CN217213547U

CN217213547U - Electronic device

Info

Publication number: CN217213547U
Application number: CN202220080904.XU
Authority: CN
Inventors: 邱浩
Original assignee: Taicang Xinhuaying Electronic Co ltd
Current assignee: Taicang Xinhuaying Electronic Co ltd
Priority date: 2022-01-13
Filing date: 2022-01-13
Publication date: 2022-08-16
Anticipated expiration: 2032-01-13

Abstract

The utility model discloses an electronic equipment, including casing, the source and the heat abstractor that generate heat. The shell is provided with an inner cavity and an opening, the heating source is arranged in the shell, and the heat dissipation device is arranged in the shell and is in contact with the heating source. The heat dissipation device comprises a first heat conduction element, a second heat conduction element, a first radiator and a driving assembly, wherein one end face of the second heat conduction element is in contact with the shell, the other end face of the second heat conduction element is in contact with one end face of the first heat conduction element, the driving assembly is in contact with the other end face of the first heat conduction element, and the first radiator is arranged on the first heat conduction element. The driving assembly drives the first heat-conducting element to move relative to the shell. The first heat sink is exposed out of the housing through the opening.

Description

Electronic device

Technical Field

The utility model belongs to the heat dissipation field, concretely relates to electronic equipment.

Background

The thickness of present notebook computer is more and more thin, and corresponding consumption is also more and more high, and notebook computer often can fall the frequency because of the high temperature under the operating pressure of high load promptly to make the performance reduce, the common radiating mode of notebook computer in the present market is double fan mode, and the radiating effect receives certain restriction, in order to promote notebook computer's heat-sinking capability, increases a heat abstractor on original heat dissipation module, uses under the machine high load, thereby can ensure that the machine can not be because of the high temperature performance decline.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic equipment that can effectively solve above-mentioned technical problem.

The utility model provides a technical scheme as follows that its technical problem provides:

an electronic device, comprising:

a housing having an interior cavity and an opening;

the heating source is arranged in the shell;

the heat dissipation device is arranged in the shell and comprises a heat conduction unit, a first radiator and a driving assembly;

the heat conducting unit is provided with a first heat conducting element, the first heat conducting element is fixed with or integrated with the first radiator, and the first heat conducting element conducts heat on the heating source to the heat radiator;

the driving assembly is fixedly combined in the shell and is linked with the first heat conducting element;

the driving assembly drives the first heat conducting element to move relative to the shell, so as to drive the first radiator to be exposed out of the shell through the opening.

Preferably, a gear chain is arranged on the first heat-conducting element, and the extending direction of the gear chain is consistent with the movable direction of the first heat-conducting element;

the driving assembly comprises a stepping motor, and a gear head of the stepping motor is meshed with the gear chain.

Preferably, the heat conducting unit further has a second heat conducting element, one end surface of the second heat conducting element contacts with the housing, the other end surface of the second heat conducting element contacts with one end surface of the first heat conducting element, and the gear chain is disposed on the other end surface of the first heat conducting element.

Preferably, a movable sliding portion is disposed on the second heat conducting element and close to the first heat conducting element, a first guiding portion and a second guiding portion are disposed on two corresponding sides of the movable sliding portion, the first guiding portion and the second guiding portion are arranged in a staggered manner along the extending direction of the gear chain, and the movable sliding portion is used for accommodating the first heat conducting element.

Preferably, the first heat sink includes a heat dissipation frame seat, a heat dissipation fan and a fin set are disposed in the heat dissipation frame seat, the fin set is fixed in an air outlet region of the heat dissipation fan, and the fin set is combined on the first heat conduction element.

Preferably, the first heat conducting element is a heat pipe.

Preferably, the first heat conducting element is a temperature equalizing plate.

Preferably, the second heat conducting element is a temperature equalization plate.

Preferably, the heat conducting unit further comprises a heat conducting copper plate, at least a part of the second heat conducting element is attached to the heat conducting copper plate, and the heat conducting copper plate and the heat generating source realize heat transfer.

Preferably, the heat conducting unit further comprises two fans, two heat conducting copper plates, two heat pipes and two fin groups, the two heat conducting copper plates are arranged in a formation, the upper surfaces of the two heat conducting copper plates are fixedly attached to the heat generating source respectively, the heat absorbing ends of the two heat pipes are aligned and do not contact with each other, the two heat conducting copper plates are attached to the lower surfaces of the two heat conducting copper plates respectively, the other surfaces of the heat absorbing ends of the two heat pipes are attached to the second heat conducting element, the heat releasing ends of the two heat pipes are away from each other and are combined to the two fin groups respectively, and the two fin groups are fixed to the air outlet regions of the two fans respectively.

Compared with the prior art, the utility model discloses set up drive assembly in heat abstractor, make the relative casing of the first heat conduction component of drive assembly drive remove, and then drive first radiator and see through the opening and expose and dispel the heat outside the casing, promote electronic equipment's radiating efficiency.

Drawings

The invention will be further explained with reference to the drawings and examples, in which:

fig. 1 is a schematic structural diagram of an electronic device disclosed in the present application;

FIG. 2 is a perspective view of the electronic device shown in FIG. 1;

FIG. 3 is a structural assembly diagram of the electronic device shown in FIG. 2;

FIG. 4 is an enlarged view of the structure of the dotted circle A shown in FIG. 3;

FIG. 5 is a schematic structural diagram of the second heat-conducting element shown in FIG. 3;

fig. 6 is a schematic structural view of the first heat sink shown in fig. 3, particularly illustrating the first heat sink with the upper cover of the heat sink frame removed;

fig. 7 is a bottom view of the electronic device shown in fig. 1, particularly illustrating a schematic structural diagram of the electronic device when the electronic device is operated in a high load state;

fig. 8 is a schematic structural diagram of another electronic device disclosed in the present application, specifically showing a three-dimensional structure diagram inside the electronic device.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

In order to explain the technical solution of the present invention, the following description is made by using specific examples.

Referring to fig. 1 to 7, an electronic device 100 disclosed in the present application includes a housing 10, a heat source and a heat sink 30. The casing 10 has a cavity therein, a base 12 and an opening 11, the heat source is disposed in the casing 10, and the heat dissipation device 30 is disposed on the base 12 and contacts with the heat source. The heat dissipation device 30 is further provided with a first heat sink 31, and the first heat sink 31 can be exposed out of the housing 10 through the opening 11. In the embodiment, the electronic device 100 may be a series of electronic products requiring heat dissipation, such as a notebook computer, a tablet computer, a television, and the like, and the embodiment is preferably a notebook computer, but not limited thereto.

Specifically, the heat dissipation device 30 further includes a heat conduction unit and a driving assembly. The heat conducting unit includes a first heat conducting element 33 and a second heat conducting element 34, the second heat conducting element 34 has two opposite end surfaces, one of the end surfaces of the second heat conducting element 34 contacts with the base 12, that is, the second heat conducting element 34 is disposed on the base 12. The first heat conducting element 33 is disposed along a horizontal direction relative to the second heat conducting element 34, and the first heat conducting element 33 also has two end surfaces disposed oppositely, one of the end surfaces of the first heat conducting element 33 contacts with the other end surface of the second heat conducting element 34, so as to realize surface contact between the first heat conducting element 33 and the second heat conducting element 34. The other end surface of the first heat conducting element 33 is in contact with the driving assembly, so that the driving assembly drives the first heat conducting element 33 to move in the horizontal direction relative to the second heat conducting element 33.

Specifically, the second heat conducting unit 34 is preferably a uniform temperature plate having a phase change cavity therein, and the first heat conducting unit 33 is preferably a straight plate-shaped heat pipe having a phase change cavity therein. In this embodiment, the first heat conducting unit 33 may be a straight plate-shaped uniform temperature plate, a copper plate, an aluminum plate, etc., and the second heat conducting unit 34 may be a straight plate-shaped copper plate, an aluminum plate, etc., which is not limited in this embodiment.

In this embodiment, a movable sliding portion 341 is disposed on the second heat conducting element 34 near the first heat conducting element 33, the movable sliding portion 341 is shaped like a flat plate, and the movable sliding portion 341 is configured to accommodate the first heat conducting element 33, so that the first heat conducting element 33 can move in the horizontal direction in the movable sliding portion 341. The two corresponding sides of the movable sliding part 341 are provided with a first guide part 3411 and a second guide part 3412, the first guide part 3411 and the second guide part 3412 are U-shaped, and the first guide part 3411 and the second guide part 3412 are staggered along the movable direction of the first heat conducting element 33, so as to limit the first heat conducting element 33 to move back and forth along only one direction.

Specifically, the gear chain 351 is disposed on the first heat conducting element 33 and is close to the second heat conducting element 34, and the extending direction of the gear chain 351 is consistent with the movable direction of the first heat conducting element 33. The driving assembly includes a stepping motor 352, the stepping motor 352 is fixedly disposed on the base 12, and a gear head 3521 of the stepping motor 352 is engaged with the gear chain 351.

Specifically, the first heat sink 31 is fixedly disposed on the first heat conducting element 33 or integrated with the first heat conducting element 33. The first heat sink 31 includes a heat dissipating frame 311, a heat dissipating fan 312 and a fin set 313 are disposed in the heat dissipating frame 311, the fin set 313 is fixedly disposed in an air outlet region of the heat dissipating fan 312, a through hole 3114 is disposed on a side of the heat dissipating frame 311 close to the fin set 313, the first heat conducting element 33 is attached to the fin set 313 through the through hole 3114 for conducting heat, so that heat on the first heat conducting element 33 is transferred to the fin set 313, and then the heat is conducted out of the heat dissipating frame 311 through the heat dissipating fan 312; meanwhile, the first heat sink 31 can be moved out of the housing 10 by the driving component, so that heat emitted from the heat source in the housing 10 can be conducted out of the housing 10 through the first heat sink 31, and the heat can be effectively discharged out of the electronic device 100; furthermore, the first heat sink 31 can be reasonably disposed in the housing 10, so as to facilitate the assembly of the electronic components in the housing 10.

Specifically, a sidewall 3111 of the heat dissipating bezel 311 is located at the opening 11 in the housing 10 for sealing the opening 11 and preventing dust from entering the electronic device 100 through the opening 11. Meanwhile, the heat dissipating frame 311 is disposed on the adjacent wall 3112 of the sidewall 3111 and has a plurality of air inlets 3113, the air inlets 3113 are disposed at the air inlets of the heat dissipating fan 312 in opposite positions, and the air inlets 3113 are used for guiding air to reduce dust entering the heat dissipating fan 312 through the air inlets 3113, thereby affecting the heat dissipating performance.

In the present embodiment, the heat conducting unit further has a heat conducting copper plate 36. At least a part of the second heat conducting element 34 is attached to the heat conducting copper plate 36, that is, the heat conducting copper plate 36 is in contact with the region of the second heat conducting element 34 away from the moving sliding part 331, and the heat conducting copper plate 36 and the heat generating source realize heat transfer.

Referring to fig. 8, in another embodiment, different from the above embodiment, two fans 312 ', two heat-conducting copper plates 36', two heat pipes 37, and two fin groups 313 'are disposed in the electronic device 100', wherein the two heat-conducting copper plates 36 'are arranged in a formation, upper surfaces of the two heat-conducting copper plates 36' are respectively and fixedly attached to the heat source 20 ', heat absorbing ends 371 of the two heat pipes 37 are disposed in an aligned manner and are not in contact with each other, and are respectively and fixedly attached to lower surfaces of the two heat-conducting copper plates 36', other surfaces of the heat absorbing ends 371 of the two heat pipes 37 are respectively and fixedly attached to the second heat-conducting element 34, heat releasing ends 372 of the two heat pipes 37 are away from each other and are respectively combined to the two fin groups 313 ', the two fin groups 313' are respectively and fixedly attached to air outlet regions of the fans 312 ', and ventilation openings are respectively disposed on the housing 10 corresponding to the two fans 312', corresponding to the air outlets and air inlets of the two fans 312'.

Specifically, when the electronic device 100 'is in a low-voltage state, the heat dissipation can be completed by two fans 312' disposed in the electronic device 100 ', which is a common heat dissipation manner of the electronic device 100', that is, the heat dissipation fans 312 in the first heat sink 31 do not participate in the work. When the electronic device 100 ' works under a high load condition, the two fans 312 ' cannot meet the heat dissipation requirement of the electronic device 100 ' at a higher ambient temperature, and therefore, a side button of the housing 10 ' of the pen electronic device 100 ' can be pressed (the button controls the stepping motor 352 to start, i.e., controls the gear head 3521 of the stepping motor 352 to rotate forward and backward), at this time, the driving component drives the first heat conducting element 33 to move relative to the housing 10, so as to drive the first heat sink 31 to be exposed out of the housing 10 through the opening 11, and when the first heat sink 31 is exposed out of the housing 10, the heat dissipation fan 312 in the first heat sink 31 starts to work. The heat dissipation fan 312 can be a high-speed fan, and because the fan is exposed outside the electronic device 100 ', the wind resistance is small, and the heat dissipation effect is better, so that the electronic device 100' can realize simultaneous heat dissipation and cooling of three fans.

To sum up, the present invention discloses an electronic device, which is provided with a driving component to force a first heat sink to move in a housing of the electronic device, so that the first heat sink can be disposed in a suitable area for reasonable use; meanwhile, the first radiator can be exposed out of the electronic equipment through the opening on the shell, so that a better radiating effect is realized.

Claims

1. An electronic device, comprising:

a housing having an internal cavity and an opening;

the heating source is arranged in the shell;

2. The electronic device according to claim 1, wherein the first heat-conducting element is provided with a gear chain, and the gear chain extends in a direction consistent with the movable direction of the first heat-conducting element;

3. The electronic device according to claim 2, wherein the heat conducting unit further has a second heat conducting element, one end surface of the second heat conducting element is in contact with the housing, the other end surface of the second heat conducting element is in contact with one end surface of the first heat conducting element, and the gear chain is disposed on the other end surface of the first heat conducting element.

4. The electronic device according to claim 3, wherein the second heat conducting element is provided with a moving sliding portion adjacent to the first heat conducting element, two corresponding sides of the moving sliding portion are provided with a first guiding portion and a second guiding portion, the first guiding portion and the second guiding portion are staggered along an extending direction of the gear chain, and the moving sliding portion is configured to receive the first heat conducting element.

5. The electronic device of claim 1, wherein the first heat sink includes a heat-dissipating frame, and a heat-dissipating fan and a set of fins are disposed in the heat-dissipating frame, the set of fins is fixed to an air outlet region of the heat-dissipating fan, and the set of fins is bonded to the first heat-conducting element.

6. The electronic device of claim 1, wherein the first thermally conductive element is a heat pipe.

7. The electronic device of claim 1, wherein the first heat conducting element is a vapor chamber.

8. The electronic device of claim 3, wherein the second heat conducting element is a vapor chamber.

9. The electronic apparatus according to claim 3, wherein the heat conducting unit further has a heat conducting copper plate to which the second heat conducting element is attached at least partially, the heat conducting copper plate being in heat transfer with the heat generating source.

10. The electronic device of claim 3, wherein the heat conducting unit further comprises two fans, two heat conducting copper plates, two heat pipes and two fin sets, the two heat conducting copper plates are arranged in a formation, upper surfaces of the two heat conducting copper plates are respectively and fixedly attached to the heat generating source, heat absorbing ends of the two heat pipes are aligned and are not in contact with each other, the heat absorbing ends are respectively and fixedly attached to lower surfaces of the two heat conducting copper plates, the other surfaces of the heat absorbing ends of the two heat pipes are respectively and fixedly attached to the second heat conducting element, heat releasing ends of the two heat pipes are far away from each other and are respectively combined to the two fin sets, and the two fin sets are respectively and fixedly attached to air outlet regions of the two fans.