TWM456042U - Dynamic type memory - Google Patents

Dynamic type memory Download PDF

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Publication number
TWM456042U
TWM456042U TW102202322U TW102202322U TWM456042U TW M456042 U TWM456042 U TW M456042U TW 102202322 U TW102202322 U TW 102202322U TW 102202322 U TW102202322 U TW 102202322U TW M456042 U TWM456042 U TW M456042U
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Taiwan
Prior art keywords
module
plasma tube
circuit
memory module
circuit module
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TW102202322U
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Chinese (zh)
Inventor
Han-Hong Zheng
ji-fen Guo
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Avexir Technologies Corp
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Priority to TW102202322U priority Critical patent/TWM456042U/en
Publication of TWM456042U publication Critical patent/TWM456042U/en

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Description

動態隨機存取記憶體Dynamic random access memory

本創作係有關於一種動態隨機存取記憶體。This creation is about a kind of dynamic random access memory.

習知之動態隨機存取記憶體,請參見專利TWM263537號,其係將一發光二極體設於一板體且電性連接於該板體,然發光二極體為一種發光效率較強之發光元件,故此種設計之發光二極體因無任何遮蔽物而使該發光二極體之光線會直射使用者之眼睛,其較易令使用者感到刺眼而有不舒適感。For a conventional dynamic random access memory, please refer to the patent TWM263537, which is provided with a light-emitting diode disposed on a plate and electrically connected to the plate body, and the light-emitting diode is a light-emitting efficiency. Since the light-emitting diode of the design has no shielding, the light of the light-emitting diode directly hits the eyes of the user, which is more likely to cause glare and discomfort to the user.

此外,發光二極體於發光時亦會產生較高之熱能,若無做好較佳之散熱效果可能導致線路因高溫而運作不正常或損壞之情事。因此,習知之動態隨機存取記憶體之結構仍未臻理想,仍有待本業界人士探討之。In addition, the light-emitting diode will also generate higher heat energy when it emits light. If the heat dissipation effect is not good, the circuit may not operate properly or be damaged due to high temperature. Therefore, the structure of the conventional dynamic random access memory is still unsatisfactory and remains to be discussed by those in the industry.

本創作之目的在於提供一種動態隨機存取記憶體,具有特殊之發光效果,不僅美觀且不易令使用者感到刺眼或不舒適。The purpose of the present invention is to provide a dynamic random access memory having a special illuminating effect, which is not only beautiful but also less glaring or uncomfortable for the user.

為達成上述目的,本創作提供一種動態隨機存取記憶體包括一記憶體模組、一電路模組、一電漿管及一殼件。In order to achieve the above object, the present invention provides a dynamic random access memory including a memory module, a circuit module, a plasma tube and a shell member.

該電路模組設於該記憶體模組且與該記憶體模組電性連接,該電路模組上設有一轉換電路,該轉換電路可供將直流電轉換為交流 電。The circuit module is disposed in the memory module and electrically connected to the memory module. The circuit module is provided with a conversion circuit for converting direct current into alternating current Electricity.

該電漿管設於該電路模組且與該電路模組電性連接,該電漿管能選擇性地發光。The plasma tube is disposed on the circuit module and electrically connected to the circuit module, and the plasma tube can selectively emit light.

該殼件設於該記憶體模組且覆蓋該記憶體模組至少部分面積,如此,該記憶體模組運作時產生的熱能便可藉由該殼件散出,使本創作達到較佳之散熱效果。The shell member is disposed on the memory module and covers at least a portion of the area of the memory module. Thus, the heat generated during operation of the memory module can be dissipated by the shell member, so that the creation can achieve better heat dissipation. effect.

藉此,當該記憶體模組與該電路模組電性導通時,該電路模組與該電漿管電性導通,使該電漿管能發光,如此一來,使本創作所提供之動態隨機存取記憶體具有特殊之發光效果,不僅美觀且產生之光線較不易令使用者感到刺眼或有不舒適感。Thereby, when the memory module is electrically connected to the circuit module, the circuit module is electrically connected to the plasma tube, so that the plasma tube can emit light, thereby providing the creation of the present invention. The dynamic random access memory has a special illuminating effect, which is not only beautiful but also produces light that is less likely to cause glare or discomfort to the user.

1‧‧‧記憶體模組1‧‧‧ memory module

11、21‧‧‧印刷電路板11, 21‧‧‧ Printed circuit boards

31‧‧‧第一插設部31‧‧‧First Insert

32‧‧‧第一夾持部32‧‧‧First clamping section

12‧‧‧積體電路12‧‧‧ integrated circuit

13‧‧‧連接埠13‧‧‧Links

14‧‧‧電連接部14‧‧‧Electrical connection

2‧‧‧電路模組2‧‧‧ circuit module

22‧‧‧轉換電路22‧‧‧Transition circuit

3‧‧‧第一連接件3‧‧‧First connector

4‧‧‧電漿管4‧‧‧Plastic tube

5‧‧‧第二連接件5‧‧‧Second connector

51‧‧‧第二插設部51‧‧‧Second Insert

52‧‧‧第二夾持部52‧‧‧Second clamping section

6‧‧‧殼件6‧‧‧Shell

圖1係本創作之立體圖。Figure 1 is a perspective view of the creation.

圖2係本創作之立體分解圖。Figure 2 is an exploded perspective view of the present creation.

圖2A係本創作之第一連接件之放大圖。Figure 2A is an enlarged view of the first connector of the present creation.

圖2B係本創作之第二連接件之放大圖。Figure 2B is an enlarged view of the second connector of the present invention.

圖3係本創作之側視圖。Figure 3 is a side view of the creation.

圖4係本創作之局部放大圖。Figure 4 is a partial enlarged view of the present creation.

圖5係本創作設置殼件後之立體圖。Figure 5 is a perspective view of the shell after the creation of the shell.

以下僅以實施例說明本創作可能之實施態樣,然並非用以限制本創作所欲保護之範疇,合先敘明。The following is a description of possible implementations of the present invention by way of example only, and is not intended to limit the scope of the creation of the present invention.

請參考圖1,本創作提供一種動態隨機存取記憶體,包括一記憶體模組1、一電路模組2及一電漿管4。Referring to FIG. 1 , the present invention provides a dynamic random access memory, including a memory module 1 , a circuit module 2 , and a plasma tube 4 .

請搭配參考圖1至圖4,該記憶體模組1可以但不限為一矩 形片體,於本實施例中,該記憶體模組1係包含有一印刷電路板11、複數個積體電路12及一連接埠13,該些積體電路12係沿該印刷電路板11之長度方向排列設置,該連接埠13係供設於一電腦主機板(圖未示)並與其電性連接,該電腦主機板經由該連接埠13供電予該記憶體模組1,並藉由該些積體電路12與該電腦主機板進行資料傳輸。Please refer to FIG. 1 to FIG. 4, the memory module 1 can be, but is not limited to, a moment. In the embodiment, the memory module 1 includes a printed circuit board 11 , a plurality of integrated circuits 12 , and a connecting port 13 . The integrated circuit 12 is along the printed circuit board 11 . The connection port 13 is disposed on a computer motherboard (not shown) and electrically connected thereto, and the computer motherboard supplies power to the memory module 1 via the connection port 13 The integrated circuit 12 performs data transmission with the computer motherboard.

該電路模組2設於該記憶體模組1且與該記憶體模組1電性連接,更仔細地說,該電路模組2包含有一印刷電路板21及一轉換電路22,該印刷電路板21係設於該記憶體模組1相對該連接埠13之一側,該轉換電路22係設於該印刷電路板21,該轉換電路22可供將直流電轉換為交流電,更清楚地說,該轉換電路22可將一較低之電壓轉換成一較高之電壓。The circuit module 2 is disposed in the memory module 1 and electrically connected to the memory module 1. More specifically, the circuit module 2 includes a printed circuit board 21 and a conversion circuit 22, and the printed circuit The board 21 is disposed on one side of the memory module 1 opposite to the connection port 13. The conversion circuit 22 is disposed on the printed circuit board 21, and the conversion circuit 22 is configured to convert direct current into alternating current, more specifically, The conversion circuit 22 converts a lower voltage to a higher voltage.

於本創作之較佳實施例中另包含有一第一連接結構,該第一連接結構以其一端設於該電路模組2,以其另端設於該記憶體模組1使該記憶體模組1與該電路模組2具有電性連接之關係,更明確地說,該第一連接結構具有複數個第一連接件3,如圖2B,各該第一連接件3具有一第一插設部31及一第一夾持部32,各該第一連接件3以該第一插設部31插設於該電路模組2較靠近該記憶體模組1之一側,且以該第一夾持部32夾持該記憶體模組1使該記憶體模組1與該電路模組2相互固定,較佳地,該記憶體模組1具有一電連接部14,各該第一連接件3以該第一夾持部32夾持於該記憶體模組1之電連接部14,使該電路模組2與該記憶體模組1電 性連接。於本實施例中係包含有四第一連接件3,其中二第一連接件3係設於該電路模組2之一端,另二第一連接件3係設於該電路模組2相對之另一端,如此一來,該些第一連接件3能夾持該記憶體模組1相對之二端而使夾持效果更為穩固。可理解的是,於其他可能實施例中該第一連接結構亦可設置有二、三個或四個以上之第一連接件或者是將該些第一連接件結合而為一體亦無不可。In a preferred embodiment of the present invention, a first connection structure is further provided. The first connection structure is disposed at one end of the circuit module 2, and the other end of the device is disposed on the memory module 1 to make the memory module. The group 1 has an electrical connection relationship with the circuit module 2, and more specifically, the first connection structure has a plurality of first connecting members 3, as shown in FIG. 2B, each of the first connecting members 3 has a first plug. The first connecting member 3 is inserted into the circuit module 2 on one side of the memory module 2, and the first connecting member 3 is inserted into the circuit module 2 The first clamping portion 32 clamps the memory module 1 to fix the memory module 1 and the circuit module 2 to each other. Preferably, the memory module 1 has an electrical connection portion 14 A connector 3 is clamped to the electrical connection portion 14 of the memory module 1 by the first clamping portion 32 to electrically connect the circuit module 2 and the memory module 1 Sexual connection. In this embodiment, four first connecting members 3 are included, wherein two first connecting members 3 are disposed at one end of the circuit module 2, and the other two connecting members 3 are disposed on the circuit module 2 At the other end, the first connecting members 3 can clamp the opposite ends of the memory module 1 to make the clamping effect more stable. It can be understood that, in other possible embodiments, the first connecting structure may also be provided with two, three or more first connecting members or the first connecting members may be integrated into one body.

於本實施例中,該電漿管4為一圓柱體,但不以此為限,於其他可能實施例中該電漿管可以為其他任意形狀之態樣。該電漿管4設於該電路模組2且與該電路模組2電性連接,該電漿管4能選擇性地發光,較佳地,該電漿管4係設於該電路模組2相對該記憶體模組1之一側,且該電漿管4相對之兩端分別具有一電連接端,當該記憶體模組1與該電路模組2電性導通時,該電路模組2與該電漿管4電性導通,使該電漿管4能發光,更仔細地說,當該電漿管4通電時,該電漿管4內之惰性氣體因受到高壓而產生放電火花,使該電漿管4內部會形成複數條似閃電狀之光線,相較於一般的發光二極體而言,此種電漿管4所產生之光線不僅較為特殊,且較不易令使用者感到刺眼或不舒適。再者,隨著填充的惰性氣體種類不同,所產生之光線顏色亦隨之改變。此外,電漿管4所通電之電流大小亦會影響該電漿管4發光之顏色及亮度。In the present embodiment, the plasma tube 4 is a cylinder, but not limited thereto. In other possible embodiments, the plasma tube may be in any other shape. The plasma tube 4 is disposed on the circuit module 2 and electrically connected to the circuit module 2, and the plasma tube 4 can selectively emit light. Preferably, the plasma tube 4 is disposed in the circuit module. 2 is opposite to one side of the memory module 1 , and the opposite ends of the plasma tube 4 respectively have an electrical connection end. When the memory module 1 is electrically connected to the circuit module 2 , the circuit module The group 2 is electrically connected to the plasma tube 4 to enable the plasma tube 4 to emit light. More specifically, when the plasma tube 4 is energized, the inert gas in the plasma tube 4 is discharged due to high pressure. The spark causes a plurality of light-like light rays to be formed inside the plasma tube 4. Compared with the general light-emitting diode, the light generated by the plasma tube 4 is not only special, but also difficult to use. Feeling glaring or uncomfortable. Furthermore, as the type of inert gas filled is different, the color of the generated light changes. In addition, the magnitude of the current applied to the plasma tube 4 also affects the color and brightness of the plasma tube 4.

於本創作之較佳實施例中另包含有一第二連接結構,該第二連接結構以其一端設於該電路模組2,以其另端設該電漿管4,使該電漿管4與該電路模組2具有電性連接之關係,更明確地說,該第二連接結構具有複數個第二連接件5,如圖2A所示,各該第二連接件5具有一第二插設部 51及一第二夾持部52,各該第二連接件5以該第二插設部51插設於該電路模組2相對該記憶體模組1之一側,且以該第二夾持部52夾持該電漿管4之電連接端,使該電路模組2與該電漿管4相互固定且彼此電性連接,較佳地,該第二夾持部52與該電漿管4相配合而概呈圓弧形。於本實施例中係包含有二第二連接件5,其中二第二連接件5係分別設於該電路模組2之相對二端,如此一來,該些第二連接件5能夾持該電漿管4相對之二端而使夾持效果更為穩固。可理解的是,於其他可能實施例中該第二連接結構亦可設置有二個以上之第二連接件或者是將該二第二連接件結合而為一體亦無不可。In a preferred embodiment of the present invention, a second connecting structure is further disposed. The second connecting structure is disposed at one end of the circuit module 2, and the plasma tube 4 is disposed at the other end to make the plasma tube 4 The circuit module 2 has an electrical connection relationship. More specifically, the second connection structure has a plurality of second connecting members 5, as shown in FIG. 2A, each of the second connecting members 5 has a second insertion. Department 51 and a second clamping portion 52, wherein the second connecting member 5 is inserted into the circuit module 2 on one side of the memory module 1 with the second insertion portion 51, and the second clamping member The holding portion 52 holds the electrical connection end of the plasma tube 4, so that the circuit module 2 and the plasma tube 4 are fixed to each other and electrically connected to each other. Preferably, the second clamping portion 52 and the plasma are The tubes 4 cooperate to form a circular arc shape. In this embodiment, the second connecting member 5 is included, and the second connecting members 5 are respectively disposed at opposite ends of the circuit module 2, so that the second connecting members 5 can be clamped. The plasma tube 4 is opposite to the two ends to make the clamping effect more stable. It can be understood that in other possible embodiments, the second connecting structure may also be provided with two or more second connecting members or the two connecting members may be integrated into one body.

藉此,復請參考圖1及圖2,當該記憶體模組1之連接埠13與該電腦主機板電性導通時,該電腦主機板供電予該記憶體模組1,該記憶體模組1藉由該些第一連接件3與該電路模組2電性導通,一般而言,該記憶體模組1所需之電壓較低,而該電漿管4所需之電壓較高,該電路模組2之轉換電路22將電壓由低壓轉為高壓並藉由該些第二連接件5與該電漿管4電性導通,供該電漿管4通電,如此一來,該電漿管4內之惰性氣體因受到高壓而產生放電火花,使該電漿管4內產生類似閃電狀之不規則光線。較佳地,該電路模組2可另包含有一溫度感應器(圖未示),當該溫度感應器感應該記憶體模組1之溫度高於一預設溫度時,該溫度感應器傳送一訊號至該轉換電路22,該轉換電路22並進一步控制該電漿管4所通電之電流大小,以警示使用者該記憶體模組1之溫度是否過熱,避免該記憶體模組1因溫度過熱而有所損害。Therefore, referring to FIG. 1 and FIG. 2, when the connection port 13 of the memory module 1 is electrically connected to the computer motherboard, the computer motherboard supplies power to the memory module 1, and the memory module is The group 1 is electrically connected to the circuit module 2 by the first connecting members 3. Generally, the voltage required by the memory module 1 is low, and the voltage required for the plasma tube 4 is relatively high. The switching circuit 22 of the circuit module 2 converts the voltage from a low voltage to a high voltage and is electrically connected to the plasma tube 4 through the second connecting members 5, so that the plasma tube 4 is energized, so that The inert gas in the plasma tube 4 generates a discharge spark due to the high pressure, so that irregular light such as lightning is generated in the plasma tube 4. Preferably, the circuit module 2 further includes a temperature sensor (not shown). When the temperature sensor senses that the temperature of the memory module 1 is higher than a preset temperature, the temperature sensor transmits a temperature sensor. Signaling to the conversion circuit 22, the conversion circuit 22 further controls the magnitude of the current applied by the plasma tube 4 to alert the user whether the temperature of the memory module 1 is overheated, and to prevent the memory module 1 from overheating due to temperature. And there is damage.

可理解的是,於其他可能實施例中,該電漿管亦可與電腦之 一電源供應器(圖未示)電性連接,並藉由該電源供應器直接供給一較高之電壓予該電漿管,例如當使用者欲設置一個以上之電漿管時,所需的電壓較高,而該轉換電路所轉換之電壓不足以供應該電漿管使用時,可藉由該電源供應器直接供給該電漿管所需之電壓,或者是當該轉換電路因外在因素耗損或損壞時,亦可直接藉由該電源供應器供給該電漿管電源。It can be understood that in other possible embodiments, the plasma tube can also be combined with a computer. A power supply (not shown) is electrically connected, and the power supply directly supplies a higher voltage to the plasma tube, for example, when the user wants to set more than one plasma tube. When the voltage is high, and the voltage converted by the conversion circuit is insufficient to supply the plasma tube, the voltage required for the plasma tube can be directly supplied by the power supply, or when the conversion circuit is externally When it is worn or damaged, the power supply to the plasma tube can also be directly supplied by the power supply.

請參考圖5,於本創作之較佳實施例中更包含有一殼件6,該殼件6係設於該記憶體模組1且覆蓋該電漿管4至少部分面積及該記憶體模組1至少部分面積,較佳地,該殼件6覆蓋該電漿管4相對之兩端並遮蔽該些第二連接件,使該電漿管4部分顯露於外。於本實施例中,該殼件6係為散熱性較佳之材質所製,如金屬,藉此亦可將該記憶體模組1及電漿管4運作時所產生的熱能散出,藉此達到較佳之散熱效果,避免記憶體模組1因溫度過高而損壞等情事發生。Referring to FIG. 5 , a preferred embodiment of the present invention further includes a shell member 6 disposed on the memory module 1 and covering at least a portion of the plasma tube 4 and the memory module. At least part of the area, preferably, the shell member 6 covers opposite ends of the plasma tube 4 and shields the second connecting members to expose the portion of the plasma tube 4 to the outside. In the present embodiment, the case member 6 is made of a material having better heat dissipation properties, such as metal, whereby the heat energy generated when the memory module 1 and the plasma tube 4 are operated can be dissipated. Achieve better heat dissipation and avoid damage to the memory module 1 due to excessive temperature.

綜上所述,本創作提供一種動態隨機存取記憶體,結構精簡且實用,相較於習知之技藝而言,使用者不僅無需設置發光功率較高之發光二極體即可達到較為特殊發光效果,且具有美觀之事實,此外,本創作亦提供較佳之傳導性散熱方式,以確保記憶體模組在提供高效能的同時亦能保持較佳的穩定運作,實乃極具進步功效之證明,符合專利法相關規定,爰依法提起專利申請,鑑請 鈞局早日核予專利,實感德便。In summary, the present invention provides a dynamic random access memory with a compact and practical structure. Compared with the conventional techniques, the user can achieve a special illumination without setting a light-emitting diode with higher luminous power. The effect, and the fact that it is aesthetically pleasing, in addition, this creation also provides a better conductive heat dissipation method to ensure that the memory module can maintain better stable operation while providing high performance, which is a proof of progress. In accordance with the relevant provisions of the Patent Law, 提起 file a patent application in accordance with the law, and ask the 钧 核 to approve the patent as soon as possible.

1‧‧‧記憶體模組1‧‧‧ memory module

22‧‧‧轉換電路22‧‧‧Transition circuit

11、21‧‧‧印刷電路板11, 21‧‧‧ Printed circuit boards

3‧‧‧第一連接件3‧‧‧First connector

12‧‧‧積體電路12‧‧‧ integrated circuit

4‧‧‧電漿管4‧‧‧Plastic tube

13‧‧‧連接埠13‧‧‧Links

5‧‧‧第二連接件5‧‧‧Second connector

2‧‧‧電路模組2‧‧‧ circuit module

Claims (7)

一種動態隨機存取記憶體,包含:一記憶體模組;一電路模組,設於該記憶體模組且與該記憶體模組電性連接,該電路模組上設有一轉換電路,該轉換電路可供將直流電轉換為交流電;一電漿管,設於該電路模組且與該電路模組電性連接,該電漿管能選擇性地發光,當該記憶體模組與該電路模組電性導通時,該電路模組與該電漿管電性導通,使該電漿管能發光。A dynamic random access memory, comprising: a memory module; a circuit module disposed in the memory module and electrically connected to the memory module, wherein the circuit module is provided with a conversion circuit, The conversion circuit is configured to convert DC power into AC power; a plasma tube is disposed in the circuit module and electrically connected to the circuit module, the plasma tube can selectively emit light, when the memory module and the circuit When the module is electrically turned on, the circuit module is electrically connected to the plasma tube, so that the plasma tube can emit light. 如請求項1所述之動態隨機存取記憶體,另包含有一第一連接結構,該記憶體模組具有一電連接部,該第一連接結構以其一端設於該電路模組之一側,以其另端設於該記憶體模組之電連接部,使該電路模組與該記憶體模組具有電性連接之關係。The DRAM of claim 1, further comprising a first connection structure, the memory module having an electrical connection, the first connection structure having one end disposed on one side of the circuit module The circuit module is electrically connected to the memory module by the other end of the electrical connection portion of the memory module. 如請求項2所述之動態隨機存取記憶體,其中該第一連接結構具有複數個第一連接件,各該第一連接件具有一第一插設部及一第一夾持部,各該第一連接件以該第一插設部插設於該電路模組,以該第一夾持部夾持該記憶體模組,使該記憶體模組與該電路模組相互固定。The DRAM of claim 2, wherein the first connection structure has a plurality of first connectors, each of the first connectors having a first insertion portion and a first clamping portion, each The first connector is inserted into the circuit module by the first insertion portion, and the memory module is clamped by the first clamping portion to fix the memory module and the circuit module to each other. 如請求項1所述之動態隨機存取記憶體,另包含有一第二連接結構,該第二連接結構以其一端設於該電路模組,以其另端設該電漿管,使該電漿管與該電路模組電性連接。The dynamic random access memory according to claim 1, further comprising a second connection structure, wherein the second connection structure is provided at one end of the circuit module, and the plasma tube is disposed at the other end to make the electricity The slurry tube is electrically connected to the circuit module. 如請求項4所述之動態隨機存取記憶體,其中該第二連接結構具有複數個第二連接件,各該第二連接件具有一第二插設部及一第二夾持部,各該第二連接件以該第二插設部插設於該電路模組,以該第二夾持部夾持 該電漿管,使該電路模組與該電漿管相互固定。The DRAM of claim 4, wherein the second connection structure has a plurality of second connectors, each of the second connectors having a second insertion portion and a second clamping portion, each The second connecting member is inserted into the circuit module by the second insertion portion, and is clamped by the second clamping portion The plasma tube fixes the circuit module and the plasma tube to each other. 如請求項1所述之動態隨機存取記憶體,其中該記憶體模組具有一連接埠,供與一電腦主機板電性連接並且與其進行資料傳輸。The dynamic random access memory of claim 1, wherein the memory module has a port for electrically connecting to a computer motherboard and transmitting data therewith. 如請求項1至6中任一項所述之動態隨機存取記憶體,更包含有一殼件,該殼件係設於該記憶體模組且覆蓋該電漿管至少部分面積及該記憶體模組至少部分面積。The dynamic random access memory according to any one of claims 1 to 6, further comprising a case member disposed on the memory module and covering at least a portion of the area of the plasma tube and the memory At least part of the area of the module.
TW102202322U 2013-02-01 2013-02-01 Dynamic type memory TWM456042U (en)

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI563530B (en) * 2016-08-19 2016-12-21 Avexir Technologies Corp Luminous keyboard
TWI569132B (en) * 2016-10-28 2017-02-01 宇帷國際股份有限公司 Power supply device
TWI582767B (en) * 2015-10-06 2017-05-11 英信科技有限公司 Dynamic random access memory
TWI587341B (en) * 2016-08-19 2017-06-11 英信科技有限公司 Luminous Keyboard
US9769893B1 (en) 2016-05-30 2017-09-19 Apacer Technology Inc. Light-emitting device and control method thereof
US9795018B2 (en) 2015-01-20 2017-10-17 Alson Technology Limited Electronic device and circuit module thereof
TWI607432B (en) * 2015-11-20 2017-12-01 英信科技有限公司 Dynamic Random Access Memory
TWI632455B (en) * 2017-03-03 2018-08-11 宇瞻科技股份有限公司 Heat dissipation device having adjustable reflector member
TWI632456B (en) * 2017-03-03 2018-08-11 宇瞻科技股份有限公司 Reflective heat dissipation device
US10645785B2 (en) 2018-04-26 2020-05-05 Giga-Byte Technology Co., Ltd. Illumination dummy module

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9795018B2 (en) 2015-01-20 2017-10-17 Alson Technology Limited Electronic device and circuit module thereof
TWI582767B (en) * 2015-10-06 2017-05-11 英信科技有限公司 Dynamic random access memory
TWI607432B (en) * 2015-11-20 2017-12-01 英信科技有限公司 Dynamic Random Access Memory
US9769893B1 (en) 2016-05-30 2017-09-19 Apacer Technology Inc. Light-emitting device and control method thereof
TWI563530B (en) * 2016-08-19 2016-12-21 Avexir Technologies Corp Luminous keyboard
TWI587341B (en) * 2016-08-19 2017-06-11 英信科技有限公司 Luminous Keyboard
TWI569132B (en) * 2016-10-28 2017-02-01 宇帷國際股份有限公司 Power supply device
TWI632455B (en) * 2017-03-03 2018-08-11 宇瞻科技股份有限公司 Heat dissipation device having adjustable reflector member
TWI632456B (en) * 2017-03-03 2018-08-11 宇瞻科技股份有限公司 Reflective heat dissipation device
US10645785B2 (en) 2018-04-26 2020-05-05 Giga-Byte Technology Co., Ltd. Illumination dummy module

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