CN213399484U

CN213399484U - A silence radiator for computer mainboard

Info

Publication number: CN213399484U
Application number: CN202022687038.4U
Authority: CN
Inventors: 戴鸿鑫
Original assignee: Shenzhen Longfeng Electronic Co ltd
Current assignee: Shenzhen Longfeng Electronic Co ltd
Priority date: 2020-11-19
Filing date: 2020-11-19
Publication date: 2021-06-08
Anticipated expiration: 2030-11-19

Abstract

The utility model relates to the technical field of computer motherboards, in particular to a silent radiator for computer motherboards. A fan is connected, a shock absorbing layer is fixed on the outside of the fan frame, a sound-absorbing layer is arranged on the outside of the shock-absorbing layer, a frame body is arranged on the outside of the sound-absorbing layer, and heat dissipation oil is arranged on the inside of the frame body, and The outer side of the frame body is fixed with heat dissipation fins. The utility model has the advantages of simple structure, low cost and convenient production. The heat-conducting fins are arranged under the heat-dissipating fins, which can dissipate the heat more intensively, and at the same time, the problem of high noise of the existing radiator is improved. A shock-absorbing layer and a sound-absorbing layer are provided, which can avoid large vibration when the fan rotates without affecting the heat dissipation, and the sound-absorbing layer can further prevent the transmission of noise.

Description

A silence radiator for computer mainboard

Technical Field

The utility model relates to a computer motherboard technical field specifically is a silence radiator for computer motherboard.

Background

The computer main board, also called main board, system board or mother board, is installed in the machine box, and is one of the most basic and important components of the microcomputer. The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally includes elements such as a BIOS chip, an I/O control chip, a keyboard and a panel control switch interface, an indicator light plug-in, an expansion slot, a main board, and a direct current power supply plug-in of a plug-in card.

After the computer mainboard works for a long time, elements on the computer mainboard can generate a large amount of heat, if timely and effective heat dissipation is not carried out, the elements can be damaged, so that the service life is prolonged, although the existing mainboard radiator achieves the heat dissipation effect, the working process of the existing mainboard radiator can generate large noise, and therefore, the technical personnel in the field provide a mute radiator for the computer mainboard to solve the problems in the background technology.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a silence radiator for computer motherboard to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a silence radiator for computer motherboard, includes the fixed plate, the top of fixed plate is provided with the conducting strip, the top of conducting strip is provided with the fan frame, the middle part of fan frame is connected with the fan, and the outside of fan frame is fixed with the buffer layer, the outside of buffer layer is provided with the amortization layer, the outside on amortization layer is provided with the framework, the inside of framework is provided with the heat dissipation oil, and the outside of framework is fixed with radiating fin.

As a further aspect of the present invention, both sides of the fixing plate are fixed with a fixing member, and the middle portion of the fixing member is connected with a first bolt.

As a further aspect of the present invention, the heat conducting fins are members made of graphite, and the heat dissipating fins are members made of aluminum alloy.

As a further aspect of the present invention, the fan frame and the heat conducting fins are fixedly connected to each other by second bolts, and the second bolts are four in number.

As a further scheme of the utility model, the buffer layer is the component of the cotton material of PE bubble, and the thickness of buffer layer is not less than 1.5 mm.

As a further aspect of the present invention, the noise reduction layer is a component made of polyester fiber, and is connected to the damping layer and the frame body by gluing.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses simple structure, low cost, the production of being convenient for, be provided with the conducting strip below radiating fin, radiating fin and conducting strip all adopt the heat conduction, the good material of heat dispersion, and the low price, be favorable to the control cost, can distribute away the heat more concentratedly, the great problem of current radiator noise has been improved simultaneously, be equipped with buffer layer and amortization layer in the outside of fan frame, when not influencing the heat dissipation, produce great vibrations when can avoiding the fan to rotate, the amortization layer can further prevent spreading of noise, thereby make this radiator be applicable to comparatively quiet place of use more.

Drawings

FIG. 1 is a schematic view of a mute heat sink for a motherboard of a computer;

FIG. 2 is an enlarged schematic view of a mute heat sink for a motherboard of a computer at A in FIG. 1;

fig. 3 is a schematic structural diagram of a cross-sectional frame of a mute heat sink for a computer motherboard.

In the figure: 1. a fixing plate; 2. a heat conductive sheet; 3. a fixing member; 4. a first bolt; 5. a fan frame; 6. a fan; 7. a shock-absorbing layer; 8. a sound-deadening layer; 9. a frame body; 91. heat dissipating oil; 10. and (4) radiating fins.

Detailed Description

Referring to fig. 1 to 3, in an embodiment of the present invention, a mute radiator for a computer motherboard includes a fixing plate 1, a heat conducting fin 2 is disposed above the fixing plate 1, a fan frame 5 is disposed above the heat conducting fin 2, a fan 6 is connected to a middle portion of the fan frame 5, a damping layer 7 is fixed to an outer side of the fan frame 5, a silencing layer 8 is disposed on an outer side of the damping layer 7, a frame body 9 is disposed on an outer side of the silencing layer 8, a heat dissipating oil 91 is disposed inside the frame body 9, and a heat dissipating fin 10 is fixed to an outer side of the frame body 9, first, the heat conducting fin 2 collects heat generated by components on the computer motherboard, and then the heat is dissipated gradually under rotation of the fan 6 and heat dissipating effect of the heat dissipating fin 10, when the fan 6 rotates, a large vibration and noise may occur, then the damping layer 7 buffers the vibration, prevent to bump and produce the noise between the harder subassembly of material, simultaneously, amortization layer 8 has the good sound absorption and falls the performance of making an uproar, can further prevent that great noise from spreading.

In fig. 1, fixing members 3 are fixed to both sides of a fixing plate 1, a first bolt 4 is connected to the middle of the fixing member 3, and the fixing plate 1 is mounted on a computer motherboard by using the first bolt 4.

In fig. 1, the heat conducting strip 2 is a member made of graphite, the heat dissipating fin 10 is a member made of aluminum alloy, the graphite has an effect of shielding heat sources and components and improving heat dissipating performance of electronic products, and has the characteristics of small occupied space, light weight and the like, the heat conducting strip 2 gathers heat generated by elements on a computer motherboard, and then the heat is gradually dissipated under the rotation of the fan 6 and the heat dissipating effect of the heat dissipating fin 10.

In fig. 1, the fan frame 5 and the heat conducting fin 2 are fixedly connected by the second bolts, four second bolts are provided, and the fan frame 5 and the heat conducting fin 2 are stably connected by the second bolts to prevent displacement.

In fig. 3, the damping layer 7 is a member made of PE foam, and the thickness of the damping layer 7 is not less than 1.5mm, so that when the fan 6 rotates, large vibration and noise may occur, and the damping layer 7 buffers the vibration to prevent noise caused by collision between components made of hard materials.

In fig. 3, the sound-deadening layer 8 is a member made of a polyester fiber material, and the sound-deadening layer 8 is connected with the shock-absorbing layer 7 and the frame body 9 by adhesion, so that the sound-deadening layer 8 has excellent sound-absorbing and noise-reducing performance and can further prevent large noise from being transmitted.

The utility model discloses a theory of operation is: firstly, the heat that conducting strip 2 produced the component on with the computer motherboard gathers together, then under the rotation of fan 6 and radiating fin 10's radiating effect, distribute away the heat gradually, the setting of heat dissipation oil 91 can accelerate thermal giving off, when fan 6 rotates, great vibrations and noise can appear, buffer layer 7 then can cushion this kind of vibrations, prevent to bump between the harder subassembly of material and produce the noise, and simultaneously, amortization layer 8 has good sound absorption and falls the performance of making an uproar, can further prevent great noise from spreading.

The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a silence radiator for computer motherboard, includes fixed plate (1), its characterized in that, the top of fixed plate (1) is provided with conducting strip (2), the top of conducting strip (2) is provided with fan frame (5), the middle part of fan frame (5) is connected with fan (6), and the outside of fan frame (5) is fixed with buffer layer (7), the outside of buffer layer (7) is provided with amortization layer (8), the outside of amortization layer (8) is provided with framework (9), the inside of framework (9) is provided with heat dissipation oil (91), and the outside of framework (9) is fixed with radiating fin (10).

2. The mute radiator for the computer mainboard of claim 1, wherein fixing pieces (3) are fixed on both sides of the fixing plate (1), and the middle part of the fixing pieces (3) is connected with a first bolt (4).

3. The silent heat sink for computer motherboard according to claim 1, wherein said heat-conducting sheet (2) is a member made of graphite, and said heat-dissipating fin (10) is a member made of aluminum alloy.

4. The silent radiator for the computer motherboard as claimed in claim 1, wherein the fan frame (5) and the heat-conducting strip (2) are fixedly connected by a second bolt, and the number of the second bolts is four.

5. The silent radiator for computer motherboard according to claim 1, wherein said shock-absorbing layer (7) is a member made of PE foam, and the thickness of shock-absorbing layer (7) is not less than 1.5 mm.

6. The silent radiator for the computer motherboard as recited in claim 1, wherein said sound-deadening layer (8) is a member made of polyester fiber, and the sound-deadening layer (8) is connected with the shock-absorbing layer (7) and the frame body (9) by gluing.