TWI632456B - Reflective heat dissipation device - Google Patents

Abstract

A reflective heat dissipation device is used for a memory module, the memory module has a lower edge for the gold finger configuration, and an upper edge away from the lower edge; the heat dissipation device includes a heat dissipation body, and A reflective part with a reflective effect on the surface, wherein the heat dissipation body has two heat sinks to be sandwiched on the memory module, and at least one heat sink is provided with a joint on the upper edge of the adjacent memory module, and the light reflecting part It is set on the joint part, and the surface of the reflective component has a reflective effect to provide visual effects such as reflective glare.

Description

Reflective heat sink

The invention relates to a heat dissipation device suitable for computer peripherals, especially a reflective heat dissipation device applied to a memory module (such as a random access memory).

Press, random access memory (RAM) is a memory used to directly exchange data with the computer's central processing unit (CPU). With the rapid development of the computer industry, today's memory has developed to high-bandwidth computer memory specifications such as DDR4, so they all have operational problems, so the heat dissipation designed to meet the heat dissipation requirements of these memory modules The device spontaneously emerged.

In the past, the heat dissipation device used in these memory modules is mainly composed of two heat sink clips placed on the chip of the memory module for the heat dissipation of the chip. At the same time, in order to meet the needs of computers in the e-sports (video game) industry or computer DIY players, the components inside the computer mainframe often also provide luminous effects through components such as LEDs, so as to cause glare and other effects in the computer case, and serve as a computer The internal memory module and its heat dissipation device are no exception; for example, LEDs are installed on the circuit board of the memory module, or light guide elements are added to the heat dissipation device.

However, because the traditional method mainly adopts the active light-emitting method, in order to provide the glare effect, that is, the memory module or its heat dissipation device itself has a light-emitting member such as an LED, and the light-emitting function is used to achieve the desired glare. Light effect, but it is often easy to connect with other components inside the computer case The glare provided cannot co-operate with each other, which greatly reduces its effectiveness. On the other hand, the self-illumination method also makes the product more susceptible to the limitations of the factory when it is shipped. It is not easy to produce diverse visual effects such as glare through the coordination and cooperation of different products.

In view of this, in order to improve and solve the above-mentioned deficiencies, the present inventors are dedicated to research and cooperate with the application of academic principles, and finally propose a reasonable design and effectively improve the above-mentioned deficiencies of the present invention.

The main purpose of the present invention is to provide a reflective heat dissipation device, which provides reflective glare or multi-level visual effects by light sources provided by other components inside the computer case, or even external light sources, and does not Affect the original heat dissipation area.

Another object of the present invention is to provide a reflective heat dissipation device, which can further provide a product in a modular manner, regardless of whether it is on the production side or the user side, can be replaced according to its needs to achieve the product The needs and objectives of diversification and customization.

In order to achieve the above object, the present invention provides a reflective heat dissipation device, which is used in a memory module having a lower edge for disposition of a gold finger and an upper edge far away from the lower edge The heat dissipation device includes a heat dissipation body and a light reflecting component with a light reflecting effect on the surface, wherein the heat dissipation body has two heat dissipation fins to sandwich the memory module, and at least one heat dissipation fin is adjacent to the upper edge of the memory module There is a joint part on the place, and the reflective part is arranged on the joint part. The surface of the reflective part has a reflective effect to provide visual effects such as reflective glare.

<This invention>

1‧‧‧radiating device

10‧‧‧cooling body

100‧‧‧heat sink

101‧‧‧Joint

102‧‧‧Base

103‧‧‧ Rib

11‧‧‧Reflective parts

110‧‧‧Side board

111‧‧‧Top board

112‧‧‧Inlay

113‧‧‧ adhesive layer

2‧‧‧Memory module

20‧‧‧ circuit board

200‧‧‧lower edge

201‧‧‧Upper edge

21‧‧‧chip

3‧‧‧Motherboard

30‧‧‧Memory slot

FIG. 1 is an exploded perspective view of the first embodiment of the present invention.

FIG. 2 is a three-dimensional assembly diagram of the first embodiment of the present invention.

3 is a schematic cross-sectional view of the first embodiment of the present invention in use.

4 is a schematic cross-sectional view of the second embodiment of the present invention in use.

5 is a schematic cross-sectional view of a third embodiment of the present invention in use.

6 is a schematic cross-sectional view of a fourth embodiment of the present invention in use.

7 is a schematic cross-sectional view of a fifth embodiment of the present invention in use.

In order for your reviewer to understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, however, the attached drawings are provided for reference and explanation only, and are not intended to limit the present invention. .

Please refer to FIGS. 1 and 2, which are respectively an exploded perspective view and a combined perspective view of the first embodiment of the present invention. The invention provides a reflective heat dissipation device. The heat dissipation device 1 is arranged on a memory module 2. The memory module 2 is a random access memory (RAM) and includes a circuit board 20. And a plurality of wafers 21 provided on the circuit board 20. The heat dissipation device 1 is used to provide the heat dissipation requirements of the chip 21 of the memory module 2; the heat dissipation device 1 includes a heat dissipation body 10 and a reflective component 11 disposed on the heat dissipation body 10, wherein: the heat dissipation The main body 10 is mainly composed of two heat sinks 100, which can be made of separate pieces of two metal materials, or integrally formed into a "ㄇ" shape by means such as aluminum extrusion In addition, the two heat sinks 100 are used to sandwich the above-mentioned memory module 2 and the outside of the memory module 2, and the inner surface of the two heat sinks 100 is attached to the chip 21 of the memory module 2, Therefore, the outer surface of the second heat sink 100 can provide good heat dissipation when the chip 21 generates heat.

Please also refer to FIG. 3, the circuit board 20 of the above memory module 2 has a lower edge 200 for gold finger configuration, and an upper edge 201 away from the lower edge 200, and in use, the lower edge The edge 200 is inserted into the memory slot 30 of the motherboard 3 of the computer. In the present invention, at least one heat sink 100 of the above heat dissipation body 10 is provided with a coupling portion 101. When the heat dissipation body 10 is assembled on the memory module 2, the coupling portion 101 is adjacent to the memory module 2 At the edge 201 for the reflective member 11 to be assembled on the joint 101; in this embodiment, the two heat sinks 100 are provided with the joint 101 and the joint 101 of the two heat sinks 100 Slots that are symmetrical to each other and concave toward the outside, such as "ㄈ" -shaped slots that are respectively in the forward and reverse directions, and the slot is formed along the upper edge 201 of the memory module 2 and the The reflective component 11 can be formed by extruding aluminum integrally, and has two side plates 110 spaced apart and a top plate 111 connected between the upper edges of the two side plates 110, and the lower edges of the two side plates 110 are respectively provided with an inwardly protruding inward Block 112 is embedded and assembled corresponding to the joint portion 101 of the insertion groove, and then the reflective member 11 can be assembled on the heat dissipation body 10, while maintaining the area where the outer surface of the two heat sinks 100 contacts the outside to avoid affecting it The proper heat dissipation effect.

As mentioned above, the surface of the reflective member 11 has a reflective effect, that is, the surfaces of the two side plates 110 or / and the top plate 111 of the reflective member 11 have a reflective effect. The reflective effect can be coated on the surface of the reflective component 11 through the material itself, or by processing methods such as electroplating or coating on the surface of the reflective component 11, or it can be used as a full or partial Cover, and on the partial cover can be designed such as text or graphics. Thus, as shown in FIG. 3, since the memory module 2 is inserted into the memory slot 30 of the motherboard 3 of the computer when in use, when the light source provided by other components inside the computer case, or even the computer When the light source provided outside the chassis is projected onto the reflective member 11, the reflective member 11 can be used to provide visual effects such as glare or multiple levels.

Therefore, with the above-mentioned structure, the reflective heat sink of the present invention can be obtained.

In addition, as shown in FIG. 4, in the second embodiment of the present invention, the above-mentioned reflective member 11 is sandwiched by the outer edges of the two heat sinks 100 through the lower edges of the two side plates 110 and can be further bonded by bonding or the like Bonding, for example, a bonding layer 113 formed by an adhesive between the lower edge of the side plate 110 and the bonding portion 101 allows the reflective member 11 to be assembled on the heat dissipation body 10.

In addition, as shown in FIG. 5, in the third embodiment of the present invention, the reflective member 11 may only have the side plates 110 arranged at two intervals, so that the two side plates 110 are independently combined on the heat dissipation body 10. Of course, only one side panel 110 (not shown) can be arranged in a single group.

Furthermore, as shown in FIG. 6, in the fourth embodiment of the present invention, the above-mentioned reflective member 11 can also be bent and formed through a metal sheet to have the two side plates 110 and the top plate 111, so the two side plates 110 can penetrate the top plate The clamping force formed by the bending between 111 is sandwiched by the lower edge of the coupling portion 101 of the heat dissipation body 10.

In addition, as shown in FIG. 7, in the fifth embodiment of the present invention, the above-mentioned coupling portion 101 may be a fixed seat, which cooperates with the upper edge 201 of the memory module 2 to extend into a strip shape, and the fixed seat has a The base 102 for sandwiching the two heat sinks 100 and a protruding rib 103 protruding from the base 102 outside the two heat sinks 100, and the protruding rib 103 is used for sandwiching the lower edges of the two side plates 110 of the reflective member 11, or The adhesive layer 113 can be further adhered between the lower edge of any side plate 110 and the rib 103. It can also be further understood that the above-mentioned protruding rib 103 provided on the base 102 is changed to a groove (not shown) formed on the base 102, and the reflective member 11 has only a single side plate 110, and the groove is provided for The lower edge of the side plate 110 is inserted.

Therefore, with the reflective heat dissipation device of the present invention, since it does not have an active luminous effect, it uses passively the reflected light generated by the peripheral light source to provide glare, so the design and cost are naturally simplified, but But without losing the glare or multi-level visual effects. At the same time, the upper edge of the two heat sinks 100 is used for the assembly of the reflective component 11, in addition to avoiding the heat dissipation of the heat dissipation body 10 In addition to the area to avoid affecting the heat dissipation effect, the reflective component 11 can also provide the clamping effect of the two heat sinks 100 on the memory module 2 to achieve the simplification of components. In addition, in terms of assembly, products can be provided in a modular manner, regardless of the production or user end, can be replaced according to their needs, in order to achieve product diversification and customization needs and purposes.

In summary, the present invention can indeed achieve the intended use purpose, and solve the lack of knowledge, and because it is extremely novel and progressive, it fully meets the requirements of the invention patent application. The application is made in accordance with the Patent Law, please check and Grant the patent in this case to protect the rights of inventors.

However, the above is only a preferred and feasible embodiment of the present invention, and the patent scope of the present invention is not limited thereby. Therefore, any changes in the equivalent technologies and means of the description and drawings of the present invention are the same. Included within the scope of the present invention, Chen Ming.

Claims (12)

A reflective heat dissipation device is used for a memory module. The memory module has a lower edge configured for gold fingers and an upper edge away from the lower edge. The heat dissipation device includes: a heat dissipation body, It has two heat sinks and is used for clamping on the memory module, and at least one of the heat sinks is provided with a joint part near the upper edge of the memory module; and a reflective part, the surface of which has a reflective effect, And set up on the joint. The reflective heat dissipation device as described in item 1 of the patent scope, wherein the two heat sinks of the heat dissipation body are in the shape of "ㄇ". As in the reflective heat dissipation device described in item 1 of the patent application scope, the coupling part is provided on both heat dissipation fins of the heat dissipation body. The reflective heat dissipation device as described in item 3 of the patent application scope, wherein the joint part of the two heat sinks is a fitting groove symmetrical to each other and concave toward the outside, and the reflective member is provided with a corresponding corresponding embedding Groove with inserts protruding towards the inside. The reflective heat dissipation device as described in item 4 of the patent application scope, wherein the inserts of the two heat sinks are "ㄈ" shaped grooves with positive and negative directions respectively. The reflective heat dissipation device as described in item 4 or 5 of the patent application scope, wherein the reflective component has two side plates spaced apart and a top plate connected between the edges of the two side plates, and the insert is provided on The lower edge of the two side plates. The reflective heat dissipation device as described in item 6 of the patent application scope, wherein the reflective component is made of aluminum extruded integrally. The reflective heat dissipation device as described in item 1 of the patent application scope, wherein the reflective component has at least one side plate, and a lower layer of the side plate is combined with the bonding portion by an adhesive layer. The reflective heat dissipation device as described in item 8 of the patent application scope, wherein the reflective component further has another side plate and a top plate, and the two side plates are spaced apart, and the top plate is connected between the edges of the two side plates. The reflective heat dissipation device as described in item 1 of the patent application scope, wherein the reflective component is a metal sheet bent and formed with two side plates spaced apart, and a top plate connected between the edges of the two side plates, and The lower edges of the two side plates are sandwiched on the joint of the heat dissipation body. The reflective heat dissipation device as described in item 1 of the patent scope, wherein the joint is a fixed seat, the fixed seat has a base for sandwiching the two heat sinks, and a base protruding from the two heat sinks The protruding rib outside the chip, and the reflective component is assembled on the protruding rib. The reflective heat dissipation device as described in item 1 of the patent application, wherein the coupling part is a fixed base, the fixed base has a base for sandwiching the two heat sinks, and a groove formed on the base , And the reflective component is assembled on the groove.