CN117715393B - Mobile phone capable of conducting heat dissipation in Z direction through phase change material and heat dissipation assembly - Google Patents
Mobile phone capable of conducting heat dissipation in Z direction through phase change material and heat dissipation assembly Download PDFInfo
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- CN117715393B CN117715393B CN202410165231.1A CN202410165231A CN117715393B CN 117715393 B CN117715393 B CN 117715393B CN 202410165231 A CN202410165231 A CN 202410165231A CN 117715393 B CN117715393 B CN 117715393B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 132
- 239000012782 phase change material Substances 0.000 title claims abstract description 126
- 239000010410 layer Substances 0.000 claims abstract description 228
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- 239000012790 adhesive layer Substances 0.000 claims abstract description 25
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 23
- 239000010439 graphite Substances 0.000 claims abstract description 23
- 238000002791 soaking Methods 0.000 claims abstract description 21
- 238000007650 screen-printing Methods 0.000 claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 8
- 239000002390 adhesive tape Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000002134 carbon nanofiber Substances 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
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- 238000010586 diagram Methods 0.000 description 11
- 239000002131 composite material Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000000110 cooling liquid Substances 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a mobile phone and a radiating component for Z-direction heat conduction and radiation through a phase change material, wherein a heat radiating substrate layer adopts a soaking plate or an edge-covered graphite sheet, the heat radiating substrate layer is attached to an LCD module through an adhesive layer of 5 um to 10um so as to absorb heat of the LCD module, the heat radiating substrate layer is attached to a camera module through a phase change material layer so as to absorb the heat of the camera module and conduct heat conduction in the Z direction so as to further soak the heat radiating substrate layer to realize X-Y direction soaking, and the phase change material layer is formed in the following way: the phase change material layer is formed in a silk screen printing mode, and the thickness of the phase change material layer is 18 mu m+/-3 mu m; the phase change material layer is a phase change material sheet, the thickness is 0.15mm to 0.5mm, the longitudinal heat transfer capacity of the heat dissipation film is improved, the structure of the product is simplified, the thickness of the product is reduced, and the heat dissipation efficiency can be improved while the structure of the product is simplified.
Description
Technical Field
The application relates to the field of mobile terminal heat dissipation, in particular to a mobile phone and a heat dissipation component for Z-direction heat conduction and heat dissipation through a phase change material.
Background
Smartphones and tablet personal computers are increasingly updated, the pixels are developed to 1 hundred million pixels from 30 ten thousand pixels before 10 years, the high-pixel cameras have ultra-clear image recognition points, and particularly under the condition of local amplification of the camera images, the high-pixel cameras are particularly important, but the power consumption is increased from tens of mW to seven eight hundred mW. However, the cmos image sensor adopted by the high-pixel camera is more complex, the number of peripheral electronic components is more, and the design of the circuit board is more precise, so that the more the power consumption of the camera is, the more the power consumption is, the temperature is continuously increased, the signal-to-noise ratio of the image is reduced when the temperature is continuously increased, and the customer experience is gradually reduced. At present, a low-power consumption CMOS sensor is mainly selected for controlling the heating value of the camera module, but the low-power consumption CMOS sensor is low in general pixel ratio, and a high-pixel camera cannot be designed and supported. The internal circuit of the high pixel cmos sensor is complex, and power consumption and temperature increase relative to those of the low pixel cmos sensor.
Some manufacturers attach steel sheets to the back of a circuit board (namely RFPC) to enable the steel sheets to be in contact with a main board or air for heat dissipation, but a layer of glue is arranged between the steel sheets and the RFPC, so that the heat conductivity is very poor, and a module adopting a mode of attaching the steel sheets to the back of the circuit board is hardly cooled obviously. Due to the temperature effect, manufacturers have to limit the performance of the camera module hardware through algorithm setting to achieve the effect of controlling the temperature, but the high performance and the continuous imaging user experience are reduced. On the other hand, the high-performance camera module has more complicated structure and further increased volume, and the heat dissipation module has also been required to be ultra-thin and efficient because the internal space of electronic products such as mobile phones, flat plates and the like is very limited.
Disclosure of Invention
The application aims to solve the technical problems of improving the heat dissipation efficiency, further solving the problems of achieving the function of controlling the temperature by limiting the performance of the hardware of the camera module in the traditional mode, fully releasing the performance of the hardware and reducing the probability of occurrence of dead halt and stuck.
The technical aim of the application is realized by the following technical scheme:
a cell phone for Z-directed heat transfer and dissipation through a phase change material, comprising:
An LCD module;
A camera module;
the heat dissipation substrate layer is arranged between the LCD module and the camera module, the heat dissipation substrate layer adopts a soaking plate or an edge-wrapping graphite sheet, the heat dissipation substrate layer is attached to the LCD module through an adhesive layer of 5 um to 10um so as to absorb heat generated by the LCD module, the heat dissipation substrate layer is attached to the camera module through a phase change material layer so as to absorb the heat generated by the camera module and further soaked in the Z direction to the heat dissipation substrate layer to realize X-Y direction soaking, wherein the phase change material layer is formed in the following way:
the phase change material layer is formed in a silk screen printing mode, and the thickness of the phase change material layer is 18 mu m+/-3 mu m;
The phase change material layer is a phase change material sheet, and the thickness is 0.15mm to 0.5mm.
According to the scheme, the longitudinal heat conduction is realized through the heat conduction performance of the phase change material layer, and then the heat dissipation is carried out through the heat dissipation substrate layer, so that the longitudinal heat conduction capacity of the heat dissipation film is improved, the structure of the product is simplified, the thickness of the product is reduced, and the heat dissipation efficiency can be improved while the structure of the product is simplified.
Optionally, the mobile phone further comprises an insulating film between the heat dissipation substrate layer and the phase change material layer, and the thickness range of the insulating film is 6um + -0.5 um.
According to the scheme, the insulating film is arranged, so that the influence of the heat dissipation substrate layer on attached devices can be reduced.
Optionally, the area of the phase change material layer corresponds to the area of the inner end of the camera module;
The areas of the LCD module, the heat dissipation substrate layer, the adhesive layer and the insulating film are corresponding to each other and are far larger than the area of the phase change material layer.
According to the scheme, the phase change material layer corresponds to the inner end area of the camera module, so that accurate heat conduction is realized, heat is conducted to the heat dissipation substrate layer, the heat dissipation area is enlarged, and the heat dissipation efficiency is improved.
In another aspect of the present application, a mobile phone for performing Z-directional heat conduction and dissipation through a phase change material is disclosed, including:
An LCD module;
a PCB provided with an SoC;
The heat dissipation substrate layer is arranged between the LCD module and the PCB, the heat dissipation substrate layer adopts a soaking plate or an edge-wrapping graphite sheet, the heat dissipation substrate layer is attached to the LCD module through an adhesive layer of 5 um to 10um so as to absorb heat generated by the LCD module, the heat dissipation substrate layer is attached to the SoC through a phase change material layer so as to absorb the heat generated by the SoC and conduct heat conduction in the Z direction so as to further soak the heat dissipation substrate layer to realize X-Y direction soaking, wherein the phase change material layer is formed in the following mode:
the phase change material layer is formed in a silk screen printing mode, and the thickness of the phase change material layer is 18 mu m+/-3 mu m;
The phase change material layer is a phase change material sheet, and the thickness is 0.15mm to 0.5mm.
According to the scheme, the longitudinal heat conduction is realized through the heat conduction performance of the phase change material layer, and then the heat dissipation is carried out through the heat dissipation substrate layer, so that the longitudinal heat conduction capacity of the heat dissipation film is improved, the structure of the product is simplified, the thickness of the product is reduced, and the heat dissipation efficiency can be improved while the structure of the product is simplified.
Optionally, the mobile phone further comprises an insulating film between the heat dissipation substrate layer and the phase change material layer, and the thickness range of the insulating film is 6um + -0.5 um.
According to the scheme, the insulating film is arranged, so that the influence of the heat dissipation substrate layer on attached devices can be reduced.
Optionally, the mobile phone, wherein an area of the phase change material layer corresponds to an area of the SoC;
The areas of the LCD module, the heat dissipation substrate layer, the adhesive layer and the insulating film are corresponding to each other and are far larger than the area of the phase change material layer.
According to the scheme, through the phase change material layer corresponding to the inner end area of the SoC, accurate heat conduction is achieved, heat is conducted to the heat dissipation substrate layer, the heat dissipation area is enlarged, and the heat dissipation efficiency is improved.
In another aspect of the application, a mobile phone heat dissipation assembly is disclosed, wherein the mobile phone heat dissipation assembly comprises the following components in turn from top to bottom:
A dustproof protective film layer;
A phase change material layer;
An insulating film;
A heat-dissipating substrate layer;
An adhesive layer;
a bottom film layer;
The phase change material layer is used for being attached to a camera module and/or an SoC of a mobile phone to absorb heat generated by the camera module and/or the SoC and conducting heat conduction in the Z direction to further soak the heat dissipation substrate layer to realize X-Y direction soaking, and the phase change material layer is formed in the following mode:
the phase change material layer is formed in a silk screen printing mode, and the thickness of the phase change material layer is 18 mu m+/-3 mu m;
The phase change material layer is a phase change material sheet, and the thickness is 0.15mm to 0.5mm.
According to the scheme, the phase change material layers are attached to the camera module and/or the SoC of the mobile phone through the film layers in sequence, so that heat generated by the camera module and/or the SoC is absorbed, longitudinal heat conduction is achieved through the heat conduction performance of the phase change material layers, and then heat is radiated through the heat radiation substrate layers, so that the longitudinal heat transmission capacity of the heat radiation film is improved, the structure of a product is simplified, the thickness of the product is reduced, and the heat radiation efficiency can be improved while the structure of the product is simplified.
Optionally, the mobile phone cooling assembly further comprises a protection film layer disposed between the dustproof protection film layer and the insulation film, and a hollow area is disposed on the protection film layer corresponding to the outer contour of the phase change material layer to support and protect the periphery of the phase change material layer.
According to the scheme, the phase change material layer is supported and protected through the protective film layer, so that the overall strength and stability of the heat dissipation assembly during molding are guaranteed.
Optionally, the mobile phone heat dissipation assembly, wherein:
the dustproof protective film layer is made of PET release film, and the thickness of the dustproof protective film layer is 50 um+/-5 um;
The heat conductivity coefficient of the phase change material layer is more than 6W/m.k
The protective film layer is made of PET protective film with the thickness of 85um + -5 um;
The insulating film is made of PET single-sided adhesive tape, and the thickness of the insulating film is 6 mu m +/-0.5 mu m;
The thickness of the adhesive layer is 5 um-10 um;
the bottom film layer is made of PET release film, and the thickness of the bottom film layer is 50um + -5 um.
In summary, the heat dissipation substrate layer of the present application is a soaking plate or an edge-wrapped graphite sheet, the heat dissipation substrate layer is bonded to the LCD module through an adhesive layer of 5 um to 10um to absorb heat generated by the LCD module, the heat dissipation substrate layer is bonded to the camera module through a phase change material layer to absorb heat generated by the camera module and conduct heat conduction in the Z direction to further soak the heat dissipation substrate layer to realize X-Y direction soaking, wherein the phase change material layer is formed by one of the following methods: the phase change material layer is formed in a silk screen printing mode, and the thickness of the phase change material layer is 18 mu m+/-3 mu m; the phase change material layer is a phase change material sheet, the thickness is 0.15mm to 0.5mm, the longitudinal heat conduction is realized through the heat conduction performance of the phase change material layer, the heat dissipation is realized through the heat dissipation substrate layer, the longitudinal heat conduction capacity of the heat dissipation film is improved, the structure of the product is simplified, the thickness of the product is reduced, and the heat dissipation efficiency can be improved while the structure of the product is simplified.
Drawings
Fig. 1 is a schematic structural diagram of a mobile phone heat dissipation assembly and a camera module according to a first embodiment of the present application.
Fig. 2 is a schematic structural diagram of a heat dissipation assembly and an SOC of a mobile phone according to a second embodiment of the present application.
FIG. 3 is a schematic diagram of a heat dissipation structure of a camera module with a non-hollow design
Fig. 4 is a schematic diagram of a heat dissipation structure of a camera module with a conventional hollow design.
Fig. 5 is a schematic structural diagram of an improved composite heat dissipation structure of a camera module according to the present application.
Fig. 6 is a schematic structural diagram of an improved composite heat dissipation structure of a camera module according to the present application.
Fig. 7 is a schematic structural diagram of a conventional SOC heat dissipation structure.
Fig. 8 is a schematic structural diagram of an improved SOC composite heat dissipation structure of the present application.
Reference numerals: 1. a heat-dissipating substrate layer; 2. a phase change material layer; 3. an adhesive layer; 4. a protective film layer; 5. a bottom film layer; 6. an insulating film; 7. a dustproof protective film layer; 8. a first back shell; 9. a first metal substrate; 10. the first display module Bao Biandan is an ink heat dissipation film; 11. a first display module copper foil; 12. a first display module; 13. the first touch control layer module; 14. a camera module; 15. a second back shell; 16. a PCB; 17. SOC; 18. an SOC shield; 19. a second metal substrate; 20. the second display module Bao Biandan is an ink heat dissipation film; 21. a second display module copper foil; 22. a second display module; 23. the second touch control layer module.
Detailed Description
The present invention will be further described with reference to specific embodiments and drawings, in which more details are set forth in the following description in order to provide a thorough understanding of the present invention, but it will be apparent that the present invention can be embodied in many other forms than described herein, and that those skilled in the art may make similar generalizations and deductions depending on the actual application without departing from the spirit of the present invention, and therefore should not be construed to limit the scope of the present invention in terms of the content of this specific embodiment.
In the following description, the present invention is described with reference to the embodiments. One skilled in the relevant art will recognize, however, that the embodiments may be practiced without one or more of the specific details, or with other alternative and/or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of various embodiments of the invention. Similarly, for purposes of explanation, specific numbers, materials and configurations are set forth in order to provide a thorough understanding of the embodiments of the invention. However, the invention may be practiced without the specific details. Furthermore, it should be understood that the embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.
The embodiment of the application discloses a mobile phone radiating component, referring to fig. 1 and 2, which are respectively schematic structural diagrams of the mobile phone radiating component, a camera module and an SOC, wherein the mobile phone radiating component comprises the following components sequentially arranged from top to bottom:
a dustproof protective film layer 7;
A phase change material layer 2;
an insulating film 6;
a heat dissipation substrate layer 1;
an adhesive layer 3;
A bottom film layer 5;
The phase change material layer 2 is used for being attached to a camera module and/or an SoC of a mobile phone to absorb heat generated by the camera module and/or the SoC and conduct heat conduction in a Z direction to further soak the heat to the heat dissipation substrate layer 1 to realize soaking in an X-Y direction, and the phase change material layer 2 is formed in one of the following ways:
the phase change material layer 2 is formed in a silk screen printing mode, and the thickness is 18 um+/-3 um;
The phase change material layer 2 is a phase change material sheet, and the thickness is 0.15mm to 0.5mm.
In the prior art, a metal sheet or a graphite heat sink is attached to the back of a circuit board of a camera module, and heat is dissipated by using the heat conductivity of the metal or the graphite heat sink.
Whether the metal sheets or the graphite radiating fins are bonded by adopting ultrathin adhesive tapes, the thickness is relatively thick, and the ultrathin adhesive tapes have no heat conducting property, so that the heat conducting efficiency in the Z direction is very low, and the heat conducting efficiency becomes a bottleneck of the whole radiating structure.
The ultra-thin adhesive tape has certain limitation on the gap filling capability, so that a certain proportion of tiny pores are formed between the micro adhesive tape and the circuit board, and the pores are filled with air, so that the thermal conductivity of the air is only 0.023W/m.k in a closed state, the interface thermal resistance is large, and the conduction of heat in the Z direction is further reduced.
The other side of the cooling fin is usually attached to the middle metal substrate in the machine body or the volume of part of the high-performance camera module is overlarge, so that the metal substrate is hollowed out for space, a graphite sheet with larger area is also arranged between the other side of the metal substrate and the display module, and the area is generally equivalent to that of the LCD module for heat dissipation of the display module. The heat of LCD module back and make a video recording the heat of module all can be through intermediate metal level or graphite layer mutual transfer, finally make heat evenly distributed to dispel the heat through the flow of air. In this way, a plurality of graphite sheets or metal sheets must be used, and a plurality of interfaces are formed between the graphite sheets/metal sheets and the substrate, and between the graphite sheets and the metal sheets, so that the heat conduction efficiency is impaired.
Based on the problems existing in the prior art, in the embodiment of the present application, the heat dissipation substrate layer 1 is provided, the heat dissipation substrate layer 1 is used as a main component for heat dissipation, the phase change material layer 2 is provided on the heat dissipation substrate layer 1, the phase change material layer 2 is made of a phase change material, and the heat conduction efficiency in the Z direction is improved through the phase change material layer 2. All the surfaces have roughness, so that when the two surfaces are contacted together, the two surfaces cannot be completely contacted together, some air gaps are always mixed in the surfaces, and the heat conductivity coefficient of air is very small, so that a relatively large contact thermal resistance is caused. The phase change material can be used for filling the air gap, so that the contact thermal resistance can be reduced, and the heat dissipation performance can be improved. According to the application, the heat dissipation substrate layer 1 and the phase change material layer 2 are arranged, the heat conduction in the Z direction is carried out through the phase change material layer 2, and then the heat dissipation is carried out through the heat dissipation substrate layer 1, so that the structure is simplified, the heat dissipation efficiency is improved, the product design can be thinner, and in the specific implementation, in the production and manufacturing process, the adhesive layer 3 is arranged on the side, away from the phase change material layer 2, of the heat dissipation substrate layer 1, and the heat dissipation substrate layer 3 can be connected with a device to be cooled.
In the embodiment of the application, the heat dissipation component is used for being connected with a device to be dissipated, wherein one surface of the heat dissipation component is connected with the device to be dissipated, and in order to ensure the installation stability, the heat dissipation component is adhered to the corresponding position of the device to be dissipated through the adhesive layer 3, but in the production process, the adhesive layer 3 is exposed and is easy to adhere to other things, so in the embodiment of the application, the adhesive layer 3 is connected with the bottom film layer 5, and certain protection is carried out through the bottom film layer 5. When leaving the factory, can be connected with adhesive layer 3 through backing film layer 5, and when specific use, can remove backing film layer 5, again be connected with the structure through adhesive layer 3, treat the heat dissipation of heat dissipation device.
In the embodiment of the application, the heat dissipation assembly is delivered from factory to application, so that in particular use, in order to facilitate the user to apply the heat dissipation assembly, a marking piece, which can be characters or patterns, can be arranged on the bottom film layer 5 for marking, can also extend outwards at the edge of the bottom film layer 5, is convenient for the user to distinguish the bottom film layer 5, and is also convenient for the user to identify the front side and the back side of the heat dissipation assembly, thereby being convenient for the user to use.
According to the embodiment of the application, after the production is completed, the whole strength of the heat radiation component is insufficient, and the heat radiation component is inconvenient to package or transport, so that the protective film layer 4 is arranged between the heat radiation substrate layer 1 and the phase change material layer 2 to support the whole structure, the whole strength is improved, and the protective film layer 4 can be removed in specific use due to the hollow arrangement at the position of the corresponding phase change material layer 2 on the protective film layer 4.
In the embodiment of the application, in order to further adapt to different application scenarios, the phase change material layer 2 can be formed by splicing, small-sized phase change material sheets can be produced in batch during production and processing, one or more phase change material sheets can be selected for splicing according to actual requirements, so that the phase change material layer is formed, and meanwhile, the phase change material layer can adapt to hollowed-out positions and is attached to different positions of a terminal.
In the embodiment of the application, the heat dissipation component is connected with the device to be dissipated, and the device to be dissipated is generally an electronic device such as a camera module, so in order to reduce the interference of the heat dissipation component on the electronic device, an insulating film 6 is arranged between the heat dissipation substrate layer 1 and the protective film layer 4, and a certain insulating effect is achieved through the insulating film 6.
In the embodiment of the application, in order to ensure the stability of the product when leaving the factory, the dustproof protective film layer 7 is preferably arranged on one surface of the phase change material layer 2, which is far away from the protective film layer 4, so that the interference of dust can be reduced, and in the specific use, the dustproof protective film is removed.
In some possible embodiments of the present application, the heat dissipating assembly, wherein the heat dissipating substrate layer 1 is a soaking plate layer or a graphite sheet layer.
In the embodiment of the present application, the heat dissipation substrate layer 1 is preferably a soaking plate or a graphite sheet, and different heat dissipation substrate layers 1 can be selected according to different working condition requirements, where the soaking plate is a vacuum cavity with a microstructure on the inner wall, and is usually made of copper. When heat is conducted from a heat source to an evaporation area, the cooling liquid in the cavity starts to generate the gasification phenomenon of the cooling liquid after being heated in the environment with low vacuum degree, at the moment, the cooling liquid absorbs heat energy and rapidly expands in volume, the whole cavity is rapidly filled with gas-phase cooling medium, and the phenomenon of condensation can be generated when the gas-phase working medium contacts a relatively cold area. By releasing heat accumulated during evaporation through condensation, the condensed cooling liquid returns to the evaporation heat source through the capillary channel of the microstructure, and the operation is repeated in the cavity. The graphite sheet layer is a brand new heat conduction and dissipation material, has unique grain orientation, uniformly conducts heat along two directions, and can well adapt to any surface, shield heat sources and components and improve the performance of consumer electronic products. The novel synthetic graphite solution has high heat dissipation efficiency, small occupied space and light weight, uniformly conducts heat along two directions, eliminates a hot spot area, shields a heat source and a component and improves the performance of consumer electronic products. The specific choice of the heat dissipation substrate layer 1 is based on different product requirements.
In some possible embodiments of the present application, the heat dissipation assembly, wherein the thermal conductivity of the phase change material layer 2 is >6W/m×k.
In the embodiment of the present application, the thermal conductivity of the phase change material layer 2 is preferably greater than 6W/m×k, which is far greater than the heat dissipation scheme adopted in the existing mobile phone, so that the heat transfer capability in the Z direction is greatly improved, and the heat dissipation efficiency is also greatly improved because the heat transfer in the Z direction is the bottleneck of the whole heat dissipation structure, and in the specific implementation, the phase change material layer 2 is a phase change thermal paste layer or a phase change sheet layer or a thermal pad layer. For example, when the phase change material layer 2 is a phase change thermal conductive paste layer, the thickness of the phase change paste can be thinner, the thinnest thickness can be about 15um, the phase change material layer can meet the working condition requirement of extremely thinness, the thickness of the attached phase change sheet is generally 0.15mm-0.5mm, the thickness of the attached high-performance thermal conductive gasket is generally more than 0.5mm, and the phase change material layer can be suitable for working conditions and applications with higher performance requirements and certain thickness required by structural design.
In the preferred embodiment of the application, the material of the dustproof protective film layer 7 is PET release film, and the thickness is 50 um+/-5 um;
the heat conductivity coefficient of the phase change material layer 2 is more than 6W/m.k
The protective film layer 4 is made of PET protective film, the thickness is 85um + -5 um, a handle part convenient to tear is arranged on one side edge, when the handle part is pulled up, the protective film layer 4 and the dustproof protective film layer 7 can be torn off at the same time, and the assembly is relatively convenient when the hand is assembled;
The insulating film 6 is made of PET single-sided adhesive tape, and the thickness of the insulating film is 6 um+/-0.5 um;
the thickness of the adhesive layer 3 is 5 um to 10um;
The bottom film layer 5 is made of PET release film, the thickness is 50um + -5 um, and the side edge of the bottom film layer 5 is preferably provided with a handle portion which is convenient to tear off.
The phase change material of the application is generally polyolefin resin, acrylic resin, aluminum oxide, carbon nano fiber tube and the like, and aluminum powder is preferably used as a heat conducting medium in the embodiment of the application.
The existing camera module has high heating and poor heat dissipation, and the power of hardware is limited by software, which is equivalent to castration of hardware functions and low-pixel operation. According to the embodiment of the application, the heat dissipation efficiency is improved through the materials, the functional limitation of hardware can be relieved, the hardware function can be fully exerted, the pixels are smooth to operate, and the blocking and the halt are not easy.
The application discloses a mobile phone for Z-direction heat conduction and radiation through a phase change material, which comprises:
An LCD module;
A camera module;
The heat dissipation substrate layer 1 is arranged between the LCD module and the camera module, the heat dissipation substrate layer 1 adopts a soaking plate or an edge-covering graphite sheet, the heat dissipation substrate layer 1 is attached to the LCD module through an adhesive layer 3 of 5 um to 10um to absorb heat generated by the LCD module, the heat dissipation substrate layer 1 is attached to the camera module through a phase change material layer 2 to absorb heat generated by the camera module and conduct heat conduction in the Z direction to further soak the heat dissipation substrate layer 1 to realize X-Y direction soaking, wherein the phase change material layer 2 is formed in the following mode:
the phase change material layer 2 is formed in a silk screen printing mode, and the thickness is 18 um+/-3 um;
The phase change material layer 2 is a phase change material sheet, and the thickness is 0.15mm to 0.5mm.
In some possible embodiments of the present application, an insulating film 6 is further disposed between the heat dissipation substrate layer 1 and the phase change material layer 2, and a thickness of the insulating film 6 ranges from 6um±0.5um.
In some possible embodiments of the present application, the area of the phase change material layer 2 corresponds to the area of the inner end of the camera module;
The areas of the LCD module, the heat dissipation substrate layer 1, the adhesive layer 3 and the insulating film 6 are corresponding to each other and are far larger than the area of the phase change material layer 2.
In the embodiment of the present application, referring to fig. 3 to 6, the structure diagrams of the existing heat dissipation structure of the camera module with non-hollowed-out design and the improved composite heat dissipation structure of the camera module of the present application are shown respectively. The camera module 14 comprises a hollowed-out design and a non-hollowed-out design, the hollowed-out design is needed to be made at the position of the camera module 14 for the metal substrate of the non-hollowed-out design of the camera module 14, so that the camera module 14 can penetrate through the substrate, and is directly connected with an LCD large graphite sheet or a soaking plate through a phase change material, thereby realizing a high-efficiency heat dissipation function, and due to the hollowed-out design made at the position of the camera module 14, more part of thickness space can be provided for the camera module 14, thereby realizing thinner product design to a certain extent or reducing the protruding degree of a camera. For the high-performance camera module 14, the first metal substrate 9 is hollowed out due to larger volume, but the functions of thinning the product design or reducing the protruding degree of the camera can be realized by reducing the graphite sheet or the metal layer of the original camera module 14.
In another embodiment of the present application, a mobile phone for performing Z-directional heat conduction and dissipation by using a phase change material is disclosed, which includes:
An LCD module;
a PCB provided with an SoC;
the heat dissipation substrate layer 1 is arranged between the LCD module and the PCB, the heat dissipation substrate layer 1 adopts a soaking plate or an edge-wrapping graphite sheet, the heat dissipation substrate layer 1 is attached to the LCD module through an adhesive layer 3 of 5 um to 10um to absorb heat generated by the LCD module, the heat dissipation substrate layer 1 is attached to the SoC through a phase change material layer 2 to absorb the heat generated by the SoC and conduct heat conduction in the Z direction to further soak the heat dissipation substrate layer 1 to realize X-Y direction soaking, wherein the phase change material layer 2 is formed in the following mode:
the phase change material layer 2 is formed in a silk screen printing mode, and the thickness is 18 um+/-3 um;
The phase change material layer 2 is a phase change material sheet, and the thickness is 0.15mm to 0.5mm.
In some possible embodiments of the present application, an insulating film 6 is further disposed between the heat dissipation substrate layer 1 and the phase change material layer 2, and a thickness of the insulating film 6 ranges from 6um±0.5um.
In some possible embodiments of the present application, the area of the phase change material layer 2 corresponds to the area of the SoC;
The areas of the LCD module, the heat dissipation substrate layer 1, the adhesive layer 3 and the insulating film 6 are corresponding to each other and are far larger than the area of the phase change material layer 2.
Specifically, referring to fig. 7, which is a schematic diagram of a conventional SOC heat dissipation structure, as shown in fig. 8, the improved SOC composite heat dissipation structure of the present application includes a second back shell 15, a PCB16, an SOC17, an SOC shielding case 18, and a second metal substrate 19 sequentially connected from top to bottom, where the second metal substrate 19 is hollowed out at a position corresponding to the SOC17, and the phase change material layer 2 of the present application is applied below the SOC17, and then an edge-covered graphite heat dissipation film 20, a second display module copper foil 21, a second display module 22, and a second touch layer module 23 sequentially from top to bottom. The phase change paste is silk-screened or the phase change sheet or the high-performance heat conduction gasket is attached to one side of the graphite sheet insulating film, the heat conduction coefficient can be 6W/m.k or more, the heat transfer capacity in the Z direction is greatly improved, and the heat transfer in the Z direction is the bottleneck of the whole heat dissipation structure, so that the efficiency of the whole heat dissipation module is also greatly improved. The thickness of the silk-screen phase-change paste can be thinner and can reach about 15um at the minimum, so that the silk-screen phase-change paste is suitable for working conditions requiring extremely thinness, the thickness of the attached phase-change sheet is generally 0.15-0.5 mm, the thickness of the attached high-performance heat-conducting gasket is generally more than 0.5mm, and the silk-screen phase-change paste is suitable for working conditions and applications with higher performance requirements and certain structural design requirements; the SoC position of the metal substrate needs to be hollowed out, so that the SoC chip can penetrate through the substrate and be directly connected with the LCD large graphite sheet or the soaking plate through the phase change material, and a high-efficiency heat dissipation function is realized; because the SoC position substrate is hollowed out, a part of thickness space can be reserved for the SoC and the shielding cover, and therefore thinner product design can be achieved to a certain extent.
The SOC17 is mainly protected by the SOC composite heat dissipation structure according to the present application, and the external structure of the whole SOC17 is not limited. While the application has been described in terms of preferred embodiments, it is not intended to be limiting, but rather to the application, as will occur to those skilled in the art, without departing from the spirit and scope of the application. Therefore, any modification, equivalent variation and modification of the above embodiments according to the technical substance of the present application fall within the protection scope defined by the claims of the present application.
Claims (6)
1. A mobile phone for Z-directional heat conduction and dissipation through a phase change material, comprising:
An LCD module;
A camera module;
The heat dissipation substrate layer (1) is arranged between the LCD module and the camera module, the heat dissipation substrate layer (1) adopts a soaking plate or an edge-wrapping graphite sheet, the heat dissipation substrate layer (1) is attached to the LCD module through an adhesive layer (3) of 5 um to 10um so as to absorb heat generated by the LCD module, the heat dissipation substrate layer (1) is attached to the camera module through a phase change material layer (2) so as to absorb the heat generated by the camera module and conduct heat conduction in the Z direction so as to further soak the heat dissipation substrate layer (1) to realize the X-Y direction, wherein the phase change material layer (2) is formed in the following mode:
the phase change material layer (2) is formed in a silk screen printing mode, and the thickness is 18 um+/-3 um;
the phase change material layer (2) is a phase change material sheet, and the thickness is 0.15mm to 0.5mm;
The phase change material layer (2) is made of polyolefin resin, acrylic resin, aluminum oxide and carbon nano fiber tube.
2. The mobile phone according to claim 1, wherein an insulating film (6) is further disposed between the heat dissipation substrate layer (1) and the phase change material layer (2), and the thickness of the insulating film (6) ranges from 6um +/-0.5 um.
3. The mobile phone of claim 2, wherein:
The area of the phase change material layer (2) corresponds to the area of the inner end of the camera module;
The areas of the LCD module, the heat dissipation substrate layer (1), the adhesive layer (3) and the insulating film (6) are corresponding to each other and far larger than the area of the phase change material layer (2).
4. The utility model provides a cell-phone cooling module which characterized in that includes from top to bottom sets gradually:
a dust-proof protective film layer (7);
a phase change material layer (2);
An insulating film (6);
A heat-dissipating substrate layer (1);
an adhesive layer (3);
A bottom film layer (5);
The phase change material layer (2) is used for being attached to a camera module and an SoC of a mobile phone to absorb heat generated by the camera module and the SoC and conducting heat conduction in the Z direction to further soak the heat to the heat dissipation substrate layer (1) to realize X-Y direction soaking, and the phase change material layer (2) is formed in the following mode:
the phase change material layer (2) is formed in a silk screen printing mode, and the thickness is 18 um+/-3 um;
the phase change material layer (2) is a phase change material sheet, and the thickness is 0.15mm to 0.5mm;
The phase change material layer (2) is made of polyolefin resin, acrylic resin, aluminum oxide and carbon nano fiber tube.
5. The mobile phone cooling assembly according to claim 4, further comprising a protection film layer (4) disposed between the dustproof protection film layer (7) and the insulating film (6), wherein a hollow area is disposed on the protection film layer (4) corresponding to the outer contour of the phase change material layer (2) so as to support and protect the periphery of the phase change material layer (2).
6. The mobile phone heat sink assembly as defined in claim 5, wherein:
The dustproof protective film layer (7) is made of PET release film, and the thickness of the PET release film is 50 um+/-5 um;
The heat conductivity coefficient of the phase change material layer (2) is more than 6W/m.k
The material of the protective film layer (4) is PET protective film, and the thickness is 85 um+/-5 um;
the insulating film (6) is made of PET single-sided adhesive tape, and the thickness of the insulating film is 6 mu m +/-0.5 mu m;
the thickness of the adhesive layer (3) is 5 um-10 um;
The material of the bottom film layer (5) is PET release film, and the thickness is 50 um+/-5 um.
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| CN202410165231.1A CN117715393B (en) | 2024-02-05 | 2024-02-05 | Mobile phone capable of conducting heat dissipation in Z direction through phase change material and heat dissipation assembly |
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| CN117715393B true CN117715393B (en) | 2024-04-26 |
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