CN220931506U - Cold and warm equipment and cell culture equipment - Google Patents
Cold and warm equipment and cell culture equipment Download PDFInfo
- Publication number
- CN220931506U CN220931506U CN202322968172.5U CN202322968172U CN220931506U CN 220931506 U CN220931506 U CN 220931506U CN 202322968172 U CN202322968172 U CN 202322968172U CN 220931506 U CN220931506 U CN 220931506U
- Authority
- CN
- China
- Prior art keywords
- cooling
- heat dissipation
- conduction
- temperature
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004113 cell culture Methods 0.000 title claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 50
- 230000017525 heat dissipation Effects 0.000 claims abstract description 36
- 238000001816 cooling Methods 0.000 claims abstract description 32
- 239000004065 semiconductor Substances 0.000 claims abstract description 19
- 229920000742 Cotton Polymers 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 6
- 238000005057 refrigeration Methods 0.000 abstract description 15
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 7
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Apparatus Associated With Microorganisms And Enzymes (AREA)
Abstract
The utility model discloses cooling and heating equipment and cell culture equipment, wherein the cooling and heating equipment comprises a main board, a temperature conduction assembly and a heat dissipation assembly; the temperature conduction assembly comprises a semiconductor chip and a conduction group used for conducting out the temperature of the semiconductor chip; the area of the temperature conduction component projected on the first surface is smaller than that of the first surface. The utility model utilizes the principle of realizing refrigeration or heating by utilizing the positive and negative voltage conversion of the semiconductor chip, so that the utility model can have two functions of refrigeration or heating, thereby solving the problem of overlarge area caused by the fact that the traditional cooling and heating equipment needs to be provided with the refrigeration and heating module at the same time.
Description
Technical Field
The embodiment of the utility model relates to the technical field of refrigeration equipment, in particular to cooling and heating equipment and cell culture equipment.
Background
Along with the development of technology, the development of biotechnology is more and more daily and different, and corresponding equipment required by matched biological research is also developed at a high speed, and the requirements on precision and temperature control are higher and higher. The cell culture apparatus (centrifuge) is such an apparatus for biotechnology research, which is required to provide high-precision cooling and heating functions simultaneously to provide a good environment for cell culture, which requires a cooling and heating device for high-precision temperature control, and which is required to be smaller in size to save materials and energy. The conventional common refrigerating and heating device has the defects that the refrigerating and heating functions are realized by different parts, so that the whole refrigerating and heating device has larger volume and is unfavorable for miniaturization of cell culture equipment; meanwhile, the installation and the maintenance are not very convenient because of a complex structure.
Disclosure of utility model
The utility model provides cooling and heating equipment and cell culture equipment for solving the technical problems in the background technology.
The utility model provides cooling and heating equipment, which comprises a main board with a first surface and a second surface, a temperature conduction component arranged on the first surface and a heat dissipation component arranged on the second surface; the temperature conduction assembly comprises a semiconductor chip arranged on the first surface and a conduction group arranged on the first surface and used for conducting out the temperature of the semiconductor chip; the area of the temperature conduction component projected on the first surface is smaller than that of the first surface.
Further, the conductive group comprises a conductive sheet covered on the semiconductor chip and a conductive fan arranged on the conductive sheet; the air outlet direction of the conduction fan is perpendicular to the first surface.
Further, the conductive fans are provided in plurality, and the plurality of conductive fans are sequentially arranged along the height direction.
Further, the heat dissipation assembly comprises a heat dissipation plate arranged on the second surface and a heat dissipation fan arranged on the heat dissipation plate.
Further, the radiating fin is provided with a plurality of radiating air channels; the heat dissipation air duct is communicated with the heat dissipation fan.
Further, the conducting piece is provided with a plurality of conducting air channels, and the air outlet direction of the conducting fan is opposite to the conducting air channels.
Further, the heat dissipation assembly further comprises heat insulation cotton arranged on the second surface; the radiating fins are arranged on the heat insulation cotton.
Further, the temperature conduction assembly is disposed at an intermediate position of the first face.
Further, a plurality of conductive fans are alternately provided at both ends of the conductive sheet in the height direction.
The utility model also provides cell culture equipment, which comprises a case, wherein a culture cavity is arranged in the case, the cell culture equipment further comprises the cooling and heating equipment, the first surface of the cooling and heating equipment faces to the culture cavity, and the temperature conduction assembly is positioned in the culture cavity.
By adopting the technical scheme, the utility model has at least the following beneficial effects: the utility model utilizes the principle of realizing refrigeration or heating by utilizing the positive and negative voltage conversion of the semiconductor chip, so that the utility model can have two functions of refrigeration or heating, thereby solving the problem of overlarge area caused by the fact that the traditional cooling and heating equipment needs to be provided with the refrigeration and heating module at the same time.
Drawings
Fig. 1 is a perspective view of the cooling and heating apparatus of the present utility model.
FIG. 2 is an exploded view of the cooling and heating apparatus of the present utility model.
Detailed Description
The utility model will be described in further detail below with reference to the drawings by means of specific embodiments. It should be understood that the embodiments described below by referring to the drawings are exemplary and intended to illustrate the utility model and not to be construed as limiting the utility model, and that features of embodiments of the utility model may be combined with each other without conflict.
As shown in fig. 1-2, the present utility model provides a cooling and heating device, comprising a main board 1 having a first surface 11 and a second surface, a temperature conduction component mounted on the first surface 11, and a heat dissipation component mounted on the second surface; the temperature conduction assembly comprises a semiconductor chip 21 arranged on the first surface 11, and a conduction group arranged on the first surface 11 and used for conducting out the temperature of the semiconductor chip 21; the area of the temperature conduction assembly projected on the first face 11 is smaller than the area of the first face 11.
In this embodiment, the principle of implementing refrigeration or heating by utilizing the positive-negative voltage conversion of the semiconductor chip 21 enables the utility model to have two functions of refrigeration or heating, so as to overcome the problem of overlarge area caused by the requirement of simultaneously setting the refrigeration and heating modules in the traditional cooling and heating equipment, in addition, the projected area of the temperature conduction component on the first surface 11 of the main board 1 is set smaller than the area of the first surface 11, so that the two sides of the temperature conduction component have a temperature conduction space, and the conduction of the refrigeration or heating temperature can be accelerated under the holding of the conduction group.
In one embodiment, the conductive set includes a conductive sheet 22 covering the semiconductor chip 21 and a conductive fan 23 mounted on the conductive sheet 22; the air outlet direction of the conducting fan 23 is perpendicular to the first surface 11, in this embodiment, the conducting strip 22 is directly in contact with the reporting lifting chip, so that the temperature of the semiconductor (the refrigerating temperature and the heating temperature during refrigeration and heating) can be conducted, the conducting fan 23 emits the temperature on the conducting strip 22, and therefore the effect of rapid refrigeration or heating is achieved, the air outlet direction of the conducting fan 23 is perpendicular to the first surface 11, and the temperature of the conducting strip 22 can be rapidly emitted, so that the effect of rapid refrigeration or heating is achieved.
In a specific embodiment, the plurality of the conductive fans 23 are arranged in sequence along the height direction, so that the temperature generated by the semiconductor chip 21 can be quickly conducted out by arranging the plurality of the conductive fans 23, and the space occupied by the whole conductive group in the excessive thickness direction can be reduced compared with the case of arranging only one conductive fan 23 (one conductive fan 23 needs to be large enough to blow air to the conductive sheet 22 quickly and uniformly, and the space in the thickness direction can be saved by arranging the plurality of conductive fans instead of the plurality of conductive fans 23).
In a specific embodiment, the heat dissipation assembly includes a heat dissipation fin 31 installed on the second surface and a heat dissipation fan 32 installed on the heat dissipation fin 31, in this embodiment, the heat dissipation fin 31 can dissipate heat of the semiconductor chip 21 when the cooling and heating device is cooled, so as to improve the service efficiency of the device, specifically, under the refrigeration pile body, heat generated by the surface of the semiconductor chip 21 attached to the first surface 11 is conducted to the heat dissipation fin 31, and the heat dissipation fan 32 blows air to the heat dissipation fin 31, so that heat of the heat dissipation fin 31 is taken away rapidly, and a heat dissipation effect is achieved.
In one embodiment, the heat sink 31 is provided with a plurality of heat dissipation air channels 311; the heat dissipation air duct 311 is communicated with the heat dissipation fan 32, and a plurality of heat dissipation air ducts 311 are provided, so that the heat dissipation effect can be improved.
In a specific embodiment, the conducting plate 22 is provided with a plurality of conducting air channels 221, and the air outlet direction of the conducting fan 23 is opposite to the conducting air channels 221, so that the conducting effect on temperature can be accelerated.
In one embodiment, the heat dissipating assembly further comprises heat insulating cotton 33 provided on the second face; the heat dissipation fin 31 and the heat insulation cotton 33 can realize the thermal isolation between the heat conduction component and the heat dissipation component of the first surface 11 of the cooling and heating equipment through the heat insulation cotton 33, and prevent the interference of the two components from affecting the refrigerating or heating effect
In a specific embodiment, the temperature conduction assembly is disposed at a middle position of the first surface 11, so that both ends of the temperature conduction assembly have a space, and the temperature generated by the semiconductor chip 21 can be conducted rapidly.
The utility model also provides a cell culture device, which comprises a case, wherein a culture cavity is arranged in the case, the cell culture device further comprises the cooling and heating device, the first surface 11 of the cooling and heating device is arranged towards the culture cavity, the temperature conduction component is positioned in the culture cavity, and the temperature conduction component is arranged in the culture cavity, so that the cooling or heating effect in the culture cavity can be realized, and the problem of overlarge area caused by the fact that the traditional cell culture device needs to be provided with a cooling and heating module at the same time is solved.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A cooling and heating apparatus, characterized in that: the heat dissipation device comprises a main board with a first surface and a second surface, a temperature conduction component arranged on the first surface and a heat dissipation component arranged on the second surface; the temperature conduction assembly comprises a semiconductor chip arranged on the first surface and a conduction group arranged on the first surface and used for conducting out the temperature of the semiconductor chip; the area of the temperature conduction component projected on the first surface is smaller than that of the first surface.
2. The cooling and heating apparatus of claim 1, wherein: the conducting group comprises a conducting sheet covered on the semiconductor chip and a conducting fan arranged on the conducting sheet; the air outlet direction of the conduction fan is perpendicular to the first surface.
3. The cooling and heating apparatus of claim 2, wherein: the conduction fans are arranged in sequence along the height direction.
4. The cooling and heating apparatus of claim 1, wherein: the heat dissipation assembly comprises a heat dissipation fin arranged on the second surface and a heat dissipation fan arranged on the heat dissipation fin.
5. The cooling and heating apparatus of claim 4, wherein: the radiating fin is provided with a plurality of radiating air channels; the heat dissipation air duct is communicated with the heat dissipation fan.
6. The cooling and heating apparatus according to claim 3, wherein the conduction sheet is provided with a plurality of conduction air channels, and the air outlet direction of the conduction fan is opposite to the conduction air channels.
7. The cooling and heating apparatus of claim 4, wherein: the heat dissipation assembly further comprises heat insulation cotton arranged on the second surface; the radiating fins are arranged on the heat insulation cotton.
8. The cooling and heating apparatus according to any one of claims 1 to 7, wherein: the temperature conduction assembly is disposed at an intermediate location of the first face.
9. The cooling and heating apparatus as set forth in claim 6, wherein a plurality of conductive fans are alternately provided at both ends of the conductive sheet in a height direction.
10. A cell culture apparatus, characterized in that: the temperature-conducting device comprises a machine case, wherein a culture cavity is arranged in the machine case, the temperature-conducting device further comprises cooling and heating equipment according to any one of claims 1-9, the first surface of the cooling and heating equipment faces the culture cavity, and the temperature-conducting component is located in the culture cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322968172.5U CN220931506U (en) | 2023-11-03 | 2023-11-03 | Cold and warm equipment and cell culture equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322968172.5U CN220931506U (en) | 2023-11-03 | 2023-11-03 | Cold and warm equipment and cell culture equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220931506U true CN220931506U (en) | 2024-05-10 |
Family
ID=90937119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322968172.5U Active CN220931506U (en) | 2023-11-03 | 2023-11-03 | Cold and warm equipment and cell culture equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220931506U (en) |
-
2023
- 2023-11-03 CN CN202322968172.5U patent/CN220931506U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2013118985A1 (en) | Bus bar having novel structure | |
| CN210008133U (en) | Heat abstractor and communication equipment | |
| CN112243339B (en) | Double-circulation heat dissipation system | |
| CN220931506U (en) | Cold and warm equipment and cell culture equipment | |
| US20210063090A1 (en) | Inverter And Heat Dissipation Device Thereof | |
| CN106774751B (en) | External surface heat abstractor | |
| CN219117422U (en) | Nucleic acid amplification device | |
| JPH07106640A (en) | Thermoelectric cooling unit | |
| JP2013229125A (en) | Battery module and vehicle | |
| EP3927127B1 (en) | Electrical device using cooling device | |
| CN220233177U (en) | Support many high-power chip cooling system | |
| CN219876768U (en) | Semiconductor heat dissipation device | |
| CN112739156A (en) | Heat dissipation module, radiator and power equipment | |
| CN112040721B (en) | Heat radiation structure, servo driver and motor | |
| CN219329846U (en) | Circuit board heat abstractor and electrical equipment | |
| CN217213547U (en) | Electronic device | |
| CN220383422U (en) | Radiator and electronic equipment | |
| CN213280191U (en) | Circuit board heat dissipation device | |
| CN218888888U (en) | Variable frequency power supply and heat radiation structure thereof | |
| CN220693617U (en) | Heat dissipation device | |
| CN214891556U (en) | Radiating assembly, radiator and air conditioner outdoor unit | |
| CN218770826U (en) | Cooling system for internal ring temperature of power supply equipment | |
| CN112020167B (en) | Radio frequency heating equipment | |
| CN220273460U (en) | Three-phase asynchronous flat pushing back and forth motor driving device | |
| CN216011397U (en) | Air-cooled heat dissipation device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |