TWM585419U - Structure of memory heat dissipation and structure of memory light guide element - Google Patents

Abstract

The invention provides a memory heat dissipation structure and a memory light guide structure. A plurality of memory elements are arranged on a circuit board, and a fixing member is disposed above one of the circuit boards. A first limiting member should be extended to the fixing member, the first limiting member covers the fixing member, and one of a second heat sink is arranged above the first heat sink in abutment; the present invention is more suitable for the circuit board. A light guide is provided on the upper side, and a plurality of first and second positioning members are provided on two sides of the light guide, and the first positioning members are respectively buckled to a plurality of first projections extended by a first heat sink. The intervals between the pieces are respectively fixed to the intervals between the plurality of second protruding pieces extending from a second heat sink.

Description

Memory heat dissipation structure and memory light guide structure

The present invention relates to a structure for dissipating heat from a memory and a structure for a light guide for a memory, and particularly to a structure for a memory and a heat radiating member and a structure for a memory and a light guide.

With the development of technology and entertainment, various memory elements used in entertainment electronic devices have also flourished, such as memory in gaming products.

The conventional memory includes a circuit board and a plurality of memory elements, such as a volatile memory element, disposed on the surface of the circuit board, and is inserted into the computer system through a connection interface. Due to the demand of the aforementioned gaming products, the working frequency of the memory is gradually developing to a high frequency, so that the memory has a higher data transmission rate and higher power consumption, resulting in the memory module being more likely to build up heat; when the memory is The working temperature is getting higher and higher. When the allowable temperature value is exceeded, the memory performance will be significantly reduced, and the error rate of the module's data retention will be increased, which will cause the computer system to become unstable.

Due to the demand of gaming products, the memory used for gaming needs to achieve rapid heat dissipation. Therefore, the industry has designed casings and plates that accelerate heat dissipation and attach them to the memory with thermal adhesive to improve the heat dissipation efficiency of the memory. .

The conventional memory heat dissipation casing, plate, and light guide strip need to be adhered to the casing or plate with adhesive or glue strips during installation. However, when a large number of pasting operations are performed, the casing and light guide strip often appear. The skewed condition produces many defective products, such as the skew of the heat dissipation case and the light guide bar, which not only affects the installation of subsequent components of the production line, but also destroys the appearance, light transmission path, and reduces the heat dissipation effect of the case. If the memory cannot be re-pasted, it will be scrapped and the product cost will be increased.

In view of the problems of the conventional memory heat dissipation casing and plates, the present invention provides a memory heat dissipation structure and a memory light guide structure, which are provided with a plurality of memory elements on a circuit board, and further A fixing member is disposed above one of the circuit boards, a first heat sink extends a first limiting member corresponding to the fixing member, so that the first limiting member covers the fixing member, and one of the second heat sink The upper extension corresponds to the first heat dissipating member; or a light guide is provided above one of the circuit boards, and a plurality of first positioning members and a plurality of second positioning members are provided on two sides of the light guide, and a first A plurality of first protruding members extend above one of a heat sink and are arranged at an interval, so that the first positioning members are buckled in the interval of the first protrusions, and one of the second heat sink A plurality of second protruding members are extended at an interval, and the second positioning members are respectively buckled at the intervals of the second protruding members, so as to solve the heat dissipation structure and the light guiding structure of the memory. Difficulties in alignment during sticking

It is an object of the present invention to provide a structure for dissipating heat from a memory. A fixing member is provided above one of the circuit boards. A limiting member is extended by the first cooling member corresponding to the fixing member, and the limiting member covers the fixing member. Then, one of the second heat sinks is abutted against the first heat sink, and the installation position of the first and second heat sinks is fixed by a combination of a fixing member and a limiting member. When the installation is solved, the heat sink is distorted. problem.

One object of the present invention is to provide a structure of a memory light guide, which is provided with a light emitting element on one side of a circuit board and a light guide on an upper side of the circuit board, and a plurality of first and second sides on the light guide. Two positioning members, each of the first positioning members is respectively buckled at the interval between the plurality of first protruding members extended by the first heat sink, and the second positioning members are respectively locked at the extension of the second heat sink. The space between the plurality of second protruding members guides the light of the light emitting element with the light guide member and fixes the installation position of the first and second heat dissipation members, thereby solving the problem of the heat dissipation member and the light guide member being skewed during the installation.

In order to achieve the aforementioned purposes and effects, the present invention provides a memory heat dissipation structure, which includes a circuit board, a first heat sink, and a second heat sink. The circuit board has a first surface and a first heat sink. Two surfaces, the second surface is provided with a plurality of memory elements, and a fixing member is further disposed above one of the circuit boards; the first heat dissipation member is adhered to the first surface, and an upper portion of the first heat dissipation member is extended to correspond to the fixing member. A first limiting member, so that the first limiting member covers the fixing member, and a plurality of first protruding members are further extended above one of the first heat dissipation members; the second heat dissipation member is adhered to the memories A body element, a plurality of second protrusions are provided corresponding to the first protrusions extending above one of the second heat sinks, and the first protrusions are abutted against the second protrusions; The above structure is used to fix the installation positions of the first and second heat sinks, thereby solving the problem that the heat sinks are skewed during installation.

In one embodiment of the present invention, two second limiting members are extended on two sides of the first heat sink, the two second limiting members are clamped on two sides of the first surface, and the second heat sink is Two third limiting members are extended on two sides, and the two third limiting members are clamped on two sides of the second surface.

In one embodiment of the present invention, it further includes a first thermally conductive adhesive member and a second thermally conductive adhesive member. The first thermally conductive adhesive member is disposed on the first heat sink and the first surface of the circuit board. In between, the second thermally conductive adhesive member is disposed between the second heat sink and the memory bodies.

In one embodiment of the present invention, the first protrusions are arranged at intervals.

In one embodiment of the present invention, the second protrusions are arranged at intervals.

In order to achieve the aforementioned purposes and effects, the present invention provides a structure of a memory light guide, which includes a circuit board, a first heat sink, and a second heat sink. The circuit board has a first surface and A second surface, the first surface is provided with a plurality of light emitting elements, the second surface is provided with a plurality of memory elements, and a light guide is further provided on one of the circuit boards, and a plurality of light guides are provided on one side of the light guide The first positioning member is provided with a plurality of second positioning members on the other side of the light guide member; the first heat dissipating member is adhered to the first surface, and an upper part of the first heat dissipation member extends corresponding to the first positioning members. A plurality of first protruding members are arranged at an interval, so that the first positioning members are respectively buckled at the intervals of the first protruding members; the second heat sink is adhered to the memory elements. , One of the second heat dissipating members is extended above the second positioning members and a plurality of second protruding members are arranged at an interval respectively, so that the second positioning members are respectively buckled at the first positioning members; The space between two protruding pieces; guided by the light guide structure described above A first light and securely mounted, the heat-dissipating member of the position of the light elements, to prevent the heat dissipation member, a light guide is skewed.

In one embodiment of the present invention, two first limiting members are extended on two sides of the first heat sink, the two first limiting members are clamped on two sides of the first surface, and the second heat sink is Two second limiting members are extended on two sides, and the two second limiting members are clamped on two sides of the second surface.

In one embodiment of the present invention, it further includes a first thermally conductive adhesive member and a second thermally conductive adhesive member. The first thermally conductive adhesive member is disposed on the first heat sink and the first surface of the circuit board. In the meantime, the second thermally conductive adhesive member is disposed between the second heat sink and the memories.

In one embodiment of the present invention, the memory elements are disposed on the first surface, the first heat sink is adhered to the memory elements, and the second heat sink is adhered to the second surface.

In order to make the Guigui review members have a better understanding and understanding of the features of the new model and the effects achieved, I would like to provide examples and cooperation descriptions, as described below:

The present invention provides a memory heat dissipation structure and a memory light guide structure. A plurality of memory elements are arranged on a circuit board, a fixing member is arranged above one of the circuit boards, and a first heat dissipation member corresponds to The fixing member is extended with a first limiting member, so that the first limiting member covers the fixing member, and one of the second heat dissipation members is extended to abut against the first heat dissipation member to fix the two heat dissipation members. The circuit board is provided with a light emitting element and a light guide member is provided on the two sides of the light guide member. A plurality of first positioning members and a plurality of second positioning members are provided on the two sides of the light guiding member. The first positioning members are respectively buckled on a first. The intervals of the plurality of first protruding pieces of the heat dissipating member are extended, and the second positioning members are respectively buckled at the intervals of the plurality of second protruding pieces of the second heat dissipating member.

Please refer to FIG. 1, which is a schematic structural explosion diagram of the first embodiment of the present invention. As shown in the figure, this embodiment is the first embodiment, which is a memory heat dissipation structure 1, which includes a circuit board 10. A first heat sink 20 and a second heat sink 30. The circuit board 10 has a first surface 12 and a second surface 14. The second surface 14 is provided with a plurality of memory elements 142 (only one of which is marked) ), In a preferred embodiment, the circuit board 10 and the memory elements 142 form a memory, such as a Double-Data-Rate Fourth Generation Synchronous Dynamic Memory Random Access Memory, DDR4 SDRAM).

Referring again to FIG. 1 and FIG. 2, FIG. 2 is a side view of the structure of the first embodiment of the present invention. As shown in the figure, the circuit board 10 is further provided with a fixing member 16 on top of it. For example, the fixing member 16 is adhered or abutted to the circuit board 10 with heat-dissipating adhesive; the first heat-dissipating member 20 is adhered to the first surface 12, and one of the first heat-dissipating members 20 is opposed to each other. A first limiting member 22 should be extended to the fixing member 16 so that the first limiting member 24 covers the fixing member 16. The combination of the first limiting member 24 and the fixing member 16 can fix the first heat sink. 20 is at the high and low positions of the circuit board 10; in this embodiment, a plurality of first protruding members 24 (only one of which is marked) is extended above one of the first heat dissipation members 20, which can be located at the circuit board 10 A gap (not shown) is created above to increase the surface area of the first heat sink 20 to improve heat dissipation efficiency; the second heat sink 30 is adhered to one side of the memory elements 142 to conduct the heat sinks. The heat emitted from the memory element 142 extends above one of the second heat sinks 30 and corresponds to the first protrusions. 24 is provided with a plurality of second protruding members 32 (only one of which is marked), so that the first protruding members 24 abut the second protruding members 32 to position the second heat sink 30. Wherein, the first protruding members 24 are spaced from the first heat sink 20, the second protruding members 32 are spaced from the second heat sink 30, the first protrusions The interval between 24 and the second protruding members 32 can increase the surface area of the first and second heat sinks 20 and 30 in contact with the air and improve the heat dissipation efficiency.

In this embodiment, the fixing member is disposed above one of the circuit boards, and then the first limiting member is extended by the first heat sink corresponding to the fixing member, so that the first limiting member and the fixing member are fixed to each other. The second heat sink and one of the first heat sinks respectively extend the first and second protruding parts and are arranged in abutment with each other, and the mounting of the first and second heat sinks is restricted by the fixing member. Set the position to achieve the effect of positioning the first and second heat sinks to prevent it from being skewed on the circuit board when the sticky mounting is achieved.

Referring to FIG. 1 and FIG. 2 again, as shown in the figure, in the first embodiment, two second limiting members 26 are further extended to two sides of the first heat sink 20 (the other side is not shown in the figure). Limit pieces), the two second limit pieces 26 correspond to the width of the circuit board 10, and are clamped on two sides of the first surface 12 to position the left and right positions of the first heat sink 20; Two third limiting members 34 are also extended on the two sides of the second heat sink 30. The two third limiting members 34 correspond to the width of the circuit board 10 and are sandwiched between the two sides of the second surface 14 for positioning. Left and right positions of the second heat sink 30.

Continuing from the above, in the first embodiment, it further includes a first thermally conductive adhesive member 42 and a second thermally conductive adhesive member 44 to provide bonding elements and improve the efficiency of heat dissipation. The first thermally conductive adhesive member 42 is provided. Between the first heat dissipating member 20 and the first surface 12 of the circuit board 10, the first heat dissipating member 20 is adhered to the first surface 12; the second heat conductive adhesive 44 is disposed on the first heat dissipating member 20. Between the second heat sink 30 and the memory bodies 142, the second heat sink 30 is adhered to the memory bodies 142 to improve the heat dissipation rate of the memory bodies 142.

Continuing from the above, in a preferred embodiment, the memory elements 142 of the circuit board 10 can also be set to 180 degrees, for example, the memory elements 142 are disposed on the first surface 12, and the first The heat sink 20 is adhered to the memory elements 142, and the second heat sink 30 is adhered to the second surface 14. In this embodiment, the memory elements may be provided on both surfaces, which is not limited in the present invention.

Please refer to FIG. 3, which is a schematic diagram of the structure explosion of the second embodiment of the new model. As shown in the figure, this embodiment is a second embodiment, which is a structure 2 of a light guide of a memory, which includes a circuit Board 50, a first heat sink 60, and a second heat sink 70. The circuit board 50 has a first surface 52 and a second surface 54. The first surface 52 is provided with a plurality of light emitting elements 522, and the second surface 54 sets a plurality of memory elements 542 (only one of them is marked). In a preferred embodiment, the circuit board 50 and the memory elements 542 form a memory, for example, the fourth generation double data rate synchronization dynamic random Access memory (Double-Data-Rate Fourth Generation Synchronous Dynamic Random Access Memory, DDR4 SDRAM); these light-emitting elements 522 can use, for example, light-emitting diodes (LED), organic light-emitting diodes (OLED), the present invention No more restrictions.

Referring again to FIG. 3, FIG. 4A, and FIG. 4B, FIG. 4A is a schematic structural diagram of the second embodiment of the new model, and FIG. 4B is a partially enlarged schematic diagram of the second embodiment of the new model, which is FIG. 4A An enlarged schematic view of circle A. As shown in the figure, the circuit board 50 is further provided with a light guide 56 above it. In a preferred embodiment, the light guide 56 is a transparent member. The abutting or light-transmitting adhesive is disposed above the circuit board 50; the first heat sink 60 is adhered to the first surface 52, and one side of the light guide 56 is provided with a plurality of first positioning members 562 ( Only one of them is marked), a plurality of second positioning members 564 (only one of which is marked) are provided on the other side of the light guide member 56; the first heat sink 60 is adhered to the first surface 52, one of which is above The first positioning members 562 extend correspondingly, and a plurality of first protruding members 64 (only one of them are marked) are arranged at an interval G1 (only one of them is marked), and each of the first positioning members 562 is provided. Do not buckle the gaps G1 of the first protruding members 64 to fix the position of the first heat sink 60; the second heat sink 70 is glued to the A memory element 542, one of the second heat sinks 70 corresponding to the plurality of second positioning members 564 is extended at a distance G2 (only one of them is marked), and a plurality of second protruding members 72 (only one of which is marked among them) (One), the second positioning members 564 are respectively buckled at the intervals G2 of the second protruding members 72 to fix the positions of the second heat sink 70. Among them, the interval G1 of the first protruding members 64 and the interval G2 of the second protruding members 72 can also increase the surface area of the first and second heat sinks 60 and 70 in contact with the air and improve heat dissipation. effectiveness.

Please refer to FIG. 5, which is a structural side view of the second embodiment of the present invention. As shown, in the second embodiment, the light-emitting elements 522 are disposed on the circuit board 50 and emit a light upward. L, the position of the light guide 56 corresponding to the positions of the light emitting elements 522 is set above it, and the light guide 56 transmits the light L emitted from the light emitting elements 522 to the light guide with total reflection and refraction Above and on both sides of the light member 56.

In this embodiment, the light guide is disposed above one of the circuit boards, and then the first projection is extended by the first heat sink to correspond to the first positioning member of the light guide, so that the first positioning member The second protruding member is fastened to the first protruding member, and the second heat dissipating member extends the second protruding member corresponding to the second positioning member of the light guide member, so that the second positioning member and the second protruding member are mutually Fastening, using the light guide to conduct the light of the light emitting elements, and restricting the installation position of the first and second heat sinks to achieve the light conduction and positioning the first and second heat sinks to avoid sticking The effect of skew on the circuit board.

Referring to FIG. 3 and FIG. 5 again, as shown in the figure, in the second embodiment, two first limiting members 66 are further extended on two sides of the first heat sink 60 (the other side is not shown in the figure). Limit pieces), the two first limit pieces 66 correspond to the width of the circuit board 50 and are clamped on two sides of the first surface 52 to position the left and right positions of the first heat sink 60; Two second limiting members 74 are also extended on the two sides of the second heat sink 70. The two second limiting members 74 correspond to the width of the circuit board 50 and are sandwiched on the two sides of the second surface 54 for positioning. Left and right positions of the second heat sink 70.

Continuing the above, in the second embodiment, it further includes a first thermally conductive adhesive member 82 and a second thermally conductive adhesive member 84 to provide bonding elements and improve the efficiency of heat dissipation. The first thermally conductive adhesive member 82 is provided. Between the first heat sink 60 and the first surface 52 of the circuit board 50, the first heat sink 60 is adhered to the first surface 52; the second heat conductive adhesive member 84 is disposed on the first heat sink Between the second heat dissipating member 70 and the memory bodies 542, the second heat dissipating member 70 is adhered to the memory bodies 542 to improve the heat dissipation rate of the memory bodies 542.

Continuing from the above, in a preferred embodiment, the memory elements 542 of the circuit board 10 can also be rotated 180 degrees, for example, the memory elements 542 are disposed on the first surface 52, and the first The heat sink 60 is adhered to the memory elements 542, and the second heat sink 70 is adhered to the second surface 54. In this embodiment, memory elements may be provided on both surfaces, which is not limited in the present invention.

In summary, the present invention provides a structure for dissipating heat from a memory and a structure for a light guiding member of a memory. The memory is provided with a plurality of memory elements on a circuit board, and the fixing member is further provided over one of the circuit boards. The first heat-dissipating member extends the first limiting member corresponding to the fixing member, so that the first limiting member covers the fixing member, and one of the second heat-dissipating members extends above the first heat-dissipating member to abut, The first limiting member and the fixing member are fixed to each other to solve the problem of alignment difficulty caused when the heat dissipation structure of the memory is adhered; or the light emitting elements are provided on the circuit board and the circuit board The light guides are disposed above one, the first positioning members and the second positioning members are disposed on two sides of the light guide, and the first heat sinks are extended above and spaced from the first ones. The protruding pieces enable the first positioning members to be fastened to the intervals of the first protruding pieces, and the second protruding pieces are extended above one of the second heat sinks to provide the second protruding pieces. The second positioning members are respectively buckled to the second protruding pieces The spacer, the conductive member to the light guiding light of the plurality of light emitting elements, while addressing the memory tin cooling, the bit issues difficulty at the time of the light guide structure paste, produced.

Therefore, this new model is a novel, progressive, and industrially available user, which should meet the patent application requirements of China's patent law. No doubt, a new patent application is filed in accordance with the law.

However, the above is only an embodiment of the present invention, and is not intended to limit the scope of implementation of the present invention. Therefore, for example, all changes and modifications based on the shapes, structures, features, and spirits described in the scope of the patent application for the present invention are equal. All should be included in the patent application scope of this new model.

1‧‧‧Memory cooling structure
10‧‧‧Circuit Board
12‧‧‧first surface
14‧‧‧ second surface
142‧‧‧Memory components
16‧‧‧Fixed parts
2‧‧‧ Structure of memory light guide
20‧‧‧The first heat sink
22‧‧‧The first limit piece
24‧‧‧ the first protruding piece
26‧‧‧Second limit piece
30‧‧‧Second heat sink
32‧‧‧ second protrusion
34‧‧‧ the third limit piece
42‧‧‧The first thermally conductive adhesive
44‧‧‧Second thermal conductive adhesive
50‧‧‧Circuit Board
52‧‧‧first surface
522‧‧‧Light-emitting element
54‧‧‧ second surface
542‧‧‧Memory components
56‧‧‧light guide
562‧‧‧First positioning piece
564‧‧‧Second positioning
60‧‧‧The first heat sink
64‧‧‧ the first protruding piece
66‧‧‧The first limit piece
70‧‧‧Second heat sink
72‧‧‧ second protrusion
74‧‧‧ second limit piece
82‧‧‧The first thermally conductive adhesive
84‧‧‧Second thermal conductive adhesive
G1‧‧‧ interval
G2‧‧‧ interval
L‧‧‧light

Figure 1: It is a structural explosion diagram of the first embodiment of the new model;
FIG. 2: It is a structural side view of the first embodiment of the present invention;
FIG. 3 is a schematic structural explosion diagram of the second embodiment of the present invention;
FIG. 4A is a schematic structural diagram of a second embodiment of the present invention;
FIG. 4B is a partially enlarged schematic view of the second embodiment of the present invention; and FIG. 5 is a structural side view of the second embodiment of the present invention.

Claims (10)

A memory heat dissipation structure includes:
A circuit board having a first surface and a second surface, the second surface is provided with a plurality of memory elements, and a fixing member is further disposed above one of the circuit boards;
A first heat sink is adhered to the first surface, and a first limiting member is extended above the fixing member corresponding to the first member, so that the first limiting member covers the fixing member, and further the first heat dissipation. A plurality of first protrusions are extended above one of the pieces; and a second heat sink is adhered to the memory elements, and the first protrusions extend above one of the second heat sinks corresponding to the first protrusions. The pieces are provided with a plurality of second protruding pieces, and the first protruding pieces are abutted against the second protruding pieces. The memory heat dissipation structure according to claim 1, wherein two second limiters are extended on two sides of the first heat sink, and the two second limiters are clamped on two sides of the first surface. Two third limiting members are extended on two sides of the second heat sink, and the two third limiting members are clamped on two sides of the second surface. The memory heat dissipation structure according to claim 1, further comprising a first thermally conductive adhesive member and a second thermally conductive adhesive member. The first thermally conductive adhesive member is disposed on the first thermally conductive member and the circuit board. Between the first surface, the second thermally conductive adhesive member is disposed between the second heat sink and the memories. The structure for dissipating heat from a memory according to claim 1, wherein the first protrusions are arranged at intervals. The structure for dissipating heat from a memory according to claim 1, wherein the second protruding pieces are arranged at intervals. The memory heat dissipation structure according to claim 1, wherein the memory elements are disposed on the first surface, the first heat sink is adhered to the memory elements, and the second heat sink is adhered to The second surface. A structure of a memory light guide includes:
A circuit board having a first surface and a second surface. The first surface is provided with a plurality of light emitting elements, the second surface is provided with a plurality of memory elements, and a light guide is further provided over one of the circuit boards. A plurality of first positioning members are provided on one side of the light guide member, and a plurality of second positioning members are provided on the other side of the light guide member;
A first heat-dissipating member is adhered to the first surface, and an upper portion of the first heat-dissipating member extends corresponding to the first positioning members and a plurality of first protruding members are respectively arranged at an interval to make the first positioning members. Pieces are respectively buckled at the intervals of the first protruding pieces; and a second heat sink is adhered to the memory elements, and one of the second heat sinks corresponds to the first The two positioning members are extended and a plurality of second protruding members are arranged at an interval respectively, so that the second positioning members are respectively buckled at the intervals of the second protruding members. The structure of a memory light guide according to claim 7, wherein two first limiters are extended on two sides of the first heat sink, and the two first limiters are clamped on two sides of the first surface. Two second limiting members are extended on two sides of the second heat sink, and the two second limiting members are clamped on two sides of the second surface. The structure of the memory light guide according to claim 7, further comprising a first thermally conductive adhesive and a second thermally conductive adhesive. The first thermally conductive adhesive is disposed on the first heat sink and the circuit board. Between the first surface, the second thermally conductive adhesive member is disposed between the second heat sink and the memories. The structure of the memory light guide according to claim 7, wherein the memory elements are disposed on the first surface, the first heat sink is adhered to the memory elements, and the second heat sink is adhered. It is provided on the second surface.