanying drawings. detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Some embodiments, but not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

As shown in Figure 1, the present invention provides an embodiment of a heat-dissipating coating.

The present invention provides a heat dissipating coating for directly or indirectly contacting the heat of the electric heating device, comprising a carrier layer 2 disposed on an outer surface of the electric heating device, wherein the carrier layer 2 is provided with a heat transfer The heat conversion layer 1 for infrared rays.

Specifically, a heat transfer layer 1 for converting heat into infrared rays is disposed on the surface of the carrier layer 2, and the heat transfer layer 1 includes at least nano or sub-nanometer carbon, and may also include nanometer or sub-nanometer grades as needed. One or more of silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide or carbon particles.

The carrier layer 2 is used to fix the heat conversion layer 1 on the electric heating device 3, and the carrier layer 2 may include a polyurethane system (PU), an epoxy resin system (EP0XY), a polyurethane resin system (HYHRID), and a polyester. ( POLYESTER ) or fluoroolefin-vinyl ether (co) copolymer coating (FEVE) and the like. When the heat transfer layer is mainly composed of nano or sub-nanometer carbon, silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide and carbon particles, nano or sub-nanometer carbon, silicon carbide, nitride The weight ratios of boron, aluminum nitride, aluminum oxide and titanium dioxide are 5-30%, 10-20%, 10-20%, 10-20%, 5-10% and 5-30%, respectively. The thickness of the carrier layer 2 is 10 um -1 OOum, and the carrier layer is not thick. Since the carrier layer 2 generally has a low heat transfer efficiency, the thickness of the carrier layer should not be too large, otherwise the heat is transferred to the heat conversion layer. In turn, the excitation energy of the heat conversion layer is affected, which affects the heat dissipation efficiency. The density of the carrier layer 2 is greater than the density of each substance constituting the heat conversion layer, and it is convenient to more uniformly set the lighter substance such as nano or sub-nano carbon or silicon carbide on the surface of the carrier layer 2 by the heat fusion property.

In use, the heat-dissipating coating is brought into contact with the electric heating device directly or through the carrier, and the heat-converting layer 1 converts the thermal energy into infrared rays, thereby dissipating the heat, and the heat-dissipating efficiency is high. It can take into account the high efficiency of heat dissipation during active heat dissipation, and at the same time, the electronic product with compact heat dissipation has a smaller size and lowers the working environment temperature, and can be widely applied to various electronic and electromechanical products.

In order to better illustrate the heat dissipation effect of the heat-dissipating coating of the present invention, a brand mobile phone is selected, and two heat-dissipating solutions are adopted: the first solution is to provide a heat-dissipating coating on the PCBA; the second solution is to respectively provide a heat-dissipating coating on the PCBA and the back casing of the mobile phone. Floor. The data obtained by testing at room temperature are shown in the table below.

As can be seen from the comparison of the data in the above table, the use of a heat-dissipating coating can effectively reduce the temperature of the mobile phone, and the larger the use area, the higher the heat dissipation efficiency. As shown in FIG. 2, the present invention further provides a heat sink for directly or indirectly contacting the heat of the electric heating device. The heat sink includes a heat dissipation substrate 4, and the carrier layer 2 is disposed on at least one side of the heat dissipation substrate 4. The heat transfer layer 1 for converting heat into infrared rays is distributed on the cut layer 2.

The carrier layer 2 is used to fix the heat conversion layer 1 on the electric heating device 3, and the carrier layer 2 may include a polyurethane system (Ρϋ), an epoxy resin system (ΕΡ0ΧΥ), and a polyurethane resin system (HYHRID) polyester ( POLYESTER) or a fluoroolefin-vinyl ether (S^) copolymer coating (FEVE) or the like. When the heat conversion layer 1 is mainly composed of nano or sub-nanometer carbon, silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide and carbon particles, the weight ratio is 5-30% by weight of nanocarbon, and the weight The ratio is 10-20% silicon carbide, the ratio is 10-20% boron nitride, the weight ratio is 10-20% aluminum nitride, the weight ratio is 5-10% alumina and the weight ratio is 5- 30% titanium dioxide. The thickness of the carrier layer 2 is 10 um -100 um, and the carrier layer is not thick. Since the carrier layer 2 generally has a low heat transfer efficiency, the thickness of the carrier layer should not be too large, otherwise the heat is transferred to the heat conversion layer. In turn, the excitation energy of the heat conversion layer is affected, which affects the heat dissipation efficiency. The density of the carrier layer 2 is greater than the density of each substance constituting the heat-converting layer, and it is convenient to more uniformly set the lighter-weight substance such as nano- or sub-nano carbon or silicon carbide on the surface of the carrier layer 2 by the hot-melting property.

When used, the heat sink is directly or indirectly contacted with the electric heating device, as shown in Fig. 2, and can be directly or indirectly fixed to the electric heater by the adhesive provided on the heat dissipation substrate 4. Since the heat conversion layer forms a uniform structure by means of hot melt, the heat conversion layer is disposed on the heat dissipation substrate 4, and the user can use it directly. At the same time, there is a certain temperature requirement in the hot melt process. Therefore, it is not suitable for a curved surface or a temperature sensitive electronic component to directly generate a heat conversion layer thereon, and can be applied to various electronic devices or electronic devices that require heat dissipation.

The use of converting thermal energy into infrared light allows the heat to be quickly dissipated. The heat sink can take care of The high efficiency of heat dissipation during active heat dissipation, and the use of passive heat dissipation, the electronic product has a smaller size, is more convenient to use, and can be widely applied to various electronic and electromechanical products.

The heat dissipating substrate 4 is made of a heat dissipating material, and includes aluminum, copper, magnesium, an alloy thereof, and the like. The heat dissipating substrate 4 is provided with an adhesive layer 5 on the surface in contact with the heat generating component 3, and the adhesive layer 5 and the heat generating component are used in use. 3 fixed, easy to install.

In order to better illustrate the heat dissipation effect of the heat sink of the present invention, a TV stick is selected, and the hottest three points of the surface of the TV bar are determined by a thermal imager, which are shown as Tl, Τ2, Τ3, and the surface temperature of the IC chip.

It can be seen from the comparison of the data in the above table that the temperature of the chip is significantly reduced by using the TV stick of the heat sink, indicating that the heat dissipation efficiency of the heat sink is high, and the heat of the chip can be effectively dissipated quickly. Reduce the temperature of the chip and the temperature of the product. As shown in FIG. 3, the present invention further provides a method for manufacturing a heat-dissipating coating for uniformly disposing a heat-converting layer for converting heat into infrared rays on an outer surface of an electric heating device or a heat-dissipating substrate, the manufacturing method comprising:

Step S1 1, preparing carrier particles carrying the same amount of nano or sub-nanoparticles on the surface, specifically preparing the carrier to include carrier particles carrying at least one nano or sub-nanoparticle, specifically, each carrier The surface of the particle carries a significant amount of nano or sub-nanoparticles;

Step S12, curing the carrier particles carrying the nano or sub-nano particles on the surface of the heat source.

The step S11 of carrying the same amount of nano or sub-nanoparticle carrier particles, when the low concentration material is added to the high concentration material, the concentration of the lower concentration material is increased, and the mixed substance is added to the new material. In the high concentration material, the concentration of the lower concentration material in the new high concentration material is approached to the high concentration material concentration by appropriate circulation. Due to the high density of the carrier, it is also dense in the liquid state, and it is difficult to make the distribution of nanocarbon and the like even. In the above cycle, the nanocarbons and the like distributed on the surface of the carrier particles tend to be uniform, and at the same time, the amount of nanocarbons carried by each carrier particle can be better controlled.

As shown in FIG. 4, the preparation surface carries carrier particles of the same amount of nano or sub-nanoparticles. Step S11 includes:

Step S110, preparing a first carrier solution having a larger concentration of nanoparticles, specifically, adding a nanoparticle containing at least nano or sub-nano carbon to the liquid carrier, and stirring the hook, the carrier being a polyurethane system (PU) , epoxy resin (EP0XY), polyurethane resin (HYHRID), polyester ( POLYESTER), fluorocarbon-vinyl ether (ester) copolymer coating (FEVE), the nanoparticle also includes nano or sub-nano carbonization One or more of silicon, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide or carbon particles;

Step S111, reconstituting a second carrier solution having a smaller concentration of nanoparticles, specifically, adding nanoparticles containing at least nano or sub-nano carbon to another liquid carrier, so that the concentration of nanoparticles in the second carrier solution is less than The concentration of nanoparticles in a carrier solution; Step S112, the second carrier solution having a smaller concentration is solidified and then pulverized into the first fine carrier particles. Specifically, the second carrier solution having a smaller concentration is solidified and then pulverized into the first fine carrier particles with the nanoparticles. Wherein the post-cure pulverization produces a first fine carrier particle having a diameter of 5 um to 50 um; and step S113, stirring the first fine carrier particle into the first carrier solution having a larger concentration of the nanoparticle, specifically, taking the first step S112 Adding fine carrier particles to the first carrier solution containing at least a nanometer or sub-nano carbon concentration, stirring and pulverizing, and then solidifying and pulverizing to form second fine carrier particles;

Step S114, determining whether the number of nanoparticles carried on the surface of the second fine carrier particle meets the requirements, and ends when the requirement is reached; when the number of nanoparticles carried by the second fine carrier particle is insufficient, the second fine carrier particle is placed In the first carrier solution having a larger concentration, the above step S113 is repeated until it meets the requirements.

Step S110 and step S111 can be formulated in no particular order. As shown in Fig. 5, the step S12 of melt-solidifying the carrier particles carrying the nano or sub-nano particles on the surface of the heat source includes the following steps:

Step S121, uniformly distributing the carrier particles carrying the nanoparticles uniformly on the surface of the heat source; specifically, uniformly distributing the carrier particles carrying a considerable amount of nano or sub-nano particles in the step S1 1 to the surface of the heat source, the heat source including A heat dissipation substrate or a heat generating device that is in contact with the heating element.

Step S122, the heat source for providing the carrier particles on the surface in step S121 is solidified by melting, specifically, the density of the carrier is greater than the density of the nano or sub-nano particles of each substance, and the carrier particles are uniformly distributed in step S121. At 100-200 ° C, the curing time is 1-20 minutes, and the nano- or sub-nano particles are layered with the carrier to form a heat conversion layer composed of nano or sub-nano particles and a fixed heat conversion layer. Carrier layer.

The heat-dissipating coating method of the invention can make the heat-converting layer composed of at least nano-carbons uniformly distributed, and can better excite the interacting nanoparticles to convert heat into corresponding infrared rays, thereby rapidly dispersing heat and improving heat dissipation. effectiveness.

Specifically, a heat transfer layer 1 for converting heat into infrared rays is disposed on the surface of the carrier layer 2, The heat conversion layer 1 includes at least nano or sub-nanometer carbon, and may also include one or more of nano or sub-nanometer silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide or carbon particles. .

The carrier layer 2 is used to fix the heat conversion layer 1 on the electric heating device 3. The carrier layer 2 may include a polyurethane system (EP), an epoxy resin system (EP0XY), a polyurethane resin system (HYHRID), and a polyester ( POLYESTER), a fluoroolefin-vinyl ether or a fluoroolefin-vinyl ester (FEVE) copolymer, and the like.

When the heat conversion layer 1 is mainly composed of nano or sub-nanometer carbon, silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium oxide and carbon particles, it has a weight ratio of 5-30% of nanocarbon, weight The ratio is 10-20% silicon carbide, the weight ratio is 10-20% boron nitride, the weight ratio is 10-20% aluminum nitride, the weight ratio is 5-10% alumina, and the weight ratio is 5- 30% titanium dioxide. As shown in FIG. 6, the present invention further provides a method for manufacturing a heat-dissipating coating for setting a heat-converting layer for converting heat into infrared rays on an outer surface of an electric heating device or a heat-dissipating substrate, the manufacturing method comprising:

In step S20, preparing a liquid heat-dissipating paint containing uniformly distributed nanoparticles, specifically, adding the nanoparticles to a liquid carrier, stirring, adding a proper amount of suspending agent and dispersing agent to form a uniform liquid heat-dissipating paint during stirring; for example, The nanoparticles and the liquid epoxy resin are thoroughly mixed and stirred, and at the same time, a suspending agent, a dispersing agent and the like are added, and after being stirred for a plurality of times, a heat-dissipating paint of the liquid spraying process can be prepared.

Step S21, preparing a liquid heat-dissipating paint for attaching the nanoparticles to the bubbles, specifically, coating the liquid heat-dissipating paint prepared in step S20 into the liquid heat-dissipating paint to inject nano-sized bubbles, so that the bubbles are attached to each of the nanoparticles; When the coating is sprayed, it is subject to the characteristics of the material such as suspending agent. Even if it is baked at a high temperature, the nanoparticles are not suspended in the surface layer of the heat sink. Therefore, there is a good heat radiation performance heat-dissipating coating, which requires a nano bubble machine to be used in this liquid state. Injecting nano-scale bubbles into the heat-dissipating coating, such as using inert bubbles such as nitrogen, or using bubbles of other substances, and nano-scale bubbles are attached to the nanoparticles, that is, at least one nano-scale bubble is attached to each of the nanoparticles; Nanoscale bubbles can be obtained in the form of a venturi. Step S22, applying a liquid heat-dissipating coating of the bubble-attached nanoparticles to the outer surface of the electric heating device or the surface of the heat-dissipating substrate and curing, specifically, applying the liquid heat-dissipating paint prepared in step S21 to the outer surface of the electric heating device or dissipating heat The surface of the substrate is cured, such as using ultraviolet light at 100-200. Melt curing at C temperature for 20 minutes; during the curing process, the nanoparticle is floated or suspended in the outermost layer of the heat sink by the buoyancy of the nano-sized bubble, and the nanoparticle and the carrier are layered to form a heat dissipation layer composed of nanoparticles and an outer surface. The carrier layer formed by the carrier forms a heat-dissipating coating of nanoparticles having heat-dissipating surfaces. In this embodiment, when the heat dissipation coating is applied to the heat dissipation substrate, the surface of the heat dissipation substrate is provided with protrusions. The heat dissipating substrate comprises thermally conductive aluminum, copper or copper aluminum alloy, aluminum alloy or other material that can conduct heat. The heat dissipation substrate may be provided with protrusions to increase the heat dissipation area, and the protrusions may form a square, a circle and an elliptical shape. Appropriate height protrusions can improve the heat radiation efficiency and reduce the linear interference of heat radiation, and produce the highest heat radiation heat dissipation performance under the minimum thermal shock state. The heat dissipating substrate can be used in LED lighting devices, portable electronic devices such as computers and notebooks, or other devices that require heat dissipation.

The nanoparticle comprises nano or sub-nanometer carbon, and further comprises one or more of nano or sub-nanometer silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide or carbon particles, when the heat conversion layer is mainly composed of silicon carbide When a mixture of boron nitride, aluminum nitride, aluminum oxide, titanium dioxide, and carbon is used, the nanometer or sub-nanometer carbon, silicon carbide, boron nitride, aluminum nitride, aluminum oxide, and titanium dioxide weight ratios are 5-30, respectively. %, 10-20%, 10-20%, 10-20%, 5-10%, and 5-30%.

The carrier is a polyurethane-based, epoxy-based, urethane-based, polyester, fluoroolefin-vinyl ether or fluoroolefin-vinyl ester copolymer.

The dispersing agent mainly uses a surfactant composed of a lipophilic group and a hydrophilic group, such as a long-chain fatty acid, cetyltrimethylammonium bromide (CTAB), etc.; the dispersing agent may also be a small molecular weight inorganic electrolyte or Inorganic polymers such as sodium silicate, sodium hexametaphosphate, etc.; dispersants may also employ large molecular weight polymers and polyelectrolytes such as gelatin, carboxymethylcellulose, polymethacrylate, polyethyleneimine, and the like. The amount of dispersant should be added in an appropriate amount, which is 5-10% of the quality of the heat-dissipating coating. It should not be excessive and not Foot, otherwise it will cause flocculation. The suspending agent can be a suspension of the existing nanoparticles. The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that The technical solutions described herein are modified, or the equivalents of some of the technical features are replaced, and the modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

Claim

A heat-dissipating coating for direct or indirect contact to dissipate heat generated by an electric heating device, characterized by:

The utility model comprises a carrier layer disposed on an outer surface of the electric heating device, wherein a heat conversion layer for converting heat into infrared rays is uniformly disposed on the carrier layer, wherein the density of the carrier layer is greater than the density of each substance constituting the heat conversion layer .

2. The heat dissipation coating according to claim 1, wherein:

The heat conversion layer comprises nano or sub-nanometer carbon particles, and further comprises one or more of nano or sub-nanometer silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide or carbon particles, when heat When the conversion layer is mainly composed of a mixture of silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide and carbon, nano or sub-nanometer carbon, silicon carbide, boron nitride, aluminum nitride, aluminum oxide and titanium dioxide weight The ratios are 5-30%, 10-20%, 10-20%, 10-20%, 5-10%, and 5-30%, respectively.

The heat dissipation coating according to claim 1 or 2, wherein the carrier layer is a polyurethane resin, an epoxy resin resin, a polyurethane resin resin, a polyester, a fluoroolefin-vinyl ether copolymer. coating.

4. A heat sink for directly or indirectly contacting heat generated by an electric heating device, the heat sink comprising a heat dissipating substrate, characterized by:

A carrier layer is disposed on at least one side of the heat dissipation substrate, and a heat conversion layer for converting heat into infrared rays is disposed on the intercept layer, wherein the carrier layer has a density greater than a density of each substance constituting the heat conversion layer.

5. The heat sink according to claim 1, wherein:

The heat conversion layer includes nano or sub-nanometer carbon particles, and also includes nano or sub-nanometer One or more of silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide or carbon particles, when the heat conversion layer is mainly composed of silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide and carbon For the mixture, the weight ratio of nano or sub-nanometer carbon, silicon carbide, boron nitride, aluminum nitride, aluminum oxide and titanium dioxide is 5-30%, 10-20%, 10-20%, 10-20%, respectively. , 5-10% and 5-30%.

The heat sink according to claim 1 or 2, wherein the carrier layer is a polyurethane resin, an epoxy resin, a polyurethane resin, a polyester, a fluoroolefin-vinyl ether copolymer coating .

A method of manufacturing a heat-dissipating coating for uniformly distributing a heat-converting layer for converting heat into infrared rays on an outer surface of an electric heating device or a heat-dissipating substrate, the manufacturing method comprising:

Preparing carrier particles carrying the same amount of nano or sub-nano particles on the surface, and solidifying the carrier particles carrying the nano or sub-nano particles on the surface of the heat source, and layering the nano or sub-nano particles with the carrier to form nano or sub- a heat conversion layer composed of nanoparticles and a carrier layer fixed to the heat conversion layer;

The step of preparing the carrier particles carrying the same amount of nano or sub-nano particles includes: preparing a first carrier solution having a larger concentration of nanoparticles and a second carrier solution having a smaller concentration of nanoparticles, respectively, and taking the concentration of the nanoparticles The smaller second carrier solution is solidified and pulverized to a diameter of

5um-50um of the first fine carrier particles, the first fine carrier particles are added to the first carrier solution having a larger concentration of nanoparticles, stirred, solidified and pulverized into second fine carrier particles having a diameter of 5 um to 50 um; When the number of nanoparticles carried on the surface of the fine carrier particles is not up to the requirement, the second fine carrier particles are placed in a first carrier solution having a larger concentration, stirred, solidified and pulverized until it meets the requirements; and: a carrier that uniformly carries the nanoparticles on the surface The particles are evenly distributed on the surface of the heat source, and the heat source with the carrier particles on the surface is placed at a temperature of 100-20 CTC for melt curing for 1-20 minutes.

8. The method of manufacturing a heat-dissipating coating according to claim 7, wherein: the nanoparticles comprise nano or sub-nanometer carbon, and further comprise nano or sub-nanometer silicon carbide, boron nitride, aluminum nitride, aluminum oxide, One or more of titanium dioxide or carbon particles, when the heat conversion layer is mainly composed of a mixture of silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide and carbon, nano or sub-nanometer carbon, silicon carbide, The weight ratios of boron nitride, aluminum nitride, aluminum oxide and titanium dioxide are 5-30%, 10-20%, 10-20%, 10-20%, 5-10% and 5-30%, respectively.

The method for producing a heat-dissipating coating according to claim 7 or 8, wherein the carrier is a polyurethane resin, an epoxy resin resin, a polyurethane resin resin, a polyester, a fluoroolefin-vinyl ether or a fluorocarbon hydrocarbon. - a vinyl ester copolymer.

10. The method of manufacturing a heat-dissipating coating according to claim 9, wherein:

The density of the support is greater than the density of the nano or sub-nanoparticle material.

A method of manufacturing a heat-dissipating coating for uniformly arranging a heat-converting layer for converting heat into infrared rays on an outer surface of an electric heating device or a heat-dissipating substrate, the manufacturing method comprising:

Preparing a liquid heat-dissipating coating containing uniformly distributed nanoparticles, mixing the nanoparticles into a liquid carrier, and adding a suspending agent and a dispersing agent to form a uniform liquid heat-dissipating coating during stirring;

12. The method of manufacturing a heat-dissipating coating according to claim 11, wherein:

The bubbles are inert bubbles.

13. The method of manufacturing a heat-dissipating coating according to claim 11, wherein: the nanoparticles comprise nano or sub-nanocarbons, and further comprise nano or sub-nanometer silicon carbide, boron nitride, aluminum nitride, aluminum oxide, One or more of titanium dioxide or carbon particles, when the heat conversion layer is mainly composed of a mixture of silicon carbide, boron nitride, aluminum nitride, aluminum oxide, titanium dioxide and carbon, nano or sub-nanometer carbon, silicon carbide, The weight ratios of boron nitride, aluminum nitride, aluminum oxide and titanium dioxide are 5-30%, 10-20%, 10-20%, 10-20%, 5-10% and 5-30%, respectively.

14. The method of manufacturing a heat-dissipating coating according to claim 11, wherein:

The carrier is a polyurethane type, an epoxy resin type, a polyurethane resin type, a polyester, a fluoroolefin-ethyl ketone ether or a fluoroolefin-vinyl ester copolymer.

15. The method of manufacturing a heat-dissipating coating according to claim 11, wherein:

The dispersing agent is a surfactant composed of an oleophilic group and a hydrophilic group, and includes a long-chain fatty acid, and a hexadecyltrimethylammonium bromide.

16. The method of manufacturing a heat-dissipating coating according to claim 11, wherein:

The dispersant is a small molecular weight inorganic or inorganic polymer, including sodium silicate or sodium hexametaphosphate.

17. The method of manufacturing a heat-dissipating coating according to claim 11, wherein:

The dispersant is a large molecular weight polymer and a polyelectrolyte, including gelatin, carboxymethyl cellulose, polydecyl acrylate or polyethyleneimine.