TW201539808A - Solid-state light emitting device - Google Patents

Abstract

A solid-state light emitting device is provided. The device comprises a printed circuit board (PCB), a LED unit and a lens unit. The PCB includes at least two assembly recesses. The LED unit is disposed on the PCB and is located between the assembly recesses. The lens unit is disposed on the PCB and is located above the LED unit. The lens unit includes a main body and at least two assembly columns, which are formed on the bottom surface of the main body. The assembly columns are corresponded to the assembly recesses, and engaged within the assembly recesses respectively by deformation for completing fastening the lens unit on the PCB.

Description

Solid state light emitting device

The present invention is a solid-state light-emitting device, and more particularly to a light-emitting device in which the assembly of the lens unit can be completed by a snap-fit design between the corresponding studs and the grooves.

Please refer to FIG. 1 , which is a partial cross-sectional view of a conventional LED strip 10 . As shown in FIG. 1, the LED strip 10 is provided with a plurality of package modules 10 on a printed circuit board 12. Each of the package modules 10 includes a light emitting diode unit 14 and an optical lens 16 . The optical lens 16 is disposed on the printed circuit board 12 and above the light emitting diode unit 14 .

According to the current technology, if the light-receiving of the direct-lit LED backlight module is generally only one optical design, the directivity of the light source is poor, that is, the light source cannot be homogenized; in this case, each light-emitting diode The body unit needs to use a larger number of grains to achieve the desired brightness or illumination range, resulting in increased cost and excessive drive power. Therefore, as shown in Fig. 1, in order to improve the utilization ratio, brightness or illumination range of the emitted light, and adjust the light output form or uniformity, etc., a secondary optical design (Second Lens) is further used, that is, light is emitted again. An optical lens 16 is disposed on the diode unit 14. Through the correction of the optical lens 16, the directivity problem of the light source can be effectively solved, so that the light source is uniformized to achieve a better light-emitting effect, thereby reducing the number of used crystal grains.

As far as the current technology is concerned, the fabrication of a light-emitting diode strip with a secondary optical design must be subjected to two heat treatments: including the first heat treatment to fix the LED unit 14 on the printed circuit board 12, and the optical A second heat treatment after the lens 16 is dispensed causes the optical lens 16 to be attached to the printed circuit board 12.

In the current state of the art, the optical lens 16 is disposed on the printed circuit board 12 by a plurality of posts 11 and 13 designed to fit the dispensing material 15, 17 or an adhesive. Wherein, the dispensing materials 15, 17 or adhesives used are mostly thermosetting adhesives or ultraviolet curing adhesives, and directly surround the protruding columns 11, 13 so that if the amount of glue used is large, in addition to the easy If the optical lens 16 is slidably offset on the printed circuit board 12, it may overflow to other places and cause damage to other components; if the amount of glue used is small, the optical lens 16 may fall off, or When the LED light bar is used for a long time, the glue may be broken.

Therefore, although the optical lens 16 can be used to improve the light-emitting effect, the technical problems as described above are also caused in assembly. In addition, since additional dispensing materials or adhesives are also required for fixing, not only the material cost is increased, but also the complexity of the process is increased.

It is an object of the present invention to provide a solid state lighting device. The light-emitting device can directly complete the fixed assembly of the lens unit to the circuit board by the engagement design between the protruding post on the lens unit and the groove on the circuit board, thereby eliminating the related dispensing material or adhesion. The use of the agent can achieve good assembly and fixation effects, and can reduce cost and process complexity.

The present invention is a solid state light emitting device comprising: a printed circuit board having at least two assembly recesses; a light emitting diode unit disposed on the printed circuit board and located between the assembly recesses; a lens unit disposed on the printed circuit board and located above the LED unit, the lens unit having a lens body and at least two assembly posts on a bottom surface of the lens body, wherein the assembly posts correspond to the The assembly grooves are correspondingly engaged in the assembly grooves by the deformation and the fixed assembly is completed.

In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

10‧‧‧Solid illuminating device

12‧‧‧Printed circuit board

11, 13‧‧‧ stud

15, 17‧‧‧ Dispensing materials

14‧‧‧Lighting diode unit

16‧‧‧ optical lens

20, 30, 40, 50, 60, 70, 80‧‧‧ solid state lighting devices

22, 32, 42, 52, 62, 72, 82‧‧‧ Printed circuit boards

First surface of 221, 321, 421, 521, 621, 721, 821‧‧

222, 322, 422, 522, 622, 722, 822‧‧‧ second surface

24, 34, 44, 54, 64, 74, 84‧‧‧Lighting diode units

21, 23, 31, 33, 41, 43, 51, 53, 61, 63, 71, 73, 81, 83 ‧ ‧ assembled studs

26, 36, 46, 56, 66, 76, 86‧ ‧ lens unit

260, 360, 460, 560, 660, 760, 860 ‧ ‧ lens body

25, 27, 35, 37, 45, 47, 55, 57, 65, 67, 75, 77, 85, 87‧‧‧ Assembly grooves

611, 631‧‧ ‧ tablets

810, 830‧‧ ‧ axis

710, 730‧‧‧ end

811, 831‧‧‧ thermoset material

Figure 1 is a partial cross-sectional view of a conventional solid state light emitting device 10.

2A and 2B are schematic views showing the completion and disassembly of a solid-state light-emitting device 20 of the present invention, respectively.

3A and 3B are schematic views showing the completion and disassembly of a solid-state light-emitting device 30 of the present invention, respectively.

4A and 4B are schematic views showing the completion and disassembly of a solid-state light-emitting device 40 of the present invention, respectively.

5A and 5B are schematic views showing the completion and disassembly of a solid-state light-emitting device 50 of the present invention, respectively.

6A and 6B are schematic views showing the completion and disassembly of a solid-state light-emitting device 60 of the present invention, respectively.

7A and 7B are schematic views showing the completion and disassembly of a solid-state light-emitting device 70 of the present invention, respectively.

8A and 8B are schematic views showing the completion and disassembly of a solid-state light-emitting device 80 of the present invention, respectively.

The following is a detailed description of the embodiments, which are intended to be illustrative only and not to limit the scope of the invention. In addition, the drawings in the embodiments omit unnecessary elements to clearly show the technical features of the present invention.

In order to solve the problems described in the prior art, the present invention proposes a solid-state light-emitting device, the main concept of which is to form an assembly stud on the lens unit therein to correspond to the assembly groove on the printed circuit board to be assembled. Furthermore, the assembly or fixing of the lens unit does not require the use of a dispensing material or an adhesive, but mainly utilizes the elastic deformation or thermal expansion deformation of the material, plus the correspondence between the assembly stud and the assembly groove. The shape design enables the assembly stud to be deformed in accordance with the assembly groove to engage therein to complete assembly and fixation therebetween.

The implementation of the solid-state light-emitting device proposed by the present invention will now be described in a first embodiment; in this embodiment, the assembly and fixing method employed is to utilize the elastic deformation characteristics of the material.

Please refer to FIG. 2A and FIG. 2B simultaneously, which are schematic diagrams showing the completion and assembly of a solid-state light-emitting device 20, respectively. As shown, the solid state light emitting device 20 mainly includes a printed circuit board 22, a light emitting diode unit 24, and a lens unit 26. In detail, in the embodiment, the printed circuit board 22 has at least two assembly recesses 25, 27, and the LED unit 24 is located on the printed circuit board 22 and located between the assembly recesses 25, 27. The lens unit 26 has a lens body 260 and at least two assembly protrusions 21, 23 located on the bottom surface of the lens body 260; that is, the spacing of the assembly grooves 25, 27 is designed to correspond to the assembly protrusions 21, 23 Pitch. The drawing is illustrated by two pillars and two recessed elements, but the invention is not limited thereto. The number of the assembly grooves and the assembly protrusions corresponds to each other.

As described above, the printed circuit board 22 of the present invention has a first surface 221 and a second surface 222. The assembly recesses 25, 27 are formed on the first surface 221 and do not penetrate the second surface. 222. The manner in which the assembly grooves 25, 27 are formed is formed on the first surface 221 by laser, machining or chemical treatment, whereby the positioning requirements of the assembly position can be achieved by the processing technique.

In this embodiment, the volume shapes of the assembly grooves 25, 27 correspond to the appearance shapes of the assembly posts 21, 23. As shown in FIG. 2A and FIG. 2B , the assembly grooves 25 and 27 and the assembly protrusions 21 and 23 are columnar, and the columnar shape may be a rectangular column or a circular column; that is, The apertures of the assembly recesses 25, 27 are equal to the bottom of the assembly recesses 25, 27 from the first surface 221, and the cross-sectional sizes of the assembly posts 21, 23 are from the lens body. The bottom edges of the 260 are equal to the end edges of the assembly studs 21, 23. The apertures or volumes of the assembly recesses 25, 27 are smaller than the cross-section or volume of the assembly posts 21, 23, and the assembly posts 21, 23 are elastic materials; for example, a resilient plastic material. In order to protect the LED unit 24 from damage, the length of the assembly posts 21, 23 is greater than the thickness of the LED unit 24 plus the depth of the assembly recesses 25, 27.

As described above, the assembly studs 21, 23 can be elastically deformed in response to a force to enter the assembly grooves 25, 27, and then recovered. Or all of the deformations result in a snap to complete the fixed assembly. In detail, as shown in FIGS. 2A and 2B, the lens unit 26 is placed above the LED unit 24, and the assembly posts 21, 23 correspond to the assembly grooves. 25, 27; since the assembly studs 21, 23 are elastic materials and the cross-section of the assembly grooves 25, 27 is designed to be large in this embodiment, pressure is applied to the lens unit 26 when the two are in contact with each other. The assembly protrusions 21, 23 can be correspondingly elastically deformed into the assembly grooves 25, 27, and then the assembly posts 21, 23 are abutted against the side walls of the assembly grooves 25, 27 by the restoring force of the deformation. Further, a snap fit is performed to complete the fixed assembly of the lens unit 26 on the printed circuit board 22.

The material of the lens unit 26 in the present invention may be a light transmissive polymer material; for example, polymethly Methacrylate (PMMA), polystyrene (PS), and methyl group. Methly-methacrylate-Styrene (MS) or Polycarbonate (PC).

In this embodiment, the shape of the assembly post and the assembly groove can be further changed according to the above concept, and the same assembly and fixing effect can be achieved. Please refer to FIGS. 3A and 3B, 4A and 4B, 5A and 5B, 6A and 6B, respectively, which are another solid-state lighting device 30, 40, 50, 60, respectively. Schematic diagram of the decomposition and assembly completed. The same elements are indicated by similar numbers. In FIGS. 3A and 3B, the shape of the assembling studs 31, 33 and the assembling grooves 35, 37 is trapezoidal; in FIGS. 4A and 4B, the assembling studs 41, 43 and the assembling groove are assembled. The shapes of 45, 47 are in the form of bumps; in Figs. 5A and 5B, the shapes of the assembling studs 51, 53 and the assembling grooves 55, 57 are inverted T-shaped; in Fig. 6A and In Fig. 6B, the shape of the assembly bosses 61, 63 is in the shape of a clip, and the assembly grooves 65, 67 are trapezoidal.

As described above, for the main designs of FIGS. 3A to 5B, the aperture sizes of the assembly recesses are increased from the first surface toward the bottoms of the assembly recesses, and correspondingly the assembly protrusions are correspondingly The cross-sectional size of the column increases from the bottom surface of the lens body toward the end edges of the assembly posts. a group similar to the above embodiment The mounting method is because the assembled stud is an elastic material, and the volume of the assembled recess can be designed to be smaller than the volume of the assembled stud in the 3A to 5B; when the two are in contact, the pressure is applied to the lens unit. The assembly posts can be correspondingly elastically deformed into the corresponding assembly grooves. Finally, the assembly studs are partially and completely deformed in the assembly groove to form a snap to complete the fixed assembly of the lens units.

On the other hand, the design shape of the assembly post and the assembly groove can be known that even if the volume of the assembly groove is larger than the volume of the assembly post, the engagement can be generated after the partial or total deformation is restored. Since the end edges of the assembly studs are relatively large, once they enter the assembly recess by elastic deformation, they cannot be withdrawn from the openings to cause engagement, thereby completing the fixed assembly. Furthermore, the length of the assembly studs can be greater than the depth of the assembly recesses plus the thickness of the light emitting diode unit.

For the variation design of FIG. 6A and FIG. 6B, wherein each of the assembly protrusions 61 and 63 further includes a plurality of elastically deformable sheets 611 and 631, and the sheets 611 and 631 are sandwiched. A variable angle. In detail, the appearance of each of the assembly studs 61, 63 in this variation design is in the shape of a clip-like clip, that is, the inside thereof is hollow and the respective sheets 611, 631 are separated from each other. The sheets 611, 631 can also be elastically deformed in response to a force to tighten and close to enter the assembly grooves 65, 67; and because the corresponding assembly grooves 65, 67 are trapezoidal, that is, the aperture size thereof. Appearing from the first surface 621 to the bottom thereof, the sheets 611, 631 of the assembling studs 61, 63 can recover part or all of the deformation and abut against the side walls of the corresponding assembly grooves 65, 67, thereby The assembly of the lens unit 66 is completed by the engagement.

The implementation of the solid-state light-emitting device proposed by the present invention will now be described in a second embodiment; in this embodiment, the assembly and fixing method employed is to utilize the thermal expansion deformation characteristics of the material.

Please refer to FIG. 7A and FIG. 7B simultaneously, which are schematic diagrams showing the completion and assembly of another solid-state light-emitting device 70, respectively. As shown, the component of the solid-state lighting device 70 is the same as that of the first embodiment, that is, mainly including a lens unit 76 and a printed circuit board 72. This embodiment is different from the first embodiment. The first end portions 710 and 730 included in the lowermost portions of the assembly studs 71 and 73 are made of a thermosetting material; for example, they may be high molecular polymers having thermal expansion properties, and may be epoxy resin or epoxy resin ( Silicone) or a combination of the foregoing. That is, the ends 710, 730 of the studs are thermoset, and the other portions may be the same material as the lens unit 76. In this embodiment, the ends 710, 730 are similarly rounded.

Next, as shown in the figure, the aperture sizes of the assembly recesses 75, 77 are increased from the first surface 721 toward the bottom of the assembly recesses 75, 77, that is, above the assembly recesses 75, 77. The columnar shape, the lower side is a groove similar to an arc and wider. The cross-sectional sizes of the assembly studs 71 and 73 are fixed between the bottom surface of the lens main body 760 and the end portions 710 and 730. The cross-sectional dimensions of the ends 710, 730 are less than or equal to the aperture size of the openings above the assembly recesses 75, 77.

As described above, when the lens unit 76 is placed over the LED unit 74 and assembled, the assembly posts 71 and 73 can smoothly enter the corresponding assembly recess. In the slots 75, 77. Therefore, in response to the operation of a heating condition (for example, by ultraviolet light (UV) irradiation or baking), the end portions 710, 730 of the assembly studs 71, 73 are thermally expanded to increase the volume, and The increased volume shape will depend on the shape of the bottom surface of the grooves 75, 77; and due to the thermosetting properties of the material, the volume will not be reduced after the temperature is lowered, so that the resulting thermosetting deformation will be combined with the assembly recesses. The slots 75, 77 are engaged to complete the fixed assembly of the lens unit 76. In one embodiment, the length of the assembly studs 71, 73 can be designed to be greater than the thickness of the LED unit 74 plus the depth of the assembly recesses 75, 77.

In this embodiment, according to the above concept, the structure of the assembly stud and the shape of the assembly groove can be further changed to achieve the same assembly and fixing effect. Please refer to FIG. 8A and FIG. 8B at the same time, which is a schematic diagram of the completion and assembly of the solid-state light-emitting device 80. As shown in the figure, similar to the 2A and 2B drawings, the assembly grooves 85, 87 and the assembly posts 81, 83 of this variation are presented in a columnar shape. The difference is that in addition to the aperture of the assembly grooves 85, 87 The assembly protrusions 81 and 83 each include a thermosetting material 811 and 831; that is, the assembly protrusions 81 and 83 are not entirely thermosetting, but the thermosetting material 811. And 831 covers at least one surface of the axes 810 and 830 of the protrusions 81 and 83.

As described above, each of the axes 810 and 830 can be the same material as the lens unit 86, that is, it can be an extension of the lens unit 86. Therefore, when the assembly studs 81, 83 are integrally inserted into the corresponding assembly grooves 85, 87, the thermosetting materials 811, 831 therein can increase the volume due to the thermal expansion of the operation of a heating condition, resulting in a volume. The thermoset deformation will abut against the side walls of the assembly recesses 85, 87, thereby creating a snap fit to complete the fixed assembly of the lens unit 86.

On the other hand, the thermal expansion of the engagement characteristics shows that the design shape of the assembly stud and the assembly groove can be less important, that is, it can be changed as described above for the relevant shape, even the shape of the assembly stud and The shape of the assembly grooves can also be different from each other. In other words, by utilizing the snap-fit characteristics of thermal expansion, as long as the aperture, volume or shape of the assembly groove can smoothly provide the corresponding assembly studs before the heating operation, effective thermal expansion and thermosetting can be produced after the heating operation. And complete the fixed assembly. Of course, the coating form of the thermosetting material on the axis of the stud is not limited to the manner in the above embodiments.

In summary, the solid-state light-emitting device of the present invention can achieve at least the following enhancements: First, the lens can be directly engaged with the lens by the design of the convex column of the lens unit itself and the groove of the circuit board. The setting is completed on the board; secondly, the use of the thermosetting glue or the ultraviolet curing glue is eliminated, the cost overhead of the process can be saved and the process complexity of the package structure can be reduced; Third, the use of the dispensing material or the adhesion is avoided. The overflow condition generated by the agent or the sliding deviation of the lens can improve the bonding strength between the lens and the circuit board, and can effectively control the light output effect under the accurate engagement position design; The bulging makes the overall structure thinner and allows the circuit board or the carrier body to be closer to the heat sink or other planar structure for better heat dissipation.

Therefore, the present invention can effectively solve the related problems proposed in the prior art. The problem can successfully achieve the main purpose of the development of the case.

Although the present invention has been disclosed above by way of example, it is not intended to limit the invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

20‧‧‧Solid illuminating device

22‧‧‧Printed circuit board

221‧‧‧ first surface

222‧‧‧ second surface

24‧‧‧Lighting diode unit

21, 23‧‧‧Assembled studs

26‧‧‧ lens unit

260‧‧‧ lens body

25, 27‧‧‧ Assembly groove

Claims (11)

A solid state light emitting device comprising: a printed circuit board having at least two assembly recesses; a light emitting diode unit disposed on the printed circuit board and located between the assembly recesses; and a lens unit disposed On the printed circuit board and above the LED unit, the lens unit has a lens body and at least two assembly protrusions on the bottom surface of the lens body, wherein the assembly protrusions correspond to the assembly grooves And correspondingly engaging in the assembly grooves by performing deformation and completing the fixed assembly. The solid state lighting device of claim 1, wherein the printed circuit board has a first surface and a second surface, the assembly grooves are formed on the first surface and do not penetrate the second surface . The solid-state lighting device of claim 2, wherein the assembly studs are made of an elastic material, and elastically deformed in response to a force to enter the assembly grooves, and then restore part or all of After the deformation, a snap is made to complete the fixed assembly. The solid-state lighting device of claim 3, wherein each of the assembly studs comprises a plurality of elastically deformable sheets, the sheets being sandwiched by a variable angle. The solid-state lighting device of claim 2, wherein the apertures of the assembly recesses increase from the first surface to the bottom of the assembly recesses. The solid state lighting device of claim 5, wherein the cross-sectional dimensions of the assembly studs increase from the bottom surface of the lens body toward the end edges of the assembly studs. The solid state lighting device of claim 2, wherein the assembly studs each comprise a thermosetting material, and the thermosetting deformation occurs in a heating condition to engage with the assembly grooves to complete the fixed assembly. The solid state light emitting device of claim 7, wherein the thermosetting material covers at least one surface of the stud. The solid state lighting device of claim 2, wherein the assembly grooves are formed on the first surface by laser, machining or chemical treatment. The solid state lighting device of claim 1, wherein the spacing of the assembly grooves corresponds to the spacing of the assembly posts. The solid-state lighting device of claim 1, wherein the volume shapes of the assembly grooves correspond to the appearance shapes of the assembly posts.