TW201833773A - Heat dissipation device having adjustable reflector member - Google Patents

Heat dissipation device having adjustable reflector member Download PDF

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Publication number
TW201833773A
TW201833773A TW106106937A TW106106937A TW201833773A TW 201833773 A TW201833773 A TW 201833773A TW 106106937 A TW106106937 A TW 106106937A TW 106106937 A TW106106937 A TW 106106937A TW 201833773 A TW201833773 A TW 201833773A
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TW
Taiwan
Prior art keywords
heat dissipation
dissipation device
pivot
connecting portion
connecting
Prior art date
Application number
TW106106937A
Other languages
Chinese (zh)
Other versions
TWI632455B (en
Inventor
古佩玉
陳建邦
曾華敏
鍾明翰
Original Assignee
宇瞻科技股份有限公司
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Publication date
Application filed by 宇瞻科技股份有限公司 filed Critical 宇瞻科技股份有限公司
Priority to TW106106937A priority Critical patent/TWI632455B/en
Application granted granted Critical
Publication of TWI632455B publication Critical patent/TWI632455B/en
Publication of TW201833773A publication Critical patent/TW201833773A/en

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Abstract

A heat dissipation device with an adjustable reflective component is used for a memory module. The memory module has a lower edge for gold finger configuration and an upper edge away from the lower edge; the heat dissipation device includes a A heat dissipation body and a reflective component, wherein the heat dissipation body has two heat dissipation fins to be sandwiched on the memory module, and at least one heat dissipation fin is provided with a first connection portion on the upper edge of the adjacent memory module, and the light reflection component It has a light reflecting part and a second connecting part provided on the light reflecting part, the surface of the light reflecting part has a light reflecting effect, and the second connecting part cooperates with the first connecting part to movably connect the light reflecting part to the heat dissipation body.

Description

Heat dissipation device with adjustable reflective parts

The invention relates to a heat dissipation device suitable for computer peripherals, in particular to a heat dissipation device with adjustable reflective components applied to a memory module (such as a random access memory).

Press, random access memory (RAM) is the memory used to directly exchange data with the computer's central processing unit (CPU). With the rapid development of the computer industry, today's memory has developed to high-bandwidth computer memory specifications such as DDR4, so they all have operational problems, so the heat dissipation designed to meet the heat dissipation requirements of these memory modules The device spontaneously emerged.

In the past, the heat dissipation device used in these memory modules is mainly composed of two heat sink clips placed on the chip of the memory module for the heat dissipation of the chip. At the same time, in order to meet the needs of computers in the e-sports (video game) industry or computer DIY players, the components inside the computer mainframe often also provide luminous effects through components such as LEDs, so as to cause glare and other effects in the computer case, and serve as a computer The internal memory module and its heat dissipation device are no exception; for example, LEDs are installed on the circuit board of the memory module, or light guide elements are added to the heat dissipation device.

However, because the traditional method mainly adopts the active light-emitting method, in order to provide the glare effect, that is, the memory module or its heat dissipation device itself has a light-emitting member such as an LED, and the light-emitting function is used to achieve the desired glare. Light effect, but it is often easy to cooperate with the glare provided by other components inside the computer case, which greatly reduces the effect. Especially under the limitation of the motherboard and other specifications, the relative positions of the components inside the computer host are limited, so the projection direction and position of the light source cannot be adjusted accordingly, and they can only emit light without providing the corresponding matching effect.

In view of this, in order to improve and solve the above-mentioned deficiencies, the present inventors are dedicated to research and cooperate with the application of academic principles, and finally propose a reasonable design and effectively improve the above-mentioned deficiencies of the present invention.

The main purpose of the present invention is to provide a heat dissipation device with adjustable reflective components, which provides reflective glare or multi-level vision through light sources provided by other components inside the computer case, or even external light sources Effect, and does not affect the original heat dissipation area.

Another object of the present invention is to provide a heat dissipation device with adjustable reflective components, which can be adjusted by movable connection, so that the reflective components can be adjusted according to the projection direction or position of the light source, To effectively use reflection to enhance its glare or multi-level visual effects.

In order to achieve the above object, the present invention provides a heat dissipation device with an adjustable reflective component, which is used for a memory module having a lower edge for disposition of a gold finger and a phase corresponding to the lower edge Away from the upper edge; the heat dissipation device includes a heat dissipation body and a reflective component, wherein the heat dissipation body has two heat dissipation fins to sandwich the memory module, and at least one heat dissipation fin is adjacent to the upper edge of the memory module The first connecting portion is provided, and the reflecting member has a reflecting portion and a second connecting portion provided on the reflecting portion, the surface of the reflecting portion has a reflecting effect, and the second connecting portion cooperates with the first connecting portion to reflect light The part is movably connected to the heat dissipation body.

In order for your reviewer to understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, however, the attached drawings are provided for reference and explanation only, and are not intended to limit the present invention. .

Please refer to FIGS. 1 and 2, which are respectively an exploded perspective view and a combined perspective view of the first embodiment of the present invention. The present invention provides a heat dissipation device with an adjustable reflective component. The heat dissipation device 1 is used to be disposed on a memory module 2. The memory module 2 is a random access memory (RAM) and includes a The circuit board 20 and a plurality of wafers 21 provided on the circuit board 20. The heat dissipation device 1 is used to provide the heat dissipation requirements of the chip 21 of the memory module 2. The heat dissipation device 1 includes a heat dissipation body 10 and a reflective component 11 disposed on the heat dissipation body 10, wherein:

The heat dissipation body 10 is mainly composed of two heat dissipation fins 100. The two heat dissipation fins 100 can be made of two separate metal materials, or integrally formed by means such as aluminum extrusion to form a "ㄇ ", And the two heat sinks 100 are used to sandwich the above memory module 2 and to be wrapped outside the memory module 2, and the inner surface of the two heat sinks 100 is attached to the chip 21 of the memory module 2 Therefore, the outer surface of the second heat sink 100 can provide good heat dissipation when the chip 21 generates heat.

Please also refer to FIG. 3, the circuit board 20 of the above memory module 2 has a lower edge 200 for gold finger configuration, and an upper edge 201 away from the lower edge 200, and in use, the lower edge The edge 200 is inserted into the memory slot 30 of the motherboard 3 of the computer. The present invention is mainly based on the fact that at least one heat sink 100 in the heat dissipation body 10 is provided with a first connecting portion 101, and the light reflecting member 11 has a light reflecting portion 110 and a second connecting portion provided on the light reflecting portion 110 111, so that the second connecting portion 111 cooperates with the first connecting portion 101, so that the reflective portion 110 can be movably connected to the heat dissipation body 10, and the reflective portion 110 can be in the form of a plate, and the reflective portion 110 Any surface has a reflective effect, that is, when the memory module 2 is inserted into the memory slot 30 of the computer motherboard 3, the light source provided by other components inside the computer case, or even provided outside the computer case And adjust the reflective part 110 so that the reflective part 110 can receive the projected light source, and then the reflective part 110 can be used to provide glare or multi-level visual effects. Furthermore, the reflective effect can be applied to any surface of the reflective part 110 through the material of the reflective part 110, or by coating materials or fluorescent paint with a reflective effect by processing methods such as electroplating or coating. It can also be used for full or partial covering, and designs such as text or graphics can be designed on the partial covering.

Please refer to FIG. 4 again. In the first embodiment of the present invention, the upper edges of the two heat sinks 100 are provided with a connection base 102 corresponding to each other, and the first connection parts 101 are respectively located at the connection base At the end of 102, a connecting notch 103 is formed, and a pivot groove 104 is provided on the first connecting portion 101, and the second connecting portion 111 is a matching pivot and extends from the lower edge of the reflecting portion 110 In order to allow the lower edge of the reflecting part 110 to correspond to the connecting notch 103, the second connecting part 111 as a pivot can be coupled with the first connecting part 101 as a pivot groove 104, and then the reflecting part 110 It can be movably connected to the heat dissipation body 10, and can be adjusted according to the actual light source's projection direction or position to adjust accordingly, so as to effectively use reflection to enhance its glare or multi-level visual effects. In addition, since the installation position of the reflective member 11 avoids the outer surface of the second heat sink 100 and can maintain its area in contact with the outside world, it can avoid affecting the heat dissipation effect of the second heat sink 100. The two heat sinks 100 can also be combined by at least one fixing element 105 such as a screw penetrating each other's connection base 102 to allow the first connection part 101 of the two heat sinks 100 to cooperate with the second connection part 111 Pivot links.

Therefore, with the above-mentioned structure, the heat dissipation device with adjustable reflective parts of the present invention can be obtained.

In addition, as shown in FIG. 5, in the second embodiment of the present invention, a rubber ring 112 may be further sleeved on the second connecting portion 111 as a pivot, so as to increase the resistance of the reflective portion 110 when turning over, thereby When flipped to a desired angle or position, it can provide a more stable positioning effect of the reflective portion 110, and is less susceptible to external force touching to change its adjustment angle or position.

In addition, as shown in FIG. 6, in the third embodiment of the present invention, the second coupling portion 111 is a ratchet tooth, and the first coupling portion 101 is provided with a tooth groove 106 cooperating with the ratchet teeth for reflection When the portion 110 is turned over, the second coupling portion 111 which is a ratchet tooth can cooperate with the tooth groove 106 to provide a positioning effect during the adjustment operation.

Secondly, as shown in FIG. 7, in the fourth embodiment of the present invention, the first connection portion 101 is a first pivot tube, and the second connection portion 111 has a second pivot tube 113 and a through The pivot pin 114 of the first and second pivot barrels 113 can also have the effect of enabling the reflective portion 110 to be adjusted by turning over.

Furthermore, as shown in FIGS. 8 and 9, in the fifth embodiment of the present invention, a ball socket 107 is provided on the first connection portion 101, and the second connection portion 111 is matched with the ball socket 107 A ball bearing is connected to the ball socket 107 by the second connecting portion 111 as a ball bearing, so that the reflective portion 110 can be adjusted in a multi-axial rotation on the heat dissipation body 10, and is not limited to the foregoing The embodiment only has to perform the flip adjustment on the same axis, so that the reflective portion 110 has more freedom in adjustment and can respond to more light sources with different projection directions or positions.

Therefore, because the heat dissipation device with adjustable reflective components of the present invention does not have an active light-emitting effect, it passively uses the reflected light generated by the projection of the peripheral light source to provide the glare effect, so it can communicate with the inner periphery of the computer case. The corresponding light sources are matched, and the adjustable functions can be used to respond to light sources from different directions or positions, so as to effectively use peripheral light sources to achieve glare or multi-level visual effects. At the same time, the upper edges of the two heat sinks 100 are used for the assembly of the reflective component 11, which also avoids the heat dissipation area of the heat dissipation body 10 to avoid affecting the heat dissipation effect.

In summary, the present invention can indeed achieve the intended use purpose, and solve the lack of knowledge, and because it is extremely novel and progressive, it fully meets the requirements of the invention patent application. The application is made in accordance with the Patent Law, please check and Grant the patent in this case to protect the rights of inventors.

However, the above is only a preferred and feasible embodiment of the present invention, and the patent scope of the present invention is not limited thereby. Therefore, any changes in the equivalent technologies and means of the description and drawings of the present invention are the same. Included within the scope of the present invention, Chen Ming.

<The present invention>

1‧‧‧radiating device

10‧‧‧cooling body

100‧‧‧heat sink

101‧‧‧First Connection Department

102‧‧‧Link base

103‧‧‧Link gap

104‧‧‧Pivot slot

105‧‧‧Fixed components

106‧‧‧Groove

107‧‧‧ball socket

11‧‧‧Reflective parts

110‧‧‧Reflecting Department

111‧‧‧Second Link Department

112‧‧‧Rubber ring

113‧‧‧Second pivot

114‧‧‧ pivot pin

2‧‧‧Memory module

20‧‧‧ circuit board

200‧‧‧lower edge

201‧‧‧Upper edge

21‧‧‧chip

3‧‧‧Motherboard

30‧‧‧Memory slot

FIG. 1 is an exploded perspective view of the first embodiment of the present invention.

FIG. 2 is a three-dimensional assembly diagram of the first embodiment of the present invention.

3 is a schematic cross-sectional view of the first embodiment of the present invention in use.

4 is a schematic cross-sectional view of the adjustment state of the first embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view of the adjusted state of the second embodiment of the present invention.

6 is a schematic cross-sectional view of the adjustment state of the third embodiment of the present invention.

7 is a three-dimensional assembly diagram of the fourth embodiment of the present invention.

8 is an exploded perspective view of a fifth embodiment of the present invention.

9 is a three-dimensional assembly diagram of the fifth embodiment of the present invention.

Claims (10)

  1. A heat dissipation device with an adjustable reflective component is used for a memory module. The memory module has a lower edge configured for gold fingers and an upper edge away from the lower edge. The heat dissipation device includes: A heat dissipation body, having two heat dissipation fins and used for clamping on the memory module, and at least one of the heat dissipation fins is provided with a first connecting portion on the upper edge of the memory module; and a reflective component, It has a reflecting part and a second connecting part provided on the reflecting part, the surface of the reflecting part has a reflecting effect, and the second connecting part cooperates with the first connecting part to movably connect the reflecting part to the On the cooling body.
  2. The heat dissipation device with adjustable reflective components as described in item 1 of the patent scope, wherein the reflective portion is in the form of a plate.
  3. The heat dissipation device with adjustable reflective components as described in item 1 of the patent application scope, wherein both upper edges of the two heat dissipation fins of the heat dissipation body are provided with a connection base corresponding to each other.
  4. The heat dissipation device with adjustable reflective components as described in item 3 of the patent application scope, wherein the connecting base of the two heat dissipation fins is connected through at least one fixing element.
  5. The heat dissipation device with adjustable reflective parts as described in item 3 of the patent application scope, wherein the first connecting parts are respectively located at the ends of the connecting base to form a connecting gap, and the lower edge of the reflecting part corresponds to the connecting gap.
  6. The heat dissipation device with adjustable reflective parts as described in any one of items 1 to 5 of the patent application scope, wherein the first connecting portion is provided with a pivot groove, and the second connecting portion is a matching pivot Shaft, and the pivot shaft is cooperatively connected with the pivot groove.
  7. The heat dissipation device with adjustable reflective components as described in item 6 of the patent application scope, wherein a rubber ring is further sleeved outside the pivot.
  8. The heat dissipation device with adjustable reflective components as described in any one of items 1 to 5 of the patent application scope, wherein the second connecting portion is a ratchet tooth, and the first connecting portion is provided with the ratchet tooth Cooperate cogging.
  9. The heat dissipation device with adjustable reflective parts as described in any one of items 1 to 5 of the patent application scope, wherein the first connecting portion is a first pivot tube, and the second connecting portion has a second pivot A barrel and a pivot pin that penetrates the first pivot barrel and the second pivot barrel.
  10. The heat dissipation device with adjustable reflective parts as described in any one of items 1 to 5 of the patent application scope, wherein the first connecting portion is provided with a ball socket, and the second connecting portion is opposite to the ball socket A ball bearing.
TW106106937A 2017-03-03 2017-03-03 Heat dissipation device having adjustable reflector member TWI632455B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW106106937A TWI632455B (en) 2017-03-03 2017-03-03 Heat dissipation device having adjustable reflector member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW106106937A TWI632455B (en) 2017-03-03 2017-03-03 Heat dissipation device having adjustable reflector member

Publications (2)

Publication Number Publication Date
TWI632455B TWI632455B (en) 2018-08-11
TW201833773A true TW201833773A (en) 2018-09-16

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106106937A TWI632455B (en) 2017-03-03 2017-03-03 Heat dissipation device having adjustable reflector member

Country Status (1)

Country Link
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Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150736A (en) * 1998-11-13 2000-05-30 Shinko Electric Ind Co Ltd Semiconductor module and heat dissipation board therefor
JP2004079949A (en) * 2002-08-22 2004-03-11 Elpida Memory Inc Heat sink of heat generating semiconductor device in memory module
CN101998808A (en) * 2009-08-25 2011-03-30 富准精密工业(深圳)有限公司 Heat dissipating device
TWM456042U (en) * 2013-02-01 2013-06-21 Avexir Technologies Corp Dynamic type memory
TWI519050B (en) * 2015-01-20 2016-01-21 宇帷國際股份有限公司 Electronic device and circuit module thereof
TWI541821B (en) * 2015-11-03 2016-07-11 宇帷國際股份有限公司 Electronic device and dynamic random access memory thereof
TWI552149B (en) * 2015-11-20 2016-10-01 宇帷國際股份有限公司 Dynamic random access memory
TWI570555B (en) * 2015-12-30 2017-02-11 宇帷國際股份有限公司 System for alternating lighting of dram

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