CN207124842U - Heat radiation module and electronic equipment - Google Patents
Heat radiation module and electronic equipment Download PDFInfo
- Publication number
- CN207124842U CN207124842U CN201721125595.9U CN201721125595U CN207124842U CN 207124842 U CN207124842 U CN 207124842U CN 201721125595 U CN201721125595 U CN 201721125595U CN 207124842 U CN207124842 U CN 207124842U
- Authority
- CN
- China
- Prior art keywords
- fin
- electronic equipment
- module
- heat radiation
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The disclosure is directed to heat radiation module and electronic equipment.The heat radiation module includes：First fin and the second fin；The one side of first fin is bonded with the heating module in electronic equipment, the another side of first fin is bonded with the near field communication (NFC) NFC module in electronic equipment, and the second fin is connected with the first fin and the one side of the second fin is bonded with the shell of electronic equipment；First fin is used to form heat dissipation path between heating module, NFC module and the second fin, and the second fin is used to form heat dissipation path between the first fin and shell.The technical scheme can be on the premise of NFC module normal work not be influenceed, it is ensured that excessive heat will not be put aside in electronic equipment, the fault rate of electronic equipment is reduced, improves Consumer's Experience.
Description
Technical field
This disclosure relates to technical field of heat dissipation, more particularly to heat radiation module and electronic equipment.
Background technology
With being on the increase for electronic functionalities, the load of various modules is gradually increased in electronic equipment, thereupon
, heating module such as main control chip cpu, radio frequency sending module, the holder of heat can be produced in electronic equipment at work
The heating power of module and battery also gradually increases.Due to that when electronic equipment has put aside excessive heat because of inside, may make
The temperature that some is put on heating module is too high, and now heating module can be stopped because temperature is too high, so as to cause electronics to set
It is standby to break down.In order to avoid the generation of above-mentioned condition, the fin being bonded with it can be set on heating module, to avoid
Other parts of the temperature that some is put on heating module apparently higher than heating module.
Utility model content
To overcome problem present in correlation technique, embodiment of the disclosure provides a kind of heat radiation module and electronic equipment.
Technical scheme is as follows：
First aspect in accordance with an embodiment of the present disclosure, there is provided a kind of heat radiation module, including the first fin and second
Fin；
The one side of first fin is bonded with the heating module in electronic equipment, and another side and the electronics of the first fin are set
Near field communication (NFC) NFC module fitting in standby, the second fin is connected with the first fin and the second fin
Simultaneously it is bonded with the shell of electronic equipment；
First fin is used to form heat dissipation path between heating module, NFC module and the second fin, the second radiating
Piece is used to form heat dissipation path between the first fin and shell.
By making the one side of the first fin in heat radiation module be bonded with the heating module in electronic equipment, another side with
NFC module fitting in electronic equipment, therefore it can avoid the temperature at heating module surface and NFC module surface any point
Spend the temperature apparently higher than other points；By making the second fin be connected with the first fin and the one side of the second fin and electricity
The shell fitting of sub- equipment, therefore the first fin forms radiating road between heating module, NFC module and the second fin
Footpath, i.e., by heating module and NFC module, caused heat is to the second fin conductive at work, and the second fin is the
Heat dissipation path is formed between one fin and shell, will be passed from the heat that the first fin conductive is come to the shell of electronic equipment
Lead, heat is dispersed into by the shell of electronic equipment outside electronic equipment, so as to not influence the premise of NFC module normal work
Under, it is ensured that excessive heat will not be put aside in electronic equipment, the fault rate of electronic equipment is reduced, improves Consumer's Experience.
In one embodiment, heating module includes at least one in mainboard and battery.
In one embodiment, mainboard includes substrate and antenna holder, and antenna holder is used to be bonded with the first fin.
In one embodiment, the second fin is connected with the first fin, including：
Second fin is bonded with the first fin and the area of fitting part is more than or equal to area threshold.
In one embodiment, the first fin is made with the second fin by conduction graphite film.
In one embodiment, the second fin extends to the edge of shell.
Second aspect in accordance with an embodiment of the present disclosure, there is provided a kind of electronic equipment, electronic equipment include the reality of the disclosure
Apply the heat radiation module of any one in the first aspect of example.
By making the one side of the first fin in heat radiation module be bonded with the heating module in electronic equipment, another side with
NFC module fitting in electronic equipment, therefore it can avoid the temperature at heating module surface and NFC module surface any point
Spend the temperature apparently higher than other points；By making the second fin be connected with the first fin and the one side of the second fin and electricity
The shell fitting of sub- equipment, therefore the first fin forms radiating road between heating module, NFC module and the second fin
Footpath, i.e., by heating module and NFC module, caused heat is to the second fin conductive at work, and the second fin is the
Heat dissipation path is formed between one fin and shell, will be passed from the heat that the first fin conductive is come to the shell of electronic equipment
Lead, heat is dispersed into by the shell of electronic equipment outside electronic equipment, so as to not influence the premise of NFC module normal work
Under, it is ensured that excessive heat will not be put aside in electronic equipment, the fault rate of electronic equipment is reduced, improves Consumer's Experience.
It should be appreciated that the general description and following detailed description of the above are only exemplary and explanatory, not
The disclosure can be limited.
Brief description of the drawings
Accompanying drawing herein is merged in specification and forms the part of this specification, shows the implementation for meeting the disclosure
Example, and be used to together with specification to explain the principle of the disclosure.
Fig. 1 a are structural representation Fig. 1 of the fin according to an exemplary embodiment；
Fig. 1 b are structural representation Fig. 2 of the fin according to an exemplary embodiment；
Fig. 1 c are structural representation Fig. 3 of the fin according to an exemplary embodiment；
Fig. 1 d are structural representation Fig. 4 of the fin according to an exemplary embodiment；
Fig. 2 a are structural representation Fig. 1 of the heat radiation module according to an exemplary embodiment；
Fig. 2 b are structural representation Fig. 2 of the heat radiation module according to an exemplary embodiment；
Fig. 3 is the structural representation of the electronic equipment according to an exemplary embodiment.
Embodiment
Here exemplary embodiment will be illustrated in detail, its example is illustrated in the accompanying drawings.Following description is related to
During accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represent same or analogous key element.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the disclosure.On the contrary, they be only with it is such as appended
The example of the consistent device of some aspects be described in detail in claims, the disclosure.
With the high speed development and people's living standards continue to improve of science and technology, in recent years, electronic equipment such as intelligence
The function of energy terminal, tablet personal computer etc. is on the increase, and the load of various modules is gradually increased in electronic equipment.The thing followed,
The heating power of heating module in electronic equipment also gradually increases, and wherein heating module is the mould that heat can be produced during work
Block, such as mainboard and battery, wherein mainboard include main control chip cpu, radio frequency sending module, holder etc..Due to working as electronics
When equipment is because having put aside excessive heat in inside, the temperature that may put on heating module some is too high, and now heating module can be because
Temperature is too high and is stopped, so as to cause electronic equipment to break down.
In order to avoid the generation of above-mentioned condition, as shown in Fig. 1 a and Fig. 1 b, pasted by being set on heating module 102 with it
The fin 101 of conjunction, to avoid the temperature of some point on heating module 102 apparently higher than the other parts of heating module 102
Temperature, it is ensured that the temperature that the heating module 102 will not be put because of some is too high and produces failure.
But with the development of technology, near field communication (NFC) NFC technique starts to be widely used in the life of people,
Near field communication (NFC) NFC module also becomes the essential part of electronic equipment.NFC module also can at work
Certain heat is produced, if but fin is set between the shell of NFC module and electronic equipment, the fin may influence
The communication efficiency of NFC module.Therefore as shown in Fig. 1 c and Fig. 1 d, fin 101 is arranged on heating module 102 and NFC module
Between 103, the one side of fin 101 is bonded with heating module 102, and the another side of fin 101 is bonded with NFC module 103.It is above-mentioned
Scheme may insure that the surface of heating module 102 and the temperature at the surface any point of NFC module 103 not can be significantly hotter than other points
Temperature, but caused heat can still be put aside in the electronic device heating module 102 at work with NFC module 103, make electricity
Sub- equipment bulk temperature rises, and electronic equipment can be caused to produce failure when temperature is higher than certain threshold value, so as to improve electronics
The fault rate of equipment, compromises Consumer's Experience.
In order to solve the above problems, in the technical scheme provided by this disclosed embodiment, by making in heat radiation module
The one side of one fin is bonded with the heating module in electronic equipment, and another side is bonded with the NFC module in electronic equipment, therefore
It can avoid the temperature at heating module surface and NFC module surface any point apparently higher than the temperature of other points；Pass through
Make that the second fin is connected with the first fin and the one side of the second fin is bonded with the shell of electronic equipment, therefore first dissipates
Backing forms heat dissipation path between heating module, NFC module and the second fin, i.e., by heating module and NFC module in work
Caused heat is to the second fin conductive when making, and the second fin forms radiating road between the first fin and shell
Footpath, it will be conducted from the heat that the first fin conductive is come to the shell of electronic equipment, make shell of the heat by electronic equipment
It is dispersed into outside electronic equipment, on the premise of not influenceing NFC module normal work, it is ensured that will not be put aside in electronic equipment excessive
Heat, the fault rate of electronic equipment is reduced, improves Consumer's Experience.
Embodiment of the disclosure provides a kind of heat radiation module, and the heat radiation module is applied to electronic equipment, and wherein electronics is set
It is standby to include intelligent terminal, tablet personal computer, intelligent wearable device etc..As shown in Fig. 2 a and Fig. 2 b, the heat radiation module includes
First fin 201 and the second fin 202.
The one side of first fin 201 is bonded with the heating module 203 in electronic equipment, and the 201 of the first fin are another
Face is bonded with the near field communication (NFC) NFC module 204 in electronic equipment, the second fin 202 and the first fin 201
Connect and the one side of the second fin 202 is bonded with the shell 205 of electronic equipment.
First fin 201 is used to form radiating between heating module 203, the fin 202 of NFC module 204 and second
Path, the second fin 202 are used to form heat dissipation path between the first fin 201 and shell 205.
Exemplary, heating module is the module that can produce heat in electronic equipment at work, such as mainboard, battery
Deng.NFC module can include NFC chip and NFC antenna etc..
First fin is made from a material that be thermally conductive with the second fin, and the first fin can be by being made from a material that be thermally conductive
Connection sheet be connected with the second fin, can be with order to form heat dissipation path between the first fin and the second fin
Directly fit together for the first fin and the second fin, or the first fin and the second fin are when making
It is integrally formed.
By making the one side of the first fin in heat radiation module be bonded with the heating module in electronic equipment, another side with
NFC module fitting in electronic equipment, therefore it can avoid the temperature at heating module surface and NFC module surface any point
Spend the temperature apparently higher than other points；By making the second fin be connected with the first fin and the one side of the second fin and electricity
The shell fitting of sub- equipment, therefore the first fin forms radiating road between heating module, NFC module and the second fin
Footpath, i.e., by heating module and NFC module, caused heat is to the second fin conductive at work, and the second fin is the
Heat dissipation path is formed between one fin and shell, will be passed from the heat that the first fin conductive is come to the shell of electronic equipment
Lead, heat is dispersed into by the shell of electronic equipment outside electronic equipment, so as to not influence the premise of NFC module normal work
Under, it is ensured that excessive heat will not be put aside in electronic equipment, the fault rate of electronic equipment is reduced, improves Consumer's Experience.
In one embodiment, heating module can include at least one in mainboard and battery, such as the first fin
It can be bonded, can also be bonded simultaneously with mainboard and battery with any one in mainboard and battery.
By making the first fin be bonded with least one in mainboard and battery, it can be ensured that the mainboard in electronic equipment
And the first fin that the temperature on battery, or mainboard, or battery can pass through is oriented to the second fin, avoids in electronic equipment
Mainboard and battery, or mainboard, or battery will not break down because temperature is too high.
In one embodiment, mainboard includes substrate and antenna holder, and antenna holder is used to be bonded with the first fin.
Due to when including substrate and during antenna holder, electronic component on the substrate heat such as caused by CPU, holder
It can be transmitted to by antenna holder on the first fin, by making antenna holder be bonded with the first fin, ensure mainboard
On the premise of caused heat can be transmitted to the first fin at work, it can reduce and paste the first fin and mainboard
The difficulty being combined, reduce the cost consumed during reproduction electronic equipment.
In one embodiment, as shown in Figure 2 b, the second fin 202 is connected with the first fin 201, including：
Second fin 202 is bonded with the first fin 201 and the area of fitting part 206 is more than or equal to area threshold
Value.
By making the second fin be more than or equal to area directly against the area for making fitting part is merged with the first fin
Threshold value, heat conduction of velocity can be more than in the heat conduction of velocity for ensuring the first fin to the heat dissipation channel of the second fin
On the premise of threshold value, reduce the cost of manufacture of heat radiation module, and facilitate user when dismantling electronic equipment by the second fin with
First fin disconnects, and improves Consumer's Experience.
In one embodiment, the first fin is made with the second fin by conduction graphite film.
It should be noted that by carrying out gum or notacoria to conduction graphite film, it can be ensured that the surface of conduction graphite film
Insulation, so as on the premise of the heat conductivility of conduction graphite film is not influenceed, allow conduction graphite film to be directly fitted in integrated
The surface of circuit (integrated circuit, IC) and circuit board.
Due to conduction graphite film, thermal conductivity factor is larger compared with conventional thermal conductive material, and vertical thermal conductivity is only 5-
20/mK, preferable heat-blocking action can be played between heating module and NFC module, makes heat along the first fin and second
Fin spreads；And conduction graphite film is more soft, the first fin can be made to be fitted tightly over heating module and NFC module
Above, the second fin is made to be brought into close contact on shell；The plasticity of conduction graphite film is also preferable, can easily be cut into required
Shape.
In one embodiment, the second fin extends to the edge of shell.
Because the edge of the shell of electronic equipment is usually metal material, its heat conductivility is preferable, is dissipated by making second
Backing extends to the edge of shell, can make the second fin by from the heat that the first fin transmits from the edge of shell compared with
Fast transfers out electronic equipment, so as to improve the efficiency of heat radiation module radiating, improves Consumer's Experience.
Embodiment of the disclosure provides a kind of electronic equipment, and the electronic equipment can be intelligent terminal, tablet personal computer, intelligence
Energy wearable device etc..As shown in figure 3, the electronic equipment 301 includes any of the above-described kind of heat radiation module 302.
By making the one side of the first fin in heat radiation module be bonded with the heating module in electronic equipment, another side with
NFC module fitting in electronic equipment, therefore it can avoid the temperature at heating module surface and NFC module surface any point
Spend the temperature apparently higher than other points；By making the second fin be connected with the first fin and the one side of the second fin and electricity
The shell fitting of sub- equipment, therefore the first fin forms radiating road between heating module, NFC module and the second fin
Footpath, i.e., by heating module and NFC module, caused heat is to the second fin conductive at work, and the second fin is the
Heat dissipation path is formed between one fin and shell, will be passed from the heat that the first fin conductive is come to the shell of electronic equipment
Lead, heat is dispersed into by the shell of electronic equipment outside electronic equipment, so as to not influence the premise of NFC module normal work
Under, it is ensured that excessive heat will not be put aside in electronic equipment, the fault rate of electronic equipment is reduced, improves Consumer's Experience.
Those skilled in the art will readily occur to the disclosure its after considering specification and putting into practice disclosure disclosed herein
Its embodiment.The application is intended to any modification, purposes or the adaptations of the disclosure, these modifications, purposes or
Person's adaptations follow the general principle of the disclosure and including the undocumented common knowledges in the art of the disclosure
Or conventional techniques.Description and embodiments are considered only as exemplary, and the true scope of the disclosure and spirit are by following
Claim is pointed out.
It should be appreciated that the precision architecture that the disclosure is not limited to be described above and is shown in the drawings, and
And various modifications and changes can be being carried out without departing from the scope.The scope of the present disclosure is only limited by appended claim.
Claims (7)
1. a kind of heat radiation module, it is characterised in that including the first fin and the second fin；
The one side of first fin is bonded with the heating module in electronic equipment, another side and the electricity of first fin
In sub- equipment near field communication (NFC) NFC module fitting, second fin be connected with first fin and
The one side of second fin is bonded with the shell of electronic equipment；
First fin is used to form radiating between the heating module, the NFC module and second fin
Path, second fin are used to form heat dissipation path between first fin and the shell.
2. heat radiation module according to claim 1, it is characterised in that the heating module is included in mainboard and battery extremely
One item missing.
3. heat radiation module according to claim 2, it is characterised in that the mainboard includes substrate and antenna holder, described
Antenna holder is used to be bonded with first fin.
4. heat radiation module according to claim 1, it is characterised in that second fin connects with first fin
Connect, including：
Second fin is bonded with first fin and the area of fitting part is more than or equal to area threshold.
5. heat radiation module according to claim 1, it is characterised in that first fin and second fin are equal
It is made up of conduction graphite film.
6. heat radiation module according to claim 1, it is characterised in that second fin extends to the side of the shell
At.
7. a kind of electronic equipment, it is characterised in that the electronic equipment includes the radiating mould as described in claim any one of 1-6
Group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721125595.9U CN207124842U (en) | 2017-09-04 | 2017-09-04 | Heat radiation module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721125595.9U CN207124842U (en) | 2017-09-04 | 2017-09-04 | Heat radiation module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207124842U true CN207124842U (en) | 2018-03-20 |
Family
ID=61602648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721125595.9U Active CN207124842U (en) | 2017-09-04 | 2017-09-04 | Heat radiation module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207124842U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315191A (en) * | 2020-03-09 | 2020-06-19 | Oppo广东移动通信有限公司 | Heat dissipation mechanism, display device and electronic equipment |
| CN111372433A (en) * | 2020-04-23 | 2020-07-03 | 华为技术有限公司 | Mobile terminal |
| CN111755802A (en) * | 2019-03-26 | 2020-10-09 | 夏普株式会社 | Antenna device and communication terminal device |
-
2017
- 2017-09-04 CN CN201721125595.9U patent/CN207124842U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111755802A (en) * | 2019-03-26 | 2020-10-09 | 夏普株式会社 | Antenna device and communication terminal device |
| CN111755802B (en) * | 2019-03-26 | 2022-03-04 | 夏普株式会社 | Antenna device and communication terminal device |
| CN111315191A (en) * | 2020-03-09 | 2020-06-19 | Oppo广东移动通信有限公司 | Heat dissipation mechanism, display device and electronic equipment |
| CN111315191B (en) * | 2020-03-09 | 2022-02-08 | Oppo广东移动通信有限公司 | Heat dissipation mechanism, display device and electronic equipment |
| CN111372433A (en) * | 2020-04-23 | 2020-07-03 | 华为技术有限公司 | Mobile terminal |
| WO2021213118A1 (en) * | 2020-04-23 | 2021-10-28 | 华为技术有限公司 | Mobile terminal |
| CN111372433B (en) * | 2020-04-23 | 2022-03-08 | 华为技术有限公司 | Mobile terminal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205194687U (en) | A heat conduction silica gel sheet for cell -phone | |
| CN207124842U (en) | Heat radiation module and electronic equipment | |
| WO2017206682A1 (en) | Mobile display device | |
| WO2015074447A1 (en) | Mobile terminal heat dissipation apparatus and shielding cover frame | |
| CN203596971U (en) | Circuit board having heat dissipation function | |
| CN107787167A (en) | A kind of mobile terminal | |
| CN203896650U (en) | Metallizing high-conductivity graphite film | |
| CN205142769U (en) | Graphite heat radiation structure for smart phone and tablet computer | |
| CN205179142U (en) | Modified heat dissipation type mobile phone motherboard | |
| CN207235341U (en) | Radiator structure and terminal based on terminal | |
| CN104902042A (en) | Heat radiation mobile phone shell | |
| US20190228902A1 (en) | Wireless charging coil structure with function of heat dissipation | |
| CN208402321U (en) | A kind of compound graphite radiating chip architecture | |
| CN215647962U (en) | Mobile phone heat dissipation mainboard based on copper material | |
| CN203968561U (en) | A kind of heat abstractor and electronic equipment | |
| CN104602484B (en) | Portable apparatus and cooling device thereof | |
| CN208094874U (en) | Flexible circuit board structure with heat conduction through hole | |
| CN201298958Y (en) | MOSFET soldering pad design circuit board with heat dissipation holes | |
| CN109618542A (en) | Mobile terminal with heat convergence conduction function | |
| CN215834516U (en) | Heat conducting device for electronic element | |
| CN209676752U (en) | Mobile terminal with heat convergence conduction function | |
| CN112584610A (en) | Circuit board device and electronic equipment | |
| CN105101757A (en) | Method and system for cooling intelligent terminal | |
| CN217544592U (en) | Double-sided heat dissipation packaging device | |
| CN205912415U (en) | Mobile terminal with heat radiation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |