CN214278879U - Heat dissipation cooling device of array server computing board - Google Patents
Heat dissipation cooling device of array server computing board Download PDFInfo
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- CN214278879U CN214278879U CN202120581779.6U CN202120581779U CN214278879U CN 214278879 U CN214278879 U CN 214278879U CN 202120581779 U CN202120581779 U CN 202120581779U CN 214278879 U CN214278879 U CN 214278879U
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Abstract
The utility model discloses a heat dissipation cooling device of array server calculation board, including calculation board, quick-witted case, first heating panel, calculation board quantity is a plurality of, and a plurality of the calculation board is in quick-witted incasement array arranges, every calculation board one side laminating has a first heating panel, every first heating panel is equipped with the heat dissipation fin that can increase first heating panel surface area in one side that the laminating has the calculation board back to back, every first heating panel extends on relative both sides limit has the spout, quick-witted incasement surface extends has the slide rail with spout matched with, first heating panel passes through the spout with the calculation board and packs into quick-witted incasement along the slide rail, the spout tip extends the heat-conducting plate, heat-conducting plate and quick-witted incasement surface laminating. The utility model discloses a partial heat that gives off on the calculation board directly conducts quick-witted case through first heating panel on, effectively utilized the surface area of quick-witted case to dispel the heat, promoted heat dissipation cooling efficiency.
Description
Technical Field
The utility model relates to a server heat abstractor technical field, in particular to heat dissipation cooling device of array server calculation board.
Background
The server is one of computers, and compared with common personal computers, the server has high-speed CPU computing capability, long-time reliable operation, strong I/O external data throughput capability and better expansibility, but the server has strong performance, and meanwhile, the server has the problems of large power consumption and large heat productivity in the operation process, the normal operation of the server is influenced by overhigh temperature, and meanwhile, the service life of the server is shortened by long-term high-temperature operation, so that the common servers are required to be provided with corresponding cooling devices.
At present, a heat dissipation cooling device with cooling fins is arranged on a computing board, one cooling fin is adhered to each single chip of a server computing board, heat dissipated by the computing board cannot be directly conducted to a case after the scheme is adopted, and the utilization rate of the surface area of the case is very low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat dissipation cooling device of array server calculation board overcomes above-mentioned defect, has utilized the surface area of aluminium machine case, and the effectual heat conduction that will calculate on the board realizes the effective cooling to the calculation board on the quick-witted case.
To achieve the above object, the solution of the present invention is: the utility model provides a heat dissipation cooling device of array server calculation board, includes calculation board, quick-witted case, first heating panel, it is a plurality of, and a plurality of to calculate the board and be in the quick-witted incasement array arranges, every calculation board one side laminating has a first heating panel, every first heating panel is equipped with the heat dissipation fin that can increase first heating panel surface area in one side that the laminating has the calculation board back to, every first heating panel extends on relative both sides limit has the spout, quick-witted incasement surface extends there is the slide rail with spout matched with, first heating panel passes through the spout with the calculation board and packs into quick-witted incasement along the slide rail, the spout tip extends the heat-conducting plate, and the heat-conducting plate laminates with quick-witted incasement surface.
Further, the quantity of the heat dissipation fins is multiple, the heat dissipation fins are vertically connected to the surface of the first heat dissipation plate, the heat dissipation fins are parallel to each other, and a certain gap is reserved between every two adjacent heat dissipation fins.
The computer further comprises second cooling plates, and one second cooling plate is attached to one side, back to the side attached with the first cooling plates, of each computing board.
Furthermore, the second heat dissipation plate comprises a first heat dissipation plate and a second heat dissipation plate, the first heat dissipation plate and the second heat dissipation plate are spliced on the surface of the computer plate, and the first heat dissipation plate and the second heat dissipation plate are symmetrical along a spliced seam.
Further, the case, the first heat dissipation plate and the second heat dissipation plate are made of aluminum materials.
The first heat dissipation plate is provided with a threaded hole, the calculation plate and the second heat dissipation plate are provided with through holes corresponding to the threaded hole, and the screws penetrate through the through holes and are connected with the threaded holes.
Furthermore, the case comprises a rectangular case body and a cover plate, wherein openings are formed in two opposite surfaces of the case body, and the cover plate is covered on the openings.
Further, the calculation board, the first heating panel and the second heating panel are perpendicular to the cover plate, the radiating fins on the first heating panel are perpendicular to the cover plate, a radiating opening is formed in the cover plate, a fan is arranged at the position of the radiating opening, and the fan is parallel to the cover plate.
After the technical scheme is adopted, the beneficial effects of the utility model reside in that: the plurality of the computing boards are arranged in the case in an array manner, one side of each computing board is attached with a first heat dissipation plate, one side of each first heat dissipation plate, back to the computing board, is provided with a heat dissipation fin capable of increasing the surface area of the first heat dissipation plate, each first heat dissipation plate extends from two opposite side edges to form a sliding groove, a sliding rail matched with the sliding groove extends from the inner surface of the case, the first heat dissipation plate and the calculation plate are arranged in the case along the sliding rail through the sliding groove, a heat conduction plate extends from the end part of the sliding groove and is attached to the inner surface of the case, thereby conducting the heat emitted by the computing board to the first heat dissipation plate, the first heat dissipation plate conducting part of the heat to the air, meanwhile, the first heat dissipation plate is in direct contact with the case, heat can be directly conducted to the case, the case has a large heat dissipation area, and heat dissipation and cooling efficiency can be effectively improved.
Drawings
Fig. 1 is a three-dimensional structure diagram of a heat dissipation cooling device of an array server computing board according to the present invention;
fig. 2 is a schematic diagram of an internal structure of a chassis of a heat dissipation cooling device for an array server computing board according to the present invention;
fig. 3 is a partially enlarged view of a heat dissipation cooling device of an array server computing board according to the present invention;
fig. 4 is a partial exploded view of the heat dissipation and cooling device of the array server computing board according to the present invention.
Description of reference numerals: 1-a computing board, 2-a case, 3-a first heat dissipation plate, 4-a heat dissipation fin, 5-a sliding chute, 6-a sliding rail, 7-a heat conduction plate, 8-a second heat dissipation plate, 9-a first heat dissipation plate, 10-a second heat dissipation plate, 11-a threaded hole, 12-a through hole, 13-a box body, 14-a cover plate, 15-a heat dissipation port, 16-a fan and 17-a second heat dissipation fin.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
As shown in fig. 2 and fig. 3, the utility model provides a heat dissipation cooling device of an array server computing board, which comprises a computing board 1, a case 2 and a first heat dissipation plate 3, wherein the number of the computing board 1 is plural, and the plurality of computing boards 1 are arranged in the case 2 in an array manner, one side of each computing board 1 is attached with a first heat dissipation plate 3, one side of each first heat dissipation plate 3 back to the computing board 1 is provided with a plurality of heat dissipation fins 4 capable of increasing the surface area of the first heat dissipation plate 3, the number of the heat dissipation fins 4 is plural, and the plurality of heat dissipation fins 4 are vertically connected on the surface of the first heat dissipation plate 3, the heat dissipation fins 4 are parallel to each other, a certain gap is left between adjacent heat dissipation fins 4, the heat dissipated during the working process of the computing board 1 is transferred to the first heat dissipation plate 3, the heat dissipation fins 4 on the first heat dissipation plate 3 can increase the contact area of the first heat dissipation plate 3 and the air, the heat conduction plate 7 extends out of the end part of the sliding chute 5, the heat conduction plate 7 is attached to the inner surface of the case 2, the contact area between the first heat dissipation plate 3 and the case 2 is further increased, the heat transfer between the first heat dissipation plate 3 and the case 2 is more efficient.
Further, in the embodiment, in order to enhance the heat dissipation effect, a second heat dissipation plate 8 is further included, and one side of each computing board 1 opposite to the side to which the first heat dissipation plate 3 is attached with one second heat dissipation plate 8, so that for the convenience of manufacturing, the second heat dissipation plate 8 is composed of a first heat dissipation plate 9 and a second heat dissipation plate 10, second heat dissipation fins 17 are arranged on one sides of the first heat dissipation plate 9 and the second heat dissipation plate 10, which are back to the joint with the calculation plate 1, the number of the second heat dissipation fins 17 is multiple, and a plurality of the second cooling fins 17 are vertically connected to the surfaces of the first cooling fins 9 and the second cooling fins 10, the second cooling fins 17 are parallel to each other, a certain gap is left between adjacent second cooling fins 17, the first cooling fins 9 and the second cooling fins 10 are spliced on the surface of the computer board 1, and the first cooling fins 9 and the second cooling fins 10 are symmetrical along the spliced seam. Also, the second heat radiating plate 8 may take other forms, and a heat radiating plate having the same structure as the first heat radiating plate 3 may be used.
Preferably, the case 2, the first heat dissipation plate 3 and the second heat dissipation plate 8 are made of aluminum materials, and the aluminum materials have the characteristics of small mass and good heat conduction performance, so that the heat dissipation device has a good heat dissipation effect under the condition that the weight is ensured to be small.
Further, as shown in fig. 4, the heat dissipation device further includes screws, the first heat dissipation plate 3 is provided with threaded holes 11, the calculation plate 1 and the second heat dissipation plate 8 are provided with through holes 12 corresponding to the threaded holes 11, and the screws penetrate through the through holes 12 to be connected with the threaded holes 11, so that the first heat dissipation plate 3, the calculation plate 1 and the second heat dissipation plate 8 are fixedly connected.
Further, as shown in fig. 1, the case 2 includes a case 13 and a cover plate 14, the case 13 is rectangular, the case 13 has openings on two opposite sides, the first heat sink 3, the computing board 1 and the second heat sink 8 are fixed by screws, the first heat sink 3, the computing board 1 and the second heat sink 8 are installed into the case 2 from the openings through a sliding slot 5 on the first heat sink 3 along a sliding rail 6 on the case 2, the sliding slot 5 is provided with a locking threaded hole, a locking through hole penetrating to the outside of the case is arranged at a position of the sliding rail 6 corresponding to the locking threaded hole, the locking screw penetrates through the locking through hole on the sliding rail 6 and is connected with the locking threaded hole on the sliding slot 5, so as to lock and fix the first heat sink 3, the computing board 1 and the second heat sink 8 in the case 2, the cover plate 14 is covered on the openings on two sides, the computing board 1, the first heat sink 3 and the second heat sink, and the heat dissipation fins 4 on the first heat dissipation plate 3 are perpendicular to the cover plate 14, the cover plate 14 is provided with a heat dissipation port 15, the heat dissipation port 15 is provided with a fan 16, the fan 16 is parallel to the cover plate 14, the fan 16 on the cover plate 14 on one side supplies air along the heat dissipation port 15 on the cover plate 14, the fan 16 on the cover plate 14 on the other side exhausts air along the heat dissipation port 15 on the cover plate 14, so that the air inside the case 2 is exchanged with the air outside the case 2, and further the heat inside the case is taken away, because the calculation plate 1, the first heat dissipation plate 3 and the second heat dissipation plate 8 are all perpendicular to the cover plate 14, and the heat dissipation fins 4 on the first heat dissipation plate 3 are perpendicular to the cover plate 14, the air passes through gaps among the heat dissipation fins 4 in the flowing process of the case 2, so that the air is fully contacted with the heat dissipation fins 4, and the heat dissipation efficiency is improved.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the design of the present application, and all equivalent changes made according to the design key of the present application fall within the protection scope of the present application.
Claims (8)
1. A heat dissipation cooling device of array server computing board, its characterized in that: including calculating board (1), quick-witted case (2), first heating panel (3), it is a plurality of, and a plurality of to calculate board (1) and be in array arrangement in quick-witted case (2), every calculate board (1) one side laminating has a first heating panel (3), every first heating panel (3) are equipped with heat dissipation fin (4) that can increase first heating panel (3) surface area in the one side that has calculation board (1) of laminating back to back, every first heating panel (3) extend on relative both sides limit has spout (5), quick-witted case (2) internal surface extends has slide rail (6) with spout (5) matched with, first heating panel (3) and calculation board (1) are packed into quick-witted case (2) along slide rail (6) through spout (5), spout (5) tip extends heat-conducting plate (7), the heat conducting plate (7) is attached to the inner surface of the case.
2. The heat dissipating and cooling assembly for a computing board of an array server of claim 1, wherein: the quantity of heat dissipation fin (4) is a plurality of, and is a plurality of heat dissipation fin (4) are connected perpendicularly first heating panel (3) are on the surface, and heat dissipation fin (4) are parallel to each other, leave certain clearance between adjacent heat dissipation fin (4).
3. The heat dissipating and cooling assembly for a computing board of an array server of claim 1, wherein: the computer is characterized by further comprising second heat dissipation plates (8), wherein one side of the computing plate (1), back to the side attached with the first heat dissipation plate (3), is attached with one second heat dissipation plate (8).
4. The array server computing board heat sink cooling apparatus of claim 3, wherein: the second heat dissipation plate (8) comprises a first heat dissipation plate (9) and a second heat dissipation plate (10), the first heat dissipation plate (9) and the second heat dissipation plate (10) are spliced on the surface of the calculation plate (1), and the first heat dissipation plate (9) and the second heat dissipation plate (10) are symmetrical along spliced seams.
5. The array server computing board heat sink cooling apparatus of claim 4, wherein: the case (2), the first heat dissipation plate (3) and the second heat dissipation plate (8) are made of aluminum materials.
6. The array server computing board heat sink cooling apparatus of claim 4, wherein: the computer cooling plate is characterized by further comprising a screw, a threaded hole (11) is formed in the first cooling plate (3), a through hole (12) corresponding to the threaded hole (11) is formed in the computer cooling plate (1) and the second cooling plate (8), and the screw penetrates through the through hole (12) to be connected with the threaded hole (11).
7. The heat dissipating and cooling assembly for a computing board of an array server of claim 1, wherein: the case (2) comprises a case body (13) and a cover plate (14), wherein the case body (13) is rectangular, openings are formed in two opposite sides of the case body (13), and the cover plate (14) covers the openings.
8. The array server computing board heat sink cooling apparatus of claim 7, wherein: the heat dissipation structure is characterized in that the computing board (1), the first heat dissipation plate (3) and the second heat dissipation plate (8) are perpendicular to the cover plate (14), the heat dissipation fins (4) on the first heat dissipation plate (3) are perpendicular to the cover plate (14), a heat dissipation opening (15) is formed in the cover plate (14), a fan (16) is arranged at the position of the heat dissipation opening (15), and the fan (16) is parallel to the cover plate (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120581779.6U CN214278879U (en) | 2021-03-22 | 2021-03-22 | Heat dissipation cooling device of array server computing board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120581779.6U CN214278879U (en) | 2021-03-22 | 2021-03-22 | Heat dissipation cooling device of array server computing board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214278879U true CN214278879U (en) | 2021-09-24 |
Family
ID=77798643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120581779.6U Active CN214278879U (en) | 2021-03-22 | 2021-03-22 | Heat dissipation cooling device of array server computing board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214278879U (en) |
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2021
- 2021-03-22 CN CN202120581779.6U patent/CN214278879U/en active Active
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