TWI632455B - Heat dissipation device having adjustable reflector member - Google Patents

Heat dissipation device having adjustable reflector member

Info

Publication number
TWI632455B
TWI632455B TW106106937A TW106106937A TWI632455B TW I632455 B TWI632455 B TW I632455B TW 106106937 A TW106106937 A TW 106106937A TW 106106937 A TW106106937 A TW 106106937A TW I632455 B TWI632455 B TW I632455B
Authority
TW
Taiwan
Prior art keywords
heat dissipating
connecting portion
dissipating device
portion
member according
Prior art date
Application number
TW106106937A
Other languages
Chinese (zh)
Other versions
TW201833773A (en
Inventor
古佩玉
陳建邦
曾華敏
鍾明翰
Original Assignee
宇瞻科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宇瞻科技股份有限公司 filed Critical 宇瞻科技股份有限公司
Priority to TW106106937A priority Critical patent/TWI632455B/en
Application granted granted Critical
Publication of TWI632455B publication Critical patent/TWI632455B/en
Publication of TW201833773A publication Critical patent/TW201833773A/en

Links

Abstract

A heat dissipating device with an adjustable reflective component is used for a memory module having a lower edge for a gold finger arrangement and an upper edge spaced apart from a lower edge thereof; the heat sink includes a heat sink a heat dissipating component and a light reflecting component, wherein the heat dissipating body has two heat dissipating fins for being sandwiched on the memory module, and at least one heat dissipating fin is provided with a first connecting portion at an upper edge of the adjacent memory module, and the reflecting component The light-reflecting portion and the second connecting portion provided on the light-reflecting portion have a reflective effect on the surface of the light-reflecting portion, and the second connecting portion cooperates with the first connecting portion to movably couple the light-reflecting portion to the heat-dissipating body.

Description

Heat sink with adjustable reflective parts

The invention relates to a heat dissipating device suitable for the periphery of a computer, in particular to a heat dissipating device with an adjustable reflective component applied to a memory module (such as a random access memory).

Pressed, random access memory (RAM) is a memory used to exchange data directly with a central processing unit (CPU) of a computer. With the rapid development of the computer industry, today's memory has developed into high-bandwidth computer memory specifications such as DDR4, so there are problems such as heat generation in operation, so the heat dissipation designed to meet the heat dissipation requirements of these memory modules The device is born.

In the past, the heat sink applied to the memory modules was mainly placed on the wafer of the memory module by the two heat sinks for heat dissipation of the wafer. At the same time, in order to meet the needs of the computer in the e-sports (video game) industry or computer DIY players, the internal components of the computer host often provide illumination effects through components such as LEDs, so as to produce glare effects in the computer case, and as a computer. The internal memory module and its heat sink are no exception; for example, setting the LED on the circuit board of the memory module or adding the light guiding component to the heat sink is indispensable.

However, since the traditional method is mainly to adopt an active light-emitting method, thereby providing a glare effect, that is, the memory module or its heat-dissipating device itself has a light-emitting member such as an LED, and the light-emitting function itself can achieve the desired dazzle. The light effect, but often it is also easy to match the glare effect provided by other components inside the computer case, so that the effect is greatly reduced. Especially under the limitation of the specifications of the motherboard, the relative positions of the components inside the computer mainframe are limited, so the projection direction and position of the light source cannot be adjusted correspondingly, and only the respective light-emitting can not provide the corresponding matching effect.

In view of the above, the present inventors have made an effort to improve and solve the above-mentioned shortcomings, and have devoted themselves to research and cooperate with the application of the theory, and finally proposed a present invention which is reasonable in design and effective in improving the above-mentioned defects.

The main object of the present invention is to provide a heat dissipating device with an adjustable reflective component, which provides a reflective glare or multi-level vision by a light source provided by other components inside the computer case or even an external light source. The effect does not affect the original heat dissipation area.

Another object of the present invention is to provide a heat dissipating device having an adjustable reflecting member, which can be adjusted in a movable manner, so that the reflecting member can be adjusted correspondingly according to the projection direction or position of the light source. Use reflective light to enhance its glare or multi-level visual effects.

In order to achieve the above object, the present invention provides a heat dissipating device with an adjustable retroreflective member for use in a memory module having a lower edge for a gold finger configuration and a lower edge thereof The heat dissipating device includes a heat dissipating body and a light reflecting component, wherein the heat dissipating body has two heat dissipating fins for being sandwiched on the memory module, and at least one heat sink is disposed adjacent to the upper edge of the memory module a first connecting portion is provided, and the reflecting member has a reflecting portion and a second connecting portion disposed on the reflecting portion. The surface of the reflecting portion has a reflective effect, and the second connecting portion cooperates with the first connecting portion to reflect light. The activity is linked to the heat sink body.

The detailed description of the present invention and the accompanying drawings are to be understood by the accompanying claims .

1 and 2 are respectively an exploded perspective view and a perspective assembled view of a first embodiment of the present invention. The present invention provides a heat dissipating device with an adjustable reflective component. The heat dissipating device 1 is disposed on a memory module 2, and the memory module 2 is a random access memory (RAM) and includes a The circuit board 20 and a plurality of wafers 21 disposed on the circuit board 20. The heat dissipating device 1 is configured to provide heat dissipation for the wafer 21 of the memory module 2; the heat dissipating device 1 includes a heat dissipating body 10 and a reflective member 11 disposed on the heat dissipating body 10, wherein:

The heat dissipating body 10 is mainly composed of two heat dissipating fins 100. The two heat dissipating fins 100 can be formed by separate sheets made of two metal materials or integrally formed by extrusion of aluminum. The two heat sinks 100 are used to sandwich the memory module 2 and sandwich the memory module 2, and the inner surfaces of the heat sinks 100 are attached to the wafer 21 of the memory module 2. Therefore, the outer surface of the heat sink 100 can provide good heat dissipation of the wafer 21 when it is heated.

Referring to FIG. 3 together, the circuit board 20 of the memory module 2 has a lower edge 200 for a gold finger arrangement and an upper edge 201 spaced apart from the lower edge 200, and when in use, The edge 200 is inserted into the memory slot 30 of the motherboard 3 of the computer. The present invention is mainly provided with a first connecting portion 101 on at least one of the heat dissipating fins 10, and the reflecting member 11 has a reflecting portion 110 and a second connecting portion disposed on the reflecting portion 110. 111, the second connecting portion 111 is matched with the first connecting portion 101, and the light reflecting portion 110 is movably coupled to the heat dissipating body 10, and the reflecting portion 110 can be a plate-shaped portion, and the reflecting portion 110 is Any surface has a reflective effect, that is, when the memory module 2 is inserted into the memory slot 30 of the motherboard 3 of the computer, the light source provided by other components inside the computer case, or even the outside of the computer case is provided. The light source is adjusted, and the light reflecting unit 110 is adjusted to receive the projected light source, so that the light reflecting unit 110 can transmit the glare or multi-level visual effects. Further, the reflective effect may be applied to the surface of the light reflecting portion 110 through the material of the light reflecting portion 110 or by a material such as a plating or coating. It can also be used for full or partial draping, and for example, text or graphics can be designed on partial drapes.

Referring to FIG. 4 again, in the first embodiment of the present invention, the upper edges of the two heat sinks 100 are provided with a connecting base portion 102 corresponding to each other, and the first connecting portions 101 are respectively located at the connecting base portion. The end of the 102 is formed to form a connecting notch 103, and a pivoting groove 104 is defined in the first connecting portion 101, and the second connecting portion 111 is a matching pivot and extends from the lower edge of the reflecting portion 110. The lower edge of the light reflecting portion 110 corresponds to the inside of the connecting gap 103, and the second connecting portion 111 as a pivot is coupled to the first connecting portion 101 as the pivot groove 104, and the light reflecting portion 110 is further coupled. The movable body 10 is movably connected to the heat dissipating body 10, and can be adjusted according to the projection direction or position of the actual light source, so as to effectively utilize the reflective light to enhance the glare or multi-level visual effects. In addition, since the position of the reflecting member 11 is avoided from the outer surface of the two fins 100 and the area in contact with the outside is maintained, the heat dissipation effect of the two fins 100 can be avoided. The two heat sinks 100 can also be coupled to each other by at least one fixing member 105 such as a screw, so that the first connecting portion 101 of the two heat sinks 100 can be matched with the second connecting portion 111. Pivot connection.

Therefore, the heat dissipating device with the adjustable reflecting member of the present invention can be obtained by the above-mentioned structural composition.

In addition, as shown in FIG. 5, in the second embodiment of the present invention, a rubber ring 112 may be further disposed on the outer portion of the second connecting portion 111 as a pivot to increase the resistance of the light reflecting portion 110 when flipped. When the flipping to the desired angle or position, the reflective portion 110 can be provided with a relatively stable positioning effect, and is less susceptible to external force to change its adjustment angle or position.

Moreover, as shown in FIG. 6, in the third embodiment of the present invention, the second connecting portion 111 is a ratchet, and the first connecting portion 101 is provided with a tooth groove 106 matching the ratchet for reflection. When the portion 110 is turned over, the positioning effect can be provided in the adjustment operation by the engagement of the second coupling portion 111 as the ratchet with the slot 106.

Next, as shown in FIG. 7, in the fourth embodiment of the present invention, the first connecting portion 101 is a first pivot, and the second connecting portion 111 has a second pivot 113 and a through The pivot pin 114 of the first and second pivots 113 can also have the effect of allowing the light reflecting portion 110 to be adjusted by turning over as described above.

Furthermore, as shown in FIG. 8 and FIG. 9, in the fifth embodiment of the present invention, the first connecting portion 101 is provided with a ball socket 107, and the second connecting portion 111 is matched with the ball socket 107. The ball bearing is coupled to the ball socket 107 by the second connecting portion 111 as a ball bearing, so that the light reflecting portion 110 can be adjusted in multiple directions on the heat dissipating body 10, and is not limited to the foregoing. The embodiment only needs to make the flip adjustment in the same axial direction, so that the light reflecting portion 110 has more degrees of freedom in adjustment and can respond to more different projection directions or positions of the light source.

Therefore, the heat dissipating device with the adjustable reflective component of the present invention can passively adopt the reflection generated by the peripheral light source to provide the glare effect, and thus can be connected with the inner periphery of the computer case. The light source is matched correspondingly, and the adjustable light source can be used to respond to the light source from different directions or positions, so as to effectively utilize the peripheral light source to achieve glare or multi-level visual effects. At the same time, the upper edge of the two heat sinks 100 is used for the light reflecting member 11 to be assembled, and the heat dissipation area of the heat dissipation body 10 is also avoided to avoid affecting the heat dissipation effect.

In summary, the present invention can achieve the intended use purpose, and solve the lack of the conventional, and because of the novelty and progress, fully meet the requirements of the invention patent application, and apply according to the patent law, please check and The patent in this case is granted to protect the rights of the inventor.

However, the above description is only a preferred embodiment of the present invention, and thus the scope of the present invention is not limited thereto, and the equivalent techniques and means, etc., which are used in the description of the present invention and the contents of the drawings, are the same. It is included in the scope of the present invention and is combined with Chen Ming.

<present invention>

1‧‧‧heating device

10‧‧‧Solution body

100‧‧‧ Heat sink

101‧‧‧First Link

102‧‧‧Connected base

103‧‧‧ Linkage gap

104‧‧‧ pivot slot

105‧‧‧Fixed components

106‧‧‧ cogging

107‧‧‧ ball nest

11‧‧‧Reflective parts

110‧‧‧Reflection Department

111‧‧‧Second Link

112‧‧‧Rubber ring

113‧‧‧Second pivot

114‧‧‧ pivot pin

2‧‧‧Memory Module

20‧‧‧ boards

200‧‧‧ lower edge

201‧‧‧Upper edge

21‧‧‧ wafer

3‧‧‧ motherboard

30‧‧‧Memory slot

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded perspective view of a first embodiment of the present invention.

Figure 2 is a perspective assembled view of a first embodiment of the present invention.

Fig. 3 is a cross-sectional view showing the state of use of the first embodiment of the present invention.

Fig. 4 is a cross-sectional view showing the adjustment state of the first embodiment of the present invention.

Fig. 5 is a cross-sectional view showing the adjustment state of the second embodiment of the present invention.

Fig. 6 is a cross-sectional view showing the adjustment state of the third embodiment of the present invention.

Figure 7 is a perspective assembled view of a fourth embodiment of the present invention.

Figure 8 is a perspective exploded view of a fifth embodiment of the present invention.

Figure 9 is a perspective assembled view of a fifth embodiment of the present invention.

Claims (10)

  1. A heat dissipating device with an adjustable reflective component for a memory module, the memory module having a lower edge disposed by a gold finger and an upper edge spaced apart from the lower edge; the heat dissipating device comprising: a heat dissipation body having two heat sinks for being sandwiched on the memory module, and at least one of the heat sinks is provided with a first connecting portion adjacent to an upper edge of the memory module; and a light reflecting member Having a light reflecting portion and a second connecting portion disposed on the light reflecting portion, the surface of the light reflecting portion has a reflective effect, and the second connecting portion cooperates with the first connecting portion to cause the light reflecting portion to be movably coupled to the surface Cooling body.
  2. The heat dissipating device with the adjustable reflective member according to claim 1, wherein the reflecting portion is in the shape of a plate.
  3. The heat dissipating device with the adjustable reflective member according to the first aspect of the invention, wherein the upper edges of the two fins of the heat dissipating body are provided with a connecting base corresponding to each other.
  4. The heat dissipating device with the adjustable reflective member according to claim 3, wherein the connecting base of the two fins is coupled by at least one fixing member.
  5. The heat dissipating device with the adjustable reflective member according to claim 3, wherein the first connecting portion is located at the end of the connecting base to form a connecting notch, and the lower edge of the reflecting portion corresponds to the connecting notch.
  6. The heat dissipating device with the adjustable reflective member according to any one of claims 1 to 5, wherein the first connecting portion is provided with a pivot groove, and the second connecting portion is a matching pivot a shaft, and the pivot is coupled to the pivot slot.
  7. The heat dissipating device with the adjustable reflective member according to the sixth aspect of the invention, wherein the pivoting system further comprises a rubber ring.
  8. The heat dissipating device with an adjustable retroreflective member according to any one of claims 1 to 5, wherein the second connecting portion is a ratchet, and the first connecting portion is provided with the ratchet Cooperating cogging.
  9. The heat dissipating device with the adjustable reflective member according to any one of claims 1 to 5, wherein the first connecting portion is a first pivoting portion and the second connecting portion has a second pivoting portion a barrel and a pivot pin extending through the first pivot and the second pivot.
  10. The heat dissipating device with the adjustable reflective member according to any one of claims 1 to 5, wherein the first connecting portion is provided with a ball socket, and the second connecting portion is opposite to the ball socket. A ball bearing with the ball.
TW106106937A 2017-03-03 2017-03-03 Heat dissipation device having adjustable reflector member TWI632455B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW106106937A TWI632455B (en) 2017-03-03 2017-03-03 Heat dissipation device having adjustable reflector member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW106106937A TWI632455B (en) 2017-03-03 2017-03-03 Heat dissipation device having adjustable reflector member

Publications (2)

Publication Number Publication Date
TWI632455B true TWI632455B (en) 2018-08-11
TW201833773A TW201833773A (en) 2018-09-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106106937A TWI632455B (en) 2017-03-03 2017-03-03 Heat dissipation device having adjustable reflector member

Country Status (1)

Country Link
TW (1) TWI632455B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150736A (en) * 1998-11-13 2000-05-30 Shinko Electric Ind Co Ltd Semiconductor module and heat dissipation board therefor
JP2004079949A (en) * 2002-08-22 2004-03-11 Elpida Memory Inc Heat sink of heat generating semiconductor device in memory module
US8154873B2 (en) * 2009-08-25 2012-04-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for memory module
TWM456042U (en) * 2013-02-01 2013-06-21 Avexir Technologies Corp Dynamic type memory
TW201521346A (en) * 2015-01-20 2015-06-01 Avexir Technologies Corp Electronic device and circuit module thereof
TW201606787A (en) * 2015-11-03 2016-02-16 宇帷國際股份有限公司 Electronic device and dynamic random access memory thereof
TW201610992A (en) * 2015-11-20 2016-03-16 宇帷國際股份有限公司 Dynamic random access memory
TW201616493A (en) * 2015-12-30 2016-05-01 宇帷國際股份有限公司 System for alternating lighting of DRAM

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150736A (en) * 1998-11-13 2000-05-30 Shinko Electric Ind Co Ltd Semiconductor module and heat dissipation board therefor
JP2004079949A (en) * 2002-08-22 2004-03-11 Elpida Memory Inc Heat sink of heat generating semiconductor device in memory module
US8154873B2 (en) * 2009-08-25 2012-04-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for memory module
TWM456042U (en) * 2013-02-01 2013-06-21 Avexir Technologies Corp Dynamic type memory
TW201521346A (en) * 2015-01-20 2015-06-01 Avexir Technologies Corp Electronic device and circuit module thereof
TW201606787A (en) * 2015-11-03 2016-02-16 宇帷國際股份有限公司 Electronic device and dynamic random access memory thereof
TW201610992A (en) * 2015-11-20 2016-03-16 宇帷國際股份有限公司 Dynamic random access memory
TW201616493A (en) * 2015-12-30 2016-05-01 宇帷國際股份有限公司 System for alternating lighting of DRAM

Also Published As

Publication number Publication date
TW201833773A (en) 2018-09-16

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