TWI582767B - Dynamic random access memory - Google Patents

Description

Dynamic random access memory

The invention relates to a dynamic random access memory.

The dynamic random access memory as disclosed in TWM448772 comprises a body, at least one light emitting diode, and an at least translucent light guide. The light emitting diode is disposed on the body and electrically connected to the body. The body is provided with a memory module. The light guiding system is disposed on the body and covers the light emitting diode, and the light of the light emitting diode The system can penetrate the light guide.

However, when such a dynamic random access memory is actually used, since the light emitting portion (LED) is integrally connected to the substrate, if the light emitting portion is damaged, it is usually necessary to replace the entire substrate and the memory module together. Bright dynamic random access memory is a waste of money and resources.

Moreover, when the heat dissipation efficiency of the light-emitting portion is too poor, the substrate is easily overheated to damage the memory module, and the entire dynamic random access memory is replaced.

In addition, the light guiding portion is not effective in uniformly distributing the emitted light, and it is difficult to achieve uniform lightening effect, and the dynamic random access memory is less beautiful.

Therefore, it is necessary to provide a novel and progressive dynamic random access memory to solve the above problems.

The main object of the present invention is to provide a dynamic random access memory, wherein the substrate and the light emitting portion can be separately disposed. When the light emitting portion is damaged, only the carrier plate provided with the light emitting portion needs to be replaced, and the entire dynamic random memory is not required to be replaced. Taking memory, thus greatly reducing the cost of replacement.

Moreover, the light-emitting portion is separately disposed on the carrier, and the heat-dissipating area is not shared with the substrate, so that the heat-dissipation efficiency is improved, and the risk of damage of the dynamic random access memory due to overheating is reduced.

In addition, for example, the light projected from the light-emitting portion can be more uniformly scattered outside the dynamic random access memory through the scattering structure of the light guiding portion, and the light can be made more soft.

To achieve the above object, the present invention provides a dynamic random access memory. The dynamic random access memory includes a body and a transport port. The main body has a substrate, a light emitting module and a light guiding portion. The substrate is provided with a memory module. The light emitting module has a carrier and a light emitting portion disposed on the carrier. The light guiding portion is opposite. The light emitting portion is configured such that at least a portion of the light source of the light emitting portion is incident on the outside of the dynamic random access memory via the light guiding portion; the transmitting port is disposed on the substrate, and the transmitting port is electrically connected to the memory module .

1‧‧‧Dynamic random access memory

10‧‧‧ Ontology

11‧‧‧Substrate

111‧‧‧through holes

112‧‧‧ memory module

113‧‧‧First electrical slot

12‧‧‧Lighting module

121‧‧‧ Carrier Board

122‧‧‧Flanking

123‧‧‧Lighting Department

124‧‧‧Second electrical slot

13‧‧‧Light Guide

131‧‧‧scatter structure

14‧‧‧Electrical cable

15‧‧‧Transportation

16‧‧‧Transmission slot

17‧‧‧Shell Department

171‧‧‧Transmission Department

123a‧‧‧Lighting Department

13a‧‧‧Light Guide

131a‧‧‧scattering structure

132a‧‧‧Incoming surface

133a‧‧‧scattering surface

134a‧‧‧Outlet

1 is a perspective view of a preferred embodiment of the present invention.

2 is an exploded view of a preferred embodiment of the present invention.

Figure 3 is another exploded view of a preferred embodiment of the present invention.

4 is a schematic view showing the state of use of a preferred embodiment of the present invention.

FIG. 5 is a block diagram of an electrical relationship according to a preferred embodiment of the present invention.

Figure 6 is a schematic view showing the state of use of another preferred embodiment of the present invention.

The following is a description of the possible embodiments of the present invention, and is not intended to limit the scope of the invention as claimed.

Referring to FIGS. 1 through 5, a preferred embodiment of the present invention is shown. The dynamic random access memory 1 of the present invention includes a body 10 and a transport port 15.

The body 10 has a substrate 11 , a light emitting module 12 , and a light guiding portion 13 . Further, the substrate 11 is provided with a memory module 112. The light-emitting module 12 has a carrier 121 and a light-emitting portion 123 disposed on the carrier 121. The light-guiding portion 13 is disposed opposite to the light-emitting portion 123.

The transmission module 15 is disposed on the substrate 11, the memory module 112 is electrically connected to the transmission port 15, and the transmission port 15 is electrically connected to a transmission slot 16, and more specifically, the transmission port 15 It not only transmits power but also transmits data. It can be understood that the transmission port 15 can be inserted into the PCI, PCI-E, IDE, USB, SATA or DDR according to the transmission slot 16 of different motherboard specifications.

The substrate 11 is provided with a first electrical socket 113 electrically connected to the transmission port 15. The carrier 121 is provided with a second electrical socket 124 electrically connected to the light-emitting portion 123. The slot 113 and the second electrical slot 124 are electrically connected to each other by an electrical cable 14 , and the substrate 11 and the carrier 121 are printed circuit boards, thereby enabling the light emitting portion 123 to The transmission board 15 is electrically connected; in other embodiments, the carrier board and the substrate are not limited to being electrically connected by sockets and electrical cables, and may be electrically connected by soldering; or the light emitting part is not It is electrically connected to the transmission, and the electrical cable is additionally connected to other external power sources (such as the remaining slots of the motherboard).

The body 10 further includes a shell portion 17 that is disposed on the substrate 11 The light-emitting portion 171 is disposed on the opposite side of the shell portion 17 , and at least a portion of the light source of the light-emitting portion 123 can be incident on the outside of the dynamic random access memory 1 via the light-guiding portion 13 and the light-transmitting portion 171 . The light transmitting portion 171 can be a light transmissive material layer or a hollow structure (or the light guiding portion is embedded on the hollow structure), and the light emitted from the light guiding portion 13 can also be projected onto the dynamic random access memory. 1 outside. In other embodiments, the shell portion is not limited to being provided with a light transmitting portion, and the light emitting module and the light guiding portion may be directly disposed on the outer surface of the shell portion, which also has the effect of brightening and increasing heat dissipation efficiency.

Further, the substrate 11 has a uniform hole 111, and the light guiding portion 13 is disposed in the through hole 111 (the carrier plate can also be embedded in the through hole), so that the light guiding portion 13 does not occupy a space, thereby reducing The overall volume of the dynamic random access memory 1. The carrier plate 121 is provided with at least one side wing 122, and the at least one side wing 122 is connected to the substrate 11. In this embodiment, the carrier plate 121 is respectively provided with a side wing 122 at opposite ends thereof, so that the carrier board 121 can be fixed on the substrate 11; it should be noted that the carrier 121 and the substrate 11 can be connected by soldering, assembling or snapping. In addition, the carrier and the substrate may not be connected to each other, and the carrier is connected to the case; or the light guide is embedded in the case, and the carrier connected to the light guide is positioned.

The light guiding portion 13 is provided with a scattering structure 131. The light source of the light emitting portion 123 is projected toward the scattering structure 131 and scattered, and then uniformly penetrates the light guiding portion 13 and is incident on the dynamic random access memory 1. Externally, when viewed from the outside of the DRAM 1, the light may not be too concentrated and glare.

In the present embodiment, the scattering structure 131 is uniformly distributed in the light guiding portion 13 , and a part of the light source of the light emitting portion 123 is scattered by the scattering structure 131 and can be emitted toward the circumferential side of the light guiding portion 13 . Further, the scattering structure 131 is a plurality of scattering particles, and the scattering particles are different from the material of the substrate of the light guiding portion 13, so that the light source is scattered (reflected) when it is incident on the scattered particles. Or refracting so that the light can be emitted more evenly. It can be understood that the light-emitting portion 123 can be closely attached to the light guiding portion 13 to make the light source transmission efficiency better; or the light-emitting portion 123 and the light guiding portion 13 can maintain an appropriate distance to avoid the light guiding portion. 13 is consumed by the heat of the light-emitting portion 123.

In another embodiment, as shown in FIG. 6 , the light guiding portion 13 a has at least one incident surface 132 a and a scattering surface 133 a provided with a scattering structure 131 a compared with the embodiment of FIGS. 1 to 5 . And an emitting surface 134a opposite to the scattering surface 133a, the light emitting portion 123a is adjacent to the at least one incident surface 132a. The light source of the light emitting portion 123a is incident on the at least one incident surface 132a, and a part of the light source is scattered through the scattering structure 131a. It can be seen from the exit surface 134a. Further, the scattering structure 131a is a concave-convex structure, and the light-emitting portion 123a is incident on the opposite end surfaces (incident surfaces) of the light guiding portion 13a, and the light source can be uniformly distributed from the emitting surface through the concave-convex structure. 134a is permeable; in other embodiments, the scattering structure may also be a scattering dot structure, which also allows the light source to be more uniformly transmitted from a specific exit surface.

In summary, the dynamic random access memory of the present invention can transmit a light-emitting portion (otherly disposed on the carrier) respectively disposed on the substrate. If the light-emitting portion is damaged, only the carrier plate provided with the light-emitting portion needs to be replaced, and the replacement is not necessary. The entire set of dynamic random access memory, thus greatly reducing the cost of replacement.

Moreover, the light-emitting portion is separately disposed on the carrier, and the heat dissipation area of the substrate is not shared with the memory module, so that the heat dissipation efficiency is improved, and the risk of overheating and damage of the dynamic random access memory is reduced.

In addition, for example, the light projected from the light-emitting portion can be more uniformly scattered outside the dynamic random access memory through the scattering structure of the light guiding portion, and the light can be made more soft.

In summary, the overall structural design, practicality and efficiency of the present invention are indeed It is fully in line with the needs of industrial development, and the disclosed structural invention is also an unprecedented innovative structure, so its "novelty" should be undoubted, and the invention can be more effective than the conventional structure. It also has "progressiveness". It fully complies with the requirements of the application requirements for invention patents in China's Patent Law. It is a patent application filed in accordance with the law and is subject to the early review and affirmation.

1‧‧‧Dynamic random access memory

10‧‧‧ Ontology

11‧‧‧Substrate

111‧‧‧through holes

112‧‧‧ memory module

113‧‧‧First electrical slot

12‧‧‧Lighting module

121‧‧‧ Carrier Board

122‧‧‧Flanking

124‧‧‧Second electrical slot

123‧‧‧Lighting Department

14‧‧‧Electrical cable

17‧‧‧Shell Department

171‧‧‧Transmission Department

Claims (10)

A dynamic random access memory, comprising: a body having a substrate, a light emitting module and a light guiding portion, the substrate is provided with a memory module, the light emitting module has a carrier plate and a device is disposed at the carrier a light-emitting portion of the board, wherein the light-guiding portion is disposed opposite to the light-emitting portion, and at least a portion of the light source of the light-emitting portion is incident on the outside of the dynamic random access memory via the light guide portion; and a transport port is disposed on the substrate The transmission port is electrically connected to the memory module. The dynamic random access memory according to claim 1, wherein the light guiding portion is provided with a scattering structure, and a part of the light source of the light emitting portion is projected toward the scattering structure to be scattered, and uniformly penetrates the light guiding portion and emits Up to the outside of the DRAM. The dynamic random access memory according to claim 2, wherein the scattering structure is uniformly distributed in the light guiding portion, and a part of the light source of the light emitting portion is projected toward the scattering structure and can be emitted toward a peripheral side of the light guiding portion. The dynamic random access memory according to claim 2, wherein the light guiding portion has at least one incident surface, a scattering surface provided with the scattering structure, and an emitting surface opposite to the scattering surface, the light emitting portion is adjacent to The at least one incident surface, the light source of the light emitting portion is incident on the at least one incident surface, and a part of the light source is scattered through the scattering structure to be permeable from the exit surface. The dynamic random access memory according to claim 4, wherein the scattering structure is a concave-convex structure or a scattering dot structure. The dynamic random access memory according to claim 1, wherein the substrate has a uniform hole, and the light guiding portion is disposed through the through hole. The dynamic random access memory according to claim 1, wherein the carrier is convexly provided with at least one side a wing, the at least one side wing being coupled to the substrate. The DRAM of claim 1, wherein the substrate is provided with a first electrical socket electrically connected to the transmission, and the carrier is provided with a second electrical connection electrically connected to the illuminating portion. The first slot and the second electrical slot are electrically connected to each other by an electrical cable. The dynamic random access memory according to any one of claims 1 to 8, wherein the body further comprises a shell portion, the shell portion is disposed on opposite sides of the substrate, and the shell portion is provided with a light transmitting portion. At least a portion of the light source of the light emitting portion is incident on the outside of the dynamic random access memory via the light guiding portion and the light transmitting portion. The dynamic random access memory according to claim 9, wherein the light transmitting portion is a light transmissive material layer or a hollow structure.