TWI777687B - Storage device with heat dissipation function - Google Patents

Abstract

A storage device with heat dissipation function is provided. The storage device with heat dissipation mechanism includes a first housing, a second housing, a storage module and a heat dissipation module. The first housing is provided with a plurality of heat dissipation holes. The second housing is arranged on the first housing, and an accommodating space is formed between the second housing and the first housing. The storage module is arranged in the accommodating space. The heat dissipation module is arranged between the first housing and the storage module. The heat dissipation module includes a partition plate, which is movably clamped on the inner side of the first housing. The partition plate is provided with a plurality of guide holes corresponding to the plurality of heat dissipation holes, and the partition plate moves back and forth between a first position and a second position relative to the first housing, so that the heat dissipation module can turn on or turn off the plurality of heat dissipation holes.

Description

Storage device with cooling function

The present invention relates to a storage device, in particular to a storage device with heat dissipation function.

With the advancement of technology, storage devices, such as mobile solid-state drives (SSD) or flash memory (Flash memory), have faster and faster read/storage speeds and better performance. As for mobile solid-state drives, different from traditional external hard disk devices, the product demands of various companies for mobile solid-state drives are small in size and large in capacity.

At present, the mobile solid state drives on the market are prone to be hot to the hands due to the high temperature. Therefore, it is necessary to add an insulating cover around the casing to prevent users from getting burned. However. This extra layer of insulation will result in poor cooling performance, resulting in slower read/storage speeds for mobile SSDs. In addition, although the storage device is equipped with heat-dissipating functional components, such as heat-dissipating aluminum sheets or thermal pads (Thermal PAD), the manufacturing cost is also increased.

Therefore, how to overcome the above-mentioned defects by improving the structure design and enhancing the heat dissipation function of the storage device has become one of the important issues to be solved in this field.

The technical problem to be solved by the present invention is to provide a storage device with a heat dissipation function in view of the deficiencies of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a storage device with a heat dissipation function, which includes a first casing, a second casing, a storage module and a heat dissipation module. The first casing is provided with a plurality of heat dissipation holes. The second casing is arranged on the first casing, and an accommodating space is formed between the second casing and the first casing. The storage module is arranged in the accommodating space. The heat dissipation module is arranged between the first casing and the storage module. The heat dissipation module includes a partition plate, which is movably clamped on the inner side of the first casing. The partition plate is provided with a plurality of guide holes corresponding to the plurality of heat dissipation holes, and the partition plate moves back and forth between a first position and a second position relative to the first casing, so that the heat dissipation module can open or close the plurality of heat dissipation holes hole.

One of the beneficial effects of the present invention is that the storage device with heat dissipation function provided by the present invention can reciprocate between a first position and a second position relative to the first casing through the "partition plate, so as to dissipate heat." The module opens or closes multiple heat dissipation holes” to improve the heat dissipation function of the storage device.

For a further understanding of the features and technical content of the present invention, please refer to the following detailed descriptions and drawings of the present invention. However, the drawings provided are only for reference and description, and are not intended to limit the present invention.

The following are specific embodiments to illustrate the embodiments of the “storage device with heat dissipation function” disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention. Additionally, it should be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are primarily used to distinguish one element from another. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[First Embodiment]

Referring to FIG. 1 and FIG. 2 , FIG. 1 is a schematic perspective view of a storage device according to an embodiment of the present invention, and FIG. 2 is an exploded schematic view of the storage device according to an embodiment of the present invention. The first embodiment of the present invention provides a storage device M with a heat dissipation function, which includes: a first casing 1 , a second casing 2 , a storage module 3 and a heat dissipation module 4 . The first casing 1 is provided with a plurality of heat dissipation holes 10 . The second casing 2 is disposed on the first casing 1 , and an accommodating space is formed between the second casing 2 and the first casing 1 . The storage module 3 and the heat dissipation module 4 are disposed in the accommodating space, and the heat dissipation module 4 is disposed between the first casing 1 and the storage module 3 , that is, above the storage module 3 .

1 and FIG. 2 , as well as FIG. 3 and FIG. 4 . FIGS. 3 and 4 are three-dimensional schematic diagrams of the first casing of the storage device according to the embodiment of the present invention. Specifically, the first casing 1 includes a flat plate and a vertical flat plate and sidewalls disposed along the periphery of the flat plate. The plurality of heat dissipation holes 10 are opened on the flat plate. In addition, two opposite grooves 11 are formed on the inner surface of the side wall, and a through hole 12 is also opened on the side wall, and it can be seen from FIG. The hole 12 communicates with the groove 11 there. In addition, it should be noted that the present invention is not limited to the number and size of the plurality of heat dissipation holes 10 . In the present embodiment, the first casing 1 is substantially rectangular (with long sides and wide sides), and the plurality of heat dissipation holes 10 are arranged in a 4×3 array, and two adjacent heat dissipation holes 10 are separated from each other. a fixed distance. On the other hand, the plurality of heat dissipation holes 10 are formed by parallel broad sides to form three rows of heat dissipation holes 10 arranged side by side, and the number of the heat dissipation holes 10 in each row is four.

Next, continue referring to FIG. 1 and FIG. 2 , and also referring to FIG. 5 . FIG. 5 is a three-dimensional schematic diagram of a heat dissipation module of a storage device according to an embodiment of the present invention. The heat dissipation module 4 includes a partition 41 , and the partition 41 is movably clamped on the inner side of the first casing 1 . The partition 41 includes a first side 411 and a second side 412 opposite to each other. The first side 411 and the second side 412 each form a convex structure 413 . Two grooves 11 are formed opposite to each other. It is worth mentioning that the length of the separator 41 is smaller than the length of each groove 11 , so the two convex structures 413 can be movably clamped in the two grooves 11 respectively, so that the separator 41 can be embedded in the first groove 11 . The housing 1 also moves along the groove 11 .

Based on the above, further, the partition plate 41 is further provided with a plurality of guide holes 40, and the plurality of guide holes 40 correspond to the plurality of heat dissipation holes 10, that is to say, the number and arrangement of the plurality of guide holes 40 are the same as The plurality of heat dissipation holes 10 are the same. When the partition plate 41 can be embedded in the first casing 1 and move along the groove 11 , the plurality of guide holes 40 and the plurality of heat dissipation holes 10 will overlap at a certain position, so that the plurality of guide holes 40 are respectively communicated with the plurality of heat dissipation holes 10 . In addition, a notch 414 is formed on the first side edge 411 of the partition plate 41 , and the heat dissipation module 4 further includes an operating member 42 , and the operating member 42 is disposed in the notch 414 . The operating member 42 includes a protruding key 421. When the two protruding structures 413 of the partition plate 41 are respectively clamped in the two grooves 11 of the first housing 1, the protruding key 421 will be arranged in the through hole 12 and exposed to the first shell 12. A shell 1. In addition, it should be noted that the length of the convex key 421 is smaller than the length of the through hole 12 . Thereby, the protruding key 421 on the operating member 42 can reciprocate along the through hole 12 and drive the partition plate 41 to reciprocate relative to the first housing 1 between a first position and a second position, so that the heat dissipation module 4 is turned on Or close multiple heat dissipation holes 10 .

Referring again to FIG. 1 to FIG. 4 , a first slot V1 (see FIG. 3 or FIG. 4 ) is also defined on the side wall of the first housing 1 , and a second slot is defined on the side wall of the second housing 2 V2 (see FIG. 2 ), and the first slot V1 and the second slot V2 can form a slot V (see FIG. 1 ). The storage module 3 includes a circuit board 31 and a communication interface 32 electrically coupled to the circuit board 31 , and the communication interface 32 is disposed in the slot V. For example, the storage device M provided by the present invention is a solid-state hard disk device (Solid-State Drive, SSD), and the communication interface 32 is a USB interface, but the present invention is not limited thereto. In addition, the storage device M provided by the present invention further includes a buffer material 5 , and the buffer material 5 can be arranged between the partition plate 41 and the circuit board 31 to protect the storage module 3 . For example, the buffer material 5 can be a buffer sponge or a buffer pad, and the present invention is not limited to the material of the buffer material 5 .

Next, referring to FIGS. 6 to 8 , FIG. 6 is a schematic diagram of the heat dissipation module of the storage device in the first position according to the embodiment of the present invention, and FIG. 7 is the heat dissipation module of the storage device according to the embodiment of the present invention in the second position 8 is a schematic top view of the heat dissipation module of the storage device in the second position according to the embodiment of the present invention. For example, the user can move the protruding key 421 on the operating member 42 to reciprocate along the through hole 12 to drive the partition plate 41 to reciprocate between a first position and a second position relative to the first housing 1 . Moving, the heat dissipation module 4 opens or closes the plurality of heat dissipation holes 10 . When the partition plate 41 is in the first position, the projection area formed by the vertical projection of each guide hole 40 on the first casing 1 does not overlap with the corresponding heat dissipation hole 10 , that is to say, the partition plate 41 will block it. The heat dissipation holes 10 prevent the heat generated by the storage module 3 from being dissipated through the heat dissipation holes 10 . When the partition plate 41 is in the second position, the projection area formed by the vertical projection of each guide hole 40 on the first casing 1 overlaps the corresponding heat dissipation hole 10 , that is, the plurality of guide holes on the partition plate 41 overlap. The guide holes 40 overlap and communicate with the plurality of heat dissipation holes 10 on the first casing 1 . At this time, the heat generated by the storage module 3 can escape through the plurality of guide holes 40 and the plurality of heat dissipation holes 10 in sequence. spread out.

Based on the above, in the embodiment shown in the present invention, in order to achieve a greater heat dissipation effect for the heat dissipation structure composed of the heat dissipation module 4 and the first casing 1, the plurality of guide holes 40 are arranged on the circuit board 31. The area distributed by the vertical projection covers at least half of the surface of the circuit board 31 , and the area distributed by the vertical projection of the plurality of heat dissipation holes 10 on the circuit board 31 covers at least half the surface of the circuit board 31 . That is to say, the present invention improves the overall heat dissipation efficiency by increasing the proportion of the distribution area of the areas where the plurality of guide holes 40 and the plurality of heat dissipation holes 10 are distributed to the area of the circuit board 31 . In addition, as can be seen from FIG. 8 , the area of the projection area formed by the vertical projection of each guide hole 40 on the first casing 1 is greater than or equal to the projection formed by the vertical projection of each heat dissipation hole 10 on the first casing 1 The area of the area is so that the heat energy generated by the storage module 3 will not be accumulated between the partition 41 and the storage module 3 , but can quickly pass through the plurality of guide holes 40 and then be dissipated by the plurality of heat dissipation holes 10 to the external environment.

[Advantageous effects of the embodiment]

One of the beneficial effects of the present invention is that the storage device with heat dissipation function provided by the present invention can reciprocate between a first position and a second position relative to the first casing 1 through the “partition plate 41, so as to The technical solution of enabling the heat dissipation module 4 to open or close the plurality of heat dissipation holes 10 ″ is to enhance the heat dissipation function of the storage device M.

Furthermore, when the partition plate 41 is in the first position, the projection area formed by the vertical projection of each guide hole 40 on the first casing 1 does not overlap with the corresponding heat dissipation hole 10 , that is to say, the time interval The plate 41 blocks the heat dissipation holes 10 , so that the heat generated by the storage module 3 cannot be dissipated through the heat dissipation holes 10 . When the partition plate 41 is in the second position, the projection area formed by the vertical projection of each guide hole 40 on the first casing 1 overlaps the corresponding heat dissipation hole 10 , that is, the plurality of guide holes on the partition plate 41 overlap. The guide holes 40 overlap and communicate with the plurality of heat dissipation holes 10 on the first casing 1 . At this time, the heat generated by the storage module 3 can escape through the plurality of guide holes 40 and the plurality of heat dissipation holes 10 in sequence. spread out.

The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

M: storage device

1: The first shell

10: cooling holes

11: Groove

12: Through hole

2: The second shell

3: storage module

31: circuit board

32: Communication interface

4: Cooling module

40: Pilot hole

41: Partition

411: First side

412: Second side

413: convex structure

414: Notch

42: Operating parts

421: convex key

5: Buffer material

V: Notch

V1: The first slot

V2: The second slot

FIG. 1 is a schematic perspective view of a storage device according to an embodiment of the present invention.

FIG. 2 is an exploded schematic diagram of a storage device according to an embodiment of the present invention.

3 is a schematic perspective view of a first casing of a storage device according to an embodiment of the present invention.

FIG. 4 is another schematic perspective view of the first casing of the storage device according to the embodiment of the present invention.

5 is a schematic perspective view of a heat dissipation module of a storage device according to an embodiment of the present invention.

6 is a schematic diagram of a heat dissipation module of a storage device in a first position according to an embodiment of the present invention.

7 is a schematic diagram of the heat dissipation module of the storage device in the second position according to the embodiment of the present invention.

8 is a schematic top view of the heat dissipation module of the storage device in the second position according to the embodiment of the present invention.

M: storage device

1: The first shell

10: cooling holes

12: Through hole

2: The second shell

421: convex key

V: Notch

Claims (11)

A storage device with heat dissipation function, which comprises: a first shell with a plurality of heat dissipation holes; a second shell, disposed on the first shell, the second shell and the first shell An accommodating space is formed between the shells; a storage module is disposed in the accommodating space; and a heat dissipation module is disposed between the first shell and the storage module, the heat dissipation The module includes a partition, which is movably clamped on the inner side of the first casing, the partition is provided with a plurality of guide holes corresponding to the plurality of heat dissipation holes, and the partition includes A first side and a second side are opposite to each other, the first side and the second side are respectively formed with a convex structure, and the inner surface of a side wall of the first casing is formed with oppositely arranged The two grooves are respectively movably clamped in the two grooves; wherein, when the partition is in a first position and a second position relative to the first casing When reciprocating between them, the heat dissipation module is correspondingly made to open or close a plurality of the heat dissipation holes. The storage device with heat dissipation function according to claim 1, wherein the length of the partition is less than the length of each of the grooves. The storage device with heat dissipation function according to claim 1, wherein a notch is formed on the first side of the partition plate, and the heat dissipation module further includes an operating member, and the operating member is disposed on the the notch. The storage device with heat dissipation function according to claim 3, wherein a through hole is further opened on the side wall of the first casing, and the operating member includes a protruding key, and the protruding key is arranged on the The through hole is exposed to the first casing, and the length of the protruding key is smaller than the length of the through hole. The storage device with heat dissipation function according to claim 1, wherein when the partition is in the first position, each of the guide holes is on the first casing The vertical projection does not overlap with the corresponding thermal vias. The storage device with heat dissipation function according to claim 1, wherein when the partition plate is in the second position, the vertical projection of each of the guide holes on the first casing overlaps with the corresponding of the heat dissipation holes. The storage device with heat dissipation function according to claim 1, wherein the storage module comprises a circuit board, and the vertical projections of the plurality of guide holes on the circuit board cover at least two parts of the circuit board. half of the surface. The storage device with heat dissipation function according to claim 7, wherein the vertical projection of the plurality of heat dissipation holes on the circuit board covers at least half of the surface of the circuit board. The storage device with heat dissipation function according to claim 7, wherein a first slot is defined on the side wall of the first casing, and a second slot is defined on the side wall of the second casing. The second slot and the first slot form a slot, the storage module further includes a communication interface coupled to the circuit board, and the communication interface is arranged in the slot. The storage device with heat dissipation function according to claim 7, further comprising a buffer material disposed between the separator and the circuit board. The storage device with heat dissipation function according to claim 1, wherein the area of the vertical projection of each of the guide holes on the first casing is greater than or equal to the area of each of the heat dissipation holes on the first casing. The area of the vertical projection on the shell.

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