CN103436066B - Heat dissipation coating, heat dissipation fin and manufacturing method - Google Patents
Heat dissipation coating, heat dissipation fin and manufacturing method Download PDFInfo
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- CN103436066B CN103436066B CN201310083816.0A CN201310083816A CN103436066B CN 103436066 B CN103436066 B CN 103436066B CN 201310083816 A CN201310083816 A CN 201310083816A CN 103436066 B CN103436066 B CN 103436066B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0257—Nanoparticles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0269—Non-uniform distribution or concentration of particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Abstract
The invention is suitable for the field of heat dissipation technology. The invention discloses heat dissipation coating for dissipating heat of an electric heating device by direct or indirect contact, a heat dissipation fin and a manufacturing method. The heat dissipation coating comprises a carrier layer disposed on the outer surface of the electric heating device; and the carrier layer is uniformly provided with heat transformation layers for transforming the heat into infrared rays. When being in use, the heat dissipation coating is directly or indirectly contacted with the electric heating device through the carrier; the heat energy is transformed into the infrared rays by the heat transformation layers; and further the heat is dissipated, so that heat dissipation efficiency is high. Compared with a conventional heat dissipation coating, the heat dissipation coating provided by the invention can balance the heat dissipation efficiency in active heat dissipation while obtaining smarter size of an electronic product in passive heat dissipation, increase the heat dissipation efficiency of the electronic product, reduces the temperature of a work environment, and can be widely applied in various electronic and electromechanical products.
Description
Technical field
The present invention relates to cooling electronic component technical field, more particularly, in heating element thermal dispersant coatings, fin
And manufacture method.
Background technology
Operationally, part electric energy is converted into heat so that electronic devices and components are operated in higher temperature for electronic devices and components
Environment, needs the heat producing electronic devices and components to scatter in time, otherwise the service life of impact electronic devices and components and work effect
Energy.
Existing electronic devices and components and electronic product mainly have two kinds of radiating modes, and one kind is to adopt active heat removal, passes through
Setting radiating power set, such as electric fan although active heat removal efficiency preferably, but its take up room larger so that electronic product body
Long-pending cannot miniaturization, simultaneously active heat removal also can increase the power consumption of electronic product.Two kinds is using passively radiating although can subtract
Miscellaneous goods volume, but because passive radiating efficiency is relatively low, for the electronic product of dense distribution electronic devices and components, electronics produces
The operating temperature of product is higher, affects electronic product and electronic devices and components service life and task performance.
Content of the invention
The invention mainly solves the technical problem of providing a kind of thermal dispersant coatings and manufacture method, this thermal dispersant coatings and manufacture
Method can take into account radiating efficiency during active heat removal, obtain using electronic product more compact volume during passive radiating simultaneously, carry
High electronic product radiating efficiency, reduces operating ambient temperature.
In order to solve above-mentioned technical problem, the present invention provides a kind of thermal dispersant coatings, and this thermal dispersant coatings, for direct or indirect
Contact the heat away that electric heating device is produced, it includes the carrier layer located at electric heating device outer surface, in this carrier layer
On be uniformly provided with heat switched to ultrared heat conversion layer, wherein carry nanometer or the carrier granular hot melt of sub- nano-particle
Layering forms the carrier layer being made up of carrier and the heat conversion layer being made up of nanometer or sub- nano-particle, the density of this carrier layer
More than composition heat conversion layer each material density, described carrier layer be polyurethane series, epoxy resin, polyester, fluoroolefins-
Vinyl ether co-polymer coating.
Further say, described heat conversion layer includes the carbon granule of nanometer or Subnano-class, also include nanometer or Asia is received
The carborundum of meter level, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide one of which or several, when heat conversion layer is mainly by carbon
When SiClx, boron nitride, aluminium nitride, the mixture of aluminium oxide, titanium dioxide and carbon granule composition, the carbon of nanometer or Subnano-class
Grain, carborundum, boron nitride, aluminium nitride, aluminium oxide and titania weight than respectively 5-30%, 10-20%, 10-20%,
10-20%, 5-10% and 5-30%.
The present invention also provides a kind of fin, and this fin directly or indirectly contacts the heat producing electric heating device and dissipates
Open, this fin includes heat-radiating substrate, be provided with carrier layer in this heat-radiating substrate at least one side, this carrier layer is evenly distributed with by
Heat switchs to ultrared heat conversion layer, and the carrier granular hot melt layering wherein carrying nanometer or sub- nano-particle forms by carrying
Carrier layer and the heat conversion layer being made up of nanometer or sub- nanometer that body is constituted, the density of this carrier layer is more than composition heat and turns
Change the density of each material of layer, described carrier layer is polyurethane series, epoxy resin, polyester, fluoroolefins-vinyl ether co-polymer
Coating.
Further say, described heat conversion layer includes the carbon granule of nanometer or Subnano-class, also include nanometer or Asia is received
The carborundum of meter level, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide one of which or several, when heat conversion layer is mainly by carbon
When SiClx, boron nitride, aluminium nitride, the mixture of aluminium oxide, titanium dioxide and carbon granule composition, the carbon of nanometer or Subnano-class
Grain, carborundum, boron nitride, aluminium nitride, aluminium oxide and titania weight than respectively 5-30%, 10-20%, 10-20%,
10-20%, 5-10% and 5-30%.
The present invention also provides a kind of manufacture method of thermal dispersant coatings, and the manufacture method of this thermal dispersant coatings is used in thermoelectric heating device
It is uniformly arranged on part outer surface or heat-radiating substrate and heat is switched to ultrared heat conversion layer, this manufacture method includes：
Preparation surface carries the nanometer of equal number or the carrier granular of sub- nano-particle, will carry nanometer or sub- nanometer
The carrier granular of grain is solidified on heat source surface so as to the nanometer that carried or sub- nano-particle are layered with carrier, formed by nanometer or
The heat conversion layer of sub- nano-particle composition and the carrier layer of fixing heat conversion layer, the density of wherein said carrier layer is more than group
Become the density of each material of heat conversion layer；
Wherein, described preparation surface carries the nanometer of equal number or the step of the carrier granular of sub- nano-particle includes：
The larger first vector solution of preparation of nano granule density and concentrations of nanoparticles less Second support solution, take nanometer respectively
It is ground into a diameter of 5 μm -50 μm of the first tiny carrier granular, by first after the solidification of granule density less Second support solution
Tiny carrier granular adds stirring in the larger first vector solution of concentrations of nanoparticles, is ground into a diameter of 5 μm -50 after solidification
μm the second tiny carrier granular；When the nano-particle quantity that the second tiny carrier particle surface carries not up to requires, will
Second tiny carrier granular puts into stirring in the larger first vector solution of concentration, pulverizes until meeting the requirements after solidification；
Described the carrier granular melting and solidification carrying nanometer or sub- nano-particle is included in the step of heat source surface：By table
The carrier granular that face uniformly carries nano-particle is uniformly distributed in heat source surface, and the thermal source that surface is provided with carrier granular is placed on
Melting and solidification 1-20 minute at a temperature of 100-200 DEG C.
Further say, described nano-particle includes nanometer or sub- nano carbon particle, also include nanometer or sub- nano silicon carbide
Silicon, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide one of which or several, when heat conversion layer is mainly by carborundum, nitridation
When boron, aluminium nitride, the mixture of aluminium oxide, titanium dioxide and carbon granule composition, the carbon granule of nanometer or Subnano-class, carbonization
Silicon, boron nitride, aluminium nitride, aluminium oxide and titania weight than respectively 5-30%, 10-20%, 10-20%, 10-20%,
5-10% and 5-30%.
Further say, described carrier is polyurethane series, epoxy resin, polyester, fluoroolefins-vinyl ether co-polymer apply
Material.
The present invention disclose a kind of for direct or indirect contact by the thermal dispersant coatings of electric heating device heat away, fin
And manufacture method.This thermal dispersant coatings includes the carrier layer located at electric heating device outer surface, this carrier layer is uniformly provided with by
Heat switchs to ultrared heat conversion layer.During use, this thermal dispersant coatings is contacted with electric heating device directly or by carrier,
Infrared ray is converted heat energy into by heat conversion layer, and then by heat away, radiating efficiency is high.Compared with prior art, permissible
Take into account radiating efficiency during active heat removal, obtain using electronic product more compact volume during passive radiating simultaneously, improve electronics
Product radiating efficiency, reduces operating ambient temperature, can be widely used in the products such as all kinds of electronics electromechanics.
Brief description
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Have technology description in required use accompanying drawing be briefly described it should be apparent that, and describe in accompanying drawing be the one of the present invention
A little embodiments, to those skilled in the art, on the premise of not paying creative work, can also be according to these
Accompanying drawing obtains other accompanying drawings.
Fig. 1 is thermal dispersant coatings embodiment cross-sectional view of the present invention.
Fig. 2 is fin embodiment cross-sectional view of the present invention.
Fig. 3 is thermal dispersant coatings manufacture method schematic flow sheet of the present invention.
Fig. 4 is to prepare surface to carry the nanometer of equal number or the carrier granular method flow schematic diagram of sub- nano-particle.
Fig. 5 is surface to be carried nanometer or the carrier granular melting and solidification of sub- nano-particle shows in heat source surface method flow
It is intended to.
With reference to embodiment, and referring to the drawings, the realization of the object of the invention, functional characteristics and advantage are made furtherly
Bright.
Specific embodiment
In order that the purpose of invention, technical scheme and advantage are clearer, below in conjunction with attached in the embodiment of the present invention
Figure, is clearly and completely described to the technical scheme in the embodiment of the present invention it is clear that described embodiment is invention one
Section Example, rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not doing
The every other embodiment being obtained on the premise of going out creative work, broadly falls into the scope of protection of the invention.
As shown in figure 1, the present invention provides a kind of thermal dispersant coatings embodiment.
Present invention offer is a kind of to be contacted the thermal dispersant coatings of electric heating device heat away for direct or indirect, and it includes
Located at the carrier layer 2 of electric heating device outer surface, this carrier layer 2 is uniformly provided with heat is switched to ultrared heat conversion
Layer 1.
Specifically, the surface in carrier layer 2 is uniformly provided with and for heat to switch to ultrared heat conversion layer 1, this heat
Conversion layer 1 at least includes the carbon of nanometer or Subnano-class, can also include carborundum, the nitrogen of nanometer or Subnano-class as needed
Change boron, aluminium nitride, aluminium oxide, titanium dioxide or carbon granule one of which or several.
Described carrier layer 2 is used for for heat conversion layer 1 being fixed on electric heating device 3, and this carrier layer 2 can include poly- ammonia
Ester system (PU), epoxy resin (EPOXY), polyurethane resin system (HYHRID), polyester (POLYESTER) or fluoroolefins-ethylene
Base ether (ester) copolymer coating (FEVE) etc..When described heat conversion layer is mainly by the carborundum of nanometer or Subnano-class, nitridation
Boron, aluminium nitride, aluminium oxide, titanium dioxide and carbon granule composition when, the carbon granule of nanometer or Subnano-class, carborundum, boron nitride,
Aluminium nitride, aluminium oxide and titania weight are than respectively 5-30%, 10-20%, 10-20%, 10-20%, 5-10% and 5-
30%.10 μm -100 μm of the thickness of described carrier layer 2, this carrier layer is unsuitable thick, because this carrier layer 2 is typically heat transference efficiency
Less high, the thickness of therefore carrier layer is unsuitable excessive, and otherwise impact heat conducts to heat conversion layer, and then affects heat conversion
The excitation energy of layer, affects radiating efficiency.The density of described carrier layer 2 is more than the density of each material of composition heat conversion layer,
Can conveniently pass through hot melt characteristic by by the lighter material of nanometer or sub- nano-sized carbon or carborundum isodensity evenly located at carrier
Layer 2 surface.
During use, this thermal dispersant coatings is contacted with electric heating device directly or by carrier, by heat conversion layer 1 by heat energy
Be converted to infrared ray, and then by heat away, radiating efficiency is high.The higher efficiency of radiating during active heat removal can be taken into account, with
When make that more compact volume is had using electronic product during passive radiating, reduce operating ambient temperature, can be widely used in all kinds of
The products such as electronics electromechanics.
In order to the radiating effect of thermal dispersant coatings of the present invention is more preferably described, choose a kind of brand mobile phone, using two kinds of radiating sides
Case：Scheme one arranges thermal dispersant coatings on PCBA；Scheme two is to be respectively provided with thermal dispersant coatings on PCBA and mobile phone battery cover.Normal
The data that the lower test of temperature obtains is as shown in the table.
Data Comparison from upper table can be seen that and effectively can reduce mobile phone temp using thermal dispersant coatings, and uses face
Long-pending bigger, radiating efficiency is higher.
As shown in Fig. 2 the present invention also provide a kind of for direct or indirect contact dissipating electric heating device heat away
Backing, this fin includes heat-radiating substrate 4, is provided with carrier layer 2 in this heat-radiating substrate 4 at least one side, this carrier layer 2 is uniformly divided
It is furnished with and heat is switched to ultrared heat conversion layer 1.
Specifically, the surface in carrier layer 2 is uniformly provided with and for heat to switch to ultrared heat conversion layer 1, this heat
Conversion layer 1 at least includes the carbon of nanometer or Subnano-class, can also include carborundum, the nitrogen of nanometer or Subnano-class as needed
Change boron, aluminium nitride, aluminium oxide, titanium dioxide or carbon granule one of which or several.
Described carrier layer 2 is used for for heat conversion layer 1 being fixed on electric heating device 3, and this carrier layer 2 can include poly- ammonia
Ester system (PU), epoxy resin (EPOXY), polyurethane resin system (HYHRID), polyester (POLYESTER) or fluoroolefins-ethylene
Base ether (ester) copolymer coating (FEVE) etc..When heat conversion layer 1 is mainly by nanometer or Subnano-class carborundum, boron nitride, nitrogen
When changing aluminum, aluminium oxide, titanium dioxide and carbon granule composition, it contains weight than the nano carbon particle for 5-30%, and weight ratio is for 10-
20% carborundum, than the boron nitride for 10-20%, than the aluminium nitride for 10-20%, weight is than the oxygen for 5-10% for weight for amount
Change aluminum and weight than the titanium dioxide for 5-30%.10 μm -100 μm of the thickness of described carrier layer 2, this carrier layer is unsuitable thick, by
Be typically in this carrier layer 2 that heat transference efficiency is less high, the thickness of therefore carrier layer is unsuitable excessive, otherwise impact heat conduct to
Heat conversion layer, and then affect the excitation energy of heat conversion layer, affect radiating efficiency.The density of described carrier layer 2 is more than group
Become the density of each material of heat conversion layer, can conveniently pass through hot melt characteristic will be close by nanometer or sub- nano-sized carbon or carborundum etc.
Spend lighter material evenly located at carrier layer 2 surface.
During use, this fin is directly or indirectly contacted with electric heating device, as shown in Fig. 2 can be by located at radiating
Viscose glue on substrate 4 is directly or indirectly fixed with thermoelectric heating device.Because heat conversion layer is formed all by way of using hot melt
Even structure, therefore by heat conversion layer on heat-radiating substrate 4, preferably facilitates user directly to use.Simultaneously in reflow process
There is certain temperature requirement, have the electronic devices and components of sensitivity therefore for curved surface or to temperature for, discomfort generates directly over
Heat conversion layer, can be suitable for the various electronic equipments needing radiating or electronic device.
Using converting heat energy into infrared ray, can be rapidly by heat away.This fin can take into account active heat removal
When the higher efficiency of radiating, make that more compact volume is had using electronic product during passive radiating simultaneously, more preferable convenient use, can
To be widely used in the products such as all kinds of electronics electromechanics.
Described heat-radiating substrate 4 is cooling material, including aluminum, copper, magnesium and its alloy etc., is provided with and sends out on heat-radiating substrate 4
Thermal part 3 contact surface is provided with adhesive layer 5, passes through adhesive layer 5 and fix with heat generating components 3 during use, easy for installation.
In order to the radiating effect of fin of the present invention is more preferably described, chooses television rod, find out determination TV with thermal imaging system
The hottest three points in excellent surface, respectively T1, T2, T3 and IC chip surface temperature is tested, on circuit boards using radiating
Piece and in the case of not using fin test to obtain temperature data as shown in the table.
| Specification | Do not post fin | Post fin |
| Ambient temperature | 25.6℃ | 27.5℃ |
| T1 temperature | 63.7℃ | 50.3℃ |
| T2 temperature | 61.8℃ | 50.9℃ |
| T3 temperature | 57.8℃ | 50.3℃ |
| IC chip temperature | 114℃ | 69.8℃ |
| T1 ascending temperature | 38.1℃ | 22.8℃ |
| T2 ascending temperature | 36.2℃ | 23.4℃ |
| T3 ascending temperature | 32.2℃ | 22.8℃ |
| IC chip ascending temperature | 88.3℃ | 41.3℃ |
| T1 cooling extent | -- | 15.3℃ |
| T2 cooling extent | -- | 12.8℃ |
| T3 cooling extent | -- | 9.4℃ |
| IC chip cooling extent | -- | 47℃ |
Data Comparison from upper table can be seen that the television rod using fin, and chip temperature has more apparent reduction, says
The radiating efficiency of this fin bright is higher, effectively can quickly disperse the heat of chip, reduces the temperature of chip and product
Temperature.
As shown in figure 3, the present invention also provides a kind of manufacture method of thermal dispersant coatings, in electric heating device outer surface or
It is uniformly arranged on heat-radiating substrate and heat is switched to ultrared heat conversion layer, this manufacture method includes：
Step S11, preparation surface carries the nanometer of equal number or the carrier granular of sub- nano-particle, specifically will carry
Body is prepared into including the carrier granular at least carrying at least one nanometer or sub- nano-particle, specifically, makes each carrier
Grain surface carries a considerable amount of nanometer of quantity or sub- nano-particle；
Step S12, the carrier carrying nanometer or sub- nano-particle is solidified on heat source surface.
Described surface carries the nanometer of equal number or step S11 of the carrier granular of sub- nano-particle, by by concentration
When low material adds in the high material of concentration, the relatively low material concentration of concentration increases, and takes mixed material will add newly again
High concentration material in, concentration is leveled off to the concentration of the material of low concentration in new high concentration material by suitable circulation
High material concentration.Because the density of carrier is larger, also denser during its liquid, it is relatively difficult to make nano-sized carbon equal distribution equal
Even.Above-mentioned cyclic process can make be distributed in the trend such as nano-sized carbon of carrier particle surface uniformly, can more preferably control simultaneously
Make each carrier granular and carry the quantity such as nano-sized carbon.
As shown in figure 4, described preparation surface carries the nanometer of equal number or carrier granular step S11 of sub- nano-particle
Including：
Step S110, the larger first vector solution of preparation of nano granule density, specifically, add in liquid carrier
At least include nanometer or the nano-particle of sub- nano-sized carbon, and stir, described carrier is polyurethane series (PU), epoxy resin
(EPOXY), polyurethane resin system (HYHRID), polyester (POLYESTER), fluoroolefins-vinyl ethers (ester) copolymer coating
(FEVE), described nano-particle also includes nanometer or sub-nanometer silicon carbide, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide or carbon
Granule one of which or several；
Step S111, then preparation of nano granule density less Second support solution, specifically, in another liquid carrier
Middle addition at least includes nanometer or the nano-particle of sub- nano-sized carbon, makes the concentrations of nanoparticles in Second support solution be less than first
Concentrations of nanoparticles in carrier solution；
Step S112, is ground into the first tiny carrier granular, specifically after taking the solidification of concentration less Second support solution
Say, less for concentration Second support solution is solidified, then is ground into the first tiny carrier granular with nano-particle, wherein solid afterwards
Change to pulverize and generate a diameter of 5 μm -50 μm of the first tiny carrier granular；
Step S113, will stir in first vector solution larger for the addition concentrations of nanoparticles of the first tiny carrier granular
Mix, specifically, take the addition of the first tiny carrier granular in step S112 at least larger containing nanometer or sub- nanometer concentration of carbon
Stir in first vector solution, solidify afterwards are pulverized, generate the second tiny carrier granular；
Step S114, judges whether the nano-particle quantity entrained by the second tiny carrier particle surface reaches requirement, when
Reach and terminate during requirement；During nano-particle lazy weight entrained by when the second tiny carrier granular, by the second tiny carrier
Grain is put in the larger first vector solution of concentration, repeats above-mentioned S113 step until meeting the requirements.
Step S110 and step S111 can sequentially be prepared in no particular order.
As shown in figure 5, surface is carried the carrier granular melting and solidification of nanometer or sub- nano-particle in the step of heat source surface
Rapid S12 comprises the following steps：
Step S121, carrier granular surface uniformly being carried nano-particle is uniformly distributed in heat source surface；Specifically,
The carrier granular carrying a considerable amount of nanometer of quantity or sub- nano-particle in step S11 is uniformly distributed in heat source surface, should
Thermal source includes heat-radiating substrate or the heater members contacting with heater.
Step S122, the thermal source that the surface in step S121 is provided with carrier granular is placed using melting solidification, tool
Say, the density of described carrier is more than each material nanometer or the density of sub- nano-particle, will be uniformly distributed load in step S121 body
, at 100-200 DEG C, hardening time is by 1-20 minute melting and solidification so as to the nanometer being carried or sub- nano-particle and carrier for body granule
Layering, forms the carrier layer of the heat conversion layer being made up of nanometer or sub- nano-particle and fixing heat conversion layer.
It is to be uniformly distributed that the manufacture method of thermal dispersant coatings of the present invention can make the heat conversion layer being at least made up of nano-sized carbon,
Converting heat is corresponding infrared ray by the nano-particle that can preferably excite interaction, and then quickly disperses by heat
Go, improve radiating efficiency.
Specifically, the surface in carrier layer 2 is uniformly provided with and for heat to switch to ultrared heat conversion layer 1, this heat
Conversion layer 1 at least includes the carbon of nanometer or Subnano-class, can also include carborundum, the nitrogen of nanometer or Subnano-class as needed
Change boron, aluminium nitride, aluminium oxide, titanium dioxide or carbon granule one of which or several.
Described carrier layer 2 is used for for heat conversion layer 1 being fixed on electric heating device 3, and this carrier layer 2 can include poly- ammonia
Ester system (PU), epoxy resin (EPOXY), polyurethane resin system (HYHRID), polyester (POLYESTER) or fluoroolefins-ethylene
Base ether (ester) copolymer coating (FEVE) etc..
When heat conversion layer 1 is mainly by the carborundum of nanometer or Subnano-class, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide
When titanium and carbon granule composition, it contains weight than the nano carbon particle for 5-30%, and weight is than the carborundum for 10-20%, weight
The boron nitride for 10-20% for the ratio, weight than the aluminium nitride for 10-20%, weight than the aluminium oxide for 5-10% and weight ratio is
The titanium dioxide of 5-30%.
Above example only in order to technical scheme to be described, is not intended to limit；Although with reference to the foregoing embodiments
The present invention has been described in detail, it will be understood by those within the art that：It still can be to aforementioned each enforcement
Technical scheme described in example is modified, or carries out equivalent to wherein some technical characteristics, and these are changed or replace
Change, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (7)
1. a kind of thermal dispersant coatings, heat away electric heating device being produced for direct or indirect contact it is characterised in that：Its
Including the carrier layer located at electric heating device outer surface, this carrier layer is uniformly provided with and heat is switched to ultrared heat turns
Change layer, wherein carry nanometer or the carrier granular hot melt layering of sub- nano-particle forms the carrier layer being made up of carrier and by nanometer
Or the heat conversion layer that sub- nano-particle is constituted, the density of this carrier layer is more than the density of each material of composition heat conversion layer,
Described carrier layer is polyurethane series, epoxy resin, polyester, fluoroolefins-vinyl ether co-polymer coating.
2. thermal dispersant coatings according to claim 1 it is characterised in that：Described heat conversion layer includes nanometer or Subnano-class
Carbon granule, also include the carborundum of nanometer or Subnano-class, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide one of which or
Mixing that are several, being mainly made up of carborundum, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide and carbon granule when heat conversion layer
During thing, the carbon granule of nanometer or Subnano-class, carborundum, boron nitride, aluminium nitride, aluminium oxide and titania weight ratio are respectively
5-30%, 10-20%, 10-20%, 10-20%, 5-10% and 5-30%.
3. a kind of fin, directly or indirectly contacts the heat away producing electric heating device, and this fin includes the base that radiates
Plate it is characterised in that：Be provided with carrier layer in this heat-radiating substrate at least one side, this carrier layer is evenly distributed with heat is switched to red
The heat conversion layer of outside line, wherein carries nanometer or the carrier granular hot melt layering of sub- nano-particle forms the load being made up of carrier
Body layer and the heat conversion layer being made up of nanometer or sub- nanometer, the density of this carrier layer is more than each thing of composition heat conversion layer
The density of matter, described carrier layer is polyurethane series, epoxy resin, polyester, fluoroolefins-vinyl ether co-polymer coating.
4. fin according to claim 3 it is characterised in that：Described heat conversion layer includes nanometer or Subnano-class
Carbon granule, also includes the carborundum of nanometer or Subnano-class, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide one of which or several
Kind, the mixture being mainly made up of carborundum, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide and carbon granule when heat conversion layer
When, the carbon granule of nanometer or Subnano-class, carborundum, boron nitride, aluminium nitride, aluminium oxide and titania weight are than respectively 5-
30%th, 10-20%, 10-20%, 10-20%, 5-10% and 5-30%.
5. a kind of manufacture method of thermal dispersant coatings, for being uniformly arranged heat on electric heating device outer surface or heat-radiating substrate
Switch to ultrared heat conversion layer, this manufacture method includes：
Preparation surface carries the nanometer of equal number or the carrier granular of sub- nano-particle, will carry nanometer or sub- nano-particle
Carrier granular is solidified on heat source surface so as to the nanometer being carried or sub- nano-particle are layered with carrier, is formed and is received by nanometer or Asia
The heat conversion layer of rice grain composition and the carrier layer of fixing heat conversion layer, the density of wherein said carrier layer is more than composition heat
The density of each material of amount conversion layer；
Wherein, described preparation surface carries the nanometer of equal number or the step of the carrier granular of sub- nano-particle includes：Respectively
The larger first vector solution of preparation of nano granule density and concentrations of nanoparticles less Second support solution, take nano-particle
It is ground into a diameter of 5 μm -50 μm of the first tiny carrier granular after the solidification of concentration less Second support solution, tiny by first
Carrier granular adds stirring in the larger first vector solution of concentrations of nanoparticles, is ground into a diameter of 5 μm -50 μm after solidification
Second tiny carrier granular；When the nano-particle quantity that the second tiny carrier particle surface carries not up to requires, by second
Tiny carrier granular puts into stirring in the larger first vector solution of concentration, pulverizes until meeting the requirements after solidification；
The described step that the carrier granular carrying nanometer or sub- nano-particle is solidified on heat source surface includes：Surface is uniformly taken
Carrier granular with nano-particle is uniformly distributed in heat source surface, and the thermal source that surface is provided with carrier granular is placed on 100-200 DEG C
At a temperature of melting and solidification 1-20 minute.
6. thermal dispersant coatings manufacture method according to claim 5 it is characterised in that：Described nano-particle includes nanometer or Asia
Nano carbon particle, also includes nanometer or sub-nanometer silicon carbide, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide one of which or several
Kind, the mixture being mainly made up of carborundum, boron nitride, aluminium nitride, aluminium oxide, titanium dioxide and carbon granule when heat conversion layer
When, the carbon granule of nanometer or Subnano-class, carborundum, boron nitride, aluminium nitride, aluminium oxide and titania weight are than respectively 5-
30%th, 10-20%, 10-20%, 10-20%, 5-10% and 5-30%.
7. the thermal dispersant coatings manufacture method according to claim 5 or 6 it is characterised in that：Described carrier is polyurethane series, ring
Oxygen resin system, polyester, fluoroolefins-vinyl ether co-polymer coating.
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| CN201310083816.0A CN103436066B (en) | 2012-04-13 | 2013-03-05 | Heat dissipation coating, heat dissipation fin and manufacturing method |
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| CN201210108801 | 2012-04-13 | ||
| CN201210108801.0 | 2012-04-13 | ||
| CN201310083816.0A CN103436066B (en) | 2012-04-13 | 2013-03-05 | Heat dissipation coating, heat dissipation fin and manufacturing method |
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| CN103436066B true CN103436066B (en) | 2017-02-15 |
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| CN201320124099.7U Expired - Lifetime CN203474703U (en) | 2012-04-13 | 2013-03-05 | Cooling coating and cooling fin |
| CN201310083816.0A Active CN103436066B (en) | 2012-04-13 | 2013-03-05 | Heat dissipation coating, heat dissipation fin and manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014107909A1 (en) * | 2014-06-05 | 2015-12-17 | Infineon Technologies Ag | Printed circuit boards and process for their manufacture |
| CN104710912B (en) * | 2015-03-31 | 2017-09-22 | 东莞市闻誉实业有限公司 | Fin |
| CN104876553A (en) * | 2015-04-29 | 2015-09-02 | 江门市华材新材料科技实业有限公司 | Nano ceramic electric heating element and manufacturing method thereof |
| CN104861831A (en) * | 2015-06-10 | 2015-08-26 | 普罗旺斯科技（深圳）有限公司 | Graphene coating, graphene cooling fin and manufacturing methods of graphene coating and graphene cooling fin |
| CN104896452A (en) * | 2015-06-11 | 2015-09-09 | 固态照明张家口有限公司 | Heat dissipation material, LED spot light radiator based on same, and LED spot light |
| CN105038374A (en) * | 2015-09-02 | 2015-11-11 | 普罗旺斯科技（深圳）有限公司 | Cooling coating, cooling fin and manufacturing method |
| EP3357308A1 (en) | 2015-10-01 | 2018-08-08 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Electronic component carrier for carrying and cooling a heat generating electronic component |
| CN105371254A (en) * | 2015-11-27 | 2016-03-02 | 海信集团有限公司 | Wavelength conversion device, preparation method thereof and laser light source device |
| CN107529540A (en) * | 2017-10-16 | 2018-01-02 | 普罗旺斯科技（深圳）有限公司 | A kind of thermal dispersant coatings and preparation method thereof |
| CN109233368A (en) * | 2018-08-03 | 2019-01-18 | 四川省思硕教育科技有限公司 | Case radiation device efficient heat-resisting thermal dispersant coatings |
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| AT412265B (en) * | 2002-11-12 | 2004-12-27 | Electrovac | HEAT EXTRACTION COMPONENT |
| DE10336747A1 (en) * | 2003-08-11 | 2005-03-17 | Infineon Technologies Ag | Semiconductor component used as a power transistor comprises a layer structure with a semiconductor chip, a support for the chip and an electrically insulating layer made from nano-particles of an electrically insulating material |
| DE102005062181A1 (en) * | 2005-12-23 | 2007-07-05 | Electrovac Ag | Composite material, preferably multi-layered material, useful e.g. as printed circuit board, comprises two components, which are adjacent to each other and connected to a surface by an adhesive compound, which is a nano-fiber material |
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- 2013-04-11 WO PCT/CN2013/000413 patent/WO2013152623A1/en active Application Filing
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| CN101003701A (en) * | 2006-12-31 | 2007-07-25 | 大连理工大学 | Method for modifying functional coat of gradient dispersed stuffing grains, and application |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2013152623A1 (en) | 2013-10-17 |
| CN103436066A (en) | 2013-12-11 |
| CN203474703U (en) | 2014-03-12 |
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