CN202816904U - Encapsulation structure of naked-die device - Google Patents

Abstract

The utility model discloses an encapsulation structure of a naked-die device. The encapsulation structure comprises a naked device, a heat dissipation cap and a heat conduction layer, the heat dissipation cap is buckled on the naked-die device, and the heat dissipation cap and the naked-die device are in contact through the heat conduction layer. The heat dissipation cap includes a cap top and a cap edge which form a groove structure, the heat conduction layer consists of material of heat conducting glue, a heat conducting pad, or a graphite flake, and the material of the cap top and the cap edge is copper, aluminum, ceramic or alloy. The encapsulation structure of the naked-die device enables the heat dissipation efficiency of the naked-die device to be enhanced, and can greatly reduce the stress on the upper casing of the naked-die device, ensuring the naked-die device not to be damaged.

Description

A kind of encapsulating structure of naked core device

Technical field

The utility model belongs to the dissipation from electronic devices field, relates in particular to a kind of good heat radiating encapsulating structure for naked core (Naked Die) device.

Background technology

The feature of the miniaturization such as communication products such as base station, server, large capacity, two-forty is more and more obvious, and this makes circuit board more complex functions, integrated level higher, and hear rate is larger.Core devices on the circuit board has generally comprised CPU (Central Processing Unit, processor), FPGA (Field Programmable Gate Array, field programmable gate array), DSP (Digital Signal Processing, digital processing unit) etc. or one of, these device packages mostly are greatly BGA (Ball Grid Array, the upside-down mounting ball grid array), component pipe core is taked upside-down mounting, bonding line is drawn from the tube core below, can reduce bonding line length, reduce electric ghost effect, device speed can be greatly improved, be beneficial in addition heat and dissipate from the device upper surface.In the handstand encapsulating structure, often can see a kind of naked core device, as shown in Figure 1, comprise naked core 1 and substrate 2, outside its component pipe core 1 is directly exposed to, because heat almost all concentrates on the naked core, and the naked core surface area is little, causes device unit are density of heat flow rate larger, the heat radiation difficulty, when especially hear rate is larger, become a bottleneck of circuit board thermal reliability.。

Radiator structure for the naked core device has following two kinds usually at present: the one, and the encapsulating structure of naked core device as shown in Figure 2 comprises: naked core 1, substrate 2, heat-conducting layer 4 and radiator 5; The 2nd, the encapsulating structure of naked core device as shown in Figure 3 comprises: naked core 1, substrate 2, heat-conducting layer 4, metal boss 6 and metal shell 7.All there is following problem in these two kinds of methods: the first can produce larger diffusion thermal resistance because the contact area of the upper casing of naked core device and radiator base plate or metal boss is too small, causes sink-efficiency to reduce, and is unfavorable for heat radiation; It two is because outside naked core was directly exposed to, relatively more fragile, bad radiator mounting means also caused naked core to be damaged by pressure easily.

Summary of the invention

The utility model embodiment provides a kind of encapsulating structure of naked core device, is intended to solve exist in the prior art low for naked core device radiating efficiency, and the technical problem that crushes easily of naked core device.

The encapsulating structure of this naked core device, comprise naked device, radiating cap and heat-conducting layer, radiating cap buckles on the naked core device, contact by heat-conducting layer between radiating cap and the naked core device, wherein, radiating cap comprises crown and hat brim, and crown and hat brim form a groove structure, this heat-conducting layer is comprised of materials such as heat-conducting glue, heat conductive pad or graphite flakes, and the material of above-mentioned crown and hat brim is copper, aluminium, pottery or alloy.

Encapsulating structure of the present utility model with have the mode that adds boss or radiator at the naked core device now and come comparison, its effect is to have reduced the diffusion thermal resistance of naked core and radiator contact position, effectively eliminated the heat radiation bottleneck, its naked core device radiating efficiency is improved.In addition, the encapsulation base material of the hat brim of radiating cap and component pipe core peripheral region is fixed together, and has played good supporting role, can greatly reduce the stressed of naked core device upper casing, guarantees that the naked core device is not damaged by pressure.

Description of drawings

Fig. 1 is naked core device schematic diagram;

Fig. 2 is the schematic diagram that existing naked core device uses the radiator structure of radiator;

Fig. 3 is the schematic diagram that existing naked core device uses the radiator structure of metal boss;

Fig. 4 is the schematic diagram of radiator structure of the naked core device of the utility model one embodiment;

The stereogram of an embodiment of the radiating cap that Fig. 5 provides for the utility model;

The side cutaway view of an embodiment of the radiating cap that Fig. 6 provides for the utility model;

Embodiment

Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme of the utility model embodiment is clearly and completely described, obviously, described embodiment only is a part of embodiment of the present utility model, rather than whole embodiment.Based on embodiment of the present utility model, those skilled in the art belong to protection range of the present utility model not making the every other embodiment that obtains under the creative work prerequisite.

As shown in Figure 4, it is the encapsulating structure schematic diagram of the naked core device that provides of the utility model, described encapsulating structure comprises naked core device, radiating cap 10 and the heat-conducting layer 4 that is made of naked core 1 and basic unit 2, wherein, radiating cap 10 buckles on naked core 1, be provided with heat-conducting layer 4 between radiating cap 10 and the naked core 1, heat-conducting layer can be heat-conducting glue, heat conductive pad or graphite etc.; Described radiating cap 10 comprises crown 8 and hat brim 9, and as shown in Figure 5 and Figure 6, the material of described crown 8 and hat brim 9 can be copper, aluminium or alloy etc., and crown 8 and hat brim 9 form a groove structure, so that described naked core device embeds; For crown 8 is fixed on naked core 1 upper casing, in the present embodiment, can take the powerful adhesivess such as heat-conducting glue or double faced adhesive tape to be fixed together between crown 8 and naked core 1 upper casing, prevent from being pasted not strongly and come off.

Claims (2)

1. encapsulating structure for the naked core device, it is characterized in that, comprise naked device, radiating cap and heat-conducting layer, described radiating cap buckles on the naked core device, contact by heat-conducting layer between radiating cap and the naked core device, wherein, radiating cap comprises crown and hat brim, and described crown and hat brim form a groove structure.

2. encapsulating structure according to claim 1 is characterized in that, the material of described crown and hat brim is copper, aluminium, pottery or alloy.

Images