TWI706241B - Light guide structure applied to memory module - Google Patents

Light guide structure applied to memory module Download PDF

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Publication number
TWI706241B
TWI706241B TW108118603A TW108118603A TWI706241B TW I706241 B TWI706241 B TW I706241B TW 108118603 A TW108118603 A TW 108118603A TW 108118603 A TW108118603 A TW 108118603A TW I706241 B TWI706241 B TW I706241B
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light guide
light
memory module
reflective
item
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TW108118603A
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Chinese (zh)
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TW202043965A (en
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黃奇咸
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搏盟科技股份有限公司
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Abstract

本發明為有關一種應用於記憶體模組之導光結構,包括:一記憶體模組,於其至少一表面設置有至少一發光元件;一反光件,其定位於該記憶體模組上方,該反光件具有二表面且於至少一表面上設有一反射結構,該反射結構係將該記憶體模組之該發光元件之光線進行反射;一導光件,其定位於該反光件上方,該導光件係將該反光件所反射光線均勻化後發散於外界;二散熱片,其各別固定於該記憶體模組之二表面,且該二散熱片係同時夾持固定該反光件及該導光件,藉由該反光件及該導光件之設置而使記憶體模組上發光元件所產生光線達到均勻化且不刺眼的效果。 The present invention relates to a light guide structure applied to a memory module, which includes: a memory module with at least one light-emitting element disposed on at least one surface thereof; and a light reflector positioned above the memory module, The reflector has two surfaces and at least one surface is provided with a reflector structure that reflects the light of the light-emitting element of the memory module; a light guide element positioned above the reflector, the The light guide member homogenizes the light reflected by the reflective member and then diverges to the outside; two heat sinks, which are respectively fixed on the two surfaces of the memory module, and the two heat sinks clamp and fix the light reflector and The light guide member, through the arrangement of the light reflecting member and the light guide member, makes the light generated by the light emitting element on the memory module uniform and not dazzling.

Description

應用於記憶體模組之導光結構 Light guide structure applied to memory module

本發明係提供一種應用於記憶體模組之導光結構,尤指一種藉由於記憶體模組上設置反光件而使發光元件所產生光線達到均勻化且不刺眼的效果。 The present invention provides a light guide structure applied to a memory module, and particularly refers to an effect that the light generated by a light-emitting element is uniformized and not dazzling due to the provision of a reflective member on the memory module.

按,由於電競產業的發達使得所有電腦配件皆走向高規化,方能符合電競分秒必爭以獲取勝利的需求,而電競選手在電競世界裏需要以明星的姿態出場且亦可能成為電腦配件代言人,當然其電腦配件無一不追逐酷炫華麗。為達此一目的,諸多電腦機殼已設計成為透明結構,而使電腦機殼內的主機板、顯示卡、電源供應器、硬碟、記憶體、散熱裝置(例如:風扇、散熱鰭片或水冷散熱機構)皆展示於眾人的眼前,故所有行銷電競市場之電腦配件廠商無不卯足全力為電腦配件增添璀璨的視覺效果,而在電腦配件上設置若干發光二極體(LED)即為一種有效的做法,藉由使若干發光二極體產生規律或不規律之變色、閃動,即可達到幻炫的視覺效果。 By the way, due to the development of the e-sports industry, all computer accessories are moving towards high standards, in order to meet the needs of e-sports to win every second, and e-sports players need to appear as stars in the e-sports world and may also become computers The accessory spokesperson, of course, its computer accessories are all chasing cool and gorgeous. To achieve this goal, many computer cases have been designed as transparent structures, so that the motherboard, graphics card, power supply, hard disk, memory, and heat dissipation devices (such as fans, cooling fins or The water-cooled heat dissipation mechanism) is displayed in front of everyone. Therefore, all computer accessory manufacturers in the e-sports market are doing their best to add bright visual effects to the computer accessories, and a number of light-emitting diodes (LED) are installed on the computer accessories. It is an effective method to achieve a phantom visual effect by causing a number of light-emitting diodes to produce regular or irregular color changes and flashes.

上述電腦配件(例如:記憶體)光有了若干發光二極體來創造迷幻的視覺效果仍有不足之處,該發光二極體需要使用對應的導光件來做為均勻光線結構。然而,若導光件直接由高透光度的透明材質製成,且當複數發光元件投射光線至導光件時,其複數發光元件發出的光線即會 直上穿過導光件,導致使用者觀看導光件時,其導光件對位於複數發光元件位置的部位會發生亮度較亮,而未設置發光元件位置的亮度較低,以致於導光件整體亮度產生明暗不均、刺眼的情況。 The above-mentioned computer accessories (such as memory) have several light-emitting diodes to create a psychedelic visual effect, which is still insufficient. The light-emitting diodes need to use corresponding light guides as a uniform light structure. However, if the light guide is directly made of a transparent material with high transmittance, and when multiple light-emitting elements project light to the light guide, the light emitted by the multiple light-emitting elements will be Passing straight up the light guide, causing the user to look at the light guide, the light guide will have brighter brightness at the position of the plurality of light emitting elements, while the brightness of the position where the light emitting element is not provided is lower, so that the light guide The overall brightness produces uneven brightness and glare.

是以,要如何設法解決上述習用之缺失與不便,即為相關業者所亟欲研究改善之方向所在。 Therefore, how to solve the above-mentioned shortcomings and inconveniences of conventional use is the direction that the relevant industry urgently wants to study and improve.

故,發明人有鑑於上述之問題與缺失,乃蒐集相關資料,經由多方評估及考量,始設計出此種應用於記憶體模組之導光結構之發明誕生。 Therefore, in view of the above-mentioned problems and deficiencies, the inventors collected relevant information, and after multiple evaluations and considerations, they designed the invention of the light guide structure applied to the memory module.

本發明之主要目的在於提供一種應用於記憶體模組之導光結構,包括:一記憶體模組,於其至少一表面設置有至少一發光元件;一反光件,其定位於該記憶體模組上方,該反光件具有二表面且於至少一表面上設有一反射結構,該反射結構係將該記憶體模組之該發光元件之光線進行反射;一導光件,其定位於該反光件上方,該導光件係將該反光件所反射光線均勻化後發散於外界;二散熱片,其各別固定於該記憶體模組之二表面,且該二散熱片係同時夾持固定該反光件及該導光件,藉由該反光件及該導光件之設置而使記憶體模組上發光元件所產生光線達到均勻化且不刺眼的效果。 The main purpose of the present invention is to provide a light guide structure applied to a memory module, which includes: a memory module with at least one light-emitting element disposed on at least one surface thereof; and a light reflector positioned on the memory module Above the assembly, the reflector has two surfaces and is provided with a reflector structure on at least one surface. The reflector structure reflects the light of the light emitting element of the memory module; a light guide element positioned on the reflector Above, the light guide member homogenizes the light reflected by the reflective member and radiates it to the outside; two heat sinks, which are respectively fixed on the two surfaces of the memory module, and the two heat sinks are clamped and fixed at the same time The light reflecting member and the light guide member are arranged to make the light generated by the light emitting element on the memory module uniform and not dazzling by the arrangement of the light reflecting member and the light guide member.

本發明之次要目的在於該反光件係由一長條片狀體所構成,其最佳化實施結構為二表面皆設置該反射結構,而該反光件係由一金屬片所構成且該金屬片較佳實施材質為鋁合金。 The secondary objective of the present invention is that the reflector is composed of a long sheet-like body, and the optimized implementation structure is that both surfaces are provided with the reflector structure, and the reflector is composed of a metal sheet and the metal The preferred material for the sheet is aluminum alloy.

本發明之另一目的在於該反光件之反射結構係為複數三角 錐體、複數四角錐體、複數五角錐體、複數六角錐體、複數七角錐體或複數八角錐體所構成。 Another object of the present invention is that the reflective structure of the reflector is a complex triangle Cones, plural quadrangular pyramids, plural pentagonal pyramids, plural hexagonal pyramids, plural heptagonal pyramids or plural octagonal pyramids.

本發明之再一目的在於該導光件係由一長條板體且具有可透光塑料材質所構成,其兩端各設有一固定部且對應穿置於該二散熱片兩端各設有一扣合部中進行固定,以構成該導光件與該二散熱片之固定結構。 Another object of the present invention is that the light guide is composed of a long plate with a transparent plastic material, and a fixing part is provided at each end of the light guide, and a fixing part is provided at each end of the two heat sinks. The fastening part is fixed to form a fixing structure of the light guide and the two heat sinks.

1‧‧‧記憶體模組 1‧‧‧Memory Module

11‧‧‧發光元件 11‧‧‧Light-emitting element

2‧‧‧反光件 2‧‧‧Reflective parts

21‧‧‧反射結構 21‧‧‧Reflective structure

3‧‧‧導光件 3‧‧‧Light guide

31‧‧‧固定部 31‧‧‧Fixed part

32‧‧‧定位溝 32‧‧‧Locating groove

4‧‧‧散熱片 4‧‧‧Heat sink

40‧‧‧散熱孔 40‧‧‧Heat vent

41‧‧‧扣合部 41‧‧‧Fastening part

第一圖 係為本發明之立體外觀圖。 The first figure is a perspective view of the present invention.

第二圖 係為本發明之第一立體分解結構圖。 The second figure is the first three-dimensional exploded structural view of the present invention.

第三圖 係為本發明之第二立體分解結構圖。 The third figure is the second three-dimensional exploded structure diagram of the present invention.

第四圖 係為本發明之正視剖面結構圖。 The fourth figure is a front sectional structural view of the present invention.

為達成上述目的及功效,本發明所採用之技術手段及其構造,茲繪圖就本發明之較佳實施例詳加說明其特徵與功能如下,俾利完全瞭解。 In order to achieve the above-mentioned purposes and effects, the technical means and structure adopted by the present invention are illustrated in detail in the following description of the preferred embodiments of the present invention, so as to fully understand.

請參閱第一、二、三、四圖所示,係為本發明之立體外觀圖、第一、二立體分解結構圖及正視剖面結構圖,由圖中可清楚看出,本發明於記憶體模組之散熱元件之主要構件包括一記憶體模組1、一反光件2、一導光件3及二散熱片4,各構件之詳細結構及連接關係如下:該記憶體模組1,於其至少一表面設置有至少一發光元件11。該發光元件11係為一發光二極體(LED)或一冷陰極螢光燈管 (CCFL)所構成。而本發明係以複數發光二極體做為發光元件11之實施例,但不以此自限,一或複數冷陰極螢光燈管設置於記憶體模組1上方對應位置,亦能達成提供光源之目的而應予一併保護。 Please refer to the first, second, third and fourth figures, which are the three-dimensional appearance view, the first and second three-dimensional exploded structure diagram and the front cross-sectional structure diagram of the present invention. It can be clearly seen from the figures that the present invention is used in memory The main components of the heat dissipation element of the module include a memory module 1, a reflective member 2, a light guide 3 and two heat sinks 4. The detailed structure and connection relationship of each member are as follows: the memory module 1, in At least one light-emitting element 11 is provided on at least one surface thereof. The light emitting element 11 is a light emitting diode (LED) or a cold cathode fluorescent tube (CCFL). The present invention uses a plurality of light-emitting diodes as an embodiment of the light-emitting element 11, but it is not self-limiting. One or more cold-cathode fluorescent lamps are arranged at the corresponding position above the memory module 1, which can also provide The purpose of the light source should be protected together.

該反光件2,其定位於該記憶體模組1上方,該反光件2具有二表面且於至少一表面上設有一反射結構21,該反射結構21係將該記憶體模組1之該發光元件11之光線進行反射。該反光件2係由一長條片狀體所構成,其最佳化實施結構為二表面皆設置該反射結構,而該反光件2係由一金屬片所構成且該金屬片較佳實施材質為鋁合金。該反光件2之反射結構係為複數三角錐體、複數四角錐體、複數五角錐體、複數六角錐體、複數七角錐體或複數八角錐體所構成。而該些反射結構21可藉由在金屬表面進行抛光作業而製成。 The reflective member 2 is positioned above the memory module 1. The reflective member 2 has two surfaces and is provided with a reflective structure 21 on at least one surface. The reflective structure 21 is used to emit light from the memory module 1. The light of element 11 is reflected. The reflective member 2 is composed of a long sheet-like body, and the optimized implementation structure is that both surfaces are provided with the reflective structure, and the reflective member 2 is composed of a metal sheet and the metal sheet is preferably made of material It is aluminum alloy. The reflective structure of the reflector 2 is composed of plural triangular pyramids, plural quadrangular pyramids, plural pentagonal pyramids, plural hexagonal pyramids, plural heptagonal pyramids or plural octagonal pyramids. The reflective structures 21 can be made by polishing the metal surface.

該導光件3,其定位於該反光件2上方,該導光件3係將該反光件2所反射光線均勻化後發散於外界。該導光件3底部更設有一定位溝32,該定位溝32係套置於該反光件2上方,以構成該導光件3與該反光件2之定位結構。該導光件3為一聚碳酸酯或一丙烯腈-丁二烯-苯乙烯共聚物製成。亦可為聚碳酸酯及丙烯腈-丁二烯-苯乙烯共聚物的組合物製成,該導光件3材料可使其具有良好導光性及均勻性,而不會產生刺眼的情況。 The light guide 3 is positioned above the light reflector 2, and the light guide 3 homogenizes the light reflected by the light reflector 2 and diverges to the outside. The bottom of the light guide 3 is further provided with a positioning groove 32, and the positioning groove 32 is sleeved above the light reflecting member 2 to form a positioning structure of the light guide 3 and the light reflecting member 2. The light guide 3 is made of a polycarbonate or an acrylonitrile-butadiene-styrene copolymer. It can also be made of a combination of polycarbonate and acrylonitrile-butadiene-styrene copolymer. The material of the light guide 3 can make it have good light guide and uniformity without glare.

該二散熱片4,其各別固定於該記憶體模組1之二表面,且該二散熱片4係同時夾持固定該反光件2及該導光件3。該散熱片4之二側各設有複數散熱孔40。而該散熱片4係由一金屬片所構成且該金屬片較佳實施材質為鋁合金。 The two heat sinks 4 are respectively fixed on the two surfaces of the memory module 1, and the two heat sinks 4 clamp and fix the reflector 2 and the light guide 3 at the same time. A plurality of heat dissipation holes 40 are respectively provided on both sides of the heat sink 4. The heat sink 4 is composed of a metal sheet and the preferred material of the metal sheet is aluminum alloy.

該導光件3係由一長條板體且具有可透光塑料材質所構成,其兩端各設有一固定部31且對應穿置於該二散熱片4兩端各設有一扣合部41中進行固定,以構成該導光件3與該二散熱片4之固定結構。 The light guide 3 is composed of a long plate with a light-transmissive plastic material. Both ends of the light guide member 3 are provided with a fixing portion 31 respectively, and the two ends of the two heat sinks 4 are provided with a fastening portion 41 respectively. The light guide 3 and the two heat sinks 4 are fixed to form a fixing structure.

欲將本發明進行組裝時,先將記憶體模組1上方設置有反光件2,再於反光件2上方設置有導光件3,接著將二散熱片4固定於記憶體模組1之二表面,且二散熱片4係同時夾持固定反光件2及導光件3,續將該導光件3兩端之固定部31對應穿置於該二散熱片4兩端之扣合部41中進行固定,即完成本發明之組裝。而本發明於作動時,先由記憶體模組1上的發光元件11向上方投射產生光線,該光線經由反光件2二表面上的均勻分佈之反射結構21於上方及二側產生均勻性反射,該反射結構21所反射均勻性光線經由導光件3均勻化後發散於外界以形成幻炫的視覺效果,即形成記憶體模組上發光元件所產生光線達到均勻化且不刺眼的效果。 When assembling the present invention, a reflective member 2 is first arranged on the memory module 1, and then a light guide 3 is arranged on the reflective member 2, and then the two heat sinks 4 are fixed to the second of the memory module 1. On the surface, the two heat sinks 4 clamp and fix the reflector 2 and the light guide 3 at the same time, and then the fixing portions 31 at both ends of the light guide 3 are correspondingly inserted into the fastening portions 41 at the two ends of the two heat sinks 4 The assembly of the present invention is completed by fixing in the middle. When the present invention is activated, the light emitting element 11 on the memory module 1 is projected upward to generate light, and the light is uniformly reflected on the upper and two sides through the uniformly distributed reflective structure 21 on the two surfaces of the reflector 2 The uniform light reflected by the reflective structure 21 is homogenized by the light guide 3 and then diverged to the outside to form a phantom visual effect, that is, the light generated by the light-emitting element on the memory module is uniform and non-glaring.

上所述僅為本發明之較佳實施例而已,非因此即侷限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本發明之專利範圍內,合予陳明。 The above is only the preferred embodiment of the present invention, and it does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be included in the same reasoning Within the scope of the patent of the present invention, it is Chen Ming.

綜上所述,本發明上述應用於記憶體模組之導光結構於使用時,為確實能達到其功效及目的,故本發明誠為一實用性優異之發明,為符合發明專利之申請要件,爰依法提出申請,盼審委早日賜准本案,以保障發明人之辛苦發明,倘若鈞局審委有任何稽疑,請不吝來函指示,發明人定當竭力配合,實感德便。 In summary, the above-mentioned light guide structure of the present invention applied to the memory module can indeed achieve its effect and purpose when used. Therefore, the present invention is truly an invention with excellent practicability and meets the requirements of an invention patent application. , Yan filed an application in accordance with the law, and I hope that the review committee will grant this case as soon as possible to protect the inventor’s hard-working invention. If the review committee has any doubts, please send me instructions and the inventor will do his best to cooperate and feel good.

1‧‧‧記憶體模組 1‧‧‧Memory Module

11‧‧‧發光元件 11‧‧‧Light-emitting element

2‧‧‧反光件 2‧‧‧Reflective parts

21‧‧‧反射結構 21‧‧‧Reflective structure

3‧‧‧導光件 3‧‧‧Light guide

31‧‧‧固定部 31‧‧‧Fixed part

4‧‧‧散熱片 4‧‧‧Heat sink

40‧‧‧散熱孔 40‧‧‧Heat vent

41‧‧‧扣合部 41‧‧‧Fastening part

Claims (9)

一種應用於記憶體模組之導光結構,包括:一記憶體模組,於其至少一表面設置有至少一發光元件;一反光件,其定位於該記憶體模組上方,該反光件具有二表面且於至少一表面上設有一反射結構,該反射結構係將該記憶體模組之該發光元件之光線進行反射,該反光件係由一金屬片所構成,且該反光件之反射結構係為複數三角錐體、複數四角錐體、複數五角錐體、複數六角錐體、複數七角錐體或複數八角錐體所構成;一導光件,其定位於該反光件上方,該導光件係將該反光件所反射光線均勻化後發散於外界;以及二散熱片,其各別固定於該記憶體模組之二表面,且該二散熱片係同時夾持固定該反光件及該導光件。 A light guide structure applied to a memory module includes: a memory module with at least one light-emitting element disposed on at least one surface thereof; a light reflecting member positioned above the memory module, the light reflecting member having Two surfaces and at least one surface is provided with a reflective structure, the reflective structure reflects the light of the light-emitting element of the memory module, the reflective element is composed of a metal sheet, and the reflective structure of the reflective element It is composed of plural triangular pyramids, plural quadrangular pyramids, plural pentagonal pyramids, plural hexagonal pyramids, plural heptagonal pyramids or plural octagonal pyramids; a light guide piece, which is positioned on the reflective piece Above, the light guide member homogenizes the light reflected by the reflective member and radiates it to the outside; and two heat sinks, which are respectively fixed on the two surfaces of the memory module, and the two heat sinks are clamped and fixed at the same time The light reflecting member and the light guide member. 如申請專利範圍第1項所述之應用於記憶體模組之導光結構,其中該反光件係由一長條片狀體所構成,其最佳化實施結構為二表面皆設置該反射結構,而該反光件構成材質為鋁合金。 The light guide structure applied to the memory module as described in item 1 of the scope of patent application, wherein the light reflecting member is composed of a long sheet-like body, and the optimized implementation structure is that both surfaces are provided with the reflecting structure , And the reflector is made of aluminum alloy. 如申請專利範圍第1項所述之應用於記憶體模組之導光結構,其中該導光件係由一長條板體且具有可透光塑料材質所構成,其兩端各設有一固定部且對應穿置於該二散熱片兩端各設有一扣合部中進行固定,以構成該導光件與該二散熱片之固定結構。 As described in the first item of the scope of patent application, the light guide structure applied to the memory module, wherein the light guide is composed of a long plate with a transparent plastic material, and both ends are provided with a fixed The two radiating fins are correspondingly penetrated and fixed in a buckling portion provided at both ends of the two radiating fins to form a fixing structure of the light guide and the two radiating fins. 如申請專利範圍第1項所述之應用於記憶體模組之導光結構,其中該導光件底部更設有一定位溝,該定位溝係套置於該反光件上方,以構成該導光件與該反光件之定位結構。 The light guide structure applied to the memory module as described in item 1 of the scope of patent application, wherein the bottom of the light guide member is further provided with a positioning groove, and the positioning groove is sleeved on the light reflecting member to form the light guide And the positioning structure of the reflective part. 如申請專利範圍第1項所述之應用於記憶體模組之導光結構,其中該發光元件係為一發光二極體或一冷陰極螢光燈管所構成。 The light guide structure applied to the memory module as described in the first item of the scope of patent application, wherein the light-emitting element is composed of a light-emitting diode or a cold cathode fluorescent tube. 如申請專利範圍第1項所述之應用於記憶體模組之導光結構,其中該散熱片之二側各設有複數散熱孔。 The light guide structure applied to the memory module as described in item 1 of the scope of patent application, wherein a plurality of heat dissipation holes are provided on both sides of the heat sink. 如申請專利範圍第1項所述之應用於記憶體模組之導光結構,其中該導光件為聚碳酸酯製成。 The light guide structure applied to the memory module as described in item 1 of the scope of patent application, wherein the light guide member is made of polycarbonate. 如申請專利範圍第1項所述之應用於記憶體模組之導光結構,其中該導光件為丙烯腈-丁二烯-苯乙烯共聚物製成。 The light guide structure applied to the memory module as described in item 1 of the scope of patent application, wherein the light guide member is made of acrylonitrile-butadiene-styrene copolymer. 如申請專利範圍第1項所述之應用於記憶體模組之導光結構,其中該導光件為聚碳酸酯及丙烯腈-丁二烯-苯乙烯共聚物的組合物製成。 The light guide structure applied to the memory module as described in the first item of the scope of patent application, wherein the light guide member is made of a composition of polycarbonate and acrylonitrile-butadiene-styrene copolymer.
TW108118603A 2019-05-29 2019-05-29 Light guide structure applied to memory module TWI706241B (en)

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TWI632456B (en) * 2017-03-03 2018-08-11 宇瞻科技股份有限公司 Reflective heat dissipation device
CN208781569U (en) * 2018-10-09 2019-04-23 深圳市大运祥精密五金电子有限公司 A kind of luminous memory bar heat dissipation vest
TWM577473U (en) * 2018-06-08 2019-05-01 芝奇國際實業股份有限公司 Light guide component

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080123300A1 (en) * 2006-11-29 2008-05-29 International Business Machines Corporation Folded-sheet-metal heatsinks for closely packaged heat-producing devices
TWM534416U (en) * 2016-05-27 2016-12-21 Corsair Memory Inc Dual inline memory module with temperature-sensing scenario mode
TWM544753U (en) * 2016-10-07 2017-07-01 芝奇國際實業股份有限公司 A memory device
TWI632456B (en) * 2017-03-03 2018-08-11 宇瞻科技股份有限公司 Reflective heat dissipation device
TWM577473U (en) * 2018-06-08 2019-05-01 芝奇國際實業股份有限公司 Light guide component
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